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PC-SOIC/DIP24-01 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SOJ24A_SOJ24B_SOJ24C_SOJ24D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 24; Bottom Pin Count: 24; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.167 - 0.367; Adapter Size Length X Width (in.): 1.2 x 0.4; Part Description: SOIC to DIP Converter; ri Buy
PC-SOIC/DIP8-01 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SO8A_S08B_SO8E; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 8; Bottom Pin Count: 8; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.15 - 0.375; Adapter Size Length X Width (in.): 0.4 x 0.4; Part Description: SOIC to DIP Converter; ri Buy
PC-SOIC/DIP20-04 Ironwood Electronics SOIC to DIP Package Converters; Top Package Code: SO20A_SO20B_SO20D; Bottom Package Code: 0.3; Top Pitch (mm): 1.27; Bottom Pitch (mm): 2.54; Top Pin Count: 20; Bottom Pin Count: 20; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.275 - 0.475; Adapter Size Length X Width (in.): 1 x 0.4; Part Description: SOIC to DIP Converter; ri Buy

tsop Shipping Trays

Catalog Datasheet Results Type PDF Document Tags
Abstract: methods to provide maximum protection for our product and to best suit our customer's needs: 1) Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our , ) SOIC (330 mil) SOIC (450 mil) Sidebraze 2. Shipping Trays · Conforms to JEDEC Thin Matrix Tray outlines · Bakeable and Conductive Quantity Per Tray PACKAGE TSOP LEAD COUNT PKG CODE QTY , Quantities 1. Shipping Tubes · Material: Clear polyvinyl chloride · ESD: Topically coated with ... Original
datasheet

3 pages,
25.04 Kb

Shipping Trays JEDEC tray standard for PLCC ATMEL SOIC tape and reel atmel tape and reel JEDEC SOIC PLCC JEDEC tray ATMEL Tape and Reel JEDEC Matrix Tray outlines ATMEL Packing Methods and Quantities EIA-481-x Atmel 918 tsop Shipping Trays tsop tray matrix outline datasheet abstract
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Abstract: methods to provide maximum protection for our product and to best suit our customer's needs: 1) Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our , ) SOIC (330 mil) SOIC (450 mil) Sidebraze 2. Shipping Trays · Conforms to JEDEC Thin Matrix Tray outlines · Bakeable and Conductive Quantity Per Tray PACKAGE TSOP LEAD COUNT PKG CODE QTY , Quantities 1. Shipping Tubes · Material: Clear polyvinyl chloride · ESD: Topically coated with ... Original
datasheet

3 pages,
12.36 Kb

tsop Shipping Trays JEDEC tray standard 13 ATMEL shipping label ATMEL Tape and Reel JEDEC TRAY PLCC ATMEL Packing Methods and Quantities EIA-481-x JEDEC tray standard for PLCC ATMEL EIA-481-x Packing JEDEC Matrix Tray outlines datasheet abstract
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Abstract: -SHIPPING TRAY, 32LD, TSOP JEDEC LOW PROFILE, 8 X 14 BODY, 1.0T A1 ^ T O IE H K , / 1 4 0 `C MAX SHIPPING TRAY. TSOP. 32LD. JEDEC LOW PROFILE. 8 X 14 BODY. 1.0T 100 525P 2 T I , _L _L _L 001IHAL 001IHAL RELEASE. NOTE : 1. BAKEABLE TRAYS ARE INTENDED TO BE CONTINUOUSLY BAKED , xxxxxx TSOP 8X14 1.0T MANUFACTURER S NAME DETAIL "E" H ! ïï ! io ! I , PERIPHERY CELLS) SECTION " B - B " SCALE : 6 /1 TOP VIEW DETAIL " B " TSOP 8X14 XXXXXXX VENDOR ... OCR Scan
datasheet

3 pages,
96.37 Kb

TSOP 32ld tray shipping tray TSOP 8x14 TSOP 48 package tray JEDEC TRAY DIMENSIONS 001IHAL 001IHAL abstract
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Abstract: ys TSOP devices will be shipped in JEDEC Standard dimension trays. JEDEC trays all have the same , IP TIO N AMD presents the Thin Small Outline Package. The TSOP is the industry's leading edge , fit memory arrays are driving this package evolution. TSOP offers a form fit close to that of bare die , also support EPROM (OTP/Express ROMTM) technology in TSOP. P rim ary C h a ra c te ris tic s JEDEC , Memory in 32 Lead TSOP 4-158 Thin Small Outline Package P ackag in g Evolution The continuing ... OCR Scan
datasheet

