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Part Manufacturer Description Datasheet BUY
TPSM84824MOLR Texas Instruments 4.5V to 17V Input, 0.6V-10V Output, 8A Power Module in Compact 7.5x7.5mm Footprint 24-QFM -40 to 105 visit Texas Instruments Buy
PTPSM84824MOLR Texas Instruments 4.5V to 17V Input, 0.6V-10V Output, 8A Power Module in Compact 7.5x7.5mm Footprint 24-QFM -40 to 105 visit Texas Instruments Buy
ISO7142CCQDBQQ1 Texas Instruments Automotive, Small Footprint, Low Power, Quad-Channel 2/2 Digital Isolator 16-SSOP -40 to 125 visit Texas Instruments
REF3450IDBVR Texas Instruments 5V Low-Drift Low-Power Small-Footprint Series Voltage Reference 6-SOT-23 -40 to 125 visit Texas Instruments Buy
TPSM84424MOLR Texas Instruments 4.5V to 17V Input, 0.6V-10V Output, 4A Power Module in Compact 7.5x7.5mm Footprint 24-QFM -40 to 105 visit Texas Instruments Buy
REF3430IDBVR Texas Instruments 3V Low-Drift Low-Power Small-Footprint Series Voltage Reference 6-SOT-23 -40 to 125 visit Texas Instruments Buy

to 252 footprint

Catalog Datasheet MFG & Type PDF Document Tags

to 252 footprint

Abstract: D-Pak (TO-252) Footprint 7.0 (0.276) 7.0 (0.276) 1.5 (0.059) 1.5 (0.059) 2.5 2.3 (0.090) 2.3 (0.090) All dimensions in mm (inches) 6.9 (0.272) International Rectifier
International Rectifier
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HP16034E

Abstract: HP4291A Recommended Footprint 2.0 3.2 0.4 The TOKO LLM3225 Series is a wirewound ferrite core chip inductor that conforms to the EIA standard 1210 footprint, is suitable for general-purpose signal line , footprint (3.2mm x 2.5mm) · Inductance tolerance: ±5%, ±10% · Operating temperature: ­40°C to +85°C · , =±10%) Inductance Footprint (l x w in mm) Type Name Test Conditions: Inductance and Q: HP4291A (Test Fixture , reduction from the initial value or coil temperature to rise by 20ºC, whichever is smaller. (Reference
TOKO
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HP16034E HP8753E llm3225100 to 252 footprint HP16192A TR6871 LLM3225-R10 LLM3225-R12

to252 footprint wave soldering

Abstract: to 252 footprint 400 1oz Copper on TO 252 Package Mounted on recommended mimimum footprint (R£ J A=125°C/W) c , 0.5 Still Air 1oz Copper on TO 252 Package Mounted on recommend mimimum footprint (R£ J A , Type Pin Option Package Type PACKAGE TYPE PIN OPTION GT3 : TO 220 Pb-free GT4 : TO 252 , .2.2 Top View www.SiliconStandard.com 1 2 3 TO-252 and TO-263 1 2 3 SOT-223 1 , .260°C, 10s TO 252, SOT 223 Package
Silicon Standard
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to252 footprint wave soldering SS8027G SS8027GTXXXX 40MAX 055MAX

to 252 footprint

Abstract: PACKAGE TYPE PIN OPTION GT3 : TO 220 Pb-free GT4 : TO 252 Pb-free GT5 : TO 263 Pb-free GT6 : SOT , www.SiliconStandard.com 1 2 3 TO-252 and TO-263 1 2 3 SOT-223 1 of 10 SS8027 Absolute , , 10s TO 252, SOT 223 , ) â'¦â'¦â'¦â'¦â'¦â'¦â'¦â'¦.â'¦â'¦â'¦â'¦.â'¦â'¦â'¦â'¦â'¦â'¦.0.8W TO 252(1 , in the SOT 223 package, θJA is 156°C/W; in the TO 252 package, θJA is 125°C/W; in the TO 263
Silicon Standard
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to220 pcb footprint

