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tamura solder paste

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Abstract: www.vishay.com 8 Document Number: 72116 15-Dec-03 AN825 AN825 Vishay Siliconix TAMURA SOLDER PASTE Tamura solder paste did not perform as well as some of the other solder pastes under the reflow , , the Tamura solder paste was classified as having 20% to 50% voiding, as shown in Figures 16 and 17. , Tamura Solder Paste a) Best-Case b) Worst-Case Single PowerPAK 1212-8 Voids: 10% - 20% c , Data In Appendix Manufacturer Several solder paste types, including lead-free, water-soluble ... Original
datasheet

14 pages,
3469.8 Kb

NC-SMQ92J PowerPAK SO-8 NC-73 tamura tlf omnix 5000 AN825 Solder Paste, Indium, Type 3 Loctite multicore Loctite rp15 1800EXL PowerPAK 1212-8 stencil PowerPAK 1212-8 tamura No clean solder paste multicore RP15 AN825 abstract
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Abstract: Packaging PC Board Pad Design Automatic Placement Equipment Considerations Solder Paste Reflow Soldering , (0.008 in.) of recommended size. Automatic Placement Equipment Considerations Solder Paste , For best results, an SN63 eutectic solder paste, liquidus at +183ºC (+361ºF), should be used. SN62 solder paste containing 2% silver, liquidus at +189 ºC (+372 ºF), may be used with the chip LED devices, with the advantage of obtaining stronger solder connections, but higher cost. The solder paste should ... Original
datasheet

6 pages,
122.48 Kb

0654E 97SC CR37 RMA-10-61A SMT IR LED SN62 SN63 SOLDERING REFLOW smt soft solder dispensing JEDEC SMT reflow profile tamura solder paste rma tamura solder paste tamura solder paste rma-10-61a tamura rma datasheet abstract
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Abstract: ) (2) (3) Lead (Pb)-free and tin-lead solder paste test samples were used: a. Lead (Pb)-free solder paste SAC-387 SAC-387 (Tamura TLF-206-93G TLF-206-93G) b. Tin-lead (Sn-Pb) no-clean solder paste Sn63-Pb37 (Alpha , SAC-387 SAC-387 (Tamura TLF-206-93G TLF-206-93G) · Tin-lead (Sn-Pb) no-clean solder paste Sn63-Pb37 (Alpha Metal UP78) · , different solder paste and reflow profiles," web link: http://www.vishay.com/docs/72116/72116.pdf. The , involving different parameters such as aperture, stencil thickness, solder paste printing pressure. Also ... Original
datasheet

9 pages,
518.11 Kb

IPC-9701 nicolet Vishay Siliconix soldering bga tc 9710 tamura tin lead solder paste bga rework station PowerPAK 1212-8 tamura tlf MIL-STD-750 method 1037 ekra hot air bga UP78 SAC-387 datasheet abstract
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Abstract: microscope 7) Lead (Pb)-free solder paste SAC-387 SAC-387 (Tamura TLF-206-93G TLF-206-93G) 8) Tin-lead (Sn-Pb) no-clean solder , ramp-long-soak-spike (LRSS). Other process variables are stencil designs, solder paste applicator machine parameters , MATERIAL: 1) EKRA E5 solder paste printer 2) Juki E2060 E2060 pick and place machine 3) BTU Pyramax 98 reflow , layers, and lead (Pb)-free solder paste. Reusing the PCB during repeat reflow after parameter , Long RSS Single 5 mils First 5 mils Figure 2: RSS profile for lead (Pb)-free solder paste ... Original
datasheet

7 pages,
463.35 Kb

x-ray machine nicolet nxr1400 tamura No clean solder paste AN611 SAC-387 SAC387 solder 5Dx diode UP78 tamura tlf pyramax SAC387 SN63 PB37 PROFILES nicolet AN611 abstract
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Abstract: qualification complied with the recommendations of solder paste suppliers. The screen should be designed to , should occur, it may be necessary to review the screen design, solder paste type or both. Conversely , This often results from the device not being in intimate contact with the solder paste across all , Rework guidelines International Rectifier evaluated different types of solder paste from various , improves the solder grain structure. The rheology of a paste often dictates its suitability for an ... Original
datasheet

