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    Part ECAD Model Manufacturer Description Download Buy
    G8233022YFEU
    		Amphenol Communications Solutions Board mount - Header Plug - Box Header 2.0mm Pitch Right Angle,2x15Pin,15u\\ Gold,NY4T,TAIL=3.2mm PDF
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    022YF Price and Stock

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    Amphenol Corporation G8233022YFEU

    Connector Wire to Board Header 30 Position Solder Right Angle Through Hole Tray - Trays (Alt: G8233022YFEU)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas G8233022YFEU Tray 7 Weeks 2,880
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    • 10000 $2.11
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    Mouser Electronics G8233022YFEU
    • 1 -
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    • 10000 $2.32
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    Wakefield-Vette HSF-50-22-Y-F

    Heat Sink Fan, 1.06Deg C/W, 5.9Cfm; Thermal Resistance:1.06°C/W; External Height - Metric:21.59Mm; External Width - Metric:50Mm; External Length - Metric:50Mm; Flow Rate Max:5.9Cfm; Noise Rating:29Dba; Heat Sink Mounting:Clip On Rohs Compliant: Yes
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark HSF-50-22-Y-F Bulk 14 1
    • 1 $51.24
    • 10 $41.71
    • 100 $37.52
    • 1000 $36.76
    • 10000 $35.99
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    RS HSF-50-22-Y-F Bulk 16 Weeks 25
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    • 100 $43.49
    • 1000 $43.49
    • 10000 $43.49
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    Amphenol Communications Solutions G8233022YFEU

    Conn, Hdr, G8233022Yfeu; |Amphenol Communications Solutions G8233022YFEU
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark () G8233022YFEU Bulk 2,880
    • 1 -
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    • 10000 $3.13
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    G8233022YFEU Bulk 2,880
    • 1 -
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    • 100 -
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    • 10000 $2.75
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    Amphenol Commercial G8233022YFEU

    BOARD MOUNT - HEADER PLUG - BOX HEADER 2.0MM PIT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS G8233022YFEU Bulk 12 Weeks 2,880
    • 1 -
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    • 10000 $2.27
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    Interstate Connecting Components G8233022YFEU
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    022YF Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    .47j 63v

    Contextual Info: THOMSON COMPONENTS THOMSON PASSIVE MbE D • TD263DS DD0037b T ■ THP TYPE AC / AN MULTILAYER CERAMIC CHIP CAPACITORS /?-PF~û5-& 7 PHYSICAL C H A R A C TER ISTIC S TERM INATIO N Standard: Silver palladium metallization. Can meet reflow solder specifications for 5 sec. @ 260°C.


    OCR Scan     		td263dsdd0037b-220pf47j 63v PDF

    MC812

    Contextual Info: Multilayer Ceramic Chip Capacitors - HIGH VOLTAGE Series Part Number Construction MC-^812 X Size' T.C.2 1 2. 3 4. 5. 6. 7 SQO 1^2 TR Capacity3 Termination5 Packaging7 Tolerance WVDC Size: 1812, 1825, 2020, 4040, 5550, 6560 Temperature Coefficient: N=NPO; X =X 7R


    OCR Scan     		056fjf033fjf33/jf22/jf+7056/jf022yf68fjf39jjf039yf039fjfmc812 PDF

    Contextual Info: Multilayer Ceramic Chip Capacitors - HIGH VOLTAGE Series Part Number Construction MC 1^812 X ] Size1 ; T.C. 1 2. 3. 1 p K P 5 TR i I Capacity3 Termination3 Packaging7 Tolerance4 WVDC6 Size: 1812, 1825, 2020, 4040, 5550, 6560 Temperature Coefficient: N=NPO; X =X 7R


    OCR Scan     		018yf039yf033yf056yf+1022yf PDF