"THE DESIGN OF THE LEADFRAME" NATIONAL Search Results

"leadframe material" DIP

Abstract: "leadframe material" DIP 20 K 1357 C1995 leadframe materials an-469 national
Contextual Info: National Semiconductor Application Note 469 R James Walker October 1986 ABSTRACT New space efficient packages for integrated circuits have been developed These include the Plastic Chip Carrier P C C and Small Outline (S O ) packages Design considerations and reliability tests for the S O package were compared to the standard plastic Dual-in-Line Package (DIP)

SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY

Abstract: MS011800 bond wire gold copper bond wire cte table epoxy substrate soft solder wire dispensing NATIONAL SEMICONDUCTOR ink MARKING AU4A cte table ic bga PCB monitor spc
Contextual Info: Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board PCB .

SOT-23-JESD51-3

Abstract: AN-1187 LM2750
Contextual Info: Application Brief Thermal Performance of National’s LLP Package, Highlighting the LM2750 Regulated Voltage Converter Application Brief 111 National’s Leadless Leadframe Package LLP provides excellent power dissipation capability in a very small package footprint. The LLP is a chip

TO metal package aluminum kovar

Abstract: Side Brazed Ceramic Dual-In-Line Packages ceramic pin grid array package lead finish gold CERAMIC FLATPACK socket CERAMIC LEADLESS CHIP CARRIER LCC 52 socket metal can equivalent national
Contextual Info: Hermetic Packages National Semiconductor offers a wide variety of ceramic and metal can packages for through-hole and surface mount applications. These ceramic and metal can packages are offered as solutions for high reliability and often high performance applications, and are extensively used in military/

LBGA196

Abstract: AN-1205 CM12 Signal Path Designer
Contextual Info: National Semiconductor Application Note 1205 August 2001 Introduction conductors. Both DC and AC Inductance can be provided for packages. To determine which inductance is appropriate for your application, please see the section ’Frequency limitations of R-L-C parameters’.

AN-1205

Abstract: CM12 Signal Path Designer
Contextual Info: National Semiconductor Application Note 1205 August 2001 INTRODUCTION This note is a snapshot of electrical performance of National’s IC packages. It is provided to help designers get an idea about electrical parasitics associated with the package, and help them compare the electrical performance of different

DAP 07

Abstract: JESD22-B111 DAP 08 transistor smd sensor 80L dap 07 smd dap sot 23-5 SPA52A AN-1187 LQB08A MO-220
Contextual Info: National Semiconductor Application Note 1187 August 27, 2010 Table of Contents Introduction . 2 Package Overview . 2

AN-1201

Abstract: SQ 1201
Contextual Info: Introduction National Semiconductor Application Note 1201 Chester Simpson June 2001 PCB Bottom Copper Pattern The new leadless leadframe package LLP provides significantly increased power dissipation capability in a tiny surface-mount package. The key feature of the LLP is that it

SQ 1201

Abstract: AN-1201 thermal pcb guidelines
Contextual Info: National Semiconductor Application Note 1201 Chester Simpson June 2001 Introduction The new leadless leadframe package LLP provides significantly increased power dissipation capability in a tiny surface-mount package. The key feature of the LLP is that it

JESD-26

Abstract: RAI-5-039 mineral spirits bulk modulus Silicone mold release agent JESD-22 KITAGAWA MINERAL SPIRITS
Contextual Info: Package Reliability All products and packages offered by National Semiconductor Corporation meet the minimum reliability qualification requirements outlined in Table 1 and Table 2 for hermetic and plastic packages, respectively. These minimum requirements are applied to new packages as well as to existing

JESD22-B111

Abstract: LLP48 JESD22B111 AA36 multicore solder paste SN50A AA100 AA-36 super mole heraeus
Contextual Info: Reliability of Chip Scale Packages under Mechanical Shock Loading T. T. Mattila1, P. Marjamäki1, L. Nguyen2, and J. K. Kivilahti1 1 Laboratory of Electronics Production Technology Helsinki University of Technology P.O. Box 3000, 02150 Espoo, Finland 2 National Semiconductor Corporation

LMP2011

Abstract: LMP2011MA LMP2011MAX LMP2011MF LMP2011MFX LMP2012MA LMP2012MM LMP2012MMX straingauge
Contextual Info: LMP2011 Single/LMP2012 Dual High Precision, Rail-to-Rail Output Operational Amplifier General Description Features The LMP201x series are the first members of National's new LMPTM precision amplifier family. The LMP201X series offers unprecedented accuracy and stability in space-saving miniature packaging while also being offered at an affordable price.

