-20/MEMS MIC Search Results

im 358 micro

Abstract: CMA3000 mems
Contextual Info: PRESSEMITTEILUNG - 25. Oktober 2010 VTI expandiert mit Konsumer Gyroskopen und Timing Devices MEMS-Pionier mischt Wachstumsmärkte auf VTI Technologies, ein Micro-Electro-Mechanical Systems-Pionier MEMS mit 20 Jahren Erfahrung, orientiert sich neu und erweitert mit dem Einstieg in das Segment Konsumer-Elektronik seine Zielmärkte.

LPG GAS SENSOR working

Abstract: LPG GAS SENSOR co2 sensor MEMS LPG mems GAS SENSOR electrochemical sensor CO mems sensor for car electrochemical gas sensors datasheet electrochemical CO2 GAS SENSOR co2 medical sensor "Flow Sensor"
Contextual Info: OMRON to Release New MEMS Mass Flow Sensor for Fuel Cells - Labor-saving innovation coupled with outstanding accuracy help improve fuel cell efficiency and reduce costs • February 20, 2008 • FOR IMMEDIATE RELEASE KYOTO, Japan - OMRON Corporation TOKYO: 6645, US: OMRNY will release a new MEMS

ADMP421

Abstract: analog ics admp401 mems microphone ADAU1361 ADAU1761 SSM2317 digital camera processor microphones
Contextual Info: ADI-7851_EET:audio_EET 11/20/08 1:26 PM Page 1 Everything sounds better, and plays longer, with Analog ICs inside. Our newest portable audio innovations MEMS Microphones Superior Sound Quality: ADMP401 analog and ADMP421 (digital) Best-in-class noise performance with flat frequency response over

Contextual Info: New High-Frequency Vibration Exciter New sensor technologies based on micro-mechanical structures MEMS increasingly require mechanical tests in the frequency range beyond 20 kHz. In this high frequency range, the trick is to stimulate the DUT with well-defined oscillations without causing uncontrolled vibration and

Specification

Abstract: CRG20 Angular Rate
Contextual Info: CRG20-12 High Rate Digital Angular Rate Sensor FEATURES − − − − − − − − − − − − − GENERAL DESCRIPTION CRG 20-12 is a high rate range 800 °/s angular rate sensor and is part of the CRG20 family of MEMS rate sensors. The CRG 20 family is the latest evolution of angular rate sensor

B2873

Abstract: 57B5 STEVAL-MKI132V1 SPBT2532 STM32F103TB Q576
Contextual Info: STEVAL-MKI132V1 BlueMotion - BlueTooth motherboard for DIL24 MEMS adapters Data brief Features • Battery powered down to 1.5 V ■ Bluetooth Class-2 ■ Transmission rate up to 2 Mbps with EDR ■ ARM Cortex -M3 32-bit RISC core operating at a 72 MHz frequency, 128 K Flash, 20 K RAM

rf mems switch

Abstract: switch 40 GHz RMSW220DTM RMSW220D Radant Mems microwave switch
Contextual Info: SPDT DC to 40 GHz, RF – MEMS Drain 1 FEATURES Gate 1 • High Isolation 20 dB typical @10 GHz ■ Low Insertion Loss (0.4 dB typical @10 GHz) ■ Typical On Resistance < 3.0 Ω ■ Hermetically Sealed ■ Long Life (>1011 cycles) Electrostatic Actuation, High Off Resistance (>1 GΩ), Fast Switching (5 µs), Current Handling (400

Contextual Info: All rights reserved 2013 OMMIC Fabrication de MMIC Intégrant des MEMS RF Brice GRANDCHAMP b.grandchamp@ommic.com RF MEMS workshop, Microwave & RF salon, Paris, April 2013 Plan OMMIC technologies Development of MEMS at OMMIC All rights reserved © 2013 OMMIC

Contextual Info: MEMS ATTENUATOR DiCon’s MEMS Attenuator is based on a micro-electro-mechanical system MEMS chip. The MEMS chip consists of an electrically movable mirror on a silicon support. A voltage applied to the MEMS chip causes the mirror to rotate, which changes the

ADA4897-1

Contextual Info: Ultralow Noise Microphone with Bottom Port and Analog Output ADMP504 Data Sheet FUNCTIONAL BLOCK DIAGRAM B SO OUTPUT POWER VDD GND Figure 1. 10140-011 Smartphones and feature phones Tablet computers Teleconferencing systems Digital still and video cameras

0121C

Abstract: MEMS package
Contextual Info: PM MEMS ATTENUATOR DiCon’s PM MEMS Attenuator is based on a micro-electromechanical system MEMS chip.The PM MEMS chip consists of an electrically movable mirror on a silicon support. A voltage applied to the PM MEMS chip causes the mirror to rotate, which changes

