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sot89 stencil

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sot89 stencil

Abstract: sot89 land pattern SOT89 Package Application Note 5051 Introduction PCB Land Pattern and Stencil Design Avago Technologies SOT89 is a 3 I/O pins (Figure 1) package platform designed to offer excellent heat dissipation and wide RF frequency response. The SOT89 package itself is lead free with a dimension of 4.1 mm , designers with general guidelines to layout suitable PCB land pattern and stencil for SOT89 package to , the vias. Stencil Design Guidelines 1.50 3.00 Figure 1. SOT89 package outline drawing
Avago Technologies
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Soldering guidelines and SMD footprint design

Abstract: SOD87 footprint solder lands by one of either three methods: dispensing, screen or stencil printing. Dispensing is , only suitable for solder paste deposits of 300 µm and wider. Stencil printing is similar to screen printing, except that a metal stencil is used instead of a fine-mesh screen. The stencil is usually made , stencil to force solder paste through the apertures in the stencil and onto the solder lands on the PCB , stencil solder land , , , board , , , filling The amount
Philips Semiconductors
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SOD80 footprint

Abstract: SOD87 footprint solder lands by one of either three methods: dispensing, screen or stencil printing. With screen , ), this method is only suitable for solder paste deposits of 300 µm and wider. Stencil printing is similar to screen printing, except that a metal stencil is used instead of a fine-mesh screen. The stencil is usually made of stainless steel or bronze and should be 150 to 200 µm thick. A squeegee is passed across the stencil to force solder paste through the apertures in the stencil and onto the
Philips Semiconductors
Original

SOD80 footprint

Abstract: SOD87 footprint PCBs solder lands by one of either three methods: dispensing, screen or stencil printing. Dispensing , method is only suitable for solder paste deposits of 300 µm and wider. Stencil printing is similar to screen printing, except that a metal stencil is used instead of a fine-mesh screen. The stencil is , the stencil to force solder paste through the apertures in the stencil and onto the solder lands on , solder paste stencil solder land , , , board , , , filling
Philips Semiconductors
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sot89 stencil

Abstract: -88 (SOT363) SOT23 SOT89 SOT223 S08 (SOT96-1) SSOP16 (SOT338-1) reflow soldering SSOP24 (SOT340-1) reflow , one of either three methods: dispensing, screen or stencil printing. Dispensing is flexible but is , solder paste deposits of 300 |im and wider. Stencil printing is similar to screen printing, except that a metal stencil is used instead of a fine-mesh screen. The stencil is usually made of stainless steel or bronze and should be 150 to 200 |j.m thick. A squeegee is passed across the stencil to force solder paste
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sot89 stencil 220AB T0220 SC-70 SC-88

SSOP16

Abstract: SSOP24 SC-70 (SOT323) SC-88 (SOT363) SOT23 SOT89 SOT223 SO8 (SOT96-1) SSOP16 (SOT338-1) reflow , : dispensing, screen or stencil printing. Although reflow soldering is recommended for SMDs, many , µm and wider. Stencil printing is similar to screen printing, except that a metal stencil is used instead of a fine-mesh screen. The stencil is usually made of stainless steel or bronze and should be 150 to 200 µm thick. A squeegee is passed across the stencil to force solder paste through the
Philips Semiconductors
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qfp 32 land pattern MLC748 MLC747

ssop24 footprint

Abstract: sot89 stencil -70 (SOT323) SC-88 (SOT363) SOT23 SOT89 SOT223 SO8 (SOT96-1) SSOP16 (SOT338-1) reflow soldering SSOP24 , applied to the PCBs solder lands by one of either three methods: dispensing, screen or stencil printing , other, wave soldering is usually applied. Stencil printing is similar to screen printing, except that a metal stencil is used instead of a fine-mesh screen. The stencil is usually made of stainless steel or bronze and should be 150 to 200 µm thick. A squeegee is passed across the stencil to force
Philips Semiconductors
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ssop24 footprint SSOP24 300 1 footprint PowerMos transistors TO220 package

