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Part Manufacturer Description Datasheet BUY
X9520B20I-B Intersil Corporation DIGITAL POTENTIOMETER, PBGA20, BGA-20 visit Intersil
X9520B20I-A Intersil Corporation DIGITAL POTENTIOMETER, PBGA20, BGA-20 visit Intersil
DRA622CIZKKQ1 Texas Instruments 640-BGA visit Texas Instruments
DRA622CIZKKRQ1 Texas Instruments 640-BGA visit Texas Instruments
HSP50216KI Intersil Corporation TELECOM, CELLULAR, BASEBAND CIRCUIT, PBGA196, 12 x 12, BGA-196 visit Intersil
TMS320C28346ZEPQ Texas Instruments Delfino Microcontroller 256-BGA visit Texas Instruments

tray bga 6x6

Catalog Datasheet MFG & Type PDF Document Tags

1f1-1717-a19

Abstract: 153FBGA ) 12*30 125 BAKE BGA 6X6 LA69-00639A ADS11400 52ULGA,12*17(8*12*),ADS16449 6*12 , Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1(8*12),256M DDR 5G , LB69-00027A FBGA,17x17 (6x15),1F1-1717-A19 6*15 125 BAKE BGA 17X17 LB69 , -00807A ADS13863 119/153BGA,(6*11) 1422 6*11 130 MAX BGA-1422-A LA69-00231A ADS05534 127TBGA , -PBGA,6*11 6*11 130 MAX BGA-1422-A LA69-00240A WDS12334 48TBGA,7.5*9.5 (8*16) 8*16
Samsung Electronics
Original
153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 ePAK BGA 5x5 tray 60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48-TBGA-10

R50-E2Y2-24

Abstract: sk 8085 solution Voltage regulators for BGA IC JTAG True target package emulation Low mass for easy assembly FPGA All package types (BGA, MLF, SOIC, etc.) accommodated Tape and Reel or tray packaging , have been lumped into this category. Pictured at right is a PGA to BGA converter which supports a , QFP to DIP QIP to DIP SOIC to ZIP QFP to PGA PGA to BGA PGA to DIP TSOP to SOIC BGA to QFP , (Device converters). Our package converters, like the BGA to QFP converter shown below, are designed with
Ironwood Electronics
Original
R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01

S1L50552

Abstract: tcon mini-lvds built up our B BGA, WCSP D F H L M T Bare Chip Plastic QFP Ceramic DIP Ceramic QFP , tape & reel (tray) TCP BL 2 directions Tape & reel BACK TCP BR 2 directions TCP BT 2 directions , * 1.2 5X5 1.2 11 X 11Row 3Row 6X6 1.2 0.5 11 X 11Row 6X6 1.2 PFBGA7U , 1.0 11 X 11Row 3Row 6X6 1.0 0.5 11 X 11Row 6X6 1.0 VFBGA7H-144 0.5 13 X , * Body Size (mm) Ball Array ASICs Package Externals Plastic BGA (PBGA) WCSP IC Chip
Seiko Epson
Original
S1L50552 tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson S1L50062 S1L60173F00A000

xilinx topside marking

Abstract: xilinx part marking : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , , page 27 and Table 2-3, page 36. Added FF1136 and FFG1136 tray and box information to Table 2-3, page , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip
Xilinx
Original
xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 SMD MARKING CODE C1G UG112 UG072 UG075 XAPP427

XILINX/part marking Hot

Abstract: PC84/PCG84 : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , 26 and Table 2-3, page 36. Added FF1136 and FFG1136 tray and box information to Table 2-3, page 36 , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip
Xilinx
Original
XILINX/part marking Hot PC84/PCG84 SMT, FPGA FINE PITCH BGA 456 BALL HQG160 qfn 3x3 tray dimension sn63pb37 solder SPHERES

xilinx part marking

Abstract: xilinx topside marking : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , Table 2-3, page 38. Added FF1136 and FFG1136 tray and box information to Table 2-3, page 38. Changed , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip
Xilinx
Original
reballing FGG484 top marking 957 so8 FF1148 TT 2076 CSG484

qfn 3x3 tray dimension

Abstract: XCDAISY : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , 27 and Table 2-3, page 36. Added FF1136 and FFG1136 tray and box information to Table 2-3, page 36 , . . . . . Cavity-Up Plastic BGA Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . .
Xilinx
Original
XCDAISY BFG95 XC5VLX330T-1FF1738I WS609 XC3S400AN-4FG400I jedec so8 Wire bond gap