Attenuators

Abstract: DiCon Fiberoptics
Contextual Info: MEMS OPTICAL AT TENUATOR DiCon’s MEMS Optical Attenuator is based on a micro-electromechanical system MEMS chip. The MEMS chip consists of an electrically movable mirror on a silicon support. A voltage applied to the MEMS chip causes the mirror to rotate, which changes the

mems

Abstract: mems pacemaker MEMS ic silicon mems microphone glass frit bolometer mems microphone structure MEMS IC Introduction to accelerometers bolometer sensor
Contextual Info: MEMS and Microsystem Packaging NMI at INNOS June 2005 CONFIDENTIAL Introduction ƒ Background to MEMS and Microsystem Packaging ƒ Types of Packaging – “Zero level” packaging – Primary packaging – Secondary packaging [Page 1] CONFIDENTIAL Silicon IC Systems

microphone mems

Abstract: AN112-4 AN-1124
Contextual Info: High SPL Microphone with Bottom Port and Analog Output ADMP411 Data Sheet FUNCTIONAL BLOCK DIAGRAM 4.72 mm x 3.76 mm × 1.0 mm surface mount package 131 dB SPL acoustic overload point Sensitivity of −46 dBV ±2 dB sensitivity tolerance Omnidirectional response

Contextual Info: COMPACT MEMS ATTENUATOR DiCon’s MEMS Attenuator is based on a micro-electro-mechanical system MEMS chip. The MEMS chip consists of an electrically movable mirror on a silicon support. A voltage applied to the MEMS chip causes the mirror to rotate, which changes the

MEMS blood pressure sensor

Abstract: "Blood Pressure Sensor" MEMS pressure sensor silicon mems microphone capacitor mems gas sensor mems microphone mems amkor microphone MEMS Filter MEMS optical tunable filters
Contextual Info: solution microelectromechanical systems technology MEMS Technology Microelectromechanical systems MEMS are micron-size devices that can sense or manipulate the physical world. MEMS are created using micro machining processes, similar to those used to produce integrated

Contextual Info: ` Attenuators MEMS Attenuator DiCon’s MEMS Attenuator is based on a micro-electro-mechanical system MEMS chip. The MEMS chip consists of an electrically movable mirror on a silicon support. A voltage applied to the MEMS chip causes the mirror to rotate, which changes the

Contextual Info: High SPL Microphone with Bottom Port and Analog Output ADMP411 Data Sheet FUNCTIONAL BLOCK DIAGRAM OUTPUT POWER VDD GND 10913-002 Figure 1. Figure 2. Isometric Views of Microphone Package B SO Fire and safety radios Safety masks Smartphones and feature phones

MEMS VOA

Contextual Info: ` Improved Specifications DiCon’s MEMS Attenuator is based on a micro-electro-mechanical system MEMS chip. The MEMS chip consists of an electrically movable mirror on a silicon support. A voltage applied to the MEMS chip causes the mirror to rotate, which changes the

mems mic

Abstract: X band attenuator
Contextual Info: Wavelength range C Band 1528 - 1563 nm L Band 1570 - 1610 nm Insertion loss Preliminary Datasheet DiCon’s MEMS Attenuator is based on a mic ro-electromechanical system MEMS chip. The MEMS chip consists of an electrically movable mirror on a silicon support. A voltage

VOA MEMS

Abstract: VOA dicon dicon
Contextual Info: MEMS Tap/VOA Hybrid DiCon's MEMS Tap/VOA Hybrid is based on a micro-electromechanical system MEMS chip integrated with a thin film filter. The thin film tap filter couples a portion of the input signal to an output tap fiber while transmitting the rest of the input signal

Multi-Channel MEMS Attenuator Module

Abstract: 0048B X band attenuator
Contextual Info: Attenuators Multi-C Channel MEMS Attenuator Module DiCon’s Multi-Channel MEMS Attenuator Module consists of an array of 8 or less MEMS Attenuator components which are used for multi-channel attenuation. DiCon’s MEMS Attenuator is based on a micro-electro-mechanical system MEMS chip.

uPC 1270

Contextual Info: ` Attenuators PM MEMS Attenuator DiCon’s PM MEMS Attenuator is based on a micro-electromechanical system MEMS chip. The MEMS chip consists of an electrically movable mirror on a silicon support. A voltage applied to the MEMS chip causes the mirror to rotate, which changes the

mems

Abstract: DiCon Fiberoptics 1x2 1x2 Multimode
Contextual Info: MULTI-MODE MEMS 1X2 SWITCH DiCon’s Multi-Mode MM MEMS 1x2 is based on a micro-electromechanical system (MEMS) chip. The MEMS chip consists of an electrically moveable mirror on a silicon support. A voltage applied to the MEMS chip causes the mirror to rotate, which changes the