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Part Manufacturer Description Datasheet BUY
LTC1643AHCGN#TR Linear Technology LTC1643A - PCI-Bus Hot Swap Controller; Package: SSOP; Pins: 16; Temperature Range: 0°C to 70°C visit Linear Technology - Now Part of Analog Devices Buy
LTC4242CG Linear Technology LTC4242 - Dual Slot Hot Swap Controller for PCI Express; Package: SSOP; Pins: 36; Temperature Range: 0°C to 70°C visit Linear Technology - Now Part of Analog Devices Buy
LTC1643AL-1CGN#TRPBF Linear Technology LTC1643A - PCI-Bus Hot Swap Controller; Package: SSOP; Pins: 16; Temperature Range: 0°C to 70°C visit Linear Technology - Now Part of Analog Devices Buy
LTC4242CUHF#PBF Linear Technology LTC4242 - Dual Slot Hot Swap Controller for PCI Express; Package: QFN; Pins: 38; Temperature Range: 0°C to 70°C visit Linear Technology - Now Part of Analog Devices Buy
LTC1536CMS8#TR Linear Technology LTC1536 - Precision Triple Supply Monitor for PCI Applications; Package: MSOP; Pins: 8; Temperature Range: 0°C to 70°C visit Linear Technology - Now Part of Analog Devices Buy
LTC1643AL-1IGN Linear Technology LTC1643A - PCI-Bus Hot Swap Controller; Package: SSOP; Pins: 16; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy

rf-microwave components

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Components Low Inductance Chip Arrays â'Zâ' Chips Capacitor Arrays Dual Resonance Chips Insulation -
OCR Scan

SMD fuse 4A

Abstract: MMC 103 ceramic capacitor Vibration Load Life 24 Conditions Components completely immersed in a solder bath at 235 ±5°C for , components stored in "as received" packaging. Components mounted to a substrate. A force of 5N applied normal to the line joining the terminations and in a line parallel to the substrate. Components , tipped tweezers or vacuum pick-ups is strongly recommended for individual components. Bulk handling , Integrated Passive Components Low Inductance Chip Arrays Capacitor Arrays Dual Resonance Chips Custom
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Abstract: Leadership As a world-class supplier of RF microwave components for todayâ'™s wireless communication systems , reliability of commercial semiconductor components. Six Sigma â'¢ #7; onsistent processes and products C , Designer Kits feature samples of a variety of leading-edge BUY NOW components, with data sheets and , recommended: ESD-sensitive components are classified according to their Personnel ESD withstand voltage using the test procedure described in this standard. The HBM ESDS components classification Skyworks Solutions
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8016 90 pins connector

Abstract: 347N Mount - European Version CH 41-94 RH31-RH61 Integrated Passive Components 023-N/A 024 025 026 027
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CK05-CK06 CCR75-CCR79 GH01-GH06 8016 90 pins connector 347N SZ 7023 SMPS MALE CONNECTOR 229N KBR bk 06 MIL-PRF-55681 CDR01-CDR06 CDR31-CDR35 MIL-PRF-39014/01/02/20/23 MIL-PRF-39014/22 MIL-PRF-39014/05

SMD fuse 4A

Abstract: smd fuse p individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. For , Components Low Inductance Chip Arrays Capacitor Arrays Dual Resonance Chips Custom IPCs Voltage
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F0402E F0603E F1206B F0603C SMD fuse 4A smd fuse p smd fuse d MMC 103 ceramic capacitor smd fuse i2t graph F02402G F0805B E143842

smd fuse p

Abstract: FUSE SMD 0603 Vibration Load Life Conditions Components completely immersed in a solder bath at 235 ±5°C for 2 , components stored in "as received" packaging. Components mounted to a substrate. A force of 5N applied normal to the line joining the terminations and in a line parallel to the substrate. Components , Conditions Components completely immersed in a solder bath at 235 ±5°C for 2 secs. Completely immersed in a solder bath at 260 ±5°C for 60 secs. 12 months minimum with components stored in "as received
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FUSE SMD 0603 FUSE SMD Fuse 0.5A rf-microwave components rf&microwave product F1206A0R50FWTR F0612D S-ACCU5M804-C

Accu-Guard SMD Thin-Film Fuse

Abstract: Accu-Guard Series SMD Thin-Film Fuse Bend Conditions Components completely immersed in a solder bath at 245 ±5°C for 3 secs. Components completely immersed in a solder bath at 255 ±5°C for 60 secs. 12 months minimum with components stored in â'as receivedâ' packaging. Components mounted to a substrate. Increasing shearing force applied paralled to the sufstrate till destruction. Components mounted to a flexible substrate , Components completely immersed in a solder bath at 235 ±5°C for 2 secs. Completely immersed in a solder
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Accu-Guard SMD Thin-Film Fuse Accu-Guard Series SMD Thin-Film Fuse Fuses Circuit Protection Accu-Guard F0402G F0603G S-ACCU0M1213-C

fuse smd code Y

Abstract: 4560 pre amp Resistance Storage Shear Temperature Cycling Bend Conditions Components completely immersed in a solder bath at 245 ±5°C for 3 secs. Components completely immersed in a solder bath at 255 ±5°C for 60 secs. 12 months minimum with components stored in "as received" packaging. Components mounted to a substrate. Increasing shearing force applied paralled to the sufstrate till destruction. Components , Conditions Components completely immersed in a solder bath at 235 ±5°C for 2 secs. Completely immersed in
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fuse smd code Y 4560 pre amp fuse smd code x fuse smd color code fuse smd code D diode on mobo

