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EP9312 Cirrus Logic IC SPECIALTY CONSUMER CIRCUIT, PBGA352, PLASTIC, BGA-352, Consumer IC:Other ri Buy
EP9312-IB Cirrus Logic IC 32-BIT, 184 MHz, RISC PROCESSOR, PBGA352, 27 X 27 MM, PLASTIC, BGA-352, Microprocessor ri Buy
EP9312-IBZ Cirrus Logic IC 32-BIT, 184 MHz, RISC PROCESSOR, PBGA352, 27 X 27 MM, LEAD FREE, PLASTIC, BGA-352, Microprocessor ri Buy

tray bga 6x6

Catalog Datasheet Results Type PDF Document Tags
Abstract: ) 12*30 125 BAKE BGA 6X6 LA69-00639A LA69-00639A ADS11400 ADS11400 52ULGA 52ULGA,12*17(8*12*),ADS16449 ADS16449 6*12 , Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1(8*12),256M DDR 5G , LB69-00027A LB69-00027A FBGA,17x17 (6x15),1F1-1717-A19 1F1-1717-A19 6*15 125 BAKE BGA 17X17 17X17 LB69-00002A LB69-00002A ADS12347 ADS12347 , ADS13863 ADS13863 119/153BGA 119/153BGA,(6*11) 1422 6*11 130 MAX BGA-1422-A LA69-00231A LA69-00231A ADS05534 ADS05534 127TBGA 127TBGA , 153FC-PBGA 153FC-PBGA,6*11 6*11 130 MAX BGA-1422-A LA69-00240A LA69-00240A WDS12334 WDS12334 48TBGA 48TBGA,7.5*9.5 (8*16) 8*16 ... Original
datasheet

7 pages,
173.55 Kb

fBGA package tray 12 x 19 SAMSUNG MCP PBGA-2727 FCMSP 78BOC 96BOC-7 LA69-01189A JEDEC Kostat FBGA 240-FBGA 121-FBGA EPAK TRAY tqfp 10x10 tray 90-FBGA-11 ePAK BGA 5x5 tray 60WMBG 48TBGA 60WMBG abstract
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Abstract: solution Voltage regulators for BGA IC JTAG True target package emulation Low mass for easy assembly FPGA All package types (BGA, MLF, SOIC, etc.) accommodated Tape and Reel or tray packaging , have been lumped into this category. Pictured at right is a PGA to BGA converter which supports a , QFP to DIP QIP to DIP SOIC to ZIP QFP to PGA PGA to BGA PGA to DIP TSOP to SOIC BGA to QFP , (Device converters). Our package converters, like the BGA to QFP converter shown below, are designed with ... Original
datasheet

26 pages,
581.19 Kb

PC-PGA/QFP-68EC020-L-02 PC-DIP/PLCC-8085-P-01 nec a1010 SK-PLCC44-Z-02 MC68EC20 pinout PLCC32/DIP32 PC-DIP/PLCC-68000-01 68HC11 PLCC84 TQ2E-24V 53C700 Aromat TQ2E-24V XE4006E uPD70236 datasheet abstract
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Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , , page 27 and Table 2-3, page 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip BGA ... Original
datasheet

118 pages,
4620.46 Kb

XC5VLX XCDAISY EF668 bga rework SMD BGA 672 DRAWING cpga material declaration Alpha WS609 solder 90Pb 10Sn solder paste XCS20 TQ144 country of origin top marking 957 so8 SMD MARKING CODE C1G XC2VP7 reflow profile BGA reflow guide UG112 UG112 abstract
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , 27 and Table 2-3, page 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 36. , . . . . . Cavity-Up Plastic BGA Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . ... Original
datasheet

118 pages,
4609.77 Kb

TSOP 54 land pattern TT 2076 XCS20 TQ144 country of origin XCS20XL pqg208 FG484 XC4VLX25 cmos 668 fcbga FFG676 XC2S50 PQG208 XC3SD1800A-4CS484LI reballing XCMECH-FG676 pcb footprint FS48, and FSG48 XC3S400AN-4FG400I UG112 UG112 abstract
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , Table 2-3, page 38. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 38. Changed , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip BGA ... Original
datasheet

