| SOT353 |
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Philips Semiconductors
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Plastic surface-mounted package, 5 leads |
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Original |
PDF
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| SOT-353 |
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SYNC Power
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OUTLINE |
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Original |
PDF
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| SOT353-1 |
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NXP Semiconductors
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Plastic thin shrink small outline package; 5 leads; body width 1.25 mm |
|
Original |
PDF
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| SOT353-1_125 |
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NXP Semiconductors
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TSSOP5; Reel pack; SMD, 7"; Q3 Reversed product orientation; Orderable part number ending, 125 or H; Ordering code (12NC) ending 125 |
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Original |
PDF
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| SOT353_115 |
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NXP Semiconductors
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Tape reel SMD; standard product orientation 12NC ending 115 |
|
Original |
PDF
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| SOT353-1_165 |
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NXP Semiconductors
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TSSOP5; Reel pack; SMD; Q3 Reverse product orientation; Orderable part number ending, 165 or Z; Ordering code (12NC) ending 165 |
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Original |
PDF
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| SOT353_125 |
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NXP Semiconductors
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Tape reel SMD; reversed product orientation 12NC ending 125 |
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Original |
PDF
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| SOT353_135 |
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NXP Semiconductors
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Tape reel SMD; standard product orientation 12NC ending 135 |
|
Original |
PDF
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| SOT354-1 |
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NXP Semiconductors
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Plastic surface-mounted single in-line power package; 9 leads |
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Original |
PDF
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| SOT355-1 |
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NXP Semiconductors
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Footprint for reflow soldering |
|
Original |
PDF
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| SOT355-1 |
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NXP Semiconductors
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Plastic thin shrink small outline package; 24 leads; body width 4.4 mm |
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Original |
PDF
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| SOT355-1 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT355-1 |
|
Original |
PDF
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| SOT355-1_118 |
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NXP Semiconductors
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TSSOP24; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
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Original |
PDF
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| SOT357-1 |
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NXP Semiconductors
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Plastic thin quad flat package; 64 leads; body 10 x 10 x 1.0 mm |
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Original |
PDF
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|
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| SOT357-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT357-1 |
|
Original |
PDF
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| SOT358-1 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT358-1 |
|
Original |
PDF
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| SOT358-1 |
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NXP Semiconductors
|
Plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm |
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Original |
PDF
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