| SOT619-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT619-1 |
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Original |
PDF
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| SOT619-11 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals |
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Original |
PDF
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| SOT619-1_518 |
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NXP Semiconductors
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HVQFN48; Reel dry pack, SMD, 13"Q1/T1 standard orientationOrderable part number ending, 518 or YOrdering code (12NC) ending 518 |
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Original |
PDF
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| SOT619-2 |
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NXP Semiconductors
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Footprint for reflow soldering SOT619-2 |
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Original |
PDF
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| SOT619-4 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm |
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Original |
PDF
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| SOT619-5 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.9 mm |
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Original |
PDF
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| SOT619-6 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm |
|
Original |
PDF
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| SOT619-7 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm |
|
Original |
PDF
|
| SOT619-8 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm |
|
Original |
PDF
|
| SOT619-9 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm |
|
Original |
PDF
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