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SN65220YZBR Texas Instruments 60W, UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE, GREEN, BGA-4 ri BuyFREE Buy
SN65220YZBT Texas Instruments 60W, UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE, GREEN, BGA-4 ri BuyFREE Buy
FSA644BUCX Fairchild Semiconductor Corporation 2:1 MIPI D-PHY (1.5Gbps) 4-Data Lane Switch, 36 BALL WLCSP, 6X6 ARRAY, 0.4MM PITCH, 250UM BALL, 534UM MAX THICKNESS, 3000/TAPE REEL ri Buy

tray bga 6x6

Catalog Datasheet Type PDF Document Tags
Abstract: ) 12*30 125 BAKE BGA 6X6 LA69-00639A LA69-00639A ADS11400 ADS11400 52ULGA 52ULGA,12*17(8*12*),ADS16449 ADS16449 6*12 , Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1(8*12),256M DDR 5G , LB69-00027A LB69-00027A FBGA,17x17 (6x15),1F1-1717-A19 1F1-1717-A19 6*15 125 BAKE BGA 17X17 17X17 LB69-00002A LB69-00002A ADS12347 ADS12347 , ADS13863 ADS13863 119/153BGA 119/153BGA,(6*11) 1422 6*11 130 MAX BGA-1422-A LA69-00231A LA69-00231A ADS05534 ADS05534 127TBGA 127TBGA , 153FC-PBGA 153FC-PBGA,6*11 6*11 130 MAX BGA-1422-A LA69-00240A LA69-00240A WDS12334 WDS12334 48TBGA 48TBGA,7.5*9.5 (8*16) 8*16 ... Original
datasheet

7 pages,
173.55 Kb

96BOC-7 tray cabga 9x9 121-FBGA LA69-01189A FCMSP 240-FBGA JEDEC Kostat FBGA EPAK TRAY 78BOC tqfp 10x10 tray 90-FBGA-11 153FBGA-9 BGA 6x6 tray 78BOC-11 60WMBG 48TBGA 60WMBG abstract
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Abstract: solution Voltage regulators for BGA IC JTAG True target package emulation Low mass for easy assembly FPGA All package types (BGA, MLF, SOIC, etc.) accommodated Tape and Reel or tray packaging , have been lumped into this category. Pictured at right is a PGA to BGA converter which supports a , QFP to DIP QIP to DIP SOIC to ZIP QFP to PGA PGA to BGA PGA to DIP TSOP to SOIC BGA to QFP , (Device converters). Our package converters, like the BGA to QFP converter shown below, are designed with ... Original
datasheet

26 pages,
581.19 Kb

intel 8088 SK-PLCC44-Z-02 68HC11 PLCC84 pinout PLCC32/DIP32 MC68EC20 INTEL DX4 PC-DIP/PLCC-68000-01 53C700 68hc001 TQ2E-24V uPD70236 XE4006E plcc44 pinout numbers datasheet abstract
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Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , , page 27 and Table 2-3, page 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip BGA ... Original
datasheet

118 pages,
4620.46 Kb

xilinx topside marking 1700E Lead Free reflow FG484 Alpha WS609 solder bga rework qfn 3x3 tray dimension XC4VLX60-10FFG668C top marking 957 so8 cpga material declaration XCS20 TQ144 country of origin CF1752 SMD MARKING CODE C1G reballing UG112 UG112 abstract
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , 27 and Table 2-3, page 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 36. , . . . . . Cavity-Up Plastic BGA Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . ... Original
datasheet

118 pages,
4609.77 Kb

TT 2076 TSOP 54 land pattern XCS20 TQ144 country of origin FG484 XCMECH-FG676 XC3SD1800A-4CS484LI XC4VLX25 cmos 668 fcbga XC2S50 PQG208 FFG676 reballing jedec so8 Wire bond gap pcb footprint FS48, and FSG48 XC3S400AN-4FG400I UG112 UG112 abstract
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , Table 2-3, page 38. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 38. Changed , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip BGA ... Original
datasheet

