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PA343 Cirrus Logic 350 V, 120 mA Peak, 2.2 mA Standby Current Dual Power Amplifier ri Buy
PA343DF Cirrus Logic DUAL OP-AMP, 40000 uV OFFSET-MAX, 10 MHz BAND WIDTH, PDSO24, ROHS COMPLIANT, MO-166, PSOP-24 ri BuyFREE Buy
VRE305KD Apex Microtechnology Inc IC VREF SERIES PREC 5V 8-DIP ri Buy

precondition DIP JEDEC

Catalog Datasheet Type PDF Document Tags
Abstract: DIP (PDIP) 28 Lead Smal Outline (SOJ) 32 Lead Thin Quad Flat Pack (TQFP) Mold Compound Name , Precondition: 48-Hrs PCT, 3 Cys Solder Reflow P Temperature Cycle MIL-STD-883C MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: 48 Hrs. PCT, 3 Cys Solder Reflow P Pressure Cooker Test No bias, 121°C, 100%RH, 30 PSIA Precondition: 40 Temperature cycles, Condition C P , accordance with JEDEC 17. Cypress Spec. 01-00081 P Current Density Cypress Spec 22-00029 P ... Original
datasheet

6 pages,
38.21 Kb

EME-6300H CY7C433 MIL-STD-883 Method 3015.7 precondition DIP JEDEC CY7C428/9 CY7C432/3 CY7C428/9 abstract
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Abstract: : CY7B8392 CY7B8392 Package: 28-pin Plastic Leaded Chip Carrier (PLCC) 16-pin, 300-mil Plastic DIP (PDIP , Chip Carrier (PLCC) 16-pin, 300-mil Plastic DIP (PDIP) Mold Compound Name/Manufacturer: Lead Frame , = 9.0V, 150°C P High Accelerated Saturation Test (HAST) 140°C, 5.5V Precondition: P Temperature Cycle MIL-STD-883C MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: 168 Hrs Moisture , Pass @ 2,000V Latchup Sensitivity In accordance with JEDEC 17. Cypress Spec. 01-00081 168 Hrs ... Original
datasheet

6 pages,
39.31 Kb

plcc-16 pin generic failure rate EME-6300H CY7B8392-PC CY7B8392 140C CY7B8392 abstract
datasheet frame
Abstract: : Marketing Part #: PALCE22V10/PALC22V10D PALCE22V10/PALC22V10D Package: 24-pin, 300-mil Plastic DIP 28-Pin Plastic Leaded , , Type, or Name: 24-pin, 300-mil Plastic DIP (PDIP) 28-pin Plastic Leaded Chip Carrier (PLCC) Mold , High Accelerated Saturation Test (HAST) 140°C, 85%RH, 5.5V Precondition: 48-Hrs PCT, 3 Cys Solder , Temperature Cycle (PLCC) MIL-STD-883C MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: 48 Hrs PCT, 3 Cys Solder Reflow P Pressure Cooker Test No bias, 121°C, 100%RH, 30 PSIA Precondition ... Original
datasheet

9 pages,
59 Kb

PALCE22V10-PC EME-6300H reliability test data 7C322 7C322d FLASH24 PALCE22V10/PALC22V10D FLASH24 abstract
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Abstract: : Flammability: Moisture Sensitivity (JEDEC J-STD20A J-STD20A) Date Code Range: DS1685 DS1685 D8N-1P2M,LLVt,ND cap LOCOS , 175 ... DS1685 DS1685 ATEC 24 PDIP 600 Sumitomo 6300H 6300H Stamped Alloy 42 SnPb Dip 84-1 LMISR4 Epoxy , : Flammability: Moisture Sensitivity (JEDEC J-STD20A J-STD20A) Date Code Range: DS1685 DS1685 ATK (Amkor, K) 24 TSSOP , : Theta JC: Flammability: Moisture Sensitivity (JEDEC J-STD20A J-STD20A) FA# DS1685 DS1685 ATP (Amkor, PI) 24 , : Die Attach: Bond Wire / Size: Theta JA: Theta JC: Flammability: Moisture Sensitivity (JEDEC ... Original
datasheet

7 pages,
20.42 Kb

J-STD-20A copper bond wire amkor copper bond wire ablebond LMISR4 J-STD20A DS1685 DS1685 abstract
datasheet frame
Abstract: , Composition / Thickness: Hot Solder Dip, 63%Sn, 37%Pb Die Backside Preparation Method/Metallization , ) P Latent Failure Rate MIL-STD-883C MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition , Saturation Test (HAST) 140 C, 5.5V,85%RH (QTP 98064) Precondition: JESD22 JESD22 Moisture Sensitivity Level 3 , , Method 1010, Condition C, -65 C to 150 C (98064) Precondition: JESD22 JESD22 Moisture Sensitivity Level 3 p , ) Precondition: JESD22 JESD22 Moisture Sensitivity Level 1 (168 Hrs, 85 C/85%RH+3IR-Reflow, 220 C+5, 0 C) P ... Original
datasheet

