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Part Manufacturer Description Datasheet BUY
LTC2226HLU Linear Technology IC 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP32, 5 X 5 MM, PLASTIC, MS-026, TQFP-32, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices
LTC2246HLU#TRPBF Linear Technology IC 1-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP32, 5 X 5 MM, LEAD FREE, PLASTIC, MS-026, TQFP-32, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices
LTC2246HLU Linear Technology IC 1-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP32, 5 X 5 MM, PLASTIC, MS-026, TQFP-32, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices
LTC2246HLU#TR Linear Technology IC 1-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP32, 5 X 5 MM, PLASTIC, MS-026, TQFP-32, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices
LTC2226HLU#TR Linear Technology IC 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP32, 5 X 5 MM, PLASTIC, MS-026, TQFP-32, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices
LTC2246HLU#PBF Linear Technology IC 1-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP32, 5 X 5 MM, LEAD FREE, PLASTIC, MS-026, TQFP-32, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices

tQFP pitch

Catalog Datasheet MFG & Type PDF Document Tags

EP1C12

Abstract: jtag pin Cyclone Device Handbook, Volume 1 Table 1­3. Cyclone QFP & FineLine BGA Package Sizes 100-Pin TQFP Pitch (mm) Area 144-Pin TQFP 240-Pin PQFP 256-Pin FineLine BGA 324-Pin FineLine BGA , through 1­3). Table 1­2. Cyclone Package Options & I/O Pin Counts Device 100-Pin TQFP 144-Pin TQFP , 301 Notes to Table 1­2: (1) (2) TQFP: thin quad flat pack. PQFP: plastic quad flat pack , the EP1C3 device in the 144-pin TQFP package and the EP1C6 device in the same package) Vertical
Altera
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Abstract: -pin, Plastic DIP 44-pin, Plastic PLCC 44-pin, Plastic QFP 48-pin, Plastic TQFP* Pitch in mm's 2.54 1.27 0.8 0.5 , required Available in 40-pin DIP, 44-pin PLCC, 44-pin QFP and 48-pin TQFP packages Provides connections to -
OCR Scan

F104B

Abstract: 48 pin laptop keyboard -pin, Plastic PLCC 44-pin, Plastic QFP 44-pin, Plastic TQFP* Pitch In mm's 2 54 mm 1.27 mm 0.8 mm 0.5 mm TA = , FKB7136,06 for FKB1406 matrix compatibility * Minimum quantities for the TQFP may apply Functional
USAR Systems
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F104B 48 pin laptop keyboard keypad Encoder IC 20 pins USAR Systems 12 key numeric encoder BAV54A DOC5-FJL-DS-104
Abstract: UR5HCSPI-FA TQFP 48 13 1 UR5HCSPI-FA 48-pin QFP (0.5 mm pitch) (7x7 mm) The UR5HCSPI also , battery life. UR5HCSPI-FB 44-pin QFP (0.80 mm pitch (10x10 mm) Copyright 1997-2000 USAR Systems , pitch â'¢ Custom versions available _ATN _SS SCK MOSI NC NC MISO XSW SW0 C8 C9 C10/WUKO , Company Ordering Code Package Options 44-pin, Plastic PLCC 44-pin, Plastic QFP 44-pin, Plastic TQFP Pitch in mmâ'™s 1.27 mm 0.8 mm 0.5 mm TA=-20° C to +85° C UR5HCSPI-XX-FN UR5HCSPI-XX-FB USAR Systems
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C200B

Abstract: PLCC 44-pin, Plastic QFP 44-pin, Plastic TQFP Pitch in mm's 1.27 mm 0.8 mm 0.5 mm TA=-20° C to +85° C , LED indicators · Available in smallest 48-pin package, measuring just 7mm x 7mm with an 0.5mm pitch · , R6 R5 R4 PWR_OK NC0 OSC0 OSCI Vcc Vss NC NC _RESET _WKU C7 C6 37 TQFP C11/_LID C12 C13 , -06-FB 44-pin QFP (0.80 mm pitch) (10x10 mm) UR5HCSPI-06-FA 48-pin QFP (0.5 mm pitch) (7x7 mm) USAR ­ , Revision number *Minimum order quantity for the TQFP may apply Block Diagram MISO MOSI SCK SS ATN SPI
USAR Systems
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C200B UR5HCSPI-06