122 pages,
4619.88 Kb

TsoP 20 Package XILINX die electric sealer 304 QFP amkor smd diode JC 0p xc9572xl vqg PC84/PCG84 pcb footprint FS48, and FSG48 bga rework CSG484 fcBGA PACKAGE thermal resistance TT 2076 FF1148 UG112 UG112 abstract
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , 26 and Table 2-3, page 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 36. , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip BGA ... Original
datasheet

118 pages,
4608.19 Kb

xc9572xl vqg FFG676 UG112 1466 ball FCBGA xilinx topside marking XC2VP7 reflow profile qfn 3x3 tray dimension sn63pb37 solder SPHERES SPARTAN-II xc2s50 pq208 jedec so8 Wire bond gap HQG160 TT 2076 FF676 UG112 abstract
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Abstract: built up our B BGA, WCSP D F H L M T Bare Chip Plastic QFP Ceramic DIP Ceramic QFP , tape & reel (tray) TCP BL 2 directions Tape & reel BACK TCP BR 2 directions TCP BT 2 directions , * 1.2 5X5 1.2 11 X 11Row 3Row 6X6 1.2 0.5 11 X 11Row 6X6 1.2 PFBGA7U-144 PFBGA7U-144 , VFBGA6H-121 VFBGA6H-121 144 Thickness Max. Full 4X4 1.0 Full 5X5 1.0 11 X 11Row 3Row 6X6 1.0 0.5 11 X 11Row 6X6 1.0 VFBGA7H-144 VFBGA7H-144 0.5 13 X 13Row 4Row 7X7 1.0 161 ... Original
datasheet

31 pages,
8645.28 Kb

Epson LQ 450 WCSP-16 t-con lvds TTL catalog TQFP24 mini-lvds spec s1k500 UXGA tcon RTL 204 601 SMART ASIC 197 S1L50062 S1K60000 tcon 17 epson S1X65263 datasheet abstract
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Abstract: Ball Grid Array (BGA) connectors for dense mezzanine board packaging operating at extremely high signal , architectures 6x6 midplane headers provide 36 crossover pairs ยท Available with or without polarization and , Part References 6x6 vertical header with right guide 6x6 vertical header with right guide 6x6 vertical header 6x6 vertical header with right guide 4x4 vertical header 4x4 d aughter card receptacle ... Original
datasheet

100 pages,
5615.93 Kb

mini pcie connector 52 pin vertical MINISAS HD connector nas 65239 pcb edge CONNECTOR 1.27mm pitch 4 pin pcie x16 right angle connector sfp 2x3 10089485-1E03LF DDR3 240 PCB Connector Footprint fci round shell connector sca-2 40 pin to sata PCI x16 footprint fingers datasheet abstract
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Abstract: 41 3.3.3 Shipping Tray , . 41 Shipping Tray Vendor , perimeter array package with 508 ball connections in the outer area of the package and a square 6x6 grid of ... Original
datasheet

56 pages,
419.88 Kb

Intel 80321 daewon BGA 6x6 tray 273416 Intel StrataFlash Memory j3 datasheet abstract
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Abstract: STM32F103T6 STM32F103T6 STM32F103C6 STM32F103C6 STM32F103R6 STM32F103R6 STM32F101T6 STM32F101T6 STM32F101C6 STM32F101C6 STM32F101R6 STM32F101R6 0 36 pins QFN (6x6) Both , embedded Flash dispatched on 7 packages BGA (10x10) BGA (10x10) Software and tools The STM32 STM32 ... Original
datasheet

35 pages,
2645.46 Kb

ST VIPER application notes EVALVIPER17H-6W hp laptop inverter board schematic schematic lcd inverter dell lenovo inverter board schematic schematic diagram of laptop dell dell laptop lcd inverter Connecting the FSMC to the LCD Intel lenovo laptop battery schematic "full hd" mobile phone camera pinout circuit diagram of smps dell STV200N55F3 STV250N55F3 STV200N55F3 abstract
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www.datasheetarchive.com/files/kaleidoscope/cad/capilano - designworks 4.3.1/mac/dwm_installer.hqx
Kaleidoscope 10/04/2005 16069.24 Kb HQX dwm_installer.hqx