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wedge*

Catalog Datasheet Results Type PDF Document Tags
Abstract: , using ball-bonding techniques. Wedge bonding is not recommended. Die-pad size is 4 mils (100µm) square ... Original
datasheet

12 pages,
731.25 Kb

MAX3693 max3688 MAX3668EHJ MAX3668 rc shunt network MAX3668 abstract
datasheet frame
Abstract: standard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also ... Original
datasheet

8 pages,
316.96 Kb

MAAP-000072-SMB003 MAAP-000072-PKG003 AN3016 MAAPGM0072-DIE MAAPGM0072-DIE abstract
datasheet frame
Abstract: 160 °C using standard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball ... Original
datasheet

8 pages,
402.82 Kb

AN3016 MAAPGM0067-DIE MAAPGM0067-DIE abstract
datasheet frame
Abstract: minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for ... Original
datasheet

5 pages,
293.69 Kb

XP1016-BD-EV1 P1016-BD tanaka epoxy tanaka TS3332LD Three bond DM6030HK TS3332LD XP1016 XP1016-BD XP1016-BD-000V ts333 P1016 P1016-BD abstract
datasheet frame
Abstract: : Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For DC and RF pad connections, use either ball or wedge bonds. For best performance, especially above 10 GHz, wedge bonds of ... Original
datasheet

5 pages,
124.71 Kb

MASWGM0002-DIE MASWGM0002-DIE abstract
datasheet frame
Abstract: 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball ... Original
datasheet

6 pages,
257.2 Kb

XD1001-BD-EV1 XD1001-BD-000V XD1001-BD TS3332LD tanaka gold wire DM6030HK D1001-BD MIL-STD-883 D1001-BD abstract
datasheet frame
Abstract: compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note ... Original
datasheet

5 pages,
209.52 Kb

MAAPGM0029-DIE MAAPGM0029 MAAPGM0029-DIE abstract
datasheet frame
Abstract: compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must ... Original
datasheet

6 pages,
265.13 Kb

MAAPGM0030-DIE RO-P-DS-3021 RO-P-DS-3021 abstract
datasheet frame
Abstract: compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must ... Original
datasheet

5 pages,
251.83 Kb

MAAPGM0044-DIE datasheet abstract
datasheet frame
Abstract: VG29 minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for ... Original
datasheet

5 pages,
150.75 Kb

CMM0618-BD-000V DM6030HK M400 PB-CMM0618-BD-0000 tanaka epoxy tanaka wire ts333 TS3332LD CMM0618-BD CMM0618-BD abstract
datasheet frame

Datasheet Content (non pdf)

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Over 1.1 million files (1986-2014): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer.
 
No abstract text available
www.datasheetarchive.com/download/76448923-740548ZC/30093.pl
SGS-Thomson 07/08/1995 355.73 Kb PL 30093.pl
No abstract text available
www.datasheetarchive.com/download/3148-740549ZC/30093-v1.pl
SGS-Thomson 12/05/1995 355.73 Kb PL 30093-v1.pl
land pad is dependent on the accuracy of the bonder as well as the type of bond. An aluminum wedge
www.datasheetarchive.com/files/intel/products one/design/smartdie/cob.htm
Intel 01/05/1999 28.5 Kb HTM cob.htm
process used (i.e. ball or wedge bond)? What is the energy the finish required for crescent or wedge bonds to be made on the
www.datasheetarchive.com/files/intel/products one/design/quality/smartdie/design.htm
Intel 30/04/1999 24.66 Kb HTM design.htm
followed by wire bonding (gold ball or aluminum wedge) to the lands on
www.datasheetarchive.com/files/intel/products one/design/quality/smartdie/compat.htm
Intel 30/04/1999 12.55 Kb HTM compat.htm
No abstract text available
www.datasheetarchive.com/download/96010470-161388ZD/h0701om security.doc
Omron 13/11/2001 19.5 Kb DOC h0701om security.doc
wedge in any pass, * and we can safely flush it, without causing interpass symbol phase * errors.
tar:bzip2:www.datasheetarchive.com/files/motorola/software/mcore/src_tar.bz2!/src_tar!/binutils-2.9.1-m.core/gas/config/tc-tahoe.c
Motorola 16/04/1999 22936.45 Kb BZ2 src_tar.bz2
instruction will wedge in any pass, * and we can safely flush it, without causing interpass symbol phase
tar:bzip2:www.datasheetarchive.com/files/motorola/software/mcore/src_tar.bz2!/src_tar!/binutils-2.9.1-m.core/gas/config/tc-vax.c
Motorola 16/04/1999 22936.45 Kb BZ2 src_tar.bz2
No abstract text available
www.datasheetarchive.com/download/83914083-139805ZD/mpltools.zip (tc-tahoe.c)
Microchip 01/06/2002 10454.37 Kb ZIP mpltools.zip
No abstract text available
www.datasheetarchive.com/download/83914083-139805ZD/mpltools.zip (tc-vax.c)
Microchip 01/06/2002 10454.37 Kb ZIP mpltools.zip