11 pages,
30.05 Kb

precondition DIP JEDEC CY7C199 CY7C197 QMI2419 R42HDHA CY7C194/195 CY7C198/199 R42HDHA abstract
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Abstract: , 300-mil Plastic DIP (7C185 7C185) Die to Package edge clearance: 60 mils per side Mold Compound Name , Omedata, Indonesia High Accelerated Saturation Test (HAST, 5.5V, 140°C, 85%RH) Precondition 40 , 0/90 Temperature Cycle Family data3 (JEDEC22 JEDEC22, Condition B -40°C to 125°C) Precondition 48 hours , Cycle Family data4 (Condition C -65°C to 150°C) Precondition 48 hours Pressure Cooker Test (PCT, No , ) Precondition 40 Temperature Cycles Conditon C (-65°C to 150°C) Device Fab Lot# Assy Lot # 168 Hours ... Original
datasheet

12 pages,
104.67 Kb

m34004 d282c CY7C185-PC CY7C185 contact spiking mos datasheet abstract
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Abstract: Solder Dip (63/37) Die Attach Method: Ag Glass Die Attach Material: QMI 2419MG 2419MG Wire Bond , (HAST) 140°C, 85%RH, 5.5V Precondition: JESD22 JESD22 Moisture Sensitivity Level 3 192 Hrs, 30°C/60%RH + , Precondition: JESD22 JESD22 Moisture Sensitivity Level 3 192 Hrs, 30°C/60%RH + 3cys Solder Reflow P , accordance with JEDEC 17. Cypress Spec. 01-00081 12V Input Capacitance Cypress Spec 01-00123 P 2 , -STRESS: TC COND. C, -65 TO 150C, PRECONDITION DRY-BAKE CY7C374I-JC CY7C374I-JC KOREA-A 2611212 349604951 ... Original
datasheet

8 pages,
34.75 Kb

reliability test data nittomp8000 nitto 201 KC700 JESD22 CY7C374I-JC cy7c373 CY7C372I/373I CY7C372I/373I abstract
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Abstract: methods Soldering method Advantages · Highly suited for mass production Full dip method , affect mounting. (6) Full solder dip (wave soldering method) When using the full solder dip method for , SZ0 1 - solder dip, no control required for moisture absorption SY0 1 - solder dip, within 1 year S28 1 - solder dip, within 28 days S14 1 - solder dip, within 14 days S08 1 - solder dip, within 8 days S04 1 - solder dip, within 4 days S02 1 - solder dip, within 2 days ... Original
datasheet

24 pages,
184.39 Kb

ultrasonic full bridge cleaning CS36 FBGA-304 FD-FBGA-60 J-STD-020A precondition DIP JEDEC tsop-48 flash CSOP-48 BGA672 DB81-10004-2E DB81-10004-2E abstract
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Abstract: Window-Cerdip Alloy 42 Lead Finish, composition: Solder Dip (63%SN/37 SN/37%Pb) Die Attach Method: Paste , Saturation Test (HAST) 140°C, 85%RH, 5.5V Precondition: JESD22 JESD22 Moisture Sensitivity Level 1 168 Hrs , Precondition: JESD22 JESD22 Moisture Sensitivity Level 1 168 Hrs, 85°C/85%RH P Internal Water Vapor , accordance with JEDEC 17. Cypress Spec. 01-00081 2,200V 750V 12.0V Cypress Semiconductor 256K ... Original
datasheet

6 pages,
32.43 Kb

precondition DIP JEDEC EME-6300H cypress mil-std-883 prom CY27C128 CY27C256A CY27C256A abstract
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Abstract: Lead Finish, Composition / Thickness: Solder Dip, 63%Sn, 37%Pb Die Backside Preparation Method , MIL-STD-883C MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 JESD22 Moisture Sensitivity Level 1 P , , Condition B, -40°C to 125°C Precondition: JESD22 JESD22 Moisture Sensitivity Level 3 P (192 Hrs, 30C , , Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 JESD22 Moisture Sensitivity Level 3 P (192 , ,85%RH Precondition: JESD22 JESD22 Moisture Sensitivity Level 3 P (192 Hrs, 30C/60 30C/60%RH+3IR-Reflow ... Original
datasheet

11 pages,
30.35 Kb

reliability test data JESD22 CY7C960AASC cy7c960a precondition DIP JEDEC QMI2569 CY7C960A-ASC CY7C960A-UM L28EPD L28EPD abstract
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