Abstract: to 252 footprint package, JA is 125°C/W. (See recommend minimum footprint). The safe operation in SOT 89, SOT 223, TO 252 , Package Mounted on recommend mimimum footprint (R £ cA=125 °C/W) J 1.2 1oz Copper on TO-252 Package , Pin Option Package Type PACKAGE TYPE PIN OPTION T2 : SOT-89 T3 : TO 220 T4 : TO 252 T5 : TO , 3 TO-252 and TO-263 www.SiliconStandard.com Top View 1 2 3 SOT-223 and SOT , ) .0.8W TO 252(1
Silicon Standard
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to220 pcb footprint T2 Package SS8026 SS8026XXXXX

T2 Package

Abstract: G952 package, JA is 125°C/W. (See recommend minimum footprint). The safe operation in SOT 89, SOT 223, TO 252 , Still Air 1oz Copper on TO-252 Package Mounted on recommend mimimum footprint (RJA=125°C/W) 1.2 1oz Copper on TO-252 Package Mounted on recommended mimimum footprint (RJA=125°C/W) 1000 Power , 89 TO 252 SOT 223 SOT 223 PIN OPTION 2 3 VOUT GND VOUT VOUT GND VIN VOUT VIN , Number PACKAGE TYPE PIN OPTION T2: SOT 89 T3: TO 220 T4: TO 252 T5: TO 263 T6: SOT 223 1
Global Mixed-Mode Technology
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G952T23U G952T25U G952T43U G952T63U G952T65U G952

to220 pcb footprint

Abstract: -220 TO-220 TO-252 TO-252 TO-263 SOT-223 SOT-223 PIN OPTION 2 3 GND VIN GND VIN GND , : TO-252 T5 : TO-263 T6 : SOT-223 2 GND VIN VOUT VIN GND VOUT Package Type PACKING 3 , )â'¦â'¦â'¦â'¦â'¦â'¦â'¦â'¦â'¦â'¦â'¦â'¦â'¦â'¦â'¦â'¦â'¦0.8W TO-263(1 , the G960 in the SOT-223 package, θJA is 156°C/W; in the TO-252 package, θJA is 125°C/W; in the TO , Minimum Footprint] If the TO-220 package is used with a heat sink, θJA is the sum of the package thermal
Global Mixed-Mode Technology
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G960T33T G960T36T G960T43U G960T45U G960T53U G960T63U

TO-263 footprint

Abstract: G960T63U Still Air 1oz Copper on TO 252 Package Mounted on recommend mimimum footprint (RJA=125°C/W) 0.4 , Type Pin Option Package Type Part Number PACKAGE TYPE PIN OPTION T3 : TO 220 T4 : TO 252 , 263 Package.260°C, 10s TO 252, SOT 223 Package , ).0.8W TO TO 263(1 , the TO 252 package, JA is 125°C/W; in the TO 263 package, JA is 75°C/W, and in the TO 220 package, JA
Global Mixed-Mode Technology
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TO-263 footprint G960

FSLM TOKO

Abstract: is a ferrite core wirewound surface mount chip inductor which conforms to the EIA standard 1008 footprint. Its proprietary welded termination architec­ ture offers superior reliability and high , Range: -40°C to +85°C Typical max Q: 40 ~ 50 Proprietary wire-wound structure with welded , soldering Low profile: 1008 footprint 1,7mm max (1,6mm typ.) S-parameter data available upon request , Footprint (I x w in mm) Type Name Q-FREQUENCY CHARACTERISTICS 1 1.847.297.0070 10 Frequency (MHz
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OCR Scan
FSLM TOKO FSLM2520 FSLM2520-R10 FSLM2520-100 FSLM2520-6R8 FSUM2520-12G FSLM2520-150

to 252 footprint

Abstract: voltage regulator sot 223 125°C/W (See recommend minimum footprint). The safe operation in SOT 223,TO 252 & TO 263 package, it , 1.1 1oz Copper on TO-252 Package Mounted on recommended mimimum footprint (R£ c A=125°C/W) J , on TO-252 Package Mounted on recommend mimimum 0.3 0.2 footprint (R£ c A=125°C/W) J 0.1 , PIN OPTION GT3 : TO 220 Pb-free GT4 : TO 252 Pb-free GT5 : TO 263 Pb-free GT6 : SOT 223 Pb-free , 10µF Top View 1 2 1 3 TO-220 Rev.2.02 7/06/2004 Top View 2 3 TO-252
Silicon Standard
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voltage regulator sot 223 SS8047 SS8047GTXXXX