SOD87 footprint

Abstract: Soldering guidelines and SMD footprint design stencil printing. Dispensing is flexible but is slow, and only suitable for pitches of 0.65 mm and above , resolution), this method is only suitable for solder paste deposits of 300 µm and wider. Stencil printing is similar to screen printing, except that a metal stencil is used instead of a fine-mesh screen. The stencil , across the stencil to force solder paste through the apertures in the stencil and onto the solder lands , used must be sufficient to give reliable soldered joints. This amount is controlled by the stencil
Philips Semiconductors
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SOD87 footprint Soldering guidelines and SMD footprint design MSA439 sot3391h MSA460 SOT343R footprint MSD059 MSD060 MSC422 SC-74 MSC423

ADA-4789

Abstract: Agilent RF amplifier SOT-89 this package in greater detail. Figure 3. Multi-purpose Evaluation Board for SOT-89 package Figure 2. Combined PCB and stencil layout for SOT-89 (dimensions in mm) This layout provides ample , ADA-4789 High P1dB Silicon Darlington Amplifier in SOT-89 package for broadband application , silicon gain block RFIC amplifier housed in a SOT-89 surface mount plastic package with thermal , with Bias Connections PCB Layout A recommended PCB pad layout for the SOT-89 package that is used
Avago Technologies
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ADA4789 AN-S003 Agilent RF amplifier SOT-89 an5051 0805CS-681XGLC common base amplifier circuit 142-0701-881 900MH AN-5051 AV01-0417EN

2sc3052ef

Abstract: 2n2222a SOT23 SOT223 SOT143 SOT143R SOT143 SOT143R SOT343 SOT143 SOT343 SOT143 SOT343 SOT143 SOT343 SOT89 , 700 700 700 1.4 0.5 1.4 3 3 3 no yes no no yes no SOT343 SOT89 SC74 SOT89 SC74 SOT89 BDP947 BDP947 BDP947 18 700 27 700 40 700 2000 2000 2000 1.4 0.5 1.4
Infineon Technologies
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2sc3052ef 2n2222a SOT23 TRANSISTOR SMD MARKING CODE s2a 1N4148 SMD LL-34 TRANSISTOR SMD CODE PACKAGE SOT23 2n2222 sot23 BF517 BF770A BF771 BF775 BF799 BF799W

XM0830SJ

Abstract: smd code marking 162 sot23-5 SOT143 SOT343 SOT143 SOT343 SOT89 SOT23 SOT23 SOT323 SOT23 SOT323 SOT23 SOT323 SOT23 SOT323 , 2.0 x 2.1 x 0.9 3:1 TSLP-4-4 ( ­ ) 1.2 x 0.6 x 0.4 4 SOT89 (SC-62) 2.9 x 2.4 x , SOT89 (SC-62) Package Outline 4.5 ±0.1 45° B 1.5 ±0.1 0.2 MAX. 2 2.75 +0.1 -0.15 , Copper 0.19 0.27 0.14 0.32 0.24 Foot Print Solder mask Stencil apertures TSLP , 0.35 1 0.3 0.35 0.45 0.275 Foot Print Stencil apertures Bottom view 0.39
Infineon Technologies
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XM0830SJ smd code marking 162 sot23-5 MARKING V14 SOT23-5 RF Transistor Selection smd code marking rf ft sot23 sot-363 inf BFP181 BFP181R BFP182 BFP182R BFP182W BFP183
Abstract: method a stencil with etched holes to pass the paste is used. The thickness of the stencil determines , General Wave soldering F l u x in g This soldering technique is not recommended for SOT89. The , Transistors SOT89 FOOTPRINTS Dimensions in mm. Placement accuracy: ±0.25 mm. Fig.22 Reflow soldering footprint for SOT89; typical dimensions. 1995 Apr 27 44 Philips Semiconductors , not recommend SOT89 for wave soldering, SOT223 is preferred. Dimensions in mm. Placement accuracy:  -
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bc 339

