| SOT830-1 |
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NXP Semiconductors
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Plastic thermal enhanced thin shrink small outline package/transparent; no leads; 16 terminals; resin based; body 5.4 x 3.9 x 1.2 mm |
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Original |
PDF
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| SOT832-1 |
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NXP Semiconductors
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Plastic low profile fine-pitch ball grid array package; 240 balls; body 11 x 11 x 0.95 mm |
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Original |
PDF
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| SOT833-1 |
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NXP Semiconductors
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Plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm |
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Original |
PDF
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| SOT833-1_115 |
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NXP Semiconductors
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Standard product orientation 12NC ending 115 |
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Original |
PDF
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| SOT834-1 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT834-1 |
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Original |
PDF
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| SOT835-1 |
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NXP Semiconductors
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Plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink |
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Original |
PDF
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| SOT836-1 |
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NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 167 balls; body 14 x 14 x 1.05 mm |
|
Original |
PDF
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| SOT838-1 |
|
NXP Semiconductors
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Plastic low profile fine-pitch ball grid array package; 167 balls; body 14 x 14 x 1.05 mm |
|
Original |
PDF
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