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Part Manufacturer Description Datasheet BUY
X5169V14I Intersil Corporation X5169V14I, TSOP-14 visit Intersil
X9428WV14T1 Intersil Corporation X9428WV14T1, TSOP-14 visit Intersil
X5165V14I-2.7T1 Intersil Corporation X5165V14I-2.7T1, TSOP-14 visit Intersil
X5329V14-2.7A Intersil Corporation X5329V14-2.7A, TSOP-14 visit Intersil
X9428WV14 Intersil Corporation X9428WV14, TSOP-14 visit Intersil
X5163V14I Intersil Corporation X5163V14I, TSOP-14 visit Intersil

tsop Shipping Trays

Catalog Datasheet MFG & Type PDF Document Tags

MIL-STD-81705

Abstract: tsop Shipping Trays MEDIA AND PACKING Trays Shipping trays are built in compliance with JEDEC thick and thin standard , PACKING Charts of trays for PQFP PGA PLCC TSOP CQFP MQFP SQFP TQFP MSC packages are shown on the , nominal cash reimbursement but it lowers the cost of plastic shipping trays employs several handicapped , shipping arrangements at no charge to the customer 19 TRANSPORT MEDIA AND PACKING All trays will , CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling
Intel
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MIL-STD-81705

Abstract: JEDEC TRAY PLCC TRANSPORT MEDIA AND PACKING 10.1.3. Trays Shipping trays are built in compliance with JEDEC thick and , of plastic shipping trays, employs several handicapped agencies and reduces environmental waste , remaining shelf life. 10.5.2. Shipping Boxes and Cartons Intel products are placed in tubes or trays, or , . Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an , CONFIDENTIAL (until publication date) 2 TRANSPORT MEDIA AND PACKING Table 10-1. PLCC Shipping Tube
Intel
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JEDEC TRAY DIMENSIONS

Abstract: tray bga 0.487 Section A-A [Dimensions in Inches] 240822-3 10.1.3 A5786-01 Trays Shipping trays , of plastic shipping trays, employs several handicapped agencies and reduces environmental waste , remaining shelf life. 10.5.2 Shipping Boxes and Cartons Intel products are placed in tubes or trays , Transport Media and Packing 10.1 Transport Media 10.1.1 10 Tubes Plastic shipping and , Environmental provides all shipping arrangements at no charge to the customer. Phone: 0500 34 10 40 Fax
Intel
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JEDEC TRAY DIMENSIONS tray bga JEDEC tray standard MIL-STD-81705 JEDEC TRAY PGA MATERIALS transport media and packing

MQFP Shipping Trays

Abstract: TSOP32 Package 0.487 Section A-A [Dimensions in Inches] 240822-3 10.1.3 A5786-01 Trays Shipping trays , program offer a nominal cash reimbursement but it lowers the cost of plastic shipping trays, employs , Transport Media and Packing 10.1 Transport Media 10.1.1 10 Tubes Plastic shipping and , Environmental provides all shipping arrangements at no charge to the customer. Phone: 0500 34 10 40 Fax , Shipping Tube Dimensions (In Inches) Lead Type Cross Section (W x H) Outside Dimensions Wall
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MQFP Shipping Trays TSOP32 Package 28F320B3 bga Shipping Trays D 2498 peak tray

Side Brazed Ceramic Dual-In-Line Packages

Abstract: intel packaging databook 10.43 10.43 16.07 23.3 84 1.980 2.170 2.670 x x x x Shipping Media: Trays , . Footprint (Inches) 1.780 UV Erasable Shipping Media: x Trays Comments / Footnotes Through , Max. Footprint (Inches) 0.640 Shipping Media Tubes x Tape & Reel x Trays x , Weight (gm) 1.15 Max. Footprint (Inches) 0.642 Shipping Media: Tape & Reel x Trays , , to detailed discussions of surface mount technology and Intel shipping and packing. Chapter 1
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Side Brazed Ceramic Dual-In-Line Packages intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom

land pattern for TSOP 2-44

Abstract: Wells programming adapter TSOP 48 TSOP/PSOP SOLDER JOINT SMT , .6-14 iii 8/19/97 5:26 PM TOC.DOC E CONTENTS CHAPTER 7 SOP HANDLING 7.1. SOP SHIPPING FORMATS/INFORMATION (TRAYS, TAPE, TUBES). 7-1 7.1.1. SOP Trays , (PSOP), Thin Small Outline Package (TSOP), and Shrink Small Outline Package (SSOP) are the surface , Outstanding in any temperature application Key features of the Thin Small Outline Package (TSOP) include
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land pattern for TSOP 2-44 Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70