16 pin 2x25, 2mm pitch header connectors

Abstract: 8609 396 81 Ball Grid Array (BGA) connectors for dense mezzanine board packaging operating at extremely high signal , architectures 6x6 midplane headers provide 36 crossover pairs · Available with or without polarization and , Part References 6x6 vertical header with right guide 6x6 vertical header with right guide 6x6 vertical header 6x6 vertical header with right guide 4x4 vertical header 4x4 d aughter card receptacle
FCI
Original
16 pin 2x25, 2mm pitch header connectors 8609 396 81 10118072 FPC high speed 6G connector VCSEL array HDMI electronic passive components catalog 10056265122ABTLF 10047129118ABTLF 10055606110ABTLF 10053826100ABTLF 10055262100BBTLF 10056422122BBTLF

BFG95

Abstract: )â', and Table 1-2: â'Xilinx Device Marking Definitionâ'"Exampleâ'. Updated â'Flip-Chip BGA , Updated â'Recommended PCB Design Rules for BGA, CSP, and CCGA Packages,â' page 87; added missing (D , 36. Added FF1136 and FFG1136 tray and box information to Table 2-3, page 36. Changed link from , . . . . . Cavity-Up Plastic BGA Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . .
Xilinx
Original

intel 80219

Abstract: XScale 80219 41 3.3.3 Shipping Tray Vendor , Shipping Tray Vendor , a square 6x6 grid of rows of ball connections in the middle area of the package. See Figure 3
Intel
Original
intel 80219 XScale 80219 VCC33

BGA 6x6 tray

Abstract: daewon tray 41 3.3.3 Shipping Tray Vendor , . 41 Shipping Tray Vendor , square 6x6 grid of rows of ball connections in the middle area of the package. See Figure 3 "544-Lead
Intel
Original
daewon tray PAR64 PC200 REQ64 daewon bga

intel 80219

Abstract: 80219 41 3.3.3 Shipping Tray Vendor , . 41 Shipping Tray Vendor , package with 508 ball connections in the outer area of the package and a square 6x6 grid of rows of ball
Intel
Original
80219 daewon CC2538

PCE-5

Abstract: P5 microarchitecture 41 3.3.3 Shipping Tray Vendor , . 41 Shipping Tray Vendor , 508 ball connections in the outer area of the package and a square 6x6 grid of rows of ball
Intel
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PCE-5 P5 microarchitecture Intel 80321 AE23 544LE

Intel StrataFlash Memory j3

Abstract: Intel 80321 41 3.3.3 Shipping Tray Vendor , . 41 Shipping Tray Vendor , connections in the outer area of the package and a square 6x6 grid of rows of ball connections in the middle
Intel
Original
Intel StrataFlash Memory j3 273416

schematic diagram inverter lcd monitor dell

Abstract: hp laptop charging CIRCUIT diagram STM32F103T6 STM32F103C6 STM32F103R6 STM32F101T6 STM32F101C6 STM32F101R6 0 36 pins QFN (6x6) Both , embedded Flash dispatched on 7 packages BGA (10x10) BGA (10x10) Software and tools The STM32
STMicroelectronics
Original
schematic diagram inverter lcd monitor dell hp laptop charging CIRCUIT diagram dell laptop battery pinout DELL laptop inverter board schematic hp laptop battery pinout testing motherboards using multi meter STV200N55F3 STV250N55F3 STP03D200 EMIF06-AUD01F2 EMIF10-LCD03F3