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SMD291SNL500T3 Chip Quik Inc SOLDER PASTE SAC305 500G visit Digikey Buy
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tamura solder paste

Catalog Datasheet MFG & Type PDF Document Tags

72116

Abstract: tamura solder paste SOLDER PASTE Tamura solder paste did not perform as well as some of the other solder pastes under the , % such, the Tamura solder paste was classified as having 20% to 50% voiding, as shown in Figures 16 and , Voids For Tamura Solder Paste a) Best-Case b) Worst-Case Single PowerPAK 1212-8 Voids: 10% - 20 , For Tamura Solder Paste Document Number: 72116 15-Dec-03 www.vishay.com 9 AN825 Vishay , Data In Appendix Manufacturer Several solder paste types, including lead-free, water-soluble
Vishay Siliconix
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72116 tamura solder paste solder paste tlf 204 29 NC-SMQ92J solder paste tamura solder paste PROFILE solder paste tamura tlf 204 29

NC-SMQ230

Abstract: tamura rma Packaging PC Board Pad Design Automatic Placement Equipment Considerations Solder Paste Reflow Soldering , (0.008 in.) of recommended size. Automatic Placement Equipment Considerations Solder Paste , . For best results, an SN63 eutectic solder paste, liquidus at +183ºC (+361ºF), should be used. SN62 solder paste containing 2% silver, liquidus at +189 ºC (+372 ºF), may be used with the chip LED devices, with the advantage of obtaining stronger solder connections, but higher cost. The solder paste should
Avago Technologies
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NC-SMQ230 tamura rma tamura solder paste rma tamura solder paste rma-10-61a JEDEC SMT reflow profile VISCOSITY tamura solder paste 150SEC 120SEC 100SEC 5989-2268EN AV01-0654EN

SAC387

Abstract: NXR-1400 Assembly Process (1) (2) (3) Lead (Pb)-free and tin-lead solder paste test samples were used: a. Lead (Pb)-free solder paste SAC-387 (Tamura TLF-206-93G) b. Tin-lead (Sn-Pb) no-clean solder paste , -1400 transmission X-ray · 30x microscope · Lead (Pb)-free solder paste SAC-387 (Tamura TLF-206-93G) · Tin-lead , : 72146 Revision: 17-May-10 different solder paste and reflow profiles," web link: http , experiments involving different parameters such as aperture, stencil thickness, solder paste printing
Vishay Siliconix
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SAC387 NXR-1400 SN63 PB37 alpha PowerPAK 1212-8 stencil ekra e5 SAC387 solder AEC-Q101 1212D IPC-9701

73494

Abstract: NXR-1400 microscope 7) Lead (Pb)-free solder paste SAC-387 (Tamura TLF-206-93G) 8) Tin-lead (Sn-Pb) no-clean solder , ramp-long-soak-spike (LRSS). Other process variables are stencil designs, solder paste applicator machine parameters , MATERIAL: 1) EKRA E5 solder paste printer 2) Juki E2060 pick and place machine 3) BTU Pyramax 98 reflow , layers, and lead (Pb)-free solder paste. Reusing the PCB during repeat reflow after parameter , Long RSS Single 5 mils First 5 mils Figure 2: RSS profile for lead (Pb)-free solder paste
Vishay Siliconix
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AN611 73494 ekra nicolet nxr1400 pyramax nicolet SN63 PB37 PROFILES SMD125T16L

tamura CF-110VH-2A

Abstract: solder paste infiltrates into the body if plenty of solder paste was applied by switch on the P.W.B. So , After spreading flux, the terminal is immersed in solder with following condition. Solder ber : M705/Sn-3.0Ag-0.5Cu (Senju Metal Indusry Co.,Ltd.) Flux : CF-110VH-2A (tamura kaken) Soldering , area(Excluding ruptured surface)where is immersed in solder shall be covered by new solder
Panasonic
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tamura CF-110VH-2A EVQQ0C03K 2002/95/EC

tamura solder paste

Abstract: CF-110VH-2A paste infiltrates into the body if plenty of solder paste was applied by switch on the P.W.B. So we , solder with following condition. Solder ber : M705/Sn-3.0Ag-0.5Cu (Senju Metal Indusry Co.,Ltd.) Flux : CF-110VH-2A (tamura kaken) Soldering temperture : 260±5 Soldering time : 2±0.5 sec. Contact , (Excluding ruptured surface)where is immersed in solder shall be covered by new solder. 5.2.6 Solderbility , product with sharp-edged object. 5) Cleaning If flux or solder is scattered on the surface of P.W.B when
Panasonic
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CF-110VH Senju M705 safety senju 533 solder paste EVPAA402W