PAL 007 pioneer

Abstract: pioneer PAL 007 A TSOP/PSOP SOLDER JOINT SMT , .6-14 iii 8/19/97 5:26 PM TOC.DOC E CONTENTS CHAPTER 7 SOP HANDLING 7.1. SOP SHIPPING FORMATS/INFORMATION (TRAYS, TAPE, TUBES). 7-1 7.1.1. SOP Trays , (PSOP), Thin Small Outline Package (TSOP), and Shrink Small Outline Package (SSOP) are the surface , Outstanding in any temperature application Key features of the Thin Small Outline Package (TSOP) include
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PAL 007 pioneer pioneer PAL 007 A PAL 008 pioneer 648-0482211 sn 7600 n sem 2106 28F800F3 28F160F3

pioneer PAL 007 A

Abstract: PAL 007 pioneer TSOP/PSOP SOLDER JOINT SMT , .6-14 iii 8/19/97 5:26 PM TOC.DOC E CONTENTS CHAPTER 7 SOP HANDLING 7.1. SOP SHIPPING FORMATS/INFORMATION (TRAYS, TAPE, TUBES). 7-1 7.1.1. SOP Trays , (PSOP), Thin Small Outline Package (TSOP), and Shrink Small Outline Package (SSOP) are the surface , Outstanding in any temperature application Key features of the Thin Small Outline Package (TSOP) include
Intel
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str 6654 pin details of str W 6654 Yamaichi Electronics ic197 TSOP56 jackson Meritec 980020-56

TSOP-48 pcb LAYOUT

Abstract: str 6654 TSOP/PSOP SOLDER JOINT SMT , .6-14 iii 8/19/97 5:26 PM TOC.DOC E CONTENTS CHAPTER 7 SOP HANDLING 7.1. SOP SHIPPING FORMATS/INFORMATION (TRAYS, TAPE, TUBES). 7-1 7.1.1. SOP Trays , (PSOP), Thin Small Outline Package (TSOP), and Shrink Small Outline Package (SSOP) are the surface , Outstanding in any temperature application Key features of the Thin Small Outline Package (TSOP) include
Intel
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TSOP-48 pcb LAYOUT pin details of str f 6654 amd socket 940 pinout str W 6654 56-Lead TSOP Package land pattern tsop 66

CERAMIC CHIP CARRIER LCC 68 socket

Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE x 1.980 2.170 2.670 x x x x Shipping Media: Trays Comments / Footnotes , ) Max. Footprint (Inches) UV Erasable x Shipping Media: Carrier x Trays Comments , UV Erasable Shipping Media: x Trays Comments / Footnotes Through Hole Use Only Table 1-8 , x x x x x x x x UV Erasable Shipping Media: Tubes Tape & Reel Trays , ) 0.640 Shipping Media Tubes x Tape & Reel x Trays x Desiccant Pack x Comments
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CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack A5603-01

28 TSSOP JEDEC Thin Matrix Tray outlines

Abstract: tsop tray matrix outline solution Shipping Trays · Conforms to JEDEC Thin Matrix Tray outlines · Bakeable and Conductive Quantity per Tube/Tray Lead Count Package Code Quantity per Tube/Tray Tubes/Trays per Bag , maximum protection for our product and to best suit our customer's needs: 1) Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also provide tape and reel upon customer request. Packing Methods and Quantities Shipping
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28 TSSOP JEDEC Thin Matrix Tray outlines tsop tray matrix outline Shipping Trays ATMEL Packing Methods and Quantities ATMEL 234 tsop Shipping Trays 0637D

tsop tray matrix outline

Abstract: tsop Shipping Trays methods to provide maximum protection for our product and to best suit our customer's needs: 1) Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our , ) SOIC (330 mil) SOIC (450 mil) Sidebraze 2. Shipping Trays · Conforms to JEDEC Thin Matrix Tray outlines · Bakeable and Conductive Quantity Per Tray PACKAGE TSOP LEAD COUNT PKG CODE QTY , Quantities 1. Shipping Tubes · Material: Clear polyvinyl chloride · ESD: Topically coated with
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Atmel 918 JEDEC Matrix Tray outlines EIA-481-x ATMEL Tape and Reel PLCC JEDEC tray JEDEC Matrix Tray outlines soic EIA-481-

IPC-J-STD-001

Abstract: TRAY DAEWON TSOP Packages (TSOP 32L, 40L, 48L, and 56L). This wand transfers TSOP devices from Intel shipped JEDEC trays to Yamaichi programming sockets and back to trays. The TSOP precision wand head utilizes guide pins which , 56L). Tray/ Socket type requirements: All trays shipped by Intel for Flash SOP devices TSOP must , all Intel TSOP (Thin Small Outline Package), PSOP (Plastic Small Outline Package) and SSOP (Shrink , trays. This method minimizes risk of bouncing devices from their pockets. The typical razor blade box
Intel
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IPC-J-STD-001 TRAY DAEWON TSOP 6n1 tube IPC-JSTD-001 VHH10-6N1 Intel Corporation esd flash small outline package guide

tsop Shipping Trays

Abstract: ys TSOP devices will be shipped in JEDEC Standard dimension trays. JEDEC trays all have the same , IP TIO N AMD presents the Thin Small Outline Package. The TSOP is the industry's leading edge , fit memory arrays are driving this package evolution. TSOP offers a form fit close to that of bare die , also support EPROM (OTP/Express ROMTM) technology in TSOP. P rim ary C h a ra c te ris tic s JEDEC , Memory in 32 Lead TSOP 4-158 Thin Small Outline Package P ackag in g Evolution The continuing
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28F010

