NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: methods to provide maximum protection for our product and to best suit our customer's needs: 1) Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our , ) SOIC (330 mil) SOIC (450 mil) Sidebraze 2. Shipping Trays · Conforms to JEDEC Thin Matrix Tray outlines · Bakeable and Conductive Quantity Per Tray PACKAGE TSOP LEAD COUNT PKG CODE QTY , Quantities 1. Shipping Tubes · Material: Clear polyvinyl chloride · ESD: Topically coated with ... | Original |
3 pages, |
ATMEL Packing Methods and Quantities ATMEL SOIC tape and reel Shipping Trays ATMEL Tape and Reel atmel tape and reel JEDEC SOIC JEDEC Matrix Tray outlines PLCC JEDEC tray EIA-481-x tsop Shipping Trays tsop tray matrix outline datasheet abstract |
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| Abstract: methods to provide maximum protection for our product and to best suit our customer's needs: 1) Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our , ) SOIC (330 mil) SOIC (450 mil) Sidebraze 2. Shipping Trays · Conforms to JEDEC Thin Matrix Tray outlines · Bakeable and Conductive Quantity Per Tray PACKAGE TSOP LEAD COUNT PKG CODE QTY , Quantities 1. Shipping Tubes · Material: Clear polyvinyl chloride · ESD: Topically coated with ... | Original |
3 pages, |
tsop Shipping Trays JEDEC tray standard 13 ATMEL Tape and Reel JEDEC TRAY PLCC EIA-481-x ATMEL Packing Methods and Quantities ATMEL EIA-481-x Packing JEDEC Matrix Tray outlines datasheet abstract |
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| Abstract: R 23 Sidebraze 32 B 12 2. Shipping Trays · Conforms to JEDEC Thin Matrix Tray , maximum protection for our product and to best suit our customer's needs: 1) Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but , Shipping Tubes · Material: Clear polyvinyl chloride · ESD: Topically coated with anti-static solution , /Tray 28 32 40 40 48 T T T V T 234 156 120 160 96 TSOP 3. Unit Pack/Boxes · ... | Original |
4 pages, |
tsop Shipping Trays ATmel 750 ATMEL shipping label S1 ATMEL JEDEC tray standard for PLCC ATMEL JEDEC SOIC EIA-481-x ATMEL SOIC tape and reel atmel tape and reel ATMEL 210 ATMEL Packing Methods and Quantities ATMEL 234 datasheet abstract |
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| Abstract: Shipping Media Tubes Tape & Reel Trays See Note See Note x x Desiccant Pack Comments , 10.43 10.43 10.43 16.07 x 23.3 84 x Shipping Media Tubes Tape & Reel Trays x x , ) Weight (gm) 12* Max. Footprint (Inches) UV Erasable Shipping Media Carrier Tape & Reel Trays , x x x x x x x x x Shipping Media Tubes Tape & Reel Trays Desiccant , x x UV Erasable Shipping Media Tubes Tape & Reel Trays Desiccant Pack Comments/Footnotes ... | Original |
21 pages, |
Intel Small Outline Package Guide kd 503 CERAMIC LEADLESS CHIP CARRIER QFP 64 Cavity dip CERAMIC CHIP CARRIER LCC 68 socket 68 CERAMIC LEADLESS CHIP CARRIER LCC Shipping Trays SIMM 80 jedec transistor KD 503 CERAMIC QUAD FLATPACK CQFP 14 pin CERAMIC PIN GRID ARRAY CPGA datasheet abstract |
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| Abstract: Max Footprint (inches) UV Eraseable Shipping Media Tubes Tape Reel Trays X X Desiccant , 950 2 16 X X UV Eraseable Shipping Media Tubes Tape Reel Trays 1 35 X X X , Footprint (inches) UV Eraseable X Shipping Media Carrier Tape Reel Trays X X Desiccant , Shipping Media Tubes Tape Reel Trays X X X X X X X X X X X X X , X Shipping Media Tubes Tape Reel Trays Desiccant Pack Comments Footnotes Available with ... | Original |
19 pages, |
