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Part Manufacturer Description Datasheet BUY
ATH006A0X4 GE Critical Power Austin Microlynx II SIP Non-isolated Power Modules visit GE Critical Power
AXA003A0X4Z GE Critical Power Austin Minilynx 12V SIP Non-isolated Power Module visit GE Critical Power
AXH005A0X GE Critical Power Austin Microlynx SIP Non-isolated Power Module visit GE Critical Power
AXA003A0X GE Critical Power Austin Minilynx 12V SIP Non-isolated Power Module visit GE Critical Power
ATH006A0X GE Critical Power Austin Microlynx II SIP Non-isolated Power Modules visit GE Critical Power
AXA003A0XZ GE Critical Power Austin Minilynx 12V SIP Non-isolated Power Module visit GE Critical Power

qfn 48 PACKAGE footprint

Catalog Datasheet MFG & Type PDF Document Tags

jedec footprint MO-220 VHHD-2

Abstract: qfn 44 PACKAGE footprint to the design of a PCB footprint for the QFN package and then goes on to describe practical , creating a QFN footprint is the package drawing for the device. Wolfson uses a number of different QFN , FL: 48 PIN QFN PLASTIC PACKAGE 7 X 7 X 0.9 mm BODY, 0.50 mm LEAD PITCH D2 SEE DETAIL 1 D D2 , SOLDERING. Figure 9 48 pin 7x7 QFN Package Wolfson Type C w January 2006, Rev 2.1 8 WAN , _0118 Figure 14 40 Pin 6x6 QFN Footprint Figure 15 48 Pin 7x7 QFN Footprint Figure 16 64 Pin 9x9 QFN
Wolfson Microelectronics
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RF5765

Abstract: RF3688 MHz and harmonic filtering in a small QFN package. APPLICATIONS · Mobile devices · Consumer , 3.0 to 4.8 3.0 to 4.8 170 190 QFN 3.0 x 3.0 QFN 3.0 x 3.0 Y Y RF5755* RF5565 RF5686 , reduced footprint and minimized component count, outside the core chipset. The RF3482 and RF5225 FEMs , count and minimized footprint and assembly cost. By integrateing a 5 GHz PA with integrated input and , RF3688 FEM significantly minimizes external component count, reducing the footprint and assembly costs
RF Micro Devices
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RF5725 RF5745 RF5506 RF5516 RF5765 wifi bluetooth combo Module RF5385 HIGH POWER AMPLIFIER 5 W FOR 2.4 GHz wifi bluetooth RF5325 RF5345 RF5365 RF5724

JEDEC Drawing MO-220 qfn

Abstract: 32 pins qfn 5x5 footprint to the design of a PCB footprint for the QFN package and then goes on to describe practical , creating a QFN footprint is the package drawing for the device. Wolfson uses a number of different QFN , 5MM×5MM 32 A AND C 7MM×7MM 48 C Figure 1 QFN Package Range The Wolfson QFN package , , Rev 1.7 5 WAN_0118 DM029.B FL: 48 PIN QFN PLASTIC PACKAGE 7 X 7 X 0.9 mm BODY, 0.50 mm LEAD , DIMENSIONS Figure 8 28 Pin 5x5 QFN Footprint Figure 9 32 Pin 5x5 QFN Footprint Figure 10 48 Pin 7x7
Wolfson Microelectronics
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JEDEC Drawing MO-220 qfn 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil

wifi bluetooth combo Module

Abstract: RF5506 2.4 - 2.7 GHz, LNA/SW (SP3T) 2.4 - 2.7 12 - 3.0 2.7 - 4.8 7 QFN 2 x 2 Y RF5686 5 GHz FEM, PA, SW, and LPF 4.9 - 5.85 27 16 3.0 3.0 - 4.8 150 QFN 3 x 3 , 4.8 150 QFN 3 x 3 Y Dual-band 2.5/5 GHz, PAs, Switches, LPF, Baluns, and PDET 2.4 - 2.5 , reduced footprint and minimized component count, outside the core chipset. The RF3482 and RF5225 FEMs , component count, minimized footprint and RF5745 · PA, LNA, SP3T · No PDET coupler · 17 dBm at 3.3% ·
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qfn 48 PACKAGE footprint WIFI switch 802.11b Amplifier MMIC Amplifier qfn RF522 QFN-48 footprint RF5501