CF-110VH-2A

Abstract: senju m705 solder paste object such as a weight etc. on the operating knob. 4) Please use the solder paste which includes flux , ) If a large amount of solder paste is applied around the switch, flux from solder paste may enter , in solder with following condition. Solder ber : M705/Sn-3.0Ag-0.5Cu (Senju Metal Indusry Co.,Ltd.) Flux : CF-110VH-2A (tamura kaken) Soldering temperture : 260±5 Soldering time : 2±0.5 sec. 95% or more of surface area(Excluding ruptured surface)where is immersed in solder shall be covered by new
Panasonic
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senju m705 solder paste Tamura kaken Senju

tamura tlf-206-93f

Abstract: p10 LED matrix single color module Phase Initial heating of component leads and solder paste balls, for removal of residual humidity , : 150-200ºC Heating/Relow Phase The temperature rises above the liquidus temperature of the solder paste , Avoid a sudden rise in temperature as any slump of the solder paste could become worse. ZMXM , Silver 3.8%/Cu Copper 0.7% Melting Temperature: 217ºC Soldering Paste: LFSOLDER TLF-206-93F (Tamura Kaken , seconds Note: If the preheat is insufficient, large solder balls tend to be generated. Conversely, if
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ZMXM-400 tamura tlf-206-93f p10 LED matrix single color module CANADA ICES 003. CLASS B mother board tamura tlf sac305 S131CL-5-RMM-2450S SAC305 indium CC2430 IPC-7711

tamura tlf-206-93f

Abstract: SAC387 component leads and solder paste balls, for removal of residual humidity. Note: The preheat phase is not , Phase The temperature rises above the liquidus temperature of the solder paste selected. Avoid a sudden rise in temperature as any slump of the solder paste could become worse. · Limit time above , Silver 3.8%/Cu Copper 0.7% Melting Temperature: 217ºC Soldering Paste: LFSOLDER TLF-206-93F (Tamura , is insufficient, large solder balls tend to be generated. Conversely, if preheat is excessive
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tamura No clean solder paste tamura tlf ZMXM-401-1C Solder Paste, Indium 5.1 AT TLF 206-93F lead free

tamura solder paste

Abstract: AN1035 the recommendations of solder paste suppliers. The screen should be designed to print 1:1 with the , may be necessary to review the screen design, solder paste type or both. Conversely, insufficient , results from the device not being in intimate contact with the solder paste across all contacts. Devices , guidelines International Rectifier evaluated different types of solder paste from various manufacturers , solder grain structure. The rheology of a paste often dictates its suitability for an application and
International Rectifier
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IRF6601 IRF6602 IRF6603 IRF6604 AN1035 DirectFet SN62 PB36 ag2 kester SN62 PB36 ag2 Copper 100N AN-1035

cf-110vh-2a

Abstract: tamura CF-110VH-2A solder coverage:95% Min. Solder temperature : 255±2 ºC Flux : Tamura CF-110VH-2A. Preconditioning : PCT 105 ºC,100 %RH 8 hours, JIS C0053 Solder Paste : Sn-Cu (Japan Speria: SN100C) or Sn , contact area, tin over nickel plating on solder area. B. Housing and Tine Plate: Material: Thermoplastic , . Test connector on PCB. Pre-Heat : 100 ºC 110 ºC 30sec Solder Temperature : 260±3 ºC 10±1sec (Under
Tyco Electronics
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HD-22 15PIN C-1932144 senju m705 solder wire senju m705 solder wire 0.5 mm Senju M705 senju m705 solder paste content HD2215P CONNECTOR/HD22 C-292469 08SEP2006

rma-20-21

Abstract: tamura rma °C max. Number of soldering: 1 time Solder paste: Tamura Corporation(Tokyo, Japan) RMA-20-21 Measurement
TDK
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AVR-M1608C080M-AAB AVR-M2012C390K 6AB varistor 103 2kv Solder paste RMA-20-21 smd code AAB varistor 110v CC0402 CC0603 CC0805

