| SOT622-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT622-1 |
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Original |
PDF
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| SOT622-1 |
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NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm |
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Original |
PDF
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| SOT623-1 |
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NXP Semiconductors
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Plastic ball grid array package; 658 balls; body 40 x 40 x 1.75 mm |
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Original |
PDF
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| SOT623-1 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT623-1 |
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Original |
PDF
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| SOT624-1 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT624-1 |
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Original |
PDF
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| SOT624-1 |
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NXP Semiconductors
|
Plastic thermal enhanced ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm; heatsink |
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Original |
PDF
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| SOT627-1 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 81 balls; body 8 x 8 x 0.8 mm |
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Original |
PDF
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| SOT629-1 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT629-1 |
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Original |
PDF
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| SOT629-1 |
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NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 4 x 4 x 0.85 mm |
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Original |
PDF
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| SOT629-1_118 |
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NXP Semiconductors
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HVQFN16; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
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Original |
PDF
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