4 pages,
97.84 Kb

tsop Shipping Trays datasheet abstract
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Abstract: R 23 Sidebraze 32 B 12 2. Shipping Trays · Conforms to JEDEC Thin Matrix Tray , maximum protection for our product and to best suit our customer's needs: 1) Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but , Shipping Tubes · Material: Clear polyvinyl chloride · ESD: Topically coated with anti-static solution , /Tray 28 32 40 40 48 T T T V T 234 156 120 160 96 TSOP 3. Unit Pack/Boxes · ... Original
datasheet

4 pages,
22.52 Kb

tsop Shipping Trays atmel 450 ATmel 750 ATMEL Package standard S1 ATMEL JEDEC tray standard for PLCC ATMEL Tape and Reel code ATMEL Packing information JEDEC SOIC atmel tape and reel JEDEC SOIC EIA-481-x ATMEL JEDEC SOIC ATMEL SOIC tape and reel datasheet abstract
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Abstract: Shipping Media Tubes Tape & Reel Trays See Note See Note x x Desiccant Pack Comments , 10.43 10.43 10.43 16.07 x 23.3 84 x Shipping Media Tubes Tape & Reel Trays x x , ) Weight (gm) 12* Max. Footprint (Inches) UV Erasable Shipping Media Carrier Tape & Reel Trays , x x x x x x x x x Shipping Media Tubes Tape & Reel Trays Desiccant , x x UV Erasable Shipping Media Tubes Tape & Reel Trays Desiccant Pack Comments/Footnotes ... Original
datasheet

21 pages,
439.88 Kb

PLCC 68 intel package dimensions PLCC 68 intel reflow QFP 64 Cavity dip transistor KD 503 SIMM 80 jedec Shipping Trays CERAMIC PIN GRID ARRAY CPGA 64 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 28 PIN INTEL CDIP 40 PIN QFP 64 Cavity package 68 CERAMIC LEADLESS CHIP CARRIER LCC datasheet abstract
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Abstract: Max Footprint (inches) UV Eraseable Shipping Media Tubes Tape Reel Trays X X Desiccant , 950 2 16 X X UV Eraseable Shipping Media Tubes Tape Reel Trays 1 35 X X X , Footprint (inches) UV Eraseable X Shipping Media Carrier Tape Reel Trays X X Desiccant , Shipping Media Tubes Tape Reel Trays X X X X X X X X X X X X X , X Shipping Media Tubes Tape Reel Trays Desiccant Pack Comments Footnotes Available with ... Original
datasheet

19 pages,
220.72 Kb

240817 50 mil pitch ceramic package CERAMIC CHIP CARRIER LCC 68 socket CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package 64 CERAMIC LEADLESS CHIP CARRIER LCC TSOP 56 socket datasheet abstract
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Abstract: Tolerance: 12. Package Type: ns � �% Plastic DIP PLCC TSOP Standard Pinout TSOP Reverse Pinout Commercial (0癈 to +70癈) Industrial (-40癈 to +85癈) Pin Count 13. Temperature Grade: 14. Shipping Information Tubes (PLCC, PDIP) Trays (TSOP only) Tape and Reel (PLCC, TSOP) In addition to the ExpressROM minimum ... Original
datasheet

2 pages,
16.29 Kb

amd part "marking" amd part marking AMD marking CODE datasheet abstract
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Abstract: TRANSPORT MEDIA AND PACKING 10.1.3. Trays Shipping trays are built in compliance with JEDEC thick and , of plastic shipping trays, employs several handicapped agencies and reduces environmental waste. , remaining shelf life. 10.5.2. Shipping Boxes and Cartons Intel products are placed in tubes or trays, or , 10.1.1. Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an , CONFIDENTIAL (until publication date) 2 TRANSPORT MEDIA AND PACKING Table 10-1. PLCC Shipping Tube ... Original
datasheet

31 pages,
929.65 Kb

100L bga Shipping Trays DIMENSIONS PQFP 132 JEDEC TRAY PLCC PEAK TRAY bga PEAK tray drawing PLCC 44 intel package dimensions thick bga tray size tray 20 x 14 INTEL PLCC 68 dimensions TRAY DIMENSIONS 132 PGA INTEL 810 AZ 2535 datasheet abstract
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Abstract: solution Shipping Trays · Conforms to JEDEC Thin Matrix Tray outlines · Bakeable and Conductive Quantity per Tube/Tray Lead Count Package Code Quantity per Tube/Tray Tubes/Trays per Bag , maximum protection for our product and to best suit our customer's needs: 1) Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also provide tape and reel upon customer request. Packing Methods and Quantities Shipping ... Original
datasheet

4 pages,
25.41 Kb

24 unit matrix TRAY ATMEL shipping label ATMEL EIA-481-x Packing TQFP Shipping Trays JEDEC TRAY PLCC tsop 66 EIA-481-x ATMEL 234 ATMEL SOIC tape and reel atmel tape and reel JEDEC Matrix Tray outlines ATMEL Packing Methods and Quantities datasheet abstract
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Datasheet Content (non pdf)

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Over 1.1 million files (1986-2014): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer.
 
