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10158514-0009SR1LF
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Amphenol Communications Solutions
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Minitek® Multipitch™,1.5mm Crimp-to-Wire Connector Platform, Wire to Board Header, 9 Position, Top Latch, Tin (preplated) |
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10157547-0009SR1LF
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Amphenol Communications Solutions
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Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 9 Position, Top Latch, Tin (preplated) |
PDF
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54112-104280850LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 28 Positions, 2.54mm (0.100in) Pitch. |
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail. |
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77317-104-28LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 28 Positions ,2.54mm (0.100in) Pitch, |
PDF
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