QFP 64 Cavity package QFP 64 Cavity dip ic packages CERAMIC LEADLESS CHIP CARRIER 64 CERAMIC LEADLESS CHIP CARRIER LCC TSOP 56 socket datasheet abstract |
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| Abstract: TRANSPORT MEDIA AND PACKING 10.1.3. Trays Shipping trays are built in compliance with JEDEC thick and , of plastic shipping trays, employs several handicapped agencies and reduces environmental waste. , remaining shelf life. 10.5.2. Shipping Boxes and Cartons Intel products are placed in tubes or trays, or , 10.1.1. Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an , CONFIDENTIAL (until publication date) 2 TRANSPORT MEDIA AND PACKING Table 10-1. PLCC Shipping Tube ... | Original |
31 pages, |
100L bga Shipping Trays tray 20 x 14 DIMENSIONS PQFP 132 thick bga tray size PEAK tray drawing PEAK TRAY bga AZ 2535 INTEL 810 PLCC JEDEC tray TRAY DIMENSIONS 132 PGA tray bga transport media and packing datasheet abstract |
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| Abstract: solution Shipping Trays · Conforms to JEDEC Thin Matrix Tray outlines · Bakeable and Conductive Quantity per Tube/Tray Lead Count Package Code Quantity per Tube/Tray Tubes/Trays per Bag , maximum protection for our product and to best suit our customer's needs: 1) Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also provide tape and reel upon customer request. Packing Methods and Quantities Shipping ... | Original |
4 pages, |
24 unit matrix TRAY ATMEL EIA-481-x Packing ATMEL shipping label ATMEL SOIC tape and reel ATMEL Packing Methods and Quantities EIA-481-x JEDEC TRAY PLCC TQFP Shipping Trays tsop 66 JEDEC Matrix Tray outlines atmel tape and reel tsop Shipping Trays datasheet abstract |
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| Abstract: MEDIA AND PACKING Trays Shipping trays are built in compliance with JEDEC thick and thin standard , PACKING Charts of trays for PQFP PGA PLCC TSOP CQFP MQFP SQFP TQFP MSC packages are shown on the , nominal cash reimbursement but it lowers the cost of plastic shipping trays employs several handicapped , shipping arrangements at no charge to the customer 19 TRANSPORT MEDIA AND PACKING All trays will , CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling ... | Original |
24 pages, |
100L JEDEC TRAY PLCC LD 273 PGA JEDEC tray pocket pc Shipping Trays transport media and packing tray 20 x 14 TRAY DIMENSIONS 132 PGA Trays 14 x 20 TQFP Shipping Trays L-273 intel tray mechanical drawings datasheet abstract |
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| Abstract: Chapter 5 Trays CHAPTER 5 TRAYS Introduction Design and Materials Device Count per Tray and , 5-1 Chapter 5 Trays INTRODUCTION Trays are used instead of tubes to protect higher lead/ball count packages from electrical and mechanical damage during handling and shipment. Trays are also , packages and multi-chip packages (MCPs), as well as PQFP, SSOP, TSOP, USON, and WSON packages are shipped in trays. Eight-lead SOIC packages also have the option of being shipped in trays. DESIGN AND ... | Original |
6 pages, |
TRAY DAEWON TSOP JEDEC Kostat KS8503 1EH-08LD-J19 124-32LD-113 FBGA tray kostat 1EC-08LD-919 camtex trays daewon tray TRAY 124-56LD-119 CAMTEX 12b-1113-119 TLC 547 datasheet abstract |
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| Abstract: x 1.980 2.170 2.670 x x x x Shipping Media: Trays Comments / Footnotes , ) Max. Footprint (Inches) UV Erasable x Shipping Media: Carrier x Trays Comments , UV Erasable Shipping Media: x Trays Comments / Footnotes Through Hole Use Only Table 1-8. , x x x x x x x x UV Erasable Shipping Media: Tubes Tape & Reel Trays , ) 0.640 Shipping Media Tubes x Tape & Reel x Trays x Desiccant Pack x Comments ... | Original |