The three SOP offerings are TSOP (Thin Small Outline Package), PSOP (Plastic Small Outline Package INTRODUCTION Intel ships SOP product in JEDEC standard dimension trays, tape and reel, and tubes (44L PSOP only). All JEDEC standard trays have the same outside dimensions and thus are stackable for ease of ( Detailed View) Table 1.1. SOP Thick Tray Physical Dimensions 32-Lead TSOP 40-Lead TSOP 48-Lead TSOP 56-Lead TSOP 56-Lead SSOP 44-Lead PSOP Pocket Center Location to Edge Y
www.datasheetarchive.com/files/intel/design/flcomp/packdata/2814-v3.htm
Intel 31/01/1997 6.46 Kb HTM 2814-v3.htm
will sort the programmed and laser marked ICs. To load the AH 500, simply place up to six trays of bent leads Program Intel Flash memory and other programmable devices in 32-56 TSOP and other IO, ACTEL, XILINX, or your custom programmer Handles tape and reel, tube and tray shipping : Part & Package 28F001BX 28F001BX 28F001BX 28F001BX - PDIP-32 PDIP-32 PDIP-32 PDIP-32 ld 28F001BX 28F001BX 28F001BX 28F001BX - PLCC-32 PLCC-32 PLCC-32 PLCC-32 ld 28F001BX 28F001BX 28F001BX 28F001BX - TSOP-32 ld 28F002BC 28F002BC 28F002BC 28F002BC - PSOP-44 PSOP-44 PSOP-44 PSOP-44 ld 28F002BC 28F002BC 28F002BC 28F002BC - TSOP-40 ld 28F002BV 28F002BV 28F002BV 28F002BV - TSOP-40 ld 28F002BX/BL 28F002BX/BL 28F002BX/BL 28F002BX/BL - TSOP-40 ld 28F004B3 28F004B3 28F004B3 28F004B3
www.datasheetarchive.com/files/intel/design/flcomp/devtools/44d9e1a6.htm
Intel 08/11/1997 5.45 Kb HTM 44d9e1a6.htm
will sort the programmed and laser marked ICs. To load the AH 500, simply place up to six trays of bent leads Program Intel Flash memory in 32, 40, 48, &56L TSOP, uBGA, SSOP, and PSOP custom programmer Handles tape and reel, tube and tray shipping media (input and output) File - PDIP-32 PDIP-32 PDIP-32 PDIP-32 ld 28F001BX 28F001BX 28F001BX 28F001BX - PLCC-32 PLCC-32 PLCC-32 PLCC-32 ld 28F001BX 28F001BX 28F001BX 28F001BX - TSOP-32 ld 28F002BC 28F002BC 28F002BC 28F002BC - PSOP-44 PSOP-44 PSOP-44 PSOP-44 ld 28F002BC 28F002BC 28F002BC 28F002BC - TSOP-40 ld 28F002BV 28F002BV 28F002BV 28F002BV - TSOP-40 ld 28F002BX/BL 28F002BX/BL 28F002BX/BL 28F002BX/BL - TSOP-40 ld 28F004BV/BE 28F004BV/BE 28F004BV/BE 28F004BV/BE - TSOP-40 ld 28F004BX/BL 28F004BX/BL 28F004BX/BL 28F004BX/BL -
www.datasheetarchive.com/files/intel/design/flcomp/devtools/4d37e1a6.htm
Intel 05/02/1998 5.73 Kb HTM 4d37e1a6.htm
No abstract text available
www.datasheetarchive.com/download/99481368-260252ZC/2814.doc
Intel 26/03/1997 1297.5 Kb DOC 2814.doc
No abstract text available
www.datasheetarchive.com/download/27146894-173515ZC/2814.doc
Intel 03/01/1996 1297.5 Kb DOC 2814.doc
No abstract text available
www.datasheetarchive.com/download/6492222-267622ZC/2814.doc
Intel 03/01/1996 1297.5 Kb DOC 2814.doc
