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FPF1C2P5BF07A Fairchild Semiconductor Corporation F1 Module solution for PV-Application, 24LD, HPM, PDD STD, F1 PKG, PRESSFIT, 110/TRAY pdf Buy
FPF1C2P5MF07AM Fairchild Semiconductor Corporation F1 Module solution for PV-Application, 24LD, HPM, PDD STD, F1 PKG, PRESSFIT, 110/TRAY pdf Buy
FAN8036L Fairchild Semiconductor Corporation Standard PWM Controllers, 48LD,PQFP,JEDEC MS-022, 14MM SQUARE,FUSED DAP, 840/TRAY pdf Buy

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TRAY - - 20 (Aug 2016) Chip One Exchange Buy
TRAYS - MISC 65 (Sep 2016) Area51 Buy

tray bga 6x6

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: ) 12*30 125 BAKE BGA 6X6 LA69-00639A LA69-00639A ADS11400 ADS11400 52ULGA 52ULGA,12*17(8*12*),ADS16449 ADS16449 6*12 , Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1(8*12),256M DDR 5G , LB69-00027A LB69-00027A FBGA,17x17 (6x15),1F1-1717-A19 1F1-1717-A19 6*15 125 BAKE BGA 17X17 17X17 LB69 , -00807A -00807A ADS13863 ADS13863 119/153BGA 119/153BGA,(6*11) 1422 6*11 130 MAX BGA-1422-A LA69-00231A LA69-00231A ADS05534 ADS05534 127TBGA 127TBGA , -PBGA,6*11 6*11 130 MAX BGA-1422-A LA69-00240A LA69-00240A WDS12334 WDS12334 48TBGA 48TBGA,7.5*9.5 (8*16) 8*16 ... Samsung Electronics
Original
datasheet

7 pages,
173.55 Kb

LA69-01189A EPAK TRAY 121-FBGA tray cabga 9x9 240-FBGA Kostat 14X18 JEDEC Kostat FBGA tqfp 10x10 tray 90-FBGA-11 78BOC 78BOC-11 ePAK BGA 5x5 tray 153FBGA-9 FCMSP 169fbga-12.0x16.0-8x16-0 BGA 6x6 tray tray bga 6x6 FBGA tray kostat 153FBGA 1f1-1717-a19 TEXT
datasheet frame
Abstract: solution Voltage regulators for BGA IC JTAG True target package emulation Low mass for easy assembly FPGA All package types (BGA, MLF, SOIC, etc.) accommodated Tape and Reel or tray packaging , have been lumped into this category. Pictured at right is a PGA to BGA converter which supports a , QFP to DIP QIP to DIP SOIC to ZIP QFP to PGA PGA to BGA PGA to DIP TSOP to SOIC BGA to QFP , (Device converters). Our package converters, like the BGA to QFP converter shown below, are designed with ... Ironwood Electronics
Original
datasheet

26 pages,
581.19 Kb

PC-DIP/PLCC-68000-01 68HC11 PLCC84 MC68EC20 pinout PLCC32/DIP32 INTEL 486 sx sl pinout 53C700 INTEL DX4 68hc001 uPD70236 TQ2E-24V XE4006E plcc44 pinout numbers soic40 Aromat TQ2E-24V INTEL 486 dx2 UT1553BCRTM 84 pin plcc ic base sk 8085 R50-E2Y2-24 TEXT
datasheet frame
Abstract: built up our B BGA, WCSP D F H L M T Bare Chip Plastic QFP Ceramic DIP Ceramic QFP , tape & reel (tray) TCP BL 2 directions Tape & reel BACK TCP BR 2 directions TCP BT 2 directions , * 1.2 5X5 1.2 11 X 11Row 3Row 6X6 1.2 0.5 11 X 11Row 6X6 1.2 PFBGA7U , 1.0 11 X 11Row 3Row 6X6 1.0 0.5 11 X 11Row 6X6 1.0 VFBGA7H-144 VFBGA7H-144 0.5 13 X , * Body Size (mm) Ball Array ASICs Package Externals Plastic BGA (PBGA) WCSP IC Chip ... Seiko Epson
Original
datasheet

31 pages,
8645.28 Kb

S1L30000 S1L7 class-d-amp Epson SuperFlash TTL catalog t-con lvds Epson LQ 450 RTL 204 601 UXGA tcon s1k500 S1K60000 SMART ASIC 197 S1L50062 S1X65263 tcon 17 epson EPSON tcon tcon mini-lvds S1L50552 TEXT
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , , page 27 and Table 2-3, page 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip ... Xilinx
Original
datasheet