pf 08a -pt

Abstract: 4 4 -p in , Plastic PLCC 4 4 -p in , Plastic Q FP 4 8 -p in , 0.5m m p itc h TQFP* PITCH 1.27 mm 0.8 , UR5HCSPI-SA-FB 44-pin QFP (0.80 mm pitch (10x10 mm) UR5HCSPI-SA-FA 48-pin QFP (0.5 mm pitch) (7x7 mm) All , u a n tity for the TQFP m ay a p p ly Functional Diagram MISO MOSI SCK SS R0-R8 SPI C om m
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OCR Scan
pf 08a -pt 00CQ3SD QDD0513
Abstract: PLCC 4 4 -p in , Plastic Q FP 4 8 -p in , 0.5m m p itc h TQFP* PITCH 1.27 mm 0.8 mm 0.5 mm TA = -40 °C , -pin QFP (0.80 mm pitch (10x10 mm) UR5HCSPI-SA01 -FA 48-pin QFP (0.5 mm pitch) (7x7 mm) All tradem , TQFP m ay a p p ly Functional Diagram MISO MOSI SCK SS R0-R8 SPI C om m unication Channel -
OCR Scan

A2 diode

Abstract: transistor A2 Plastic SVP Nominal Dimensions (mm) Lead Pitch (mm) 11 × 25 0.65 Pin Counts 32 TQFP , : Available, : Under development Plastic QFP (Fine Pitch) Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7×7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5 TQFP QFP 20 × 20 LQFP QFP 24 × 24 LQFP QFP 28 × 28 LQFP QFP 32 ×
NEC
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A2 diode transistor A2 272-pin 3eb data lmu a2 TQFP 32 PACKAGE S48GA-50-2E5-1 S48GA-50-9EU-1 S64GB-50-9EU-1 S72GB-50-2EP-2 P80GK-50-BE9-5 S80GK-50-9EU

GS71024

Abstract: GS71024T-10 TQFP, FP-BGA Commercial Temp Industrial Temp Features Fine Pitch BGA Bump Configuration · Fast , operation · Industrial Temperature Option: ­40 to 85°C · Package T: 100-pin TQFP package U: 6 mm x 8 mm Fine Pitch Ball Grid Array GT: RoHS-compliant 100-pin TQFP available GU: RoHS-compliant 6 mm x 8 mm , . The GS71024 is available in a 6 mm x 8 mm Fine Pitch BGA package, as well as in a 100-pin TQFP , -15I RoHS-compliant 100-Pin TQFP 15 ns Industrial PQ GS71024U-8 6 mm x 8 mm Fine Pitch BGA 8 ns
GSI Technology
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GS71024T-10 GS71024T-12 GS71024T-15 GS71024T-8 GS71024T-8I GS71024T-9 GS71024T/U A15/C GS710241 8/1999B 8/1999C 9/1999C

GS72116AG

Abstract: GS72116AGT-8 , 44-pin TSOP Type II package T: 10 mm x 10 mm, 44-pin TQFP GT: RoHS-compliant 10 mm x 10 mm, 44-pin TQFP U: 6 mm x 8 mm Fine Pitch Ball Grid Array package GU: RoHS-compliant 6 mm x 8 mm Fine Pitch Ball , TTLcompatible. The GS72116A is available in a 6 mm x 8 mm Fine Pitch BGA package, a 10 mm x 10 mm TQFP package , GS72116ATP/J/T/U SOJ, TSOP, FP-BGA, TQFP Commercial Temp Industrial Temp 7, 8, 10, 12 ns 3.3 , GS72116ATP/J/T/U 44-Pin TQFP 128K x 16-Pin Configuration A16 A15 A14 A13 A12 A11 A10 A9 OE UB LB CE DQ1
GSI Technology
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GS72116AG GS72116AGT-8 72116A

GS72116AGT-10

Abstract: GS72116AGT-10I -pin TQFP GT: Pb-Free 10 mm x 10 mm, 44-pin TQFP U: 6 mm x 8 mm Fine Pitch Ball Grid Array package GU: Pb-Free 6 mm x 8 mm Fine Pitch Ball Grid Array package · Pb-Free TSOP-II, TQFP, and FP-BGA packages , TTLcompatible. The GS72116A is available in a 6 mm x 8 mm Fine Pitch BGA package, a 10 mm x 10 mm TQFP package , GS72116ATP/J/T/U SOJ, TSOP, FP-BGA, TQFP Commercial Temp Industrial Temp 7, 8, 10, 12 ns 3.3 , GS72116ATP/J/T/U 44-Pin TQFP 128K x 16-Pin Configuration A16 A15 A14 A13 A12 A11 A10 A9 OE UB LB CE DQ1
GSI Technology
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GS72116AGT-10 GS72116AGT-10I GS72116ATP-8T