18 pages, |
QFP 64 Cavity package PCB footprint cqfp 132 CERAMIC PIN GRID ARRAY CPGA lead frame 7912 pin configuration ic 7912 CERAMIC CHIP CARRIER LCC 68 socket datasheet abstract |
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| Web SOP Tray and Tube Media Drawings Intel Corp. (Folsom) Architecture: Type : Last Update: Flash Memory Components High Integration Boot Block Shipping Media 6/26/97 11:30:00 AM Vendor Information Tool Description: Contains Jedec thick (PSOP & SSOP) and thin (TSOP) tray, and tube (44 PSOP) shipping media deminsional drawings. Can be used to assist in the set up of - Version 1.0 Supported Device Detail Matrix: Part & Package 28F001BX 28F001BX 28F001BX 28F001BX - TSOP www.datasheetarchive.com/files/intel/design/flcomp/devtools/4316e1a6.htm |
Intel | 08/11/1997 | 4.3 Kb | HTM | 4316e1a6.htm |
| Web SOP Tray and Tube Media Drawings Intel Corp. (Folsom) Architecture: Type : Last Update: Flash Memory Components High Integration Boot Block Shipping Media 6/26/97 11:30:00 AM Vendor Information Tool Description: Contains Jedec thick (PSOP & SSOP) and thin (TSOP) tray, and tube (44 PSOP) shipping media deminsional drawings. Can be used to assist in the set up of - Version 1.0 Supported Device Detail Matrix: Part & Package 28F001BX 28F001BX 28F001BX 28F001BX - TSOP www.datasheetarchive.com/files/intel/design/flcomp/devtools/4b59a1a6.htm |
Intel | 05/02/1998 | 4.66 Kb | HTM | 4b59a1a6.htm |
| ) and thin (TSOP) tray, and tube (44 PSOP) shipping media deminsional drawings. Can be used to assist in FlashWeb SOP Tray and Tube Media Drawings Intel Corp. Architecture: Type : Last Update: FLASH Boot Block_Component Shipping 28F001BX 28F001BX 28F001BX 28F001BX - TSOP-32 ld 28F002BC 28F002BC 28F002BC 28F002BC - PSOP-44 PSOP-44 PSOP-44 PSOP-44 ld 28F002BC 28F002BC 28F002BC 28F002BC - TSOP-40 ld 28F002BV/BE 28F002BV/BE 28F002BV/BE 28F002BV/BE - TSOP-40 ld 28F002BX/BL 28F002BX/BL 28F002BX/BL 28F002BX/BL - TSOP-40 ld 28F004BV/BE 28F004BV/BE 28F004BV/BE 28F004BV/BE - TSOP-40 ld 28F004BX/BL 28F004BX/BL 28F004BX/BL 28F004BX/BL - TSOP-40 ld 28F008BV/BE 28F008BV/BE 28F008BV/BE 28F008BV/BE - TSOP-40 www.datasheetarchive.com/files/intel/design/flcomp/devtools/4fb6a_~1.htm |
Intel | 31/01/1997 | 3.53 Kb | HTM | 4fb6a_~1.htm |
| Web SOP Tray and Tube Media Drawings Intel Corp. (Folsom) Architecture: Type : Last Update: Flash Memory Components High Value FlashFile(TM) Memory Shipping Media 6/26/97 11:30:00 AM Vendor Information Tool Description: Contains Jedec thick (PSOP & SSOP) and thin (TSOP) tray, and tube (44 PSOP) shipping media deminsional drawings. Can be used to assist in the set up of -44 ld 28F004S3 28F004S3 28F004S3 28F004S3 - TSOP-40 ld 28F004S5 28F004S5 28F004S5 28F004S5 - PSOP-44 PSOP-44 PSOP-44 PSOP-44 ld 28F004S5 28F004S5 28F004S5 28F004S5 - TSOP-40 ld 28F004SC 28F004SC 28F004SC 28F004SC - PSOP-44 PSOP-44 PSOP-44 PSOP-44 ld www.datasheetarchive.com/files/intel/design/flcomp/devtools/431761a6.htm |
Intel | 08/11/1997 | 4.25 Kb | HTM | 431761a6.htm |
| Web SOP Tray and Tube Media Drawings Intel Corp. (Folsom) Architecture: Type : Last Update: Flash Memory Components High Value FlashFile(TM) Memory Shipping Media 6/26/97 11:30:00 AM Vendor Information Tool Description: Contains Jedec thick (PSOP & SSOP) and thin (TSOP) tray, and tube (44 PSOP) shipping media deminsional drawings. Can be used to assist in the set up of - Version 1.0 Supported Device Detail Matrix: Part & Package 28F004S3 28F004S3 28F004S3 28F004S3 - TSOP www.datasheetarchive.com/files/intel/design/flcomp/devtools/4b5a21a6.htm |
