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Part Manufacturer Description Datasheet BUY
EL2250CN Intersil Corporation 2 CHANNEL, VIDEO AMPLIFIER, PDIP8, PLASTIC, DIP-8 visit Intersil
EL4585CN Intersil Corporation 36MHz, VIDEO CLOCK GENERATOR, PDIP16, PLASTIC, DIP-16 visit Intersil
ICM7555IPA Intersil Corporation SQUARE, 1MHz, TIMER, PDIP8, PLASTIC, DIP-8 visit Intersil
ISL81487IP Intersil Corporation LINE TRANSCEIVER, PDIP8, PLASTIC, MS-001BA, DIP-8 visit Intersil
ISL8485EIP Intersil Corporation LINE TRANSCEIVER, PDIP8, PLASTIC, MS-001BA, DIP-8 visit Intersil
EL2045CN Intersil Corporation VIDEO AMPLIFIER, PDIP8, PLASTIC, DIP-8 visit Intersil

precondition DIP JEDEC

Catalog Datasheet MFG & Type PDF Document Tags

precondition DIP JEDEC

Abstract: MIL-STD-883 Method 3015.7 -Lead Plastic Leaded Chip Carrier (PLCC) Other packages qualified by similarity: 28 Lead Plastic DIP (PDIP , Precondition: 48-Hrs PCT, 3 Cys Solder Reflow P Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: 48 Hrs. PCT, 3 Cys Solder Reflow P Pressure Cooker Test No bias, 121°C, 100%RH, 30 PSIA Precondition: 40 Temperature cycles, Condition C P , accordance with JEDEC 17. Cypress Spec. 01-00081 P Current Density Cypress Spec 22-00029 P
Cypress Semiconductor
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CY7C433 precondition DIP JEDEC MIL-STD-883 Method 3015.7 EME-6300H CY7C428/9 CY7C432/3 7C433C 3/R28 7C433DB-AJC

M02142

Abstract: CSOP-48 Soldering method Advantages · Highly suited for mass production Full dip method Disadvantages · , . (6) Full solder dip (wave soldering method) When using the full solder dip method for mounting , 1 × solder dip, no control required for moisture absorption SY0 1 × solder dip, within 1 year S28 1 × solder dip, within 28 days S14 1 × solder dip, within 14 days S08 1 × solder dip, within 8 days S04 1 × solder dip, within 4 days S02 1 × solder dip, within 2 days
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M02142 CSOP-48 BGA672 S02-1 FBGA-304 FD-FBGA-60 DB81-10004-2E

7C322d

Abstract: reliability test data : Marketing Part #: PALCE22V10/PALC22V10D Package: 24-pin, 300-mil Plastic DIP 28-Pin Plastic Leaded , , Type, or Name: 24-pin, 300-mil Plastic DIP (PDIP) 28-pin Plastic Leaded Chip Carrier (PLCC) Mold , High Accelerated Saturation Test (HAST) 140°C, 85%RH, 5.5V Precondition: 48-Hrs PCT, 3 Cys Solder , Temperature Cycle (PLCC) MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: 48 Hrs PCT, 3 Cys Solder Reflow P Pressure Cooker Test No bias, 121°C, 100%RH, 30 PSIA Precondition
Cypress Semiconductor
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PALCE22V10-PC 7C322d reliability test data 7C322 FLASH24 7C322D FLASH24D 34952062B PALC22V10D-JC

140C

Abstract: CY7B8392 : CY7B8392 Package: 28-pin Plastic Leaded Chip Carrier (PLCC) 16-pin, 300-mil Plastic DIP (PDIP , Chip Carrier (PLCC) 16-pin, 300-mil Plastic DIP (PDIP) Mold Compound Name/Manufacturer: Lead Frame , = 9.0V, 150°C P High Accelerated Saturation Test (HAST) 140°C, 5.5V Precondition: P Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: 168 Hrs Moisture , Pass @ 2,000V Latchup Sensitivity In accordance with JEDEC 17. Cypress Spec. 01-00081 168 Hrs
Cypress Semiconductor
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CY7B8392-PC 140C generic failure rate plcc-16 pin 7B9392 85C/85 CY7B8392-JC

CY7C185-PC

Abstract: d282c -pin, 300-mil Plastic DIP (7C185) Die to Package edge clearance: 60 mils per side Mold Compound , Omedata, Indonesia High Accelerated Saturation Test (HAST, 5.5V, 140°C, 85%RH) Precondition 40 , 0/90 Temperature Cycle Family data3 (JEDEC22, Condition B -40°C to 125°C) Precondition 48 hours , Cycle Family data4 (Condition C -65°C to 150°C) Precondition 48 hours Pressure Cooker Test (PCT, No , ) Precondition 40 Temperature Cycles Conditon C (-65°C to 150°C) Device Fab Lot# Assy Lot # 168 Hours
Cypress Semiconductor
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CY7C185 CY7C185-PC d282c contact spiking mos m34004 CY7C161/A CY7C162/A CY7C164/A CY7C166/A CY7C185/A CY7C187/A