122 pages,
4619.88 Kb

WS609 bga rework 304 QFP amkor CSG484 die electric sealer fcBGA PACKAGE thermal resistance xc9572xl vqg TT 2076 PC84/PCG84 pcb footprint FS48, and FSG48 smd diode JC 0p FF1148 top marking 957 so8 UG112 UG112 abstract
datasheet frame
Abstract: : "Xilinx Device Marking Definition-Example". Updated "Flip-Chip BGA Packages" in Chapter 1; added content , Resistance for Packages", which was removed). Updated "Recommended PCB Design Rules for BGA, CSP, and CCGA , 26 and Table 2-3, page 36. Added FF1136 FF1136 and FFG1136 FFG1136 tray and box information to Table 2-3, page 36. , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cavity-Up Plastic BGA , Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flip-Chip BGA ... Original
datasheet

118 pages,
4608.19 Kb

XC2C256-7PQ108I xilinx topside marking UG112 FF676 xc9572xl vqg FFG676 1466 ball FCBGA XCDAISY XC2VP7 reflow profile jedec so8 Wire bond gap sn63pb37 solder SPHERES HQG160 SPARTAN-II xc2s50 pq208 UG112 abstract
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Abstract: built up our B BGA, WCSP D F H L M T Bare Chip Plastic QFP Ceramic DIP Ceramic QFP , tape & reel (tray) TCP BL 2 directions Tape & reel BACK TCP BR 2 directions TCP BT 2 directions , * 1.2 5X5 1.2 11 X 11Row 3Row 6X6 1.2 0.5 11 X 11Row 6X6 1.2 PFBGA7U-144 PFBGA7U-144 , VFBGA6H-121 VFBGA6H-121 144 Thickness Max. Full 4X4 1.0 Full 5X5 1.0 11 X 11Row 3Row 6X6 1.0 0.5 11 X 11Row 6X6 1.0 VFBGA7H-144 VFBGA7H-144 0.5 13 X 13Row 4Row 7X7 1.0 161 ... Original
datasheet

31 pages,
8645.28 Kb

Epson SuperFlash QFN5-32 Epson LQ 450 WCSP-16 t-con lvds TTL catalog s1k500 UXGA tcon RTL 204 601 tcon 17 epson S1K60000 S1L50062 SMART ASIC 197 EPSON tcon datasheet abstract
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Abstract: Ball Grid Array (BGA) connectors for dense mezzanine board packaging operating at extremely high signal , architectures 6x6 midplane headers provide 36 crossover pairs ยท Available with or without polarization and , Part References 6x6 vertical header with right guide 6x6 vertical header with right guide 6x6 vertical header 6x6 vertical header with right guide 4x4 vertical header 4x4 d aughter card receptacle ... Original
datasheet

100 pages,
5615.93 Kb

XCEDE optical pcb edge CONNECTOR 1.27mm pitch 4 pin DDR3 udimm 8G mini pcie connector 52 pin vertical nas 65239 MINISAS HD sfp 2x3 10089485-1E03LF mini PCIe 52 pin vertical sca-2 40 pin to sata fci round shell connector PCI x16 footprint fingers datasheet abstract
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Abstract: 41 3.3.3 Shipping Tray , . 41 Shipping Tray Vendor , perimeter array package with 508 ball connections in the outer area of the package and a square 6x6 grid of ... Original
datasheet

56 pages,
419.88 Kb

Intel 80321 daewon BGA 6x6 tray 273416 Intel StrataFlash Memory j3 datasheet abstract
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Abstract: STM32F103T6 STM32F103T6 STM32F103C6 STM32F103C6 STM32F103R6 STM32F103R6 STM32F101T6 STM32F101T6 STM32F101C6 STM32F101C6 STM32F101R6 STM32F101R6 0 36 pins QFN (6x6) Both , embedded Flash dispatched on 7 packages BGA (10x10) BGA (10x10) Software and tools The STM32 STM32 ... Original
datasheet

35 pages,
2645.46 Kb

ST VIPER application notes pure sine wave dimmer EVALVIPER17H-6W hp laptop inverter board schematic schematic lcd inverter dell schematic diagram of laptop dell lenovo laptop battery schematic dell laptop lcd inverter Connecting the FSMC to the LCD Intel hp laptop ac adapter schematics diagram "full hd" mobile phone camera pinout STV200N55F3 STV250N55F3 STV200N55F3 abstract
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www.datasheetarchive.com/files/kaleidoscope/cad/capilano - designworks 4.3.1/mac/dwm_installer.hqx
Kaleidoscope 10/04/2005 16069.24 Kb HQX dwm_installer.hqx