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tFBGA144

Catalog Datasheet MFG & Type PDF Document Tags

LQFP144

Abstract: 16C550 32 ARM7TDMI-STM LPC22x0 ARM7 Headline 75 MHz 64 KB RAM 75-MHz 32 AHB/APB 8 CAN LPC22x0 ARM7TDMI-S 64 KB SRAM 10 A/D CAN LPC 2 290 ARM7 128 16 Thumb 75 MHz 16 32 Thumb PWM 76 SPI I/O - 40 + 85 °C 32 LPC22x0 (VIC) UART 2 I C 30% 64 KB ICE-RT ETM RAM 16 Mb ­ LQFP144 ­ TFBGA144 (LPC2220) 8/16/32 RAM , TFBGA144 LPC2290 16 KB 76 (8 x 10) 2 1 2 2 -40 +85 LQFP144 LPC2210 16
NXP Semiconductors
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16C550 IC 16c550 LPC22 75-MH

hdg104

Abstract: tft ipod touch 2 page 14 LQFP144, TFBGA144 LQFP144, TFBGA144 LQFP144, TFBGA144 TQFP100 TQFP100 TQFP100 LQFP144, TFBGA144 LQFP144, TFBGA144 LQFP144, TFBGA144 LQFP144, TFBGA144 LQFP144, TFBGA144 LQFP144, TFBGA144
Atmel
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hdg104 tft ipod touch 2 interface bluetooth with AVR 32-bit AVR UC3 datasheet AT32UC3C1512 AT32UC3C

AT32UC3C0128

Abstract: AT32UC3C2512 SD/MMC Flash (KBytes) Product Selector Guide Products page 14 LQFP144, TFBGA144 LQFP144, TFBGA144 LQFP144, TFBGA144 TQFP100 TQFP100 TQFP100 LQFP144, TFBGA144 LQFP144, TFBGA144 LQFP144, TFBGA144 LQFP144, TFBGA144 LQFP144, TFBGA144 LQFP144, TFBGA144 TQFP64, QFN64 TQFP64, QFN64
Atmel
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AT32UC3C0128 AT32UC3C2512 AT32UC3C2128 AT32UC3C2256 ATEVK1103 TQFP100 footprint AVR32

LQFP144

Abstract: LQFP-144 LPC2294 LPC2294 ­ LQFP144 ­ TFBGA144( (VIC) CAN ICE-RT ETM LPC2292) 16 Mb 8/16/32 2.44 , 16 KB 112 8 2 1 2 2 -40 to +85 LQFP144 TFBGA144 LPC2294 256 KB 16
NXP Semiconductors
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LQFP-144 ahb to i2c isp iap IAP16 ARM7TDMI-S pll ARM7TDMI-S 60-MH LPC229 256KB
Abstract: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA144 package SOT569-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste SL SP occupied area SR solder resist detail X DIMENSIONS in mm P SL SP SR 0.80 0.400 0.400 0.550 Hx Hy 12.575 12.575 SOT569-1_fp PDF Â Philips Semiconductors
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Abstract: Package outline TFBGA144: plastic thin fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.8 mm SOT569-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 ball A1 index area y âw M C N M L K J H G F E D C B A shape optional (4×) y1 C âv M C A B b e e e2 1 2 3 4 5 6 7 8 9 10 11 12 13 X 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 b D NXP Semiconductors
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MO-216

tFBGA144

Abstract: E 1220 PDF: 2000 Mar 07 Philips Semiconductors Package outline TFBGA144: plastic thin fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.8 mm SOT569-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X k k e1 b e C v M B y y1 C w M v M A P N M L K J H G F E D C B A e e1 1 2 3 4 5 6 7 8 9 10 11 12 13 X 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 b
Philips Semiconductors
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E 1220 SOT56 sot569

