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EP3SL150F780C4LNES Altera Corporation STRATIX III FPGA 150K 780 BGA ri Buy
EP3SL150F780C3NES Altera Corporation STRATIX III FPGA 150K 780 BGA ri Buy
EP3SL150F780C4NES Altera Corporation STRATIX III FPGA 150K 780 BGA ri Buy

tray bga 6x6

Catalog Datasheet Results Type PDF Document Tags
Abstract: ) 12*30 125 BAKE BGA 6X6 LA69-00639A LA69-00639A ADS11400 ADS11400 52ULGA 52ULGA,12*17(8*12*),ADS16449 ADS16449 6*12 , Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1(8*12),256M DDR 5G , LB69-00027A LB69-00027A FBGA,17x17 (6x15),1F1-1717-A19 1F1-1717-A19 6*15 125 BAKE BGA 17X17 17X17 LB69-00002A LB69-00002A ADS12347 ADS12347 , ADS13863 ADS13863 119/153BGA 119/153BGA,(6*11) 1422 6*11 130 MAX BGA-1422-A LA69-00231A LA69-00231A ADS05534 ADS05534 127TBGA 127TBGA , 153FC-PBGA 153FC-PBGA,6*11 6*11 130 MAX BGA-1422-A LA69-00240A LA69-00240A WDS12334 WDS12334 48TBGA 48TBGA,7.5*9.5 (8*16) 8*16 ... Original
datasheet

7 pages,
173.55 Kb

78BOC-11 FBGA tray kostat fBGA package tray 12 x 19 PBGA-2727 SAMSUNG MCP 78BOC 96BOC-7 LA69-01189A 240-FBGA JEDEC Kostat FBGA 121-FBGA EPAK TRAY ePAK BGA 5x5 tray 60WMBG 48TBGA 60WMBG abstract
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Abstract: solution Voltage regulators for BGA IC JTAG True target package emulation Low mass for easy assembly FPGA All package types (BGA, MLF, SOIC, etc.) accommodated Tape and Reel or tray packaging , have been lumped into this category. Pictured at right is a PGA to BGA converter which supports a , QFP to DIP QIP to DIP SOIC to ZIP QFP to PGA PGA to BGA PGA to DIP TSOP to SOIC BGA to QFP , (Device converters). Our package converters, like the BGA to QFP converter shown below, are designed with ... Original
datasheet

26 pages,
581.19 Kb

Aromat TQ2E-24V PC-DIP/PLCC-8085-P-01 nec a1010 TQ2E-24V PC-DIP/SOIC40-01 PLCC32/DIP32 68HC11 PLCC84 53C700 SK-PLCC44-Z-02 PC-DIP/PLCC-68000-01 pinout PLCC32/DIP32 UT1553BCRTM plcc44 pinout numbers datasheet abstract
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , , page 27 and Table 2-3, page 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip BGA ... Original
datasheet

118 pages,
4620.46 Kb

qfn 3x3 tray dimension EF668 TT 2076 top marking 957 so8 XC5VLX XCDAISY xilinx part marking SMD BGA 672 DRAWING Alpha WS609 solder 90Pb 10Sn solder paste recommended layout CSG324 SMD MARKING CODE C1G XCS20 TQ144 country of origin UG112 UG112 abstract
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , 27 and Table 2-3, page 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 36. , . . . . . Cavity-Up Plastic BGA Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . ... Original
datasheet

118 pages,
4609.77 Kb

XC4013XL PIN BG256 XCMECH-FG676 XC4VLX25 cmos 668 fcbga XCS20 TQ144 country of origin XCS20XL pqg208 TSOP 54 land pattern TT 2076 FG484 FFG676 XC3SD1800A-4CS484LI reballing XC3S400AN-4FG400I pcb footprint FS48, and FSG48 UG112 UG112 abstract
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , Table 2-3, page 38. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 38. Changed , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip BGA ... Original
datasheet

122 pages,
4619.88 Kb

XCDAISY WS609 bga rework TT 2076 xc9572xl vqg CSG484 pcb footprint FS48, and FSG48 PC84/PCG84 smd diode JC 0p 304 QFP amkor die electric sealer fcBGA PACKAGE thermal resistance xilinx topside marking xilinx part marking UG112 UG112 abstract
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , 26 and Table 2-3, page 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 36. , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip BGA ... Original
datasheet