GS71024

Abstract: GS71024T-10 TQFP, FP-BGA Commercial Temp Industrial Temp Features Fine Pitch BGA Bump Configuration · Fast , operation · Industrial Temperature Option: ­40 to 85°C · Package T: 100-pin TQFP package U: 6 mm x 8 mm Fine Pitch Ball Grid Array GT: Pb-Free 100-pin TQFP available 1 4 5 6 DQ A3 A2 , outputs are TTLcompatible. The GS71024 is available in a 6 mm x 8 mm Fine Pitch BGA package, as well as in a 100-pin TQFP package. 3 A Description 2 DQ A15 A14 A13 A12 DQ 6
GSI Technology
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17PM K011 04V GS71024R 1999C 2/2000D

1313de

Abstract: Temperature Option: ­40 to 85°C · Package T: 100-pin TQFP package U: 6 mm x 8 mm Fine Pitch Ball Grid Array GT: Pb-Free 100-pin TQFP available 64K x 24 1.5Mb Asynchronous SRAM 8, 9, 10, 12, 15 ns 3.3 V VDD Center , Pitch BGA package, as well as in a 100-pin TQFP package. DQ DQ A9 G H A11 A14 A10 A13 , Pb-free 100-Pin TQFP me nd ed for 6 mm x 8 mm Fine Pitch BGA Re co m 6 mm x 8 mm Fine Pitch , GS71024T/U TQFP, FP-BGA Commercial Temp Industrial Temp Features · Fast access time: 8, 9, 10, 12
GSI Technology
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1313de GS71024T/U-12T
Abstract: package GP: RoHS-compliant 400 mil, 44-pin TSOP Type II package T: 10 mm x 10 mm, 44-pin TQFP GT: RoHS-compliant 10 mm x 10 mm, 44-pin TQFP U: 6 mm x 8 mm Fine Pitch Ball Grid Array package GU: RoHS-compliant , available in a 6 mm x 8 mm Fine Pitch BGA package, a 10 mm x 10 mm TQFP package, and 400 mil TSOP Type-II , -pin TQFP 12 ns Industrial GS72116AU-7 6 mm x 8 mm Fine Pitch BGA 7 ns Commercial , GS72116ATP/T/U TSOP, FP-BGA, TQFP Commercial Temp Industrial Temp 7, 8, 10, 12 ns 3.3 V VDD GSI Technology
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2116ATP/T/U

GS72116AGU-12I

Abstract: GS72116A , 44-pin TSOP Type II package T: 10 mm x 10 mm, 44-pin TQFP GT: RoHS-compliant 10 mm x 10 mm, 44-pin TQFP U: 6 mm x 8 mm Fine Pitch Ball Grid Array package GU: RoHS-compliant 6 mm x 8 mm Fine Pitch Ball , TTLcompatible. The GS72116A is available in a 6 mm x 8 mm Fine Pitch BGA package, a 10 mm x 10 mm TQFP package , GS72116ATP/J/T/U SOJ, TSOP, FP-BGA, TQFP Commercial Temp Industrial Temp 7, 8, 10, 12 ns 3.3 , GS72116ATP/J/T/U 44-Pin TQFP 128K x 16-Pin Configuration A16 A15 A14 A13 A12 A11 A10 A9 OE UB LB CE DQ1
GSI Technology
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GS72116AGU-12I

lcmxo2-1200

Abstract: LCMXO2-4000 TQFP/PQFP 64-Pin QFNS 9 x 9 mm 0.90 mm height 0.50 mm pitch 208-Pin PQFP 28 x 28 mm (body , -Pin TQFP 24 x 24 mm (body) 1.40 mm height 0.50 mm pitch 144-Pin TQFP 20 x 20 mm (body) 1.40 mm , height 0.50 mm pitch 64-Ball csBGA 5 x 5 mm 1.00 mm height 0.50 mm pitch 100-Pin TQFP 128-Pin TQFP 14 x 14 mm (body) 1.4 mm height 0.50 mm pitch (100 TQFP) 0.40 mm pitch (128 TQFP) 44-Pin TQFP , (64 TQFP) 0.80 mm pitch (44 TQFP) 0.50 mm pitch (64 TQFP) 48-Pin TQFP 7 x 7 mm (body) 1.00 mm
Lattice Semiconductor
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lcmxo2-1200 LCMXO2-4000 DDR3 pcb layout guide DDR3 sodimm pcb layout schematic isp Cable lattice hw-dln-3c LCMXO2-640 I0211

