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tray bga 6x6

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Abstract: ) 12*30 125 BAKE BGA 6X6 LA69-00639A ADS11400 52ULGA,12*17(8*12*),ADS16449 6*12 , Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1(8*12),256M DDR 5G , LB69-00027A FBGA,17x17 (6x15),1F1-1717-A19 6*15 125 BAKE BGA 17X17 LB69 , -00807A ADS13863 119/153BGA,(6*11) 1422 6*11 130 MAX BGA-1422-A LA69-00231A ADS05534 127TBGA , -PBGA,6*11 6*11 130 MAX BGA-1422-A LA69-00240A WDS12334 48TBGA,7.5*9.5 (8*16) 8*16 Samsung Electronics
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153FBGA FBGA tray kostat BGA 6x6 tray 169fbga-12.0x16.0-8x16-0 FCMSP 153FBGA-9 60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48-TBGA-10
Abstract: solution Voltage regulators for BGA IC JTAG True target package emulation Low mass for easy assembly FPGA All package types (BGA, MLF, SOIC, etc.) accommodated Tape and Reel or tray packaging , have been lumped into this category. Pictured at right is a PGA to BGA converter which supports a , QFP to DIP QIP to DIP SOIC to ZIP QFP to PGA PGA to BGA PGA to DIP TSOP to SOIC BGA to QFP , (Device converters). Our package converters, like the BGA to QFP converter shown below, are designed with Ironwood Electronics
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R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01
Abstract: built up our B BGA, WCSP D F H L M T Bare Chip Plastic QFP Ceramic DIP Ceramic QFP , tape & reel (tray) TCP BL 2 directions Tape & reel BACK TCP BR 2 directions TCP BT 2 directions , * 1.2 5X5 1.2 11 X 11Row 3Row 6X6 1.2 0.5 11 X 11Row 6X6 1.2 PFBGA7U , 1.0 11 X 11Row 3Row 6X6 1.0 0.5 11 X 11Row 6X6 1.0 VFBGA7H-144 0.5 13 X , * Body Size (mm) Ball Array ASICs Package Externals Plastic BGA (PBGA) WCSP IC Chip Seiko Epson
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S1L50552 tcon mini-lvds EPSON tcon tcon 17 epson S1X65263 S1L50062 S1L60173F00A000
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , , page 27 and Table 2-3, page 36. Added FF1136 and FFG1136 tray and box information to Table 2-3, page , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip Xilinx
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xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 CF1752 smd code v36 XC2VP7 reflow profile UG112 UG072 UG075 XAPP427
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , 26 and Table 2-3, page 36. Added FF1136 and FFG1136 tray and box information to Table 2-3, page 36 , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip Xilinx
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XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 diode MARKING A1 v34 HQG160 XCDAISY
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , Table 2-3, page 38. Added FF1136 and FFG1136 tray and box information to Table 2-3, page 38. Changed , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip Xilinx
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FGG484 reballing qfn 3x3 tray dimension FF1148 top marking 957 so8 CSG484
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , 27 and Table 2-3, page 36. Added FF1136 and FFG1136 tray and box information to Table 2-3, page 36 , . . . . . Cavity-Up Plastic BGA Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . Xilinx
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BFG95 XC5VLX330T-1FF1738I WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I BGG560
Abstract: Ball Grid Array (BGA) connectors for dense mezzanine board packaging operating at extremely high signal , architectures 6x6 midplane headers provide 36 crossover pairs · Available with or without polarization and , Part References 6x6 vertical header with right guide 6x6 vertical header with right guide 6x6 vertical header 6x6 vertical header with right guide 4x4 vertical header 4x4 d aughter card receptacle FCI
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8609 396 81 10118072 FPC high speed 6G connector VCSEL array HDMI 10112633-101LF PCI x16 footprint fingers 10056265122ABTLF 10047129118ABTLF 10055606110ABTLF 10053826100ABTLF 10055262100BBTLF 10056422122BBTLF
Abstract: )â', and Table 1-2: â'Xilinx Device Marking Definitionâ'"Exampleâ'. Updated â'Flip-Chip BGA , Updated â'Recommended PCB Design Rules for BGA, CSP, and CCGA Packages,â' page 87; added missing (D , 36. Added FF1136 and FFG1136 tray and box information to Table 2-3, page 36. Changed link from , . . . . . Cavity-Up Plastic BGA Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . Xilinx
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Abstract: 41 3.3.3 Shipping Tray Vendor , Shipping Tray Vendor , a square 6x6 grid of rows of ball connections in the middle area of the package. See Figure 3 Intel
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intel 80219 XScale 80219 VCC33
Abstract: 41 3.3.3 Shipping Tray Vendor , . 41 Shipping Tray Vendor , square 6x6 grid of rows of ball connections in the middle area of the package. See Figure 3 "544-Lead Intel
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daewon bga daewon tray PAR64 PC200 REQ64
Abstract: 41 3.3.3 Shipping Tray Vendor , . 41 Shipping Tray Vendor , package with 508 ball connections in the outer area of the package and a square 6x6 grid of rows of ball Intel
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80219 daewon CC2538 B2764-
Abstract: 41 3.3.3 Shipping Tray Vendor , . 41 Shipping Tray Vendor , 508 ball connections in the outer area of the package and a square 6x6 grid of rows of ball Intel
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PCE-5 P5 microarchitecture Intel 80321 AE23 544LE
Abstract: 41 3.3.3 Shipping Tray Vendor , . 41 Shipping Tray Vendor , connections in the outer area of the package and a square 6x6 grid of rows of ball connections in the middle Intel
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Intel StrataFlash Memory j3 273416
Abstract: STM32F103T6 STM32F103C6 STM32F103R6 STM32F101T6 STM32F101C6 STM32F101R6 0 36 pins QFN (6x6) Both , embedded Flash dispatched on 7 packages BGA (10x10) BGA (10x10) Software and tools The STM32 STMicroelectronics
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hp laptop charging CIRCUIT diagram dell laptop battery pinout DELL laptop inverter board schematic hp laptop battery pinout testing motherboards using multi meter hp laptop ac adapter schematics diagram STV200N55F3 STV250N55F3 STP03D200 EMIF06-AUD01F2 EMIF10-LCD03F3