qfn 44 PACKAGE footprint

Abstract: qfn 76 PACKAGE footprint Ethernet Media Converter was introduced. The ML6652CM/EM is the QFN/LPCC44 package version of the ML6652 , schematic symbol and PCB footprint will have a total of 96 pins. TQFP44 QFN/LPCC44 GND/THERMAL Pins , LinearCorporation 2050 Concourse Drive, San Jose, CA 95131 Page 1 ML6652 QFN/LPCC Package 408 , TQFP package is being used. Since the QFN/LPCC44 requires a copper area underneath the package for , shown in Figure 2 and 3. This connection indicates the QFN/LPCC44 package will be used in the design
Micro Linear
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LPCC44 qfn 44 PACKAGE footprint qfn 76 PACKAGE footprint ML6652CM QFN 36 footprint qfn 64 pcb layout ML6652CH AN-002 QFN/LPCC44 ML6652CH/EH TPQFP44

RFFM8800

Abstract: 5.8ghz pa ) 2.7 to 4.8 RF Ports ICC DC(mA) Blocked 15 No Package (dim. in mm) QFN 2.0 x 2.0 x 0.5 Part , DCBlocked No No No Yes Package (dim. in mm) QFN 2.0 x 2.0 x 0.6 QFN 2.0 x 2.0 x 0.6 QFN 1.75 x 1.75 x , Package (dim. in mm) QFN 2.0 x 2.0 x 0.5 Flip Chip 1.0 x 1.0 x 0.4 QFN 1.75 x 1.75 x 0.5 QFN 2.0 x 2.0 x , Current at Po (mA) 130 160 130 150 170 250 200 200 160 150 160 Package (dim. in mm) QFN 3 x 3 x 0.5 , Current at Po (mA) 150 175 175 200 220 220 240 Package (dim. in mm) QFN 3 x 3 x 0.5 QFN 3 x 3 x 0.5
RF Micro Devices
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RFFM8500 RFFM8502 RFFM8503 RFFM8504 RFFM8800 5.8ghz pa SW SPDT FOOTPRINT AMPLIFIER 5GHZ wifi IEEE802 RF5836

TOSHIBA 8879

Abstract: QFN-20 footprint compatible w/ 1.8V host processor n Ultra small footprint â'¢ 3.0mm x 3.0mm 20-QFN Sensor Inputs , I2C serial interface n Ultra small footprint â'¢ 4.0mm x 4.0mm 20-QFN â'¢ 4.4mm x 6.5mm , n Small footprint â'¢ 5.0mm x 5.0mm 32-QFN >5mm ü Lin./Log. ü ü ü 5x5mm , small footprint â'¢ 4.0mm x 4.0mm 28-QFN Button Min. Scan Time Power @ 195ms Overlay , components per input n Ultra small footprint â'¢ 4.0mm x 4.0mm 28-QFN â'¢ 5.0mm x 5.0mm 32-QFN Min
Semtech
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TOSHIBA 8879 QFN-20 footprint SX9300 SG-0612

QFN-36 footprint

Abstract: compatible w/ 1.8V host processor n Ultra small footprint â'¢ 3.0mm x 3.0mm 20-QFN Sensor Inputs , footprint â'¢ 5.0mm x 5.0mm 32-QFN >5mm ü Lin./Log. ü ü ü 5x5mm - 7 - , small footprint â'¢ 4.0mm x 4.0mm 28-QFN Button Min. Scan Time Power @ 195ms Overlay , small footprint â'¢ 2.07mm x 2.07mm 19-WLCSP â'¢ 4.0mm x 4.0mm 20-QFN Digital Filter Resolution , Protection Small Footprint Proximity SAR Engine IR Analog Haptic Driver LED Driver
Semtech
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QFN-36 footprint SG-AG-0612

SOT23W-3

Abstract: transistor crossreference (4) populated sides and exposed thermal pad (MLPQ/QFN); square body, 5 x 5 mm maximum footprint , thermal pad (MLPQ/QFN); square body, 6 x 6 mm minimum footprint; 0.90 mm nominal (1.00 maximum) height , mount, 0.50 mm contact pitch MS-026ABC 48 ­ 4 K (none) Package Type (Common Package , (Common Package Designator) Pictorial View/ Representative Footprint UA (TI,TN, TJ) Continued , MSOP LY, LZ PLCC EA EB ED EP EQ QFN ES ET EU EV QSOP Package Designator K
Allegro MicroSystems
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PUB26013 SOT23W-3 transistor crossreference footprint soic DFN 10 socket 16 soic pcb footprint DUAL ROW QFN leadframe