2S20

Abstract: FSLM2520 wirewound surface mount chip inductor which conforms to the EIA standard 1008 footprint. Its proprietary , as matching elements. FEATURES â  1008 Footprint â  Inductance Range: 0.1 to 220 |jH â  Low , =5%) -Inductance -Footprint (| xw in mm) -Type Name Q-FREQUENCY CHARACTERISTICS DIMENSIONS 2.0 . . 1.6*° rrn 1.4 , Reotatanco (njmux. noted DC Curronl (mA) max. SRF (MHz) mln. FSLM2520 Rt0_ 0.10 ±5%±10% 25.2 0.21 570 eao FSLM2520-R12_ 0.12 t5%±10% 30 25.2 0.22 550 650 FSLM2520-R15_ 0.15 ±5%*10% 30 25.2 0.25 500 530 FSLM2520-R1
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OCR Scan
2S20 FSLM2620-R39 core i5 520 Toko 7mm 1008 footprint TOKO 252 FSLM2620-680 FSLM2520-820 FSLM2520-101 FSLM2520- FSLM2520-221
Abstract: a wirewound ferrite core chip inductor that conforms to the EIA standard 1210 footprint, is suitable , 1.9 0.4 Recommended Footprint 2.0 3.2 Unit: mm Tolerance: ± 0.2mm 0.5 1.0 2.0 , temperature: ­40°C to +85°C · Packaged on tape and reel in 2,000 piece quantity · Reflow solderable Test , ) [Lo 100µH]. SRF: HP8753E. LLM 3225 - R10 K Tolerance (J=±5%, K=±10%) Inductance Footprint (l x , (IDC) is that which causes a 10% inductance reduction from the initial value or coil temperature to TOKO
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LLM3225-R15 LLM3225-R18 LLM3225-R22 LLM3225-R27 LLM3225-R33 LLM3225-R39

to 252 footprint

Abstract: FSLM TOKO wirewound surface mount chip inductor which conforms to the EIA standard 1008 footprint. Its proprietary , standard 1008 footprint (2.5mm x 2.0mm) · Temperature coefficient: 750ppm/°C · Temperature range: ­40°C to +85°C · Typical max Q: 40 ~ 50 · Proprietary wirewound structure with welded terminations , Tolerance (J=±5%, K=±10%) Inductance Footprint (l x w in mm) Type Name Q-FREQUENCY CHARACTERISTICS 70 , . Self Resonant Frequency (MHz) min. FSLM2520-R10_* 0.10 J, K 30 25.2 0.21 570
TOKO
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LLM2520 R-LOG0703A M2520-5R6 FSLM2520-8R2 FSLM2520-120 FSLM2520-180

250v 1000 K capacitor

Abstract: to 252 footprint package, JA is 125°C/W (See recommend minimum footprint). The safe operation in SOT 223,TO 252 & TO 263 , TO 252 TO 263 SOT 223 SOT 223 SOT 223 SOT 223 (Pb Free) SOT 223 PIN OPTION 2 GND GND , : TO 220 T4 : TO 252 T5 : TO 263 T6 : SOT 223 1 1 : VOUT 2 : VOUT 3 : GND 4 : GND 5 : VIN 6 , Package.260°C, 10s TO 252, TO 263, SOT 223 Package , ).0.8W TO TO 263(1
Global Mixed-Mode Technology
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G950T45U G950T55U G950T63U G950T64U G950T65U G950T66U 250v 1000 K capacitor G950T65
Abstract: ferrite core wirewound surface mount chip inductor which conforms to the EIA standard 1008 footprint. Its , Coefficient: 750ppm/°C · Temperature Range: ­40°C to +85°C · Typical max Q: 40 ~ 50 · Proprietary wire-wound , for flow and reflow soldering · Low profile: 1008 footprint 1.7mm max (1.6mm typ.) · S-parameter data , Numbering FSLM 2520 - R10 K Tolerance (J=±5%, K=±10%) Inductance Footprint (l x w in mm) Type Name , Frequency DC Resistance MHz ( ) max. 25.2 25.2 25.2 25.2 25.2 25.2 25.2 25.2 25.2 25.2 25.2 25.2 7.96 7.96 TOKO
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FSLM2520-121 FSLM2520-151 FSLM2520-181