Tamura kaken

Abstract: tamura solder paste PROFILE condition Temperature profile: 230°C max., Number of soldering: 1 time, Solder paste: Tamura Kaken
TDK
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rma2021 TDK AVR-M1608C270K 2AB smd 6AB tamura IEC801-2/10

AVR-M1608C080M-AAB

Abstract: rma-20-21 Temperature profile: 230°C max. Number of soldering: 1 time Solder paste: Tamura Corporation(Tokyo, Japan
TDK
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AVR-M1608C120M 2AB AVR-M1608C270M ABB AVR-M2012C220K 6AB ess-630a 1501 VARISTOR AVR soldering temperature

Solder paste RMA-20-21

Abstract: tamura rma time Solder paste: Tamura Corporation(Tokyo, Japan) RMA-20-21 Measurement shall be made 24 hours after
TDK
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TDK AVR-M1608C270K 1N120 AVR-M2012C390K 12mg 9C11

73507

Abstract: IPC-9701 · Minimum area ratio (LxW / 2(L+W)T) = 0.8 Solder pastes: The following solder paste was used: · Lead-free solder paste SAC-387 (Tamura TLF-20693G) Document Number 73507 31-Aug-05 Area ratio 5 , application note were used for lead-free solder paste. The latter includes other process variables such as stencil designs and parameters for solder paste applicator machines and part pick-and-place machines , nitrogen, air only RSS profile shown in Figure 7 was used for the leadfree solder paste For immediate
Vishay Siliconix
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AN610 73507 IPC-A-610D Cold solder joint ipc 610D mosfet so8 smd

tamura solder paste

Abstract: AN-1035 , Tamura Kaken (UK), Agmet Ltd (ESL Europe) and Alpha Metals for supplying solder paste samples and , types of solder paste from various manufacturers. The properties of pastes vary from manufacturer to , alloys, metal contents and flux constituents all influence the rheology of the solder paste. This in , insufficient solder paste to make good solder joints with the die; high reductions sometimes create similar , perimeter of the die. This can be caused by too much solder paste, in which case the stencil might need to
International Rectifier
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SN63 PB37 multicore SN62 MP Litton 663n BS EN 60068-2-21 AN-1050
Abstract: long time. 7) There is a possibility the flux from solder paste infiltrates into the body if plenty of solder paste was applied by switch on the P.W.B. So we recommend to use our proposed land design in , terminal is immersed in solder with following condition. Solder ber : M705/Sn-3.0Ag-0.5Cu (Senju Metal Indusry Co.,Ltd.) Flux : CF-110VH-2A (tamura kaken) Soldering temperture : 260±5â"ƒ Soldering time : 2±0.5 sec. 95% or more of surface area(Excluding ruptured surface)where is immersed in solder Panasonic
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EVPAFGB65

p10 LED matrix single color module

Abstract: SAC-387 solder paste balls, for removal of residual humidity. Note: The preheat phase is not intended to replace , temperature rises above the liquidus temperature of the solder paste selected. · Limit time above liquidus , any slump of the solder paste could become worse. ZMXM-400 Series PROCESSING (Continued) Cooling , 3.8%/Cu Copper 0.7% Melting Temperature: 217ºC Soldering Paste: LFSOLDER TLF-206-93F (Tamura Kaken [UK , , large solder balls tend to be generated. Conversely, if preheat is excessive, small and large balls
California Eastern Laboratories
Original

OM338

Abstract: technical of tamura solder paste is 125 m. The area coverage of the solder paste is greater than 90%. This yields a solder joint , AN10365. "The most important step in reflow soldering is reflow itself, when the solder paste deposits , solder joints; this is determined by solder paste characteristics; contact your paste supplier for , . Figure 21. Reflow profile of LUXEON Rebel using SAC 305 solder paste. Reflow Accuracy Calculate the , accuracy, low solder voids, and solder ability indicators. Figure 7 shows the individual layers of the
LumiLeds Lighting
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OM338 technical of tamura solder paste technical of tamura solder mask luxeon F1 LUXEON Rebel LED Tamura Of America
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