SOT900-1 |
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NXP Semiconductors
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Plastic thermal enhanced ball grid array package; 456 balls; body 27 x 27 x 1.75 mm; heatsink |
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SOT901-1 |
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NXP Semiconductors
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Plastic ball grid array package; 400 balls; body 27 x 27 x 1.75 mm |
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PDF
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SOT902-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT902-1 |
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SOT902-1 |
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NXP Semiconductors
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Plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm |
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PDF
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SOT902-1_125 |
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NXP Semiconductors
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XQFN8(U); Reel pack, reverse; SMD, 7"Q3/T4 Standard product orientationOrderable part number ending ,125 or HOrdering code (12NC) ending 125 |
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SOT902-2 |
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NXP Semiconductors
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Footprint for reflow soldering SOT902-2 |
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SOT902-2_125 |
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NXP Semiconductors
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XQFN8(U); Reel pack, reverse; SMD, 7"Q3/T4 Standard product orientationOrderable part number ending ,125 or HOrdering code (12NC) ending 125 |
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Original |
PDF
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SOT902-3 |
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NXP Semiconductors
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Footprint for reflow soldering SOT902-3 |
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SOT902-3 |
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NXP Semiconductors
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Plastic extremely thin quad flat package; no leads; 8 terminals |
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Original |
PDF
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SOT903-1 |
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NXP Semiconductors
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Plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based; body 9 x 9 x 1.6 mm |
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SOT903-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT903-1 |
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SOT903-2 |
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NXP Semiconductors
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Plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based |
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PDF
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SOT904-1 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 84 balls; body 7 x 7 x 0.8 mm |
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Original |
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SOT905-1 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3 x 3 x 0.85 mm |
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SOT905-1_118 |
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NXP Semiconductors
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HVQFN24; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
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PDF
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SOT906-1 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 88 terminals; body 10 x 10 x 0.85 mm |
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Original |
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SOT906-2 |
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NXP Semiconductors
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Footprint SOT906-2 |
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SOT906-5 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 88 terminals; body 10 x 10 x 0.85 mm |
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SOT908-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT908-1 |
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SOT908-1 |
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NXP Semiconductors
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Plastic thermal enhanced very thin small outline package; no leads; 8 terminals |
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