will sort the programmed and laser marked ICs. To load the AH 500, simply place up to six trays of bent leads Program Intel Flash memory in 32, 40, 48, &56L TSOP, uBGA, SSOP, and PSOP custom programmer Handles tape and reel, tube and tray shipping media (input and output) File - TSOP-40 ld 28F004S5 28F004S5 28F004S5 28F004S5 - TSOP-40 ld 28F004SC 28F004SC 28F004SC 28F004SC - TSOP-40 ld 28F008S3 28F008S3 28F008S3 28F008S3 - PSOP-44 PSOP-44 PSOP-44 PSOP-44 ld 28F008S3 28F008S3 28F008S3 28F008S3 - TSOP-40 ld 28F008S3 28F008S3 28F008S3 28F008S3 - uBGA-40 ball 28F008S5 28F008S5 28F008S5 28F008S5 - PSOP-44 PSOP-44 PSOP-44 PSOP-44 ld 28F008S5 28F008S5 28F008S5 28F008S5 - TSOP-40 ld 28F008S5 28F008S5 28F008S5 28F008S5 - uBGA-40
www.datasheetarchive.com/files/intel/design/flcomp/devtools/4d3861a6.htm
Intel 05/02/1998 5.63 Kb HTM 4d3861a6.htm
will sort the programmed and laser marked ICs. To load the AH 500, simply place up to six trays of bent leads Program Intel Flash memory and other programmable devices in 32-56 TSOP and other IO, ACTEL, XILINX, or your custom programmer Handles tape and reel, tube and tray shipping : Part & Package 28F004S3 28F004S3 28F004S3 28F004S3 - PSOP-44 PSOP-44 PSOP-44 PSOP-44 ld 28F004S3 28F004S3 28F004S3 28F004S3 - TSOP-40 ld 28F004S5 28F004S5 28F004S5 28F004S5 - PSOP-44 PSOP-44 PSOP-44 PSOP-44 ld 28F004S5 28F004S5 28F004S5 28F004S5 - TSOP-40 ld 28F004SC 28F004SC 28F004SC 28F004SC - PSOP-44 PSOP-44 PSOP-44 PSOP-44 ld 28F004SC 28F004SC 28F004SC 28F004SC - TSOP-40 ld 28F008S3 28F008S3 28F008S3 28F008S3 - PSOP-44 PSOP-44 PSOP-44 PSOP-44 ld 28F008S3 28F008S3 28F008S3 28F008S3 -
www.datasheetarchive.com/files/intel/design/flcomp/devtools/44da61a6.htm
Intel 08/11/1997 5.4 Kb HTM 44da61a6.htm
laser marked ICs. To load the AH 500, simply place up to six trays of ICs into the input section of , &56L TSOP, uBGA, SSOP, and PSOP User-friendly interface Programmer options: System General shipping media (input and output) File Attachments: Supported Device Detail Matrix: Part & Package 28F001BX 28F001BX 28F001BX 28F001BX - PDIP-32 PDIP-32 PDIP-32 PDIP-32 ld 28F001BX 28F001BX 28F001BX 28F001BX - PLCC-32 PLCC-32 PLCC-32 PLCC-32 ld 28F001BX 28F001BX 28F001BX 28F001BX - TSOP-32 ld 28F002BC 28F002BC 28F002BC 28F002BC - PSOP-44 PSOP-44 PSOP-44 PSOP-44 ld 28F002BC 28F002BC 28F002BC 28F002BC - TSOP-40 ld 28F002BX/BL 28F002BX/BL 28F002BX/BL 28F002BX/BL - TSOP-40 ld 28F004BX/BL 28F004BX/BL 28F004BX/BL 28F004BX/BL - TSOP-40 ld
www.datasheetarchive.com/files/intel/design/flcomp/devtools/713e21a6.htm
Intel 05/11/1998 5.24 Kb HTM 713e21a6.htm
laser marked ICs. To load the AH 500, simply place up to six trays of ICs into the input section of , &56L TSOP, uBGA, SSOP, and PSOP User-friendly interface Programmer options: System General shipping media (input and output) File Attachments: Supported Device Detail Matrix: Part & Package 28F001BX 28F001BX 28F001BX 28F001BX - PDIP-32 PDIP-32 PDIP-32 PDIP-32 ld 28F001BX 28F001BX 28F001BX 28F001BX - PLCC-32 PLCC-32 PLCC-32 PLCC-32 ld 28F001BX 28F001BX 28F001BX 28F001BX - TSOP-32 ld 28F002BC 28F002BC 28F002BC 28F002BC - PSOP-44 PSOP-44 PSOP-44 PSOP-44 ld 28F002BC 28F002BC 28F002BC 28F002BC - TSOP-40 ld 28F002BX/BL 28F002BX/BL 28F002BX/BL 28F002BX/BL - TSOP-40 ld 28F004BX/BL 28F004BX/BL 28F004BX/BL 28F004BX/BL - TSOP-40 ld
www.datasheetarchive.com/files/intel/design/flcomp/devtools/6b2861a6.htm
Intel 02/08/1998 4.91 Kb HTM 6b2861a6.htm