/128E Search Results
/128E Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| 50388-5128ELF |
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High Pin Count, Backplane Connectors, Receptacle, Vertical, Through Hole, 4 Row, 128 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch | |||
| 50642-1128ELF |
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High Pin Count, Backplane Connectors, Receptacle, Right Angle, 4 Row, 0 Guide Pin, Solder-less Press-Fit, 128 Positions, 2.54mm (0.100in) Pitch | |||
| HM2J07PE5128E9LF |
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Back Plane Connectors, 2mm Hard Metric Series, 5 RowRight angle Header Type A Press Fit , Shielded with 4 mm Top Shield 500 mating cycles ROHS Compliant | |||
| 50295-1128ELF |
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High Pin Count, Backplane Connectors, Receptacle, Right Angle, 4 Row, 0 Guide Pin, Through Hole, 128 Positions, 2.54mm (0.100in) Pitch | |||
| 50576-5128ELF |
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High Pin Count, Backplane Connectors, Receptacle, Right Angle, Through Hole, 4 Row, 128 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch |
/128E Datasheets (8)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
GT24C128E
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作为国内EEPROM龙头企业，聚辰半导体现已拥有A1（AECQ-100 Grade 1 ，-40°C~125°C)及以下等级的全系列汽车级 EEPROM 产品，具备高可靠性和低失效率等优势，擦写次数最高可达400万次以上，其温度适应能力强，数据可存储100年。新产品SPI NOR Flash也按照车规等级125℃设计。产品主要应用于车载摄像头、液晶显示、娱乐系统等外围部件，并逐渐延伸到新能源车三电系统、车身控制、底盘传动及微电机、智能座舱等核心部件。 经过十年技术积累和市场推广，聚辰已经成为国内外众多Tier1&Tier2厂商的供应商，终端客户包含比亚迪、特斯拉、保时捷、现代、丰田、大众、马自达、吉利等国内外一线汽车品牌。2021年上半年，公司已取得第三方权威机构颁发的IATF 16949:2016汽车行业质量管理体系的符合性证明。 | Original | ||||
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GD25LF128E
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GigaDevice Semiconductor (Beijing) Inc | Serial flash, 128M-bit, SPI, Dual/Quad SPI, Dual I/O 332Mbit/s, Quad I/O 664Mbit/s, DTR Quad I/O 832Mbit/s. | Original | ||||
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GD25Q128E
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GigaDevice Semiconductor (Beijing) Inc | 128M-bit Serial Flash, supports SPI, Dual/Quad SPI, Dual I/O 266Mbit/s, Quad I/O 532Mbit/s, SOP8/DIP8/USON8/WSON8 package. | Original | ||||
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GD25LB128E
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GigaDevice Semiconductor (Beijing) Inc | Serial flash, 128M-bit, SPI, Dual/Quad SPI, Dual I/O 266Mbit/s, Quad I/O 532Mbit/s, 8-LEAD WSON/USON, 8-LEAD SOP, 24-BALL TFBGA (5x5), 16-LEAD SOP. | Original | ||||
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GD25LQ128E
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GigaDevice Semiconductor (Beijing) Inc | 128M-bit Serial Flash, standard SPI, Dual/Quad SPI, Dual I/O 240Mbit/s, Quad I/O 480Mbit/s, 16-LEAD SOP, 24-BALL TFBGA, 8-LEAD SOP, 8-LEAD USON/WSON. | Original | ||||
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GD25B128E
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GigaDevice Semiconductor (Beijing) Inc | 128M-bit, Serial NOR Flash, SPI, Dual/Quad SPI, Dual I/O 266Mbit/s, Quad I/O 532Mbit/s. | Original | ||||
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GD25LE128E
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GigaDevice Semiconductor (Beijing) Inc | 128M-bit Serial flash, SPI, Dual/Quad SPI, Dual I/O 266Mbit/s, Quad I/O 532Mbit/s. | Original | ||||
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GD25WQ128E
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GigaDevice Semiconductor (Beijing) Inc | 128M-bit, SPI, Dual/Quad SPI, Dual I/O 208Mbit/s, Quad I/O 416Mbit/s, 8-Lead SOP, 16-Lead SOP, 8-Lead USON/WSON, 24-Ball TFBGA. | Original |
/128E Price and Stock
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Infineon Technologies AG CY62128EV30LL-45ZXITIC SRAM 1MBIT PARALLEL 32TSOP I |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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CY62128EV30LL-45ZXIT | Digi-Reel | 4,077 | 1 |
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CY62128EV30LL-45ZXIT | Cut Tape | 113 | 0 Weeks, 1 Days | 1 |
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CY62128EV30LL-45ZXIT | 1,500 |
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GigaDevice Semiconductor (Beijing) Inc GD25LE128ESIGR128MBIT, 1.8V, SOP8 208MIL, INDU |
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GD25LE128ESIGR | Digi-Reel | 3,980 | 1 |
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GD25LE128ESIGR | 1 |
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Infineon Technologies AG CY62128ELL-45SXATIC SRAM 1MBIT PARALLEL 32SOIC |
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Infineon Technologies AG CY62128EV30LL-45ZAXIIC SRAM 1MBIT PARALLEL 32STSOP |
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CY62128EV30LL-45ZAXI | Tray | 735 | 1 |
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CY62128EV30LL-45ZAXI | Tray | 2,065 | 8 Weeks | 1 |
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CY62128EV30LL-45ZAXI | 49,805 | 1 |
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CY62128EV30LL-45ZAXI | Tray | 3,917 | 0 Weeks, 1 Days | 1 |
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CY62128EV30LL-45ZAXI | 6,810 |
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CY62128EV30LL-45ZAXI | 1,872 | 2,340 |
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Infineon Technologies AG CY62128EV30LL-45SXITIC SRAM 1MBIT PARALLEL 32SOIC |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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CY62128EV30LL-45SXIT | Digi-Reel | 559 | 1 |
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CY62128EV30LL-45SXIT | 496 | 1 |
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CY62128EV30LL-45SXIT | Cut Tape | 1,000 | 0 Weeks, 1 Days | 1 |
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CY62128EV30LL-45SXIT | 93,000 |
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CY62128EV30LL-45SXIT | 1,000 | 1,000 |
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