to252 footprint wave soldering

Abstract: G950T63U package, JA is 125°C/W (See recommend minimum footprint). The safe operation in SOT 223,TO 252 & TO 263 , ADSL/Cable Modem Set-Top-Box LAN switch/Hub Router Ordering Information TO 252 TO 263 SOT , Option Package Type Part Number PACKAGE TYPE PIN OPTION T3 : TO 220 T4 : TO 252 T5 : TO 263 , Package.260°C, 10s TO 252, TO 263, SOT 223 Package , ).0.8W TO TO 263(1
Global Mixed-Mode Technology
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TO252263 G950

FSLM TOKO

Abstract: #fslm2520-101 ferrite core wirewound surface mount chip inductor which conforms to the EIA standard 1008 footprint , to +85°C · Typical max Q: 40 ~ 50 · Proprietary wire-wound structure with welded terminations , · Low profile: 1008 footprint 1.7mm max (1.6mm typ.) · S-parameter data available upon request · , =±10%) Inductance Footprint (l x w in mm) Type Name Q-FREQUENCY CHARACTERISTICS 70 60 50 Q 47µH 4.7µH , J, K Q (min.) 30 Test Frequency DC Resistance MHz ( ) max. 25.2 0.21 Rated DC
TOKO
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TOKO SURFACE MOUNT INDUCTORS FSLM2520-5R6 FSLM2520-220 FSLM2520-270 FSLM2520-330 FSLM2520-390 FSLM2520-470

t4 MARKING SOT223

Abstract: G1117-33T43Uf minimum footprint). The safe operation in SOT-223, TO-252 package, it can see "Typical Performance , Area (in2) 45 65 TAMB (oC) 85 Recommend Minimum Footprint SOT-223 TO-252 TEL , °C -40°C~85°C TO-252 TO-252 TO-252 TO-252 TO-252 SOT-223 SOT-223 SOT-223 SOT-223 SOT , PIN OPTION 1 3: GND T4: TO-252 T6: SOT-223 2 VOUT PACKING U : Tape & Reel 3 VIN , SOT-223 1 2 G1117-XX VIN IO VOUT VIN VOUT GND C1 1µF COUT 10µF TO-252
Global Mixed-Mode Technology
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G1117-15T43U G1117-18T43U G1117-25T43U G1117-15T63U G1117-18T63U G1117-33T63U t4 MARKING SOT223 G1117-33T43Uf 1117-18 G1117-25T63UF G1117 G1117-33T43U G1117-35T43U

G952T43U

Abstract: SOT-252 package, JA is 124°C/W. (See recommend minimum footprint). The safe operation in SOT- 89, SOT-223, TO-252 , 85 TAMB ( °C) Recommended Minimum Footprint SOT-89 SOT-223 TO-252 TEL: 886-3-5788833 , ~85°C -40°C~85°C -40°C~85°C -40°C~85°C -40°C~85°C SOT-89 SOT-89 SOT-89 TO-252 SOT-223 SOT , Number PACKAGE TYPE T2: SOT-89 T4: TO-252 T6: SOT-223 PIN OPTION 1 1: VOUT 2: VOUT 3: GND 4 , COUT 10µF TO-252 TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 2.6 Mar 19, 2007 1
Global Mixed-Mode Technology
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G952T24U SOT-252 845 motherboard circuit
Abstract: °C/W, in TO-252 package, θJA is 124°C/W. (See recommend minimum footprint). The safe operation in , °C -40°C~85°C -40°C~85°C -40°C~85°C -40°C~85°C -40°C~85°C SOT-89 SOT-89 SOT-89 TO-252 , Option Package Type Part Number PACKAGE TYPE T2: SOT-89 T4: TO-252 T6: SOT-223 PIN OPTION 1 , G952 C1 1µF 3 IQ VOUT COUT 10µF TO-252 TEL: 886-3-5788833 http://www.gmt.com.tw , /W TO-252 . . . . . . . . . . . . . . . . . . . . . . . . . . . .124°C/W Thermal Resistance Global Mixed-Mode Technology
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26BSC 09BSC
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