AN3111

Abstract: qfn 48 PACKAGE footprint Footprint for 16-Lead QFN, 6 x 6 mm for Automotive, Non-wettable Flank AN3111 2 Sensors Freescale Semiconductor Figure 4. PCB Footprint for 16-Lead QFN, 6 x 6 mm for Automotive, Wettable Flank Figure 5. PCB Footprint for 16-Lead QFN, 6 x 6 mm for Consumer Grade Products and Applications GENERAL PCB , PCB landing pad -0.025 mm = 0.525 x 0.475 mm Package footprint Figure 7. Stencil Design for , components, the solder joints of QFN are formed primarily underneath the package. Optical inspection and
Freescale Semiconductor
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AN3111

Abstract: AN-311-1 manufacturing facilities before qualification. Figure 3. PCB Footprint for 16-Lead QFN, 6 x 6 mm for , 16-Lead QFN, 6 x 6 mm for Automotive, Wettable Flank Figure 5. PCB Footprint for 16-Lead QFN, 6 x , following are the general recommended guidelines for mounting QFN sensors: 1. Use PCB land pad (footprint , -0.025 mm = 0.525 x 0.475 mm Package footprint Figure 7. Stencil Design for Consumer Applications , QFN are formed primarily underneath the package. Optical inspection and x-ray inspection are
Freescale Semiconductor
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AN-311-1 etch amkor exposed pad sensor x-ray

QFN-48 LAND PATTERN

Abstract: QFN PACKAGE thermal resistance LS/LR 48 Pin QFN Package Outline Cypress Semiconductor Corporation · 3901 North First Street , X 5.3 Figure 2. WirelessUSB LS/LR 48 Pin QFN Package Outline including EPAD to optimize the , a 48-pin exposed paddle QFN package shown in Figure 1 and Figure 2. In order to achieve peak , GEmin ZEmax AEmax Table 1. QFN Package Dimensions TYPICAL PAD FOOTPRINT Size 7X7 Y I/O 48 Q FN Package Leads/Side 12 Lead Pitch 0.50 m m X ADmax GDmin QFN Package
Cypress Semiconductor
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AN5060 QFN-48 LAND PATTERN QFN PACKAGE thermal resistance qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo LF48A LY48A

qfn 6x6 foot print

Abstract: QFN-6x6 0.5mm Figure 2. PCB Footprint for 16-Lead QFN, 6x6 mm for Automotive Grade Products and Application For , Footprint for 16-Lead QFN, 6x6 mm for Consumer Grade Products and Applications PCB DESIGN GUIDELINES , removed during PCB rework are not recommended to be reused for final assemblies. Figure 9. QFN Package , Freescale Semiconductor Application Note AN3111 Rev 2, 06/2007 Soldering the QFN Stacked , purpose of this application note is to describe suggested methods of soldering sensor QFN devices to a
Freescale Semiconductor
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qfn 6x6 foot print QFN-6x6 0.5mm QFN-6x6 48 nozzle heater sensors-free qfn stencil

SOT23W-3

Abstract: tssop 38 footprint leadless package with quad (4) populated sides and exposed thermal pad (MLPQ/QFN); square body, 0.75 mm , Plastic leadless package with quad (4) populated sides and exposed thermal pad (MLPQ/QFN); square body , ) populated sides and exposed thermal pad (MLPQ/QFN); square body, 6 x 6 mm minimum footprint; 0.90 mm , Gull wing surface mount, 0.50 mm contact pitch Pictorial View/ Representative Footprint 48 MS , 28 L Package Type (Common Package Designator) Pictorial View/ Representative Footprint
Allegro MicroSystems
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tssop 38 footprint MS-018-AC PLCC 44 pin through hole MO-220WGGC SOT23 MARK EW MS-013-AB

