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SN65220YZBR Texas Instruments 60W, UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE, GREEN, BGA-4 ri Buy
TMS320C5502ZZZR300 Texas Instruments TMS320C55 201-BGA MICROSTAR ri Buy
TMS320C28341ZEPQ Texas Instruments Delfino Microcontroller 256-BGA ri Buy

tray bga 6x6

Catalog Datasheet Type PDF Document Tags
Abstract: ) 12*30 125 BAKE BGA 6X6 LA69-00639A LA69-00639A ADS11400 ADS11400 52ULGA 52ULGA,12*17(8*12*),ADS16449 ADS16449 6*12 , Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1(8*12),256M DDR 5G , LB69-00027A LB69-00027A FBGA,17x17 (6x15),1F1-1717-A19 1F1-1717-A19 6*15 125 BAKE BGA 17X17 17X17 LB69-00002A LB69-00002A ADS12347 ADS12347 , ADS13863 ADS13863 119/153BGA 119/153BGA,(6*11) 1422 6*11 130 MAX BGA-1422-A LA69-00231A LA69-00231A ADS05534 ADS05534 127TBGA 127TBGA , 153FC-PBGA 153FC-PBGA,6*11 6*11 130 MAX BGA-1422-A LA69-00240A LA69-00240A WDS12334 WDS12334 48TBGA 48TBGA,7.5*9.5 (8*16) 8*16 ... Original
datasheet

7 pages,
173.55 Kb

96BOC-7 tray cabga 9x9 PBGA-2727 121-FBGA LA69-01189A EPAK TRAY FCMSP JEDEC Kostat FBGA 240-FBGA tqfp 10x10 tray 78BOC 90-FBGA-11 ePAK BGA 5x5 tray 78BOC-11 60WMBG 48TBGA 60WMBG abstract
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Abstract: solution Voltage regulators for BGA IC JTAG True target package emulation Low mass for easy assembly FPGA All package types (BGA, MLF, SOIC, etc.) accommodated Tape and Reel or tray packaging , have been lumped into this category. Pictured at right is a PGA to BGA converter which supports a , QFP to DIP QIP to DIP SOIC to ZIP QFP to PGA PGA to BGA PGA to DIP TSOP to SOIC BGA to QFP , (Device converters). Our package converters, like the BGA to QFP converter shown below, are designed with ... Original
datasheet

26 pages,
581.19 Kb

actel 1020 68HC11 PLCC84 INTEL DX4 SK-PLCC44-Z-02 pinout PLCC32/DIP32 MC68EC20 PC-DIP/PLCC-68000-01 53C700 XE4006E 68hc001 TQ2E-24V uPD70236 plcc44 pinout numbers soic40 datasheet abstract
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , , page 27 and Table 2-3, page 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip BGA ... Original
datasheet

118 pages,
4620.46 Kb

bga rework cpga material declaration BGA Ball Crack Alpha WS609 solder SMD BGA 672 DRAWING Lead Free reflow FG484 xilinx topside marking 1700E top marking 957 so8 XCS20 TQ144 country of origin CF1752 SMD MARKING CODE C1G BGA reflow guide UG112 UG112 abstract
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , 27 and Table 2-3, page 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 36. , . . . . . Cavity-Up Plastic BGA Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . ... Original
datasheet

118 pages,
4609.77 Kb

XCS20 TQ144 country of origin XCS20XL pqg208 TT 2076 TSOP 54 land pattern XC95XL reballing XCMECH-FG676 XC4VLX25 cmos 668 fcbga XC3SD1800A-4CS484LI XC2S50 PQG208 FFG676 pcb footprint FS48, and FSG48 XC3S400AN-4FG400I UG112 UG112 abstract
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , Table 2-3, page 38. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 38. Changed , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip BGA ... Original
datasheet

122 pages,
4619.88 Kb

SF363 pcb footprint FS48, and FSG48 smd diode JC 0p 304 QFP amkor bga rework TT 2076 xc9572xl vqg fcBGA PACKAGE thermal resistance PC84/PCG84 CSG484 die electric sealer FF1148 top marking 957 so8 UG112 UG112 abstract
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , 26 and Table 2-3, page 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 36. , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip BGA ... Original
datasheet

