SOT1220 |
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NXP Semiconductors
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Plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals |
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Original |
PDF
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SOT1220_115 |
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NXP Semiconductors
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DFN2020MD-6; reel pack; Standard orientation; 12NC ending 115 |
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Original |
PDF
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SOT1220_125 |
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NXP Semiconductors
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DFN2020MD-6; Tape reel SMD; reversed product orientation 12NC ending 125 |
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Original |
PDF
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SOT1221-1 |
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NXP Semiconductors
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Plastic, heatsink small outline package; 6 leads(flat) |
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Original |
PDF
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SOT1222-1 |
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NXP Semiconductors
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Plastic, heatsink small outline package; 6 leads |
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Original |
PDF
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SOT1223-1 |
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NXP Semiconductors
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Plastic, heatsink small outline package; 4 leads(flat) |
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Original |
PDF
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SOT1224-1 |
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NXP Semiconductors
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Plastic, heatsink small outline package; 4 leads |
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Original |
PDF
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SOT1225 |
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NXP Semiconductors
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Plastic extremely thin small outline package; no leads; 8 terminals; body 1.6 x 1.2 x 0.4 mm |
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Original |
PDF
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SOT1226 |
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NXP Semiconductors
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Plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals |
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Original |
PDF
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SOT1227A |
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NXP Semiconductors
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Flanged ceramic package; 2 mounting holes; 2 leads |
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Original |
PDF
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SOT1227B |
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NXP Semiconductors
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Earless Flanged ceramic package; 2 leads |
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Original |
PDF
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SOT1228A |
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NXP Semiconductors
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Flanged LDMOST ceramic package; 2 mounting holes; 4 leads |
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Original |
PDF
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SOT1229 |
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NXP Semiconductors
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Footprint information for reflow soldering of DFN1212-6 package |
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Original |
PDF
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SOT122D |
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NXP Semiconductors
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studless ceramic package; 4 leads |
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Original |
PDF
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SOT122E |
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NXP Semiconductors
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studded ceramic package; 4 leads |
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Original |
PDF
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SOT122F |
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NXP Semiconductors
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studded ceramic package; 4 leads |
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Original |
PDF
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