TFBGA144

Abstract: MO-216 PDF: 2003 Jul 17 Philips Semiconductors Package outline TFBGA144: plastic thin fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.8 mm SOT569-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 ball A1 index area v M C A B b e P N M L K J H G F E D C B A shape optional (4×) y1 C y w M C e e2 1 2 3 4 5 6 7 8 9 10 11 12 13 X 0 5 10 mm scale DIMENSIONS (mm are the original dimensions
Philips Semiconductors
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Abstract: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA144 package SOT569-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste SL SP occupied area SR solder resist detail X DIMENSIONS in mm P SL SP SR 0.80 0.400 0.400 0.550 Hx Hy 12.575 12.575 SOT569-2_fr PDF © NXP B.V. 2008 NXP Semiconductors
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ATSAM3X8E

Abstract: ZIGBEE interface with AVR ATmega16 PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA144: plastic thin fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.8 mm SOT569-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 v M C A B b e P N M L K J H G F E D C B A shape optional (4×) y1 C y w M C e e2 1 2 3 4 5 6 7 8 9 10 11 12 13 X 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max
Atmel
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ATSAM3X8E ZIGBEE interface with AVR ATmega16 ATSAM4E16E ATSAM4S16 ATMEGA USART programming example ATSAM4SA16C

TFBGA144

Abstract: Package outline TFBGA144: plastic thin fine-pitch ball grid array package; 144 balls A B D SOT569-2 ball A1 index area E A A2 A1 detail X e1 e âv âw b N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 5 4 6 7 8 9 10 11 12 13 X 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm max nom min OUTLINE VERSION A
Philips Semiconductors
Original
Abstract: to +85 LQFP144 TFBGA144 LPC2290 16 KB 76 One (8 x 10) 2 1 2 2 -40 to NXP Semiconductors
Original
Abstract: , LPC3154, LPC3180/10, LPC3220, LPC3230, LPC3240, LPC3250, LH79524, LH7A400, LH7A404, TFBGA100, TFBGA144 , TFBGA144 SOT569-2 [2] 12 x 12 x 0.7mm 0.8mm 0.45mm 13 x 13; partial matrix TFBGA180 , 0.4 0.35 [4] 0.5 9.6 TFBGA144 0.8 0.45 0.4 0.35 [4] 0.5 12.6 TFBGA180 NXP Semiconductors
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FBGA144

LPC2468 reflow solder profile

Abstract: 0.65mm pitch BGA -40 to +85 LQFP144 TFBGA144 2 2 -40 to +125 LQFP144 UART SPI www.nxp.com Â
NXP Semiconductors
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AN10778 LPC2364 LPC2368 LPC2458 LPC2468 LPC2470 LPC2468 reflow solder profile 0.65mm pitch BGA 1mm pitch BGA LFBGA32 MO-275
Abstract: , LPC3154, LPC3180/01, LPC3220, LPC3230, LPC3240, LPC3250, LH79524, LH7A400, LH7A404, TFBGA100, TFBGA144 , SOT926-1[2] 9 x 9 x 0.7 mm 0.8 mm 0.45 mm 10 x 10; full matrix TFBGA144 SOT569-2[2 , 0.35[4] 0.5 9.6 TFBGA144 0.8 0.45 0.4 0.35[4] 0.5 12.6 TFBGA180 0.8 NXP Semiconductors
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256-KB

PCB layout guidelines for NXP MCUs in BGA packages

Abstract: LBGA256 3.3 V F LQFP144, LPC2214/01 upgrade with 2x CAN TFBGA144 LPC2290/01 64K 5 6 2 , /01 TFBGA144 LPC2214/01 256K 16K 5 6 2 1 2 8 112 · · 60 1.8 V
NXP Semiconductors
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LPC178 LPC185 LPC3130 LBGA256 LFBGA256 LFBGA324 PCB layout guidelines for NXP MCUs in BGA packages land pattern for TSOP 2 54 pin NXP lpc LPC175x TSOP 54 land pattern LPC175 LPC176 LPC177 LPC181 LPC182