118 pages,
4608.19 Kb

SF363 XC2C256-7PQ108I die electric sealer diode MARKING A1 v34 UG112 1466 ball FCBGA xc9572xl vqg FFG676 XCDAISY XC2VP7 reflow profile sn63pb37 solder SPHERES jedec so8 Wire bond gap HQG160 UG112 abstract
datasheet frame
Abstract: built up our B BGA, WCSP D F H L M T Bare Chip Plastic QFP Ceramic DIP Ceramic QFP , tape & reel (tray) TCP BL 2 directions Tape & reel BACK TCP BR 2 directions TCP BT 2 directions , * 1.2 5X5 1.2 11 X 11Row 3Row 6X6 1.2 0.5 11 X 11Row 6X6 1.2 PFBGA7U-144 PFBGA7U-144 , VFBGA6H-121 VFBGA6H-121 144 Thickness Max. Full 4X4 1.0 Full 5X5 1.0 11 X 11Row 3Row 6X6 1.0 0.5 11 X 11Row 6X6 1.0 VFBGA7H-144 VFBGA7H-144 0.5 13 X 13Row 4Row 7X7 1.0 161 ... Original
datasheet

31 pages,
8645.28 Kb

Epson SuperFlash QFN5-32 Epson LQ 450 WCSP-16 t-con lvds TTL catalog RTL 204 601 s1k500 UXGA tcon tcon 17 epson EPSON tcon S1L50062 SMART ASIC 197 S1K60000 datasheet abstract
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Abstract: Ball Grid Array (BGA) connectors for dense mezzanine board packaging operating at extremely high signal , architectures 6x6 midplane headers provide 36 crossover pairs ยท Available with or without polarization and , Part References 6x6 vertical header with right guide 6x6 vertical header with right guide 6x6 vertical header 6x6 vertical header with right guide 4x4 vertical header 4x4 d aughter card receptacle ... Original
datasheet

100 pages,
5615.93 Kb

XCEDE optical qsfp aoc reliability QSFP 40G transceiver pcb edge CONNECTOR 1.27mm pitch 4 pin mini pcie connector 52 pin vertical LF 952 cable car DDR3 240 PCB Connector Footprint sca-2 40 pin to sata sfp 2x3 VCSEL array HDMI fci round shell connector mini PCIe 52 pin vertical datasheet abstract
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Abstract: 41 3.3.3 Shipping Tray , . 41 Shipping Tray Vendor , perimeter array package with 508 ball connections in the outer area of the package and a square 6x6 grid of ... Original
datasheet

56 pages,
419.88 Kb

daewon BGA 6x6 tray 273416 Intel StrataFlash Memory j3 datasheet abstract
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Abstract: STM32F103T6 STM32F103T6 STM32F103C6 STM32F103C6 STM32F103R6 STM32F103R6 STM32F101T6 STM32F101T6 STM32F101C6 STM32F101C6 STM32F101R6 STM32F101R6 0 36 pins QFN (6x6) Both , embedded Flash dispatched on 7 packages BGA (10x10) BGA (10x10) Software and tools The STM32 STM32 ... Original
datasheet

35 pages,
2645.46 Kb

lenovo inverter board schematic pure sine wave dimmer EVALVIPER17H-6W hp laptop inverter board schematic schematic lcd inverter dell lenovo laptop battery schematic schematic diagram of laptop dell Connecting the FSMC to the LCD Intel dell laptop lcd inverter circuit diagram of smps dell hp laptop ac adapter schematics diagram STV200N55F3 STV250N55F3 STV200N55F3 abstract
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Datasheet Content (non pdf)

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Over 1.1 million files (1986-2014): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer.
 
(This file must be converted with BinHex 4.0) :% !!! !! # !!! !!!!!!!!!!!!!!!!X,!!!!)!%"!3!!!!!!!!!!!%!!"Q3!2rrrrm!!!!!rrrrr`! !!!!!!!!$!!!#3`!!!!%!!!QB!!!+X!!!,#3!!!!"!!!!!!!!!!!!!!!!!!!!!!! !! !!!!!!!!!!!!
www.datasheetarchive.com/files/kaleidoscope/cad/capilano - designworks 4.3.1/mac/dwm_installer.hqx
Kaleidoscope 10/04/2005 16069.24 Kb HQX dwm_installer.hqx