Intel | 05/02/1998 | 4.56 Kb | HTM | 4b5a21a6.htm |
| _Component Shipping Media Vendor Information Tool Description: Contains Jedec thick (PSOP & SSOP) and thin (TSOP) tray, and tube (44 PSOP) shipping media deminsional drawings. Can be used to FlashWeb SOP Tray and Tube Media 28F001BX 28F001BX 28F001BX 28F001BX - TSOP-32 ld 28F002BC 28F002BC 28F002BC 28F002BC - PSOP-44 PSOP-44 PSOP-44 PSOP-44 ld 28F002BC 28F002BC 28F002BC 28F002BC - TSOP-40 ld 28F002BV/BE 28F002BV/BE 28F002BV/BE 28F002BV/BE - TSOP-40 ld 28F002BX/BL 28F002BX/BL 28F002BX/BL 28F002BX/BL - TSOP-40 ld 28F004BV/BE 28F004BV/BE 28F004BV/BE 28F004BV/BE - TSOP-40 ld 28F004BX/BL 28F004BX/BL 28F004BX/BL 28F004BX/BL - TSOP-40 ld 28F008BV/BE 28F008BV/BE 28F008BV/BE 28F008BV/BE - TSOP-40 www.datasheetarchive.com/files/intel/products/design/flcomp/devtools/3f7de_~1.htm |
Intel | 23/10/1996 | 3.72 Kb | HTM | 3f7de_~1.htm |
| Web SOP Tray and Tube Media Drawings Intel Corp. (Folsom) Architecture: Type : Last Update: Flash Memory Components Boot Block Packaging and Shipping Information 10/1/98 4:33:28 PM Vendor Information Tool Description: Contains Jedec thick (PSOP & SSOP) and thin (TSOP) tray, and tube (44 PSOP) shipping media deminsional drawings. Can be used to assist in the set up of - Version 1.0 Supported Device Detail Matrix: Part & Package 28F001BX 28F001BX 28F001BX 28F001BX - TSOP www.datasheetarchive.com/files/intel/design/flcomp/devtools/6eaf61a6.htm |
Intel | 05/11/1998 | 4.31 Kb | HTM | 6eaf61a6.htm |
| Web SOP Tray and Tube Media Drawings Intel Corp. (Folsom) Architecture: Type : Last Update: Flash Memory Components Boot Block Shipping Media 6/26/97 11:30:00 AM Vendor Information Tool Description: Contains Jedec thick (PSOP & SSOP) and thin (TSOP) tray, and tube (44 PSOP) shipping media deminsional drawings. Can be used to assist in the set up of automation equipment .0 Supported Device Detail Matrix: Part & Package 28F001BX 28F001BX 28F001BX 28F001BX - TSOP-32 ld 28F002BC 28F002BC 28F002BC 28F002BC www.datasheetarchive.com/files/intel/design/flcomp/devtools/507c2_1a.htm |
Intel | 13/05/1998 | 3.9 Kb | HTM | 507c2_1a.htm |
| Web SOP Tray and Tube Media Drawings Intel Corp. (Folsom) Architecture: Type : Last Update: Flash Memory Components Boot Block Shipping Media 5/8/98 4:04:29 PM Vendor Information Tool Description: Contains Jedec thick (PSOP & SSOP) and thin (TSOP) tray, and tube (44 PSOP) shipping media deminsional drawings. Can be used to assist in the set up of automation equipment .0 Supported Device Detail Matrix: Part & Package 28F001BX 28F001BX 28F001BX 28F001BX - TSOP-32 ld 28F002BC 28F002BC 28F002BC 28F002BC www.datasheetarchive.com/files/intel/design/flcomp/devtools/68a5e1a6.htm |
Intel | 02/08/1998 | 3.96 Kb | HTM | 68a5e1a6.htm |
| Web SOP Tray and Tube Media Drawings Intel Corp. (Folsom) Architecture: Type : Last Update: Flash Memory Components Boot Block Packaging and Shipping Information 10/1/98 4:33:28 PM Vendor Information Tool Description: Contains Jedec thick (PSOP & SSOP) and thin (TSOP) tray, and tube (44 PSOP) shipping media deminsional drawings. Can be used to assist in the set up of Device Detail Matrix: Part & Package 28F001BX 28F001BX 28F001BX 28F001BX - TSOP-32 ld 28F002BC 28F002BC 28F002BC 28F002BC - PSOP www.datasheetarchive.com/files/intel/design/flcomp/devtools/7acca1a6.htm |
Intel | 08/02/1999 | 4.2 Kb | HTM | 7acca1a6.htm |