008SX Search Results

Contextual Info: 3_ I_ 4_ I_ 5_ I_ 6 9_ I_10 I 11_ I 15 IS I 16 17 I 18 Ep] R ecom m ended P.C.B Layout 19 an 13 .1 0 ± 0 .2 5 1 4.50 REF. 19 sn 17.00 Q ] NOTE: 0 2 0 1 2 2 M R 0 0 8 D a 2 5ZA SH E LL 1 ’ S 2 ,—Gold fla sh in co n ta ct a r e a /

Contextual Info: 9_ I_ID I la 11 i 13 15 I 16 17 I 18 R ecom m ended P.C.B Layout 12.80 8-gQ .92±Q . 1 2.00 |T] NOTE: 0201 22MRQ08 □ □ 1BZA 1 1. Selective plating ’S1.—0 5 u ” Min. gold in c o n ta c t a r e a / 100 u" Min. Tin in solder area. ’S 2,—Gold flash in c o n ta ct a r e a /

Contextual Info: 17.50 1?. 50+ 0.1 CDNOTE: A. 0201 22MR008 S_Q 1 6ZX 2522A X - 08 G D T - P 1 Recom m ended 14.50 REF (Com ponend 2.50 1 1. Selective plating ’S 1 (G1T) —0 5 u ” select gold in c o n ta c t/ Min. 100u” tin in solder area ’S2(G2T) —Gold flash in contact a re a /

Contextual Info: R ecom m ended P .C .B Layout 1 2 .8 0 2.00 |T] NOTE: 0 2 0 1 22M R Q 08 D D 2 3 Z U 1 1. Selective plating ’S 1 ,-0 5 u " Min. gold in c o n ta ct a re a / 1 00 u" Min. Tin in solder area. 'S 2 ,-G o ld fla sh in c o n ta c t a r e a / 1 00 u" Min. Tin in solder area.