IC51-0804-394

Abstract: yamaichi IC51-0562-1387 -pin TQFP (PCB) 16.0 Area: 256.00 mm2 Height: 1.6 mm Lead Pitch: 0.4 mm 25.2 17.6 25.2 , Surface-Mount FIFO Packages PACKAGE 44-pin PLCC NO. OF DATA BITS 9 64-pin TQFP 9 56-pin SSOP 18 68-pin PLCC 18 80-pin TQFP 18 80-pin QFP 120-pin TQFP SSOP PLCC TQFP QFP = , per watt. Table 2 lists RQJA for SSOP, PLCC, TQFP, and QFP packages under five different air-flow , 44-pin PLCC Copper 65 N/A 68-pin PLCC Copper 47.2 64-pin TQFP Copper 80
Texas Instruments
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IC51-0804-394 yamaichi IC51-0562-1387 IC51-0804-808 QFP PACKAGE thermal resistance 32PIN TQFP TEXAS tqfp 64 socket SSPA001A

49-BGA

Abstract: lattice 2096ve will be released, also in 1Q99, in 176-TQFP, 160-pin PQFP and 208-ball Fine Pitch BGA packages , . This family takes advantage of the 0.8mm ball pitch Chip Array BGA (49 and 100 balls) as well as the 1.0mm pitch Fine Pitch BGA (208 balls). Available now are the 32-macrocell ispLSI 2032VE featuring 4ns , 6,000 180 5.0 3.5 3.5 128 64/128 8,000 150 6.0 TBD TBD 192 96 44-PLCC 44-TQFP 49-BGA 44-PLCC 44-TQFP 84-PLCC 100-TQFP 100-BGA 128-TQFP 128-PQFP 84-PLCC 100-TQFP 100-BGA 160
Lattice Semiconductor
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PB1106 2128VE 2192VE lattice 2096ve 100-Ball PLSI 2064VE 2000VE 2000E
Abstract: -pin TSOP Type II package GP:Pb-free 400 mil, 44-pin TSOP Type II package T: 10 mm x 10 mm, 44-pin TQFP U: 6 mm x 8 mm Fine Pitch Ball Grid Array package · Pb-Free TSOP-II and TQFP packages available 128K x , available in a 6 mm x 8 mm Fine Pitch BGA package, a 10 mm x 10 mm TQFP package, as well as in 400 mil SOJ , -pin TQFP Pb-free 44-pin TQFP Pb-free 44-pin TQFP 6 mm x 8 mm Fine Pitch BGA 6 mm x 8 mm Fine Pitch BGA 6 mm , GS72116ATP/J/T/U SOJ, TSOP, FP-BGA, TQFP Commercial Temp Industrial Temp Features · Fast access GSI Technology
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nec 44 pin LQFP

Abstract: BGA and QFP Package Nominal Dimensions (mm) Lead Pitch (mm) 11 × 25 0.65 Pin Counts 32 TQFP: Mounting , ) Plastic QFP (Quad Flat Package) (7) Plastic QFP (Fine Pitch) (Quad Flat Package) (8) Plastic , BGA (Ball Grid Array) (15) Plastic Fine pitch BGA (Ball Grid Array) (16) Tape BGA (Ball Grid Array , ) Plastic SOP Nominal Dimensions (mil) Lead Pitch (mm) Pin Counts 8 14 16 20 24 28 , ) Lead Pitch (mm) 225 0.65 Pin Counts 8 0.50 300 0.65 0.8 0.65 375 0.8 500
NEC
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nec 44 pin LQFP BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP 44-Pin QFN X288R-50A-1 X528R-50A-1 X528RF-50A-1 P119S1-R4 P225S1-B1-1 S225S1-B1-1
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