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to262 pcb footprint

Catalog Datasheet MFG & Type PDF Document Tags

to262 pcb footprint

Abstract: 51a marking on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and soldering techniques refer to application note #AN-994. www.irf.com IRF1010EZ/S/LPbF TO-262 Package Outline Dimensions are shown in millimeters (inches) TO-262 Part Marking Information @Y6HQG@) UCDTÃDTÃ6IÃDSG" "G , IRF1010EZLPbF ID = 75A S TO-220AB IRF1010EZPbF D2Pak TO-262 IRF1010EZSPbF IRF1010EZLPbF , Junction-to-Ambient ­­­ 62 RJA Junction-to-Ambient (PCB Mount, steady state) ­­­ 40 HEXFET® j
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to262 pcb footprint 51a marking irf1010ezpbf MARKING 51A IRF1010EZP IRF1010EZSP IRF1010EZLP IRF1010EZ/S/LP

to262 pcb footprint

Abstract: AN-994 " square PCB (FR-4 or G-10 Material ). For recommended footprint and soldering techniques refer to , TO-262 Parameter ID @ TC = 25°C ID @ TC = 100°C IDM PD @TA = 25°C PD @TC = 25°C V GS EAS , Junction-to-Case Junction-to-Ambient (PCB mount) * Typ. Max. Units 2.2 40 °C/W 1 07/19 , ) Notes: Repetitive rating; pulse width limited by D IRFZ34NS/LPbF TO-262 Package Outline Dimensions are shown in millimeters (inches) TO-262 Part Marking Information EXAMPLE : THIS IS AN
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IRFZ34NS IRFZ34NL IRFZ34N IRL3103L IRFZ34NSP IRFZ34NLP IRFZ34NS/LP

to262 pcb footprint

Abstract: smd marking 634 of other applications. TO-220AB IRF2804PbF D2Pak IRF2804SPbF TO-262 IRF2804LPbF , , Flat, Greased Surface RJA Junction-to-Ambient RJA Junction-to-Ambient (PCB Mount, steady , % tested to this value in production. This is applied to D 2Pak, when mounted on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and soldering techniques refer to application note #AN-994. Max R DS(on) for D2Pak and TO-262 (SMD) devices. TO-220 device will have an Rth value of 0.45
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smd marking 634 IRF2804LPBF IRF2804P IRF2804SP IRF2804LP IRF2804/S/LP EIA-418

IRLZ34NS

Abstract: GS Logo, Marking 30A through-hole version (IRLZ34NL) is available for lowprofile applications. ID = 30A S D 2 Pak TO-262 , RJA Junction-to-Case Junction-to-Ambient ( PCB Mounted,steady-state)* Typ. Max. Units , ) TJ 175°C Uses IRLZ34N data and test conditions * When mounted on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and soldering techniques refer to application note #AN-994. 2 IRLZ34NS/LPbF TO-262 Package Outline Dimensions are shown in millimeters (inches) TO-262 Part Marking
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IRLZ34NS GS Logo, Marking 30A IRLZ34NSP IRLZ34NLP IRLZ34NS/LP 3103L

mJ 6920

Abstract: 5MAD " square PCB (FR-4 or G-10 Material). For recom mended footprint and soldering techniques refer to application note #AN-994. R is measured at TJ approximately 90°C. IRFB/S/SL3207ZPbF TO-262 Package Outline Dimensions are shown in millimeters (inches) TO-262 Part Marking Information @Y6HQG@ , IRFS3207ZPbF TO-220AB IRFB3207ZPbF D TO-262 IRFSL3207ZPbF G D S Gate Drain Source , Junction-to-Ambient, TO-220 k ­­­ ­­­ Units 62 40 RJC 2 Junction-to-Ambient (PCB Mount) , D Pak jk
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mJ 6920 5MAD IRFB3207ZPBF J 6920 A irfb3207z D670 97213C IRFB3207ZP IRFS3207ZP IRFSL3207ZP IRFB/S/SL3207ZP

marking 49M

Abstract: AN-994 of other applications. TO-220AB IRF1405ZPbF D2Pak IRF1405ZSPbF TO-262 IRF1405ZLPbF , (PCB Mount, steady state) ­­­ 40 i Units °C/W HEXFET® is a registered trademark of , is applied to D2Pak, when mounted on 1" square PCB Pulse width 1.0ms; duty cycle 2%. ( FR-4 or G-10 Material ). For recommended footprint and Coss eff. is a fixed capacitance that gives the same soldering , . 2 IRF1405Z/S/LPbF TO-262 Package Outline Dimensions are shown in millimeters (inches
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marking 49M IRF1405ZP IRF1405ZSP IRF1405ZLP IRF1405Z/S/LP