118 pages,
4620.46 Kb

TsoP 20 Package XILINX TT 2076 90Pb 10Sn solder paste XCDAISY XCS20 TQ144 country of origin cpga material declaration top marking 957 so8 reballing recommended layout CSG324 BGA reflow guide SMD MARKING CODE C1G XC2VP7 reflow profile UG112 smd code v36 UG112 CF1752 UG112 pcb footprint FS48, and FSG48 UG112 xilinx part marking UG112 xilinx topside marking UG112 UG112 UG112 TEXT
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , 26 and Table 2-3, page 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 36 , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip ... Xilinx
Original
datasheet

118 pages,
4608.19 Kb

UG112 XC2C256-7PQ108I xc9572xl vqg XC2VP7 reflow profile sn63pb37 solder SPHERES TT 2076 FF676 jedec so8 Wire bond gap qfn 3x3 tray dimension SPARTAN-II xc2s50 pq208 XCDAISY HQG160 xilinx topside marking diode MARKING A1 v34 xilinx part marking PC84/PCG84 SMT, FPGA FINE PITCH BGA 456 BALL XILINX/part marking Hot TEXT
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , Table 2-3, page 38. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 38. Changed , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip ... Xilinx
Original
datasheet

122 pages,
4619.88 Kb

304 QFP amkor smd diode JC 0p xilinx XC2V6000-FF1152 TT 2076 xc9572xl vqg bga rework fcBGA PACKAGE thermal resistance CSG484 pcb footprint FS48, and FSG48 PC84/PCG84 top marking 957 so8 FF1148 qfn 3x3 tray dimension UG112 reballing UG112 FGG484 UG112 HQG160 UG112 UG112 UG112 xilinx topside marking xilinx part marking TEXT
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , 27 and Table 2-3, page 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 36 , . . . . . Cavity-Up Plastic BGA Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . ... Xilinx
Original
datasheet

118 pages,
4609.77 Kb

TT 2076 TSOP 54 land pattern XC4VLX25 cmos 668 fcbga FFG676 XCMECH-FG676 XC2S50 PQG208 XC3SD1800A-4CS484LI reballing XC3S400AN-4FG400I jedec so8 Wire bond gap pcb footprint FS48, and FSG48 XC5VLX330T-1FF1738I XCDAISY UG112 qfn 3x3 tray dimension UG112 UG112 UG112 TEXT
datasheet frame
Abstract: Ball Grid Array (BGA) connectors for dense mezzanine board packaging operating at extremely high signal , architectures 6x6 midplane headers provide 36 crossover pairs · Available with or without polarization and , Part References 6x6 vertical header with right guide 6x6 vertical header with right guide 6x6 vertical header 6x6 vertical header with right guide 4x4 vertical header 4x4 d aughter card receptacle ... FCI
Original
datasheet

100 pages,
5615.93 Kb

43356 5159 009 28 pin zif socket 1.27mm pitch 10060905-101LF mini PCIe 52 pin vertical 10089485-1E03LF fci round shell connector sfp 2x3 DDR3 240 PCB Connector Footprint sca-2 40 pin to sata electronic passive components catalog VCSEL array HDMI PCI x16 footprint fingers FPC high speed 6G connector 8609 396 81 TEXT
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Abstract: )”, and Table 1-2: “Xilinx Device Marking Definition—Example”. Updated “Flip-Chip BGA , Updated “Recommended PCB Design Rules for BGA, CSP, and CCGA Packages,” page 87; added missing (D , 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 36. Changed link from , . . . . . Cavity-Up Plastic BGA Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . ... Xilinx
Original
datasheet

124 pages,
4693.46 Kb

BFG95 UG112 TEXT
datasheet frame
Abstract: 41 3.3.3 Shipping Tray Vendor , Shipping Tray Vendor , a square 6x6 grid of rows of ball connections in the middle area of the package. See Figure 3 ... Intel
Original
datasheet

56 pages,
373.64 Kb

XScale 80219 intel 80219 TEXT
datasheet frame

Archived Files

Abstract Saved from Date Saved File Size Type Download
No abstract text available
/datasheets/files/kaleidoscope/cad/capilano - designworks 4.3.1/mac/dwm_installer.hqx
Kaleidoscope 10/04/2005 16069.24 Kb HQX dwm_installer.hqx