118 pages,
4608.19 Kb

UG112 1466 ball FCBGA FFG676 xilinx part marking xc9572xl vqg XCDAISY XC2VP7 reflow profile jedec so8 Wire bond gap sn63pb37 solder SPHERES HQG160 SPARTAN-II xc2s50 pq208 FF676 qfn 3x3 tray dimension UG112 abstract
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Abstract: built up our B BGA, WCSP D F H L M T Bare Chip Plastic QFP Ceramic DIP Ceramic QFP , tape & reel (tray) TCP BL 2 directions Tape & reel BACK TCP BR 2 directions TCP BT 2 directions , * 1.2 5X5 1.2 11 X 11Row 3Row 6X6 1.2 0.5 11 X 11Row 6X6 1.2 PFBGA7U-144 PFBGA7U-144 , VFBGA6H-121 VFBGA6H-121 144 Thickness Max. Full 4X4 1.0 Full 5X5 1.0 11 X 11Row 3Row 6X6 1.0 0.5 11 X 11Row 6X6 1.0 VFBGA7H-144 VFBGA7H-144 0.5 13 X 13Row 4Row 7X7 1.0 161 ... Original
datasheet

31 pages,
8645.28 Kb

QFN5-32 Epson LQ 450 t-con lvds mini-lvds spec TTL catalog WCSP-16 s1k500 UXGA tcon RTL 204 601 S1K60000 S1L50062 SMART ASIC 197 tcon 17 epson EPSON tcon datasheet abstract
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Abstract: Ball Grid Array (BGA) connectors for dense mezzanine board packaging operating at extremely high signal , architectures 6x6 midplane headers provide 36 crossover pairs ยท Available with or without polarization and , Part References 6x6 vertical header with right guide 6x6 vertical header with right guide 6x6 vertical header 6x6 vertical header with right guide 4x4 vertical header 4x4 d aughter card receptacle ... Original
datasheet

100 pages,
5615.93 Kb

MINISAS HD pcie x16 right angle connector qsfp 40g aoc mini pcie connector 52 pin vertical pcb edge CONNECTOR 1.27mm pitch 4 pin 10089485-1E03LF mini PCIe 52 pin vertical sfp 2x3 sca-2 40 pin to sata PCI x16 footprint fingers DDR3 240 PCB Connector Footprint fci round shell connector datasheet abstract
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Abstract: 41 3.3.3 Shipping Tray , . 41 Shipping Tray Vendor , perimeter array package with 508 ball connections in the outer area of the package and a square 6x6 grid of ... Original
datasheet

56 pages,
419.88 Kb

Intel 80321 daewon BGA 6x6 tray 273416 Intel StrataFlash Memory j3 datasheet abstract
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Abstract: STM32F103T6 STM32F103T6 STM32F103C6 STM32F103C6 STM32F103R6 STM32F103R6 STM32F101T6 STM32F101T6 STM32F101C6 STM32F101C6 STM32F101R6 STM32F101R6 0 36 pins QFN (6x6) Both , embedded Flash dispatched on 7 packages BGA (10x10) BGA (10x10) Software and tools The STM32 STM32 ... Original
datasheet

35 pages,
2645.46 Kb

pure sine wave dimmer EVALVIPER17H-6W hp laptop inverter board schematic schematic lcd inverter dell lenovo inverter board schematic dell laptop lcd inverter schematic diagram of laptop dell lenovo laptop battery schematic Connecting the FSMC to the LCD Intel "full hd" mobile phone camera pinout circuit diagram of smps dell STV200N55F3 STV250N55F3 STV200N55F3 abstract
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Datasheet Content (non pdf)

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Over 1.1 million files (1986-2015): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer.
 
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www.datasheetarchive.com/files/kaleidoscope/cad/capilano - designworks 4.3.1/mac/dwm_installer.hqx
Kaleidoscope 10/04/2005 16069.24 Kb HQX dwm_installer.hqx