AN-994

Abstract: IRG4BH20K-L PD - 93764 PRELIMINARY TO-263 IRG4BH20K-S, TO-262 IRG4BH20K-L Short Circuit Rated , ) · Low-profile through-hole TO-262 (IRG4BH20KL) VCES = 1200V VCE(on) typ. = 3.17V G @VGE = , Junction-to-Case Case-to-Sink, Flat, Greased Surface Junction-to-Ambient ( PCB Mounted,steady-state , (oz) 1 8/17/99 TO-263 IRG4BH20K-S, TO-262 IRG4BH20K-L Electrical Characteristics @ TJ = 25 , ) junction temperature. (See fig. 13a) Pulse width 5.0µs, single shot. * When mounted on 1" square PCB
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IRG4BH20KS
Abstract: . D i Pak TO-262 Absolute Maximum Ratings U n its P a ra m e te r M ax. lD @ Tc = 25 , Junction-to-Case Junction-to-Ambient ( PCB Mounted,steady-state)â' â'" â'" Max. Units 3.3 40 , < 300(js; duty cycle < 2%. © Uses IRLZ24N data and test conditions * When mounted on 1" square PCB ( FR-4 or G-10 M aterial). For recommended footprint and soldering techniques refer to application , ) 1.14 (.045) MINIMUM RECOMMENDED FOOTPRINT 11.43 (.450) ff; NOTES: 1 DIMENSIONS AFTER SOLDER DIP -
OCR Scan
1358D IRLZ24NS/L IRLZ24NS IRLZ24NL

3pn06l03

Abstract: ANPS071E ambient, leaded RthJA - - 62 SMD version, device on PCB: RthJA @ min. footprint - , · n-Channel 55 RDS(on) max. SMD version Feature 100 A P- TO262 -3-1 P- TO263 , 3PN06L03 IPI100N06S3L-03 P- TO262 -3-1 - 3PN06L03 Maximum Ratings, at Tj = 25 °C, unless , www.infineon.com/optimos 2Qualified at -5V and +16V 3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. 4Defined by
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IPP100N06S3L-03 IPB100N06S3L-03 BIPP100N06S3L-03 ANPS071E smd diode marking 78A 3pn06 INFINEON PART MARKING to263 K TRANSISTOR SMD MARKING CODE OPTIMOS TRANSISTOR BIPB100N06S3L-03 BIPI100N06S3L-03

irf540

Abstract: IRF540NS . *When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to application note #AN-994 IRF540NS/IRF540NL TO-262 Package Outline Dimensions are shown in millimeters (inches) TO-262 Part Marking Information @Y6HQG@) UCDTÃDTÃ6IÃDSG" "G GPUÃ8P9@Ã
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IRF540N irf540 IRF540NS IRF540NL diode 16A 100V

Diode smd marking 44

Abstract: IPP25N06S3L-21 version, device on PCB: RthJA @ min. footprint - - 62 @ 6 cm2 cooling area 3) - - , version P- TO262 -3-1 P- TO263 -3-2 V 21 m 25 RDS(on) · Enhancement mode 55 , 3N06L21 IPI25N06S3L-21 P- TO262 -3-1 - 3N06L21 Maximum Ratings, at Tj = 25 °C, unless , 2Qualified at -5V and +16V 3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. 4Defined by design. Not subject to
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IPP25N06S3L-21 IPB25N06S3L-21 Diode smd marking 44 INFINEON smd PART MARKING BIPP25N06S3L-21 BIPB25N06S3L-21 BIPI25N06S3L-21

3N0625

Abstract: INFINEON PART MARKING 252 - 62 SMD version, device on PCB: RthJA @ min. footprint - - 62 @ 6 cm2 , On-Resistance RDS(on) IPI25N06S3-25 IPP25N06S3-25,IPB25N06S3-25 P- TO262 -3-1 V 24.9 m 25 , -25 P- TO262 -3-1 - 3N0625 Maximum Ratings, at Tj = 25 °C, unless otherwise specified Parameter , on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. 4Defined by design. Not subject to production test. Page 2
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INFINEON PART MARKING 252 SMD marking code 1696 TO220 package infineon smd diode code marking 33A BIPP25N06S3-25 BIPB25N06S3-25 BIPI25N06S3-25

AN-994

Abstract: IRF2907Z D2Pak, when mounted on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and , . D2Pak IRF2907ZS TO-220AB IRF2907Z TO-262 IRF2907ZL Absolute Maximum Ratings Parameter , Junction-to-Ambient (PCB Mount, steady state) k jk Units 0.45 °C/W 0.50 Junction-to-Case Max , °C. IRF2907Z/S/L TO-262 Package Outline Dimensions are shown in millimeters (inches) 1- GATE IGBT 2- COLLECTOR 3- EMITTER TO-262 Part Marking Information G " " G DS Ã I 6 Ã T D Ã
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to262 pcb footprint

