00002B3 Search Results
00002B3 Price and Stock
TE Connectivity AST2000F00002B3F1000AST2000F00002B3F1000:CTO-1300000 |
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AST2000F00002B3F1000 | Bulk | 10 |
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AST2000F00002B3F1000 |
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TE Connectivity AST2000C00002B3Z1000AST2000C00002B3Z1000:CTO-1300000 |
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AST2000C00002B3Z1000 | Bulk | 5 |
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AST2000C00002B3Z1000 |
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Cree, Inc. MLEAWT-A1-0000-0002B3LED XLAMP WHITE SMD |
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MLEAWT-A1-0000-0002B3 | Reel | 1,400 |
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Glenair Inc 100-002B375Spiral Wraps, Sleeves, Tubing & Conduit BRAIDING - BRAID CABLING EXTRUDING |
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100-002B375 |
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100-002B375 | Bulk | 750 | 1 |
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00002B3 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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56F8037
Abstract: MC56F8037 CH1837A BSS 97 NV 15F v.8bis XE0092 56F8323 56F8346 56F8357
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AN3607 MC56F802x/3x 22bis 56F802x/3x 56F8037 MC56F8037 CH1837A BSS 97 NV 15F v.8bis XE0092 56F8323 56F8346 56F8357 | |
Contextual Info: TIES27 Gallium Arsenide Infrared-Emitting Diodes Texas Optoelectronics, Inc. DESIGNED TO EM IT N E A R -IN FR A R E D R A D IA N T ENERGY WHEN FORWARD BIASED • High Output Power . . . 15 mW Min at 25°C • Spectrally Matched to Silicon Sensors . . .Peak Emission at 930 nm |
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TIES27 G00D524 | |
Contextual Info: Normal DIN 41612 Boardmount Socket 3 Row Type C Rows A & C Filled 7364 Series • High density (64 position) • Low mating force minimizes plating wear on contact surfaces • High reliability contact design • Solder tail and wrap post tail options • Individual connector coding with the 3435-1 keying |
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TS-0183-06 QQ-N-290, MIL-G-45204, 7364-60DX T005413 00002b3 | |
Contextual Info: M13 Device DS3/DS1 MUX/DEMUX TXC-03301 DATA SHEET Preliminary FEATURES - ~ DESCRIPTION = = f ^ — The M13 is a CMOS VLSI device that provides the func tions needed to multiplex and demultiplex 28 indepen dent DS1 signals to and from a DS3 signal with either |
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TXC-03301 1D041S5 181-PGA |