16*2 LCD interface with lpc2129

Abstract: lpc2468 LPC2292FET144/01 LQFP144 LQFP144 LQFP144 TFBGA144 TFBGA144 TFBGA144 Description plastic low profile quad flat , -1 TFBGA144 LQFP144 LQFP144 LQFP144 Table 1. Type number LPC2292FET144/G LPC2294HBD144 LPC2294HBD144/00 , . TFBGA144 pinning LPC2292_2294_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev
NXP Semiconductors
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ARM926EJ LQFP44 P89CV51RD2 16*2 LCD interface with lpc2129 LPC2148 PWM 16*2 LCD interface with lpc2148 GPS interfaced with lpc2148 LPC2148 p89lpc9311 LPC3000 LPC2000 LPC900 LPC3180 LFBGA320
Abstract: 16/32-bit ARM7TDMI-S microcontroller in a LQFP144 and TFBGA144 package. I 16/64 kB on-chip static , package; 144 leads; body 20 × 20 × 1.4 mm SOT486-1 LPC2220FET144 TFBGA144 plastic thin , TFBGA144 plastic thin fine-pitch ball grid array package; 144 balls; body 12 × 12 × 0.8 mm SOT569 , TFBGA144 LPC2210_2220_6 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 06 â NXP Semiconductors
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LPC2292/2294 LPC2292/01 LPC2294/01
Abstract: F LQFP144, TFBGA144 LPC2290/01 64 KB 5 6 2 1 2 2 8 76 · · , 2 1 2 8 76 · · 75 1.8 V 3.3 V F LQFP144, TFBGA144 64 NXP Semiconductors
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LPC2210/2220 LPC2210/01

LPC2148 i2c eeprom c code

Abstract: lcd c program using lpc2378 to +85 LQFP144 TFBGA144 LPC2290 16 KB 76 One (8 x 10) 2 1 2 2 -40 to
NXP Semiconductors
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LPC700 LFBGA296 LPC2148 i2c eeprom c code lcd c program using lpc2378 embedded c code to interface lpc2148 with sensor LPC922 LPC932A1 lpc935 ac motor control LPC1000 80C51 DIP40 PLCC44

TSOP 66 Package

Abstract: RLDRAM PDF: 2000 Mar 07 Philips Semiconductors Package outline TFBGA144: plastic thin fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.8 mm SOT569-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X k k e1 b e C v M B y y1 C w M v M A P N M L K J H G F E D C B A e e1 1 2 3 4 5 6 7 8 9 10 11 12 13 X 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 b
Infineon Technologies
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TSOP 66 Package RLDRAM Infineon technology roadmap TSOP-66 tsop 66 Multibank - DRAM 300MH B166-H7931-X-X-7600

RLDRAM

Abstract: General Semiconductor SM , LPC3154, LPC3180/10, LPC3220, LPC3230, LPC3240, LPC3250, LH79524, LH7A400, LH7A404, TFBGA100, TFBGA144 , TFBGA144 SOT569-2 [2] 12 x 12 x 0.7mm 0.8mm 0.45mm 13 x 13; partial matrix TFBGA180 , 0.4 0.35 [4] 0.5 9.6 TFBGA144 0.8 0.45 0.4 0.35 [4] 0.5 12.6 TFBGA180
Infineon Technologies
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General Semiconductor SM PC133

32072S

Abstract: SMC12 LPC2292FET144 LPC2292FET144/00 LPC2292FET144/G LPC2294HBD144 LPC2294HBD144/00 LQFP144 LQFP144 TFBGA144 TFBGA144 TFBGA144 LQFP144 LQFP144 Description plastic low profile quad flat package; 144 leads; body 20 × 20 × 1.4 , 13 A B C D E F G H J K L M N 002aab362 Transparent top view Fig 3. TFBGA144 pinning
Atmel
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32072S SMC12 BOD33LEVEL AT32UC3A4 at32uc3a3256 372 ball VFBGA thermal resistance 51DMIPS/MH 128KB 32072SH
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