Abstract: ISD 1720 . ID = 61A S TO-220AB IRFZ48Z D2Pak IRFZ48ZS TO-262 IRFZ48ZL Absolute Maximum Ratings , Junction-to-Ambient RJA j Junction-to-Ambient (PCB Mount, steady state) ­­­ 62 ­­­ 40 HEXFET , % tested to this value in production. This is applied to D2Pak, when mounted on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and soldering techniques refer to application note #AN-994. IRFZ48Z/S/LPbF TO-262 Package Outline Dimensions are shown in millimeters (inches) TO-262
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ISD 1720 IRFZ48ZP IRFZ48ZSP IRFZ48ZLP IRFZ48Z/S/LP

3N0607

Abstract: DIODE 7387 - 62 SMD version, device on PCB: RthJA @ min. footprint - - 62 @ 6 cm2 , · Low On-Resistance RDS(on) IPI80N06S3-07 IPP80N06S3-07,IPB80N06S3-07 80 A P- TO262 , -07 P- TO262 -3-1 - 3N0607 Maximum Ratings, at Tj = 25 °C, unless otherwise specified Parameter , on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. 4Defined by design. Not subject to production test. Page 2
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DIODE 7387 c4 09 smd marking code smd diode code 102a BIPP80N06S3-07 BIPB80N06S3-07 BIPI80N06S3-07

3P03L04

Abstract: ANPS071E , leaded RthJA - - 62 SMD version, device on PCB: RthJA @ min. footprint - - , · Automotive AEC Q101 qualified 4 ID · Logic Level P- TO262 -3-1 V m -80 P , -3-2 - 3P03L04 IPI80P03P3L-04 P- TO262 -3-1 - Gate pin1 Marking 3P03L04 Maximum , information see app.-note ANPS071E available at www.infineon.com/optimos 2Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without
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IPP80P03P3L-04 IPB80P03P3L-04 INFINEON PART MARKING sMD MARKING CODE C3 package to220 DIODE smd marking code UM 31 DIODE smd marking Ag BIPP80P03P3L-04 BIPB80P03P3L-04 BIPI80P03P3L-04

3PN0603

Abstract: INFINEON smd PART MARKING - 62 SMD version, device on PCB: RthJA @ min. footprint - - 62 @ 6 cm2 , ID · AEC Q101 qualified · Low On-Resistance RDS(on) 55 P- TO262 -3-1 V 3 m 100 , -03 P- TO262 -3-1 - 3PN0603 Maximum Ratings, at Tj = 25 °C, unless otherwise specified Parameter , 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB
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IPI100N06S3-03 IPP100N06S3-03 IPB100N06S3-03 BIPP100N06S3-03 BIPB100N06S3-03 BIPI100N06S3-03

3N06L06

Abstract: C4 diode , leaded RthJA - - 62 SMD version, device on PCB: RthJA @ min. footprint - - , · n-Channel 55 RDS(on) max. SMD version Feature 80 A P- TO262 -3-1 P- TO263 , 3N06L06 IPI80N06S3L-06 P- TO262 -3-1 - 3N06L06 Maximum Ratings, at Tj = 25 °C, unless , www.infineon.com/optimos 2Qualified at -5V and +16V 3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. 4Defined by
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IPP80N06S3L-06 IPB80N06S3L-06 C4 diode IPI80N06S3L06 BIPP80N06S3L-06 BIPB80N06S3L-06 BIPI80N06S3L-06

AN-994

Abstract: 24v 30a smps mounted on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and soldering techniques , 30V 260A D2 Pak IRL3713SPbF TO-262 IRL3713LPbF Absolute Maximum Ratings Max Units , , Flat, Greased Surface RJA Junction-to-Ambient RJA Junction-to-Ambient (PCB Mount) fi , (end of life) for D2Pak and TO-262 = 0.50°C/W. This is the maximum measured value after 1000
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24v 30a smps 97011B IRL3713P IRL3713SP IRL3713LP

WE-270

Abstract: AN-994 S D G S D G D2Pak IRFS3307PbF TO-220AB IRFB3307PbF TO-262 IRFSL3307PbF , Junction-to-Ambient (PCB Mount) , D Pak jk l Units °C/W 1 IRFB/S/SL3307PbF Static @ TJ = 25 , rising from 0 to 80% VDSS. When mounted on 1" square PCB (FR-4 or G-10 Material). For recom mended footprint and soldering techniques refer to application note #AN-994. R is measured at TJ approximately 90°C. RJC (end of life) for D2Pak and TO-262 = 0.75°C/W. Note: This is the maximum measured value
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WE-270 10mhz mosfet 95706C IRFB3307P IRFS3307P IRFSL3307P IRFB/S/SL3307P
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