qfn 48 PACKAGE footprint

Abstract: ISLA112P50 69.5 48 Ld QFN, 72 Ld QFN KAD5612P-12 12 x 2 125 342 67.2 72 Ld QFN KAD5514P-21 14 210 363/402 70.2 48 Ld QFN, 72 Ld QFN ISLA110P50* 10 500 441 60.7 , /378 70.6 48 Ld QFN, 72 Ld QFN KAD2710C-27 10 275 261 55.7 68 Ld QFN KAD2710L-27 10 275 278 55.7 68 Ld QFN KAD5514P-12 14 125 309/345 70.9 48 , KAD5512HP-25 12 250 390/429 68.3 48 Ld QFN, 72 Ld QFN KAD5610P-21 10 x 2 210 387
Intersil
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ISLA112P50 ISLA118P50 7 segment display 5612 qfn 48 KAD2710L-10 KAD5512P-21 KAD5612P-21 KAD5512HP-17

qfn 48 PACKAGE footprint

Abstract: qfn 48 411 60.8 Package 72 Ld QFN KAD5512P-25 12 250 234/267 66.1 48 Ld QFN, 72 Ld , 250 390/429 69.5 48 Ld QFN, 72 Ld QFN KAD5610P-25 KAD5514P-21 14 210 363/402 70.2 48 Ld QFN, 72 Ld QFN KAD2710C-21 10 210 222 56.4 68 Ld QFN KAD5514P-17 14 170 339/378 70.6 48 Ld QFN, 72 Ld QFN KAD2710L-21 10 210 240 56.4 68 Ld QFN KAD5514P-12 14 125 309/345 70.9 48 Ld QFN, 72 Ld QFN KAD5610P-21 10 x
Intersil
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x2210 5610 intersil 48LD KAD5514P-25 5512H-25 5512H-12 5512H-21 5512H-17 KAD55XX KAD2708C-10

QFN-6x6 0.5mm

Abstract: QFN-6x6 48 mm. Figure 3. PCB Footprint for 16-Lead QFN, 6x6 mm for Consumer Grade Products and Applications , further guidance. Figure 11. QFN Package Removal Process AN3111 4 Sensors Freescale , AN3111 Rev 3, 07/2008 Freescale Semiconductor Application Note Soldering the QFN Stacked , purpose of this application note is to describe suggested methods of soldering sensor QFN devices to a , practices. Figure 1 shows the bottom view of QFN 16 lead, 6x6, individual sensor packaged device
Freescale Semiconductor
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MEC1609

Abstract: MEC1310 supports variable External MII Mixed Endian Checksum Offload Engine Pin & Package 56-pin QFN , LAN8710 Interface Ethernet Pin & Package MII/RMII 10/100 32-pin QFN SMSC's highest performing Ethernet , -pin QFN (8x8mm) lead-free RoHS-compliant package Hi-Speed USB 2.0 Switch ­ USB3740 Hi-Speed USB 2.0 switch for portable applications Small-footprint, 10-pin QFN package Provides a high-bandwidth switch , LAN9500A Ethernet Downstream Ports Pin & Package 56-pin QFN 10/100 LAN9512 10/100 2 64-pin QFN
Standard MicroSystems
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MEC1609 MEC1310 MEC1619 smsc MEC1310 USB HSIC ECE1099 from SMSC

N681622

Abstract: GR909 including 1MHz / 2MHz Sampling Rate: 8 kHz Small Footprint Packages: LQFP-48, QFN-48 and QFN -20 (SLFC , support VDD N681386 SINGLE PROGRAMMABLE QFN/LQFP 48-Pin 32 31 30 VDD2 TIN RIN Package LQFP-48 QFN-48 QFN-20 10 6 7 8 9 Notes Green/RoHS Green/RoHS Green/RoHS N681386DG , 17 48 47 46 45 44 43 42 41 40 39 38 37 RIP 16 RING , DSY Metal Paddle (VBAT) N681622 QFN 20-Pin 13 14 15 16 17 18 19 20 21
nuvoTon
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GR909 N6813 DTMF to FSK CONVERTER n681622yg caller id converter fsk to dtmf LQFP-48 footprint N681386/N681622 90VPK GR-909 LQFP-48 QFN-20 N681386YG

GS12141

Abstract: compact 6x6 48 pin QFN package. A smaller package variant, the GS6151 is also available. The GS6151 with its 4x4 32 pin QFN package is ideal for high channel density designs or other applications where the , with integrated retiming features a 4x6 QFN package. This manufacturing friendly, asymmetric package , QFN -40 to +85 EQs 195 4x4 16 QFN Footprint Compat. with Temp Size Range , 130 6x6 48 QFN 2:1 YES -40 to +85 130 4x4 32 QFN 4:1 YES -40 to +85
Semtech
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GS12141 GS12070
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