MCP market

Abstract: "The design of the leadframe" national
Contextual Info: Multi-Chip Packages “Multi-Chip Packages” or MCP is a terminology used within National Semiconductor Corp. Outsiders refer to the same type of packaging as “Few-Chip Packages” or FCP proposed by MCC or low-end Multi-Chip Modules (MCM). MCP refers to a packaging configuration containing at most

Contextual Info: AN11076 Thermal behavior of small-signal discretes on multilayer PCBs Rev. 1 — 11 July 2011 Application note Document information Info Content Keywords Low VCEsat, BISS, thermal resistance Rth , thermal impedance (Zth), total power dissipation (Ptot) Abstract

pcb thermal Design guide trace theta layout

Abstract: pcb thermal Design guide trace theta pcb thermal Design guide trace theta layout via LM2652 AN1520
Contextual Info: National Semiconductor Application Note 1520 September 2006 Table of Contents 1.0 Abstract . 2 2.0 Introduction . 2

2013290-9

Contextual Info: LMP2014MT LMP2014MT Quad High Precision, Rail-to-Rail Output Operational Amplifier Literature Number: SNOSAK6A LMP2014MT Quad High Precision, Rail-to-Rail Output Operational Amplifier General Description Features TM The LMP2014MT is a member of National’s new LMP

Contextual Info: High Precision, Rail-to-Rail Output Operational Amplifier General Description Features The LMP201x series are the first members of National's new LMPTM precision amplifier family. The LMP201X series offers unprecedented accuracy and stability in space-saving miniature packaging while also being offered at an affordable price.

AN-690

Abstract: C1995 AN-690 national
Contextual Info: UNDERSTANDING THE FUNDAMENTALS OF NOISE Today’s electronic system designers are becoming increasingly more familiar with the issues involved in migrating to high-speed logic One key issue is total system noise Noise in an electronic system can be described according

AN-690

Contextual Info: capacitively-coupled and mutually-induced energy from the active signal trace. Its amplitude and duration are determined by the active signal’s edge rate and the length of adjacent parallel traces. The faster the edge or the closer the adjacent traces, the higher the crosstalk amplitude. The

PGA68

Abstract: clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight
Contextual Info: CHEMICAL CONTENT OF SEMICONDUCTOR PACKAGING SEPTEMBER 1998 Corp. Environment Strategies Corp. Package Development USE IN LIFE SUPPORT DEVICES OR SYSTEMS MUST BE EXPRESSLY AUTHORIZED STMicroelectronics PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE

AN-1254

Abstract: DDR200 DDR266 DDR333 LP2995
Contextual Info: National Semiconductor Application Note 1254 Chance Dunlap September 2002 With the advent of DDR-SDRAM as the industry standard for memory in desktop computers, laptops and videocards, power management has become a focal point for system designers. Active termination of bus interconnects has required the use of another regulator, increasing cost and

AN-1187

Abstract: AN-1389 AN-1398 DS40MB200 "differential via" an-1398 national
Contextual Info: National Semiconductor Application Note 1398 TK Chin October 2005 1.0 Introduction choice for high speed communication designs. The high speed differential IO’s are assigned to the center portion of the package such that each differential pair is sandwiched by

NATIONAL SEMICONDUCTOR MARKING TYPE

Abstract: SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY national semiconductor packaging QFP PACKAGE thermal resistance Thermal Considerations for Surface Mount Packages national semiconductor databook
Contextual Info: Introduction Thank you for selecting National Semiconductor products. National Semiconductor’s products find wide use in applications ranging from the latest personal computers to lightweight portable consumer products. As next generation electronic systems require higher levels of performance, device

DM3000

Abstract: NDM3000 SOIC-16 spindle motor control q406
Contextual Info: Nationa l f i Semiconductor May 1996 " N D M 3000 3 Phase Brush less M otor Driver G en eral D escription Features The NDM3000 three phase brushless m otor driver consists o f three N-Channel and P-Channel MOSFETs in a half bridge configuration. These devices are produced using National's proprietary,