7 pages,
307.8 Kb

tamura solder paste IRF6601 IRF6602 IRF6603 100N Tamura kaken IRF6604 SN62 PB36 ag2 Copper SN62 PB36 ag2 kester DirectFet AN1035 AN-1035 AN-1035 abstract
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Abstract: leads and solder paste balls, for removal of residual humidity. Note: The preheat phase is not intended , temperature rises above the liquidus temperature of the solder paste selected. · Limit time above liquidus , any slump of the solder paste could become worse. ZMXM-400 ZMXM-400 Series PROCESSING (Continued) Cooling , Melting Temperature: 217ºC Soldering Paste: LFSOLDER TLF-206-93F TLF-206-93F (Tamura Kaken [UK] Ltd.) Alloy , insufficient, large solder balls tend to be generated. Conversely, if preheat is excessive, small and large ... Original
datasheet

12 pages,
1282.18 Kb

ZMXM-401 P10 LED MATRIX RF power amplifier 10mW SAC387 Solder Paste, Indium 5.1 AT tamura solder paste tamura tlf sac305 CANADA ICES 003. CLASS B mother board SAC387 solder SAC305 indium S131CL-5-RMM-2450S p10 LED matrix single color module ZMXM-400 ZMXM-400 abstract
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Abstract: , Tamura Kaken (UK), Agmet Ltd (ESL Europe) and Alpha Metals for supplying solder paste samples and , types of solder paste from various manufacturers. The properties of pastes vary from manufacturer to , alloys, metal contents and flux constituents all influence the rheology of the solder paste. This in , insufficient solder paste to make good solder joints with the die; high reductions sometimes create similar , perimeter of the die. This can be caused by too much solder paste, in which case the stencil might need to ... Original
datasheet

15 pages,
342.43 Kb

100N 663n AN-1050 SN62 PB36 ag2 BS EN 60068-2-21 AN1035 Litton tamura solder paste PROFILE SN62 MP SN62 PB36 ag2 kester AN-1035 SN63 PB37 multicore tamura solder paste AN-1035 abstract
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Abstract: paste infiltrates into the body if plenty of solder paste was applied by switch on the P.W.B. So we , solder with following condition. Solder ber : M705/Sn-3.0Ag-0.5Cu (Senju Metal Indusry Co.,Ltd.) Flux : CF-110VH-2A CF-110VH-2A (tamura kaken) Soldering temperture : 260±5 Soldering time : 2±0.5 sec. Contact resistance 100 , (Excluding ruptured surface)where is immersed in solder shall be covered by new solder. 5.2.6 Solderbility , product with sharp-edged object. 5) Cleaning If flux or solder is scattered on the surface of P.W.B when ... Original
datasheet

8 pages,
138.95 Kb

tamura CF-110VH-2A Senju M705 safety CF-110VH CF-110VH-2A tamura solder paste datasheet abstract
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Abstract: is 125 m. The area coverage of the solder paste is greater than 90%. This yields a solder joint , AN10365 AN10365. "The most important step in reflow soldering is reflow itself, when the solder paste deposits , able solder joints; this is determined by solder paste characteristics; contact your paste supplier for , Figure 21. Reflow profile of LUXEON Rebel using SAC 305 solder paste. Reflow Accuracy Calculate the , goal of the study is to create a board with low thermal resistance, high placement accuracy, low solder ... Original
datasheet

18 pages,
2392.63 Kb

210w 210-W OM338 thermal conductivity optical pick up assembly sac mu OM-338 rebel 210WP spray nozzles E38152 tamura solder paste tamura solder paste PROFILE Tamura Of America LUXEON Rebel LED datasheet abstract
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Abstract: Solder pastes: The following solder paste was used: · Lead-free solder paste SAC-387 SAC-387 (Tamura TLF-20693G TLF-20693G , application note were used for lead-free solder paste. The latter includes other process variables such as stencil designs and parameters for solder paste applicator machines and part pick-and-place machines. , used for the leadfree solder paste For immediate reference, the reflow process and parameters used , AN610 AN610 Vishay Siliconix PolarPAK Solder Joint Reliability Based on Thermal Fatigue IPC-9701 IPC-9701 By ... Original
datasheet

17 pages,
1195.22 Kb

Vishay Siliconix soldering bga SAC-387 SAC387 solder AN610 tamura solder paste PROFILE 9701 mosfet TLF-20693G ekra ipc 610D mosfet so8 smd "BGA Rework Practices", pyramax tamura solder paste AN610 abstract
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