Abstract: is usually between 150 and 200 urn. Stencilling In this method a stencil with etched holes to pass the paste is used. The thickness of the stencil determines the amount of amount of solder paste , RF Wideband Transistors Wave soldering This soldering technique is not recommended tor SOT89. A d h , ; typical dimensions. 1997 Nov 26 57 Philips Semiconductors RF Wideband Transistors SOT89 , mm. Placement accuracy: ±0.25 mm. Fig.24 Reflow soldering footprint for SOT89; typical dimensions
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bc 339

sot59

Abstract: is usually between 150 and 200 jim . Stencilling In this method a stencil with etched holes to pass the paste is used. The thickness of the stencil determ ines the am ount of am ount of solder paste , technique is not recom m ended for SOT89. A d h e s iv e a p p l ic a t io n General suited to low , iconductors Small-signal Transistors SOT89 General F O O T P R IN T S s o ld er land pattern s , so ld e r re sist cu t o ul of the footprint. Fig.25 Reflow soldering footprint for SOT89; typical
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sot59

TGF2021-04-SD

Abstract: a low cost SOT89 surface mount package. The device's ideal operating point for low noise operation , (1/) 4.6 mm Ø SOLDERMASK KEEPOUT FOR LOCKWASHER (4/) SOT-89 PACKAGE OUTLINE 1 2 3 , stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and , C/sec Ordering Information Part TGF2021-04-SD TGF2021-04-SD-T/R Package Style SOT-89, BULK SOT-89
TriQuint Semiconductor
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08052U270GAT2A

Abstract: TGF2021-04-SD Transistor (pHEMT) housed in a low cost SOT89 surface mount package. The device's ideal operating point for , OF VIAS (1/) 4.6 mm Ø SOLDERMASK SOT-89 PACKAGE OUTLINE KEEPOUT FOR LOCKWASHER (4/) 1 , paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on , Information Part Package Style TGF2021-04-SD SOT-89, BULK TGF2021-04-SD-T/R SOT-89, TAPE AND
TriQuint Semiconductor
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08052U270GAT2A 08052U2R7BAT2A 08052U3R3BAT2A 08052U4R7CAT2A

TGF2021-04-SD

Abstract: 51923 Transistor (pHEMT) housed in a low cost SOT89 surface mount package. The device's ideal operating point for , OF VIAS (1/) 4.6 mm Ø SOLDERMASK SOT-89 PACKAGE OUTLINE KEEPOUT FOR LOCKWASHER (4/) 1 , paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on , Information Part Package Style TGF2021-04-SD SOT-89, BULK TGF2021-04-SD-T/R SOT-89, TAPE AND
TriQuint Semiconductor
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51923 SD 1083 31669 L0805220JESTR TriQuint SOT-89 TAPE AND REEL
Abstract: Electron Mobility GaAs Transistor (pHEMT) housed in a low cost SOT89 surface mount package. The deviceâ , ˜ SOLDERMASK SOT-89 PACKAGE OUTLINE KEEPOUT FOR LOCKWASHER (4/) 1 2 3 Assembly Notes 1/ The , be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and , Ordering Information Part Package Style TGF2021-04-SD SOT-89, BULK TGF2021-04-SD-T/R SOT-89 TriQuint Semiconductor
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Abstract: -watt Heterojunction GaAs Field Effect Transistor (HFET) housed in a low cost SOT89 surface mount package. The device , 7.6 mm COPPER AREA (3/) ARRAY OF VIAS (1/) 4.6 mm Ø SOLDERMASK KEEPOUT FOR 2-56 LOCKWASHER (4/) SOT-89 , . Solder paste can be applied using a stencil printer or dot placement. The volume of solder paste depends , Style SOT-89 TAPE AND REEL 19 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972 TriQuint Semiconductor
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TGF2961-SD

TGF2961-SD

Abstract: e/TriQuint SOT-89 TAPE AND REEL Transistor (HFET) housed in a low cost SOT89 surface mount package. The device's ideal operating point is , /) 4.6 mm Ø SOLDERMASK SOT-89 PACKAGE OUTLINE KEEPOUT FOR 2-56 LOCKWASHER (4/) 1 2 3 , using a stencil printer or dot placement. The volume of solder paste depends on PCB and component , , TAPE AND REEL SOT-89, TAPE AND REEL 20 TriQuint Semiconductor: www. triquint.com (972)994-8465
TriQuint Semiconductor
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e/TriQuint SOT-89 TAPE AND REEL
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