DAEWON tray tsop 48LD

Abstract: nikon v12B tensions should prevent the trays from breaking and ensure adequate shipping strength. 7.1.3 ESD , above packages TRAYS (Thin) 32L TSOP 40L TSOP 48L TSOP 56L TSOP MINIMUM ORDER QTY. VENDOR , thin JEDEC trays) will require different vacuum wand heads. Socket type requirement: TSOP must use , . Actual Changes to date: *3/20/96 Precision wand for TSOP Thin trays. The thin tray wand has been , handling and programming processes and techniques for all Intel TSOP (Thin Small Outline Package), PSOP
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DAEWON tray tsop 48LD nikon v12B nikon GRAINGER TRAY TSOP 56LD daewon

intel packaging

Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame Shipping Media Tubes Tape & Reel Trays See Note See Note x x Desiccant Pack Comments , 10.43 10.43 10.43 16.07 x 23.3 84 x Shipping Media Tubes Tape & Reel Trays x x , ) Weight (gm) 12* Max. Footprint (Inches) UV Erasable Shipping Media Carrier Tape & Reel Trays , x x x x x x x x x Shipping Media Tubes Tape & Reel Trays Desiccant , x x UV Erasable Shipping Media Tubes Tape & Reel Trays Desiccant Pack Comments/Footnotes
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intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC QFP Shipping Trays INTEL CDIP 40 PIN CH01WIP

TSOP 56 socket

Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC Max Footprint (inches) UV Eraseable Shipping Media Tubes Tape Reel Trays X X Desiccant , 950 2 16 X X UV Eraseable Shipping Media Tubes Tape Reel Trays 1 35 X X X , Footprint (inches) UV Eraseable X Shipping Media Carrier Tape Reel Trays X X Desiccant , Shipping Media Tubes Tape Reel Trays X X X X X X X X X X X X X , X Shipping Media Tubes Tape Reel Trays Desiccant Pack Comments Footnotes Available with
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TSOP 56 socket 50 mil pitch ceramic package 80SM CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip MC00XFLKA NC110XX

JEDEC TRAY DIMENSIONS

Abstract: TSOP 8x14 -SHIPPING TRAY, 32LD, TSOP JEDEC LOW PROFILE, 8 X 14 BODY, 1.0T A1 ^ T O IE H K , / 1 4 0 `C MAX SHIPPING TRAY. TSOP. 32LD. JEDEC LOW PROFILE. 8 X 14 BODY. 1.0T 100 525P 2 T I , _L _L _L 001IHAL RELEASE. NOTE : 1. BAKEABLE TRAYS ARE INTENDED TO BE CONTINUOUSLY BAKED , xxxxxx TSOP 8X14 1.0T MANUFACTURER S NAME DETAIL "E" H ! ïï ! io ! I , PERIPHERY CELLS) SECTION " B - B " SCALE : 6 /1 TOP VIEW DETAIL " B " TSOP 8X14 XXXXXXX VENDOR
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TSOP 8x14 TSOP 48 package tray TSOP 32ld tray JEDEC TRAY 10 X 10 TSOP package tray jedec tray scale 1X105 1X1012 100525P1

ATMEL 234

Abstract: ATMEL Packing Methods and Quantities R 23 Sidebraze 32 B 12 2. Shipping Trays · Conforms to JEDEC Thin Matrix Tray , maximum protection for our product and to best suit our customer's needs: 1) Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but , . Shipping Tubes · Material: Clear polyvinyl chloride · ESD: Topically coated with anti-static solution , /Tray 28 32 40 40 48 T T T V T 234 156 120 160 96 TSOP 3. Unit Pack/Boxes ·
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ATMEL 210 ATMEL shipping label ATMEL Tape and Reel code ATMEL JEDEC SOIC ATMEL SOIC tape and reel atmel tape and reel JEDEC SOIC 0637B

JEDEC Matrix Tray outlines

Abstract: ATMEL EIA-481-x Packing methods to provide maximum protection for our product and to best suit our customer's needs: 1) Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our , ) SOIC (330 mil) SOIC (450 mil) Sidebraze 2. Shipping Trays · Conforms to JEDEC Thin Matrix Tray outlines · Bakeable and Conductive Quantity Per Tray PACKAGE TSOP LEAD COUNT PKG CODE QTY , Quantities 1. Shipping Tubes · Material: Clear polyvinyl chloride · ESD: Topically coated with
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ATMEL EIA-481-x Packing JEDEC tray standard for PLCC JEDEC TRAY PLCC TSOP 54 tray JEDEC tray standard 13
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