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X9523Z20-A Intersil Corporation IC SPECIALTY TELECOM CIRCUIT, PBGA20, BGA-20, Telecom IC:Other ri Buy
X9522Z20-A Intersil Corporation IC SPECIALTY TELECOM CIRCUIT, PBGA20, BGA-20, Telecom IC:Other ri Buy
X9522B20I-A Intersil Corporation IC DIGITAL POTENTIOMETER, PBGA20, BGA-20, Digital Potentiometer ri Buy

tray bga 6x6

Catalog Datasheet Results Type PDF Document Tags
Abstract: ) 12*30 125 BAKE BGA 6X6 LA69-00639A LA69-00639A ADS11400 ADS11400 52ULGA 52ULGA,12*17(8*12*),ADS16449 ADS16449 6*12 , Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1(8*12),256M DDR 5G , LB69-00027A LB69-00027A FBGA,17x17 (6x15),1F1-1717-A19 1F1-1717-A19 6*15 125 BAKE BGA 17X17 17X17 LB69-00002A LB69-00002A ADS12347 ADS12347 , ADS13863 ADS13863 119/153BGA 119/153BGA,(6*11) 1422 6*11 130 MAX BGA-1422-A LA69-00231A LA69-00231A ADS05534 ADS05534 127TBGA 127TBGA , 153FC-PBGA 153FC-PBGA,6*11 6*11 130 MAX BGA-1422-A LA69-00240A LA69-00240A WDS12334 WDS12334 48TBGA 48TBGA,7.5*9.5 (8*16) 8*16 ... Original
datasheet

7 pages,
173.55 Kb

ADS33317 96BOC-7 FCMSP PBGA-2727 121-FBGA EPAK TRAY JEDEC Kostat FBGA 240-FBGA LA69-01189A tqfp 10x10 tray 90-FBGA-11 78BOC ePAK BGA 5x5 tray 153FBGA-9 60WMBG 48TBGA 60WMBG abstract
datasheet frame
Abstract: solution Voltage regulators for BGA IC JTAG True target package emulation Low mass for easy assembly FPGA All package types (BGA, MLF, SOIC, etc.) accommodated Tape and Reel or tray packaging , have been lumped into this category. Pictured at right is a PGA to BGA converter which supports a , QFP to DIP QIP to DIP SOIC to ZIP QFP to PGA PGA to BGA PGA to DIP TSOP to SOIC BGA to QFP , (Device converters). Our package converters, like the BGA to QFP converter shown below, are designed with ... Original
datasheet

26 pages,
581.19 Kb

intel 8088 3030A XILINX PC-DIP/PLCC-68000-01 SK-PLCC44-Z-02 68HC11 PLCC84 pinout PLCC32/DIP32 MC68EC20 53C700 TQ2E-24V soic40 68hc001 uPD70236 XE4006E datasheet abstract
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , , page 27 and Table 2-3, page 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip BGA ... Original
datasheet

118 pages,
4620.46 Kb

XC5VLX XCDAISY cpga material declaration EF668 90Pb 10Sn solder paste Alpha WS609 solder SMD BGA 672 DRAWING CF1752 top marking 957 so8 SMD MARKING CODE C1G XCS20 TQ144 country of origin reballing BGA reflow guide UG112 UG112 abstract
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , 27 and Table 2-3, page 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 36. , . . . . . Cavity-Up Plastic BGA Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . ... Original
datasheet

118 pages,
4609.77 Kb

XCS20 TQ144 country of origin XC95XL XC4VLX25 cmos 668 fcbga TT 2076 FFG676C TSOP 54 land pattern FG484 XC2S50 PQG208 XC3SD1800A-4CS484LI XCMECH-FG676 reballing jedec so8 Wire bond gap pcb footprint FS48, and FSG48 UG112 UG112 abstract
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , Table 2-3, page 38. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 38. Changed , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip BGA ... Original
datasheet