electronic passive components catalog

Abstract: fuse smd code Y Conditions Components completely immersed in a solder bath at 245 ±5°C for 3 secs. Components completely immersed in a solder bath at 255 ±5°C for 60 secs. 12 months minimum with components stored in "as received" packaging. Components mounted to a substrate. Increasing shearing force applied paralled to the sufstrate till destruction. Components mounted to a flexible substrate (e.g. FR ­ 4). 1000 cycles -55ºC to , Solderability Leach Resistance Conditions Components completely immersed in a solder bath at 235 ±5°C for 2 secs
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electronic passive components catalog fuse smd code L suface 0603 S-ACCU5M612-C

fuse smd code Y

Abstract: trapezoidal pulse Bend Conditions Components completely immersed in a solder bath at 245 ±5°C for 3 secs. Components completely immersed in a solder bath at 255 ±5°C for 60 secs. 12 months minimum with components stored in "as received" packaging. Components mounted to a substrate. Increasing shearing force applied paralled to the sufstrate till destruction. Components mounted to a flexible substrate (e.g. FR ­ 4). , Storage Shear Rapid Change of Temperature Vibration Bend Conditions Components completely
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trapezoidal pulse smd t05 glass fuse color code

elco power supply

Abstract: rf-microwave components design engineer to compact more electronics components onto the PCB board. Assembly tooling can be , compact more electronic components onto the PCB. The kit can be modified for specific applications such , ) Diameter 8=5.0mm (0.197) Diameter FRAMELESS KIT GUIDE BY OPTIONAL COMPONENTS 68 Position Standard , Elco end customers. Several other components such as antennas, LED's, light pipes and I/O connectors , , standoff type (H=0/H=2.0) can also be offered, which enables the components to be mounted on the back
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elco power supply ELCO Edge Connectors 20-5069-068-003-871 56 PIN ELCO Connector cd 5411 ELCO 5638 5M1001-C

MAX2654

Abstract: MAX2654EXT-T for external matching components. A shutdown feature in the MAX2654/MAX2655 reduces the operating , and external matching components. 4 4 VCC Supply Voltage. Bypass to ground with an , need for external matching components. (For MAX2655, a shunt inductor is recommended for best output , matching networks at the input ports. The values of these matching components are recommended in the
Maxim Integrated Products
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MAX2654 MAX2656 MAX2654EXT-T MAX2655EXT-T MAX2656EXT-T sc70 topmark 1575MH 1960MH MAX2655/MAX2656

max2654

Abstract: for external matching components. A shutdown feature in the MAX2654/MAX2655 reduces operating , and external matching components. 4 4 VCC Supply Voltage. Bypass to ground with an , need for external matching components. (For MAX2655, a shunt inductor is recommended for best output , matching networks at the input ports. The values of these matching components are recommended in the
Maxim Integrated Products
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MAX2654/MAX2655/MAX2656

10 micro farad 16V capacitor

Abstract: capacitor 100nf 100v 0603 x7r /34/35) European Version CECC 32 101-801 Chips Packaging of Chip Components Automatic Insertion
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10 micro farad 16V capacitor capacitor 100nf 100v 0603 x7r capacitor 220nf 50v 0805 datasheet by avx Silver mica capacitor 68pf 100V 3 pf Silver Dipped Mica Capacitor capacitor 10nf surface mount 1812 MIL-C-55681/C CDR01 CDR06 CDR31 CDR35 CDR32

Practical statistical simulation for efficient circuit design

Abstract: kopin dominates the system behavior, or when all the components vary independently (as if the parts were all independent discrete components). The possible statistical system responses, in those cases, can be obtained , ), the assumption that circuit components vary independently or that one device changes while other
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Practical statistical simulation for efficient circuit design kopin CUUK1544-09 CUUK1544/F 2009/U 28DOE

CECC32101

Abstract: 27NF 500V 31 Packaging of Chip Components Automatic Insertion Packaging . . . . . . . . . . . . . . . . . . .
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CECC32101 27NF 500V elco 330 u 08055A101JAT2A CDR02 1nF 2000V X7R S-MCC20M299-C

Silver mica capacitor 68pf 100V

Abstract: CECC32101 31 Packaging of Chip Components Automatic Insertion Packaging . . . . . . . . . . . . . . . . . . .
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capacitor 1nf 500v 1812 x7r

elco power supply

Abstract: elco smt 100 , components, and software for implementing the PCI standard were already in wide use by the personal
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elco smt 100 24 5602 040 000 829 H rf-microwave catalog Battery angle Connector, Pitch 2.5mm, 4 pin ELCO 120 elco 5046 S-FP00M802-C

ELCO Edge Connectors

Abstract: elco 5046 handling I/O functions. In addition, the chips, components, and software for implementing the PCI standard
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AVX X20 AVX 14 5046 060 630 829 N2414 S-FP10M1001-N

CDR31

Abstract: CDR32 31 Packaging of Chip Components Automatic Insertion Packaging . . . . . . . . . . . . . . . . . . .
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CDR33 Reliability data CECC32101-801 3300 XL
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