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wedge*

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: . Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias connections. Aluminum ... Mimix Broadband
Original
datasheet

5 pages,
255.39 Kb

ka-band transistor 84-1LMI 30MPA0562 TEXT
datasheet frame
Abstract: minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for ... Mimix Broadband
Original
datasheet

5 pages,
398.83 Kb

84-1LMI 30SPA0557 ablestick TEXT
datasheet frame
Abstract: thick gold minimum. · Use caution to prevent air bridge damage. · Thermosonic ball or wedge ... Cree
Original
datasheet

8 pages,
715.86 Kb

F240 CuMoCu CRF24060D CRF24060 85713 08816 95160 TC 9164 N TEXT
datasheet frame
Abstract: °C Dimensions (L x W x T) Backside Wedge Angle ( ) Price Contact us for quote [1 ... Bookham Technology
Original
datasheet

3 pages,
432.31 Kb

gain flattening Bookham GAIN-FLATTENING-FILTER TEXT
datasheet frame
Abstract: ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge ... Mimix Broadband
Original
datasheet

9 pages,
288.8 Kb

RF Transistor Selection 84-1LMI 26TX0555 2.4 ghz transmitter rf test usb pre amplifier circuit diagram 2.4 ghz transmitter TEXT
datasheet frame
Abstract: minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for ... Mimix Broadband
Original
datasheet

7 pages,
347.9 Kb

usb transmitter schematic diagram 84-1LMI 27TRX0357 TEXT
datasheet frame
Abstract: recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds ... Hittite Microwave
Original
datasheet

6 pages,
312.1 Kb

HMC516 TEXT
datasheet frame
Abstract: Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 ... Hittite Microwave
Original
datasheet

6 pages,
275.54 Kb

STM-64 HMC576 TEXT
datasheet frame
Abstract: ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge ... Mimix Broadband
Original
datasheet

5 pages,
432.06 Kb

84-1LMI 44MPA0478 TEXT
datasheet frame
Abstract: . Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias connections. Aluminum ... Mimix Broadband
Original
datasheet

5 pages,
274.3 Kb

84-1LMI 7OSC0462 vco mimix IC 566 vco TEXT
datasheet frame

Archived Files

Abstract Saved from Date Saved File Size Type Download
accuracy of the bonder as well as the type of bond. An aluminum wedge bond leaves a "tail" on the bond as a
/datasheets/files/intel/products/design/smartdie/cob.htm
Intel 23/10/1996 28.65 Kb HTM cob.htm
No abstract text available
/download/73342108-956339ZC/168831_t.dxf
Weidmuller 11/02/1999 12.34 Kb DXF 168831_t.dxf
No abstract text available
/download/92845362-956312ZC/168470_i.dxf
Weidmuller 11/02/1999 140.08 Kb DXF 168470_i.dxf
No abstract text available
/download/88107609-956331ZC/168827_i.dxf
Weidmuller 11/02/1999 913.7 Kb DXF 168827_i.dxf
No abstract text available
/download/64938009-956325ZC/168811_t.dxf
Weidmuller 11/02/1999 35.67 Kb DXF 168811_t.dxf
No abstract text available
/download/54680502-956073ZC/161634_t.dxf
Weidmuller 11/02/1999 18.04 Kb DXF 161634_t.dxf
No abstract text available
/download/54599386-956086ZC/161649_f.dxf
Weidmuller 11/02/1999 212.56 Kb DXF 161649_f.dxf
No abstract text available
/download/79958582-956063ZC/161430_s.dxf
Weidmuller 11/02/1999 12.56 Kb DXF 161430_s.dxf
No abstract text available
/download/74600732-955957ZC/160431_t.dxf
Weidmuller 11/02/1999 5.92 Kb DXF 160431_t.dxf
No abstract text available
/download/62624037-956041ZC/160908_s.dxf
Weidmuller 11/02/1999 7.35 Kb DXF 160908_s.dxf