122 pages,
4619.88 Kb

XC5VLX bga rework 304 QFP amkor CSG484 die electric sealer fcBGA PACKAGE thermal resistance xc9572xl vqg TT 2076 PC84/PCG84 pcb footprint FS48, and FSG48 smd diode JC 0p FF1148 top marking 957 so8 UG112 UG112 abstract
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , 26 and Table 2-3, page 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 36. , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip BGA ... Original
datasheet

118 pages,
4608.19 Kb

XC2C256-7PQ108I die electric sealer xilinx topside marking UG112 1466 ball FCBGA xc9572xl vqg FF676 FFG676 XCDAISY qfn 3x3 tray dimension XC2VP7 reflow profile jedec so8 Wire bond gap HQG160 UG112 abstract
datasheet frame
Abstract: built up our B BGA, WCSP D F H L M T Bare Chip Plastic QFP Ceramic DIP Ceramic QFP , tape & reel (tray) TCP BL 2 directions Tape & reel BACK TCP BR 2 directions TCP BT 2 directions , * 1.2 5X5 1.2 11 X 11Row 3Row 6X6 1.2 0.5 11 X 11Row 6X6 1.2 PFBGA7U-144 PFBGA7U-144 , VFBGA6H-121 VFBGA6H-121 144 Thickness Max. Full 4X4 1.0 Full 5X5 1.0 11 X 11Row 3Row 6X6 1.0 0.5 11 X 11Row 6X6 1.0 VFBGA7H-144 VFBGA7H-144 0.5 13 X 13Row 4Row 7X7 1.0 161 ... Original
datasheet

31 pages,
8645.28 Kb

QFN5-32 Epson LQ 450 TTL catalog t-con lvds mini-lvds spec WCSP-16 RTL 204 601 s1k500 UXGA tcon tcon 17 epson S1K60000 S1L50062 SMART ASIC 197 EPSON tcon datasheet abstract
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Abstract: Ball Grid Array (BGA) connectors for dense mezzanine board packaging operating at extremely high signal , architectures 6x6 midplane headers provide 36 crossover pairs ยท Available with or without polarization and , Part References 6x6 vertical header with right guide 6x6 vertical header with right guide 6x6 vertical header 6x6 vertical header with right guide 4x4 vertical header 4x4 d aughter card receptacle ... Original
datasheet

100 pages,
5615.93 Kb

XCEDE optical LF 952 cable car mini pcie connector 52 pin vertical MINISAS HD nas 65239 pcb edge CONNECTOR 1.27mm pitch 4 pin fci round shell connector 10089485-1E03LF sfp 2x3 mini PCIe 52 pin vertical sca-2 40 pin to sata DDR3 240 PCB Connector Footprint datasheet abstract
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Abstract: 41 3.3.3 Shipping Tray , . 41 Shipping Tray Vendor , perimeter array package with 508 ball connections in the outer area of the package and a square 6x6 grid of ... Original
datasheet

56 pages,
419.88 Kb

Intel 80321 daewon BGA 6x6 tray 273416 Intel StrataFlash Memory j3 datasheet abstract
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Abstract: STM32F103T6 STM32F103T6 STM32F103C6 STM32F103C6 STM32F103R6 STM32F103R6 STM32F101T6 STM32F101T6 STM32F101C6 STM32F101C6 STM32F101R6 STM32F101R6 0 36 pins QFN (6x6) Both , embedded Flash dispatched on 7 packages BGA (10x10) BGA (10x10) Software and tools The STM32 STM32 ... Original
datasheet

35 pages,
2645.46 Kb

ST VIPER application notes EVALVIPER17H-6W hp laptop inverter board schematic lenovo inverter board schematic schematic lcd inverter dell lenovo laptop battery schematic schematic diagram of laptop dell dell laptop lcd inverter Connecting the FSMC to the LCD Intel hp laptop ac adapter schematics diagram "full hd" mobile phone camera pinout STV200N55F3 STV250N55F3 STV200N55F3 abstract
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Datasheet Content (non pdf)

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www.datasheetarchive.com/files/kaleidoscope/cad/capilano - designworks 4.3.1/mac/dwm_installer.hqx
Kaleidoscope 10/04/2005 16069.24 Kb HQX dwm_installer.hqx