LMISR4

Abstract: J-STD20A : Flammability: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1685 D8N-1P2M,LLVt,ND cap LOCOS , 175 Å DS1685 ATEC 24 PDIP 600 Sumitomo 6300H Stamped Alloy 42 SnPb Dip 84-1 LMISR4 Epoxy , : Flammability: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1685 ATK (Amkor, K) 24 TSSOP , : Theta JC: Flammability: Moisture Sensitivity (JEDEC J-STD20A) FA# DS1685 ATP (Amkor, PI) 24 , : Die Attach: Bond Wire / Size: Theta JA: Theta JC: Flammability: Moisture Sensitivity (JEDEC
Dallas Semiconductor
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LMISR4 J-STD-20A copper bond wire amkor ti 9841 copper bond wire ablebond MIL-STD-883-2012 MIL-STD-883-2016 MIL-STD-883-2015 MIL-STD-883-2004

CY7C374I-JC

Abstract: KC700 Solder Dip (63/37) Die Attach Method: Ag Glass Die Attach Material: QMI 2419MG Wire Bond , %RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30°C/60%RH + 3cys Solder Reflow P Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture , ) Cypress Spec. 25-00020 P 500V Latchup Sensitivity In accordance with JEDEC 17. Cypress Spec , -STRESS: TC COND. C, -65 TO 150C, PRECONDITION DRY-BAKE CY7C374I-JC KOREA-A 2611212 349604951
Cypress Semiconductor
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KC700 nittomp8000 cy7c373 nitto 201 CY7C372I/373I PLCC/44 7C372D/373D 7C372I/373I FLASH24/28 CY7C374I-YM

QMI2419

Abstract: precondition DIP JEDEC , Composition / Thickness: Hot Solder Dip, 63%Sn, 37%Pb Die Backside Preparation Method/Metallization , ) P Latent Failure Rate MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition , Saturation Test (HAST) 140 C, 5.5V,85%RH (QTP 98064) Precondition: JESD22 Moisture Sensitivity Level 3 , -883C, Method 1010, Condition C, -65 C to 150 C (98064) Precondition: JESD22 Moisture Sensitivity Level 3 p , ) Precondition: JESD22 Moisture Sensitivity Level 1 (168 Hrs, 85 C/85%RH+3IR-Reflow, 220 C+5, 0 C) P
Cypress Semiconductor
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CY7C197 CY7C199 QMI2419 R42HDHA CY7C194/195 CY7C198/199 7C1599G
Abstract: Max Above 220°C 120sec Max â'¢ Dip Soldering Pre-heat 100°C Max Pre-heat Time 60sec , , Shaded areas: Footprint * The product is designed to be dip soldered and reflow soldered to a PCB. * Reflow soldering must not be performed more than twice. Dip soldering and manual soldering must only be , JEITA ED-4701 Tsld=260°C, 10sec, 1dip, 300 301 Precondition: 30°C, 70%RH, 168hr JEITA ED-4701 Tsld=260°C, 10sec, 2reflows, 300 301 Precondition: 30°C, 70%RH, 168hr Solderability JEITA Nichia
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STS-DA1-1783A
Abstract: °C 120sec Max â'¢ Dip Soldering Pre-heat 100°C Max Pre-heat Time 60sec Max Solder Bath , * The product is designed to be dip soldered and reflow soldered to a PCB. * Reflow soldering must not be performed more than twice. Dip soldering and manual soldering must only be done once. * Care , Precondition: 30°C, 70%RH, 168hr JEITA ED-4701 Tsld=260°C, 10sec, 2reflows, 300 301 Precondition: 30°C, 70%RH, 168hr Solderability JEITA ED-4701 Tsld=245±5°C, 5sec, (Dip/Reflow -
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STS-DA1-1541A N3801
Abstract: Max Above 220°C 120sec Max â'¢ Dip Soldering Pre-heat 100°C Max Pre-heat Time 60sec , opening , Shaded areas: Footprint * The product is designed to be dip soldered and reflow soldered to a PCB. * Reflow soldering must not be performed more than twice. Dip soldering and manual soldering , JEITA ED-4701 Tsld=260°C, 10sec, 1dip, 300 301 Precondition: 30°C, 70%RH, 168hr JEITA ED-4701 Tsld=260°C, 10sec, 2reflows, 300 301 Precondition: 30°C, 70%RH, 168hr Solderability JEITA Nichia
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STS-DA1-1529A NESB017T

CY27C128

Abstract: EME-6300H -mil Window-Cerdip Alloy 42 Lead Finish, composition: Solder Dip (63%SN/37%Pb) Die Attach Method: Paste , Accelerated Saturation Test (HAST) 140°C, 85%RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level 1 , °C Precondition: JESD22 Moisture Sensitivity Level 1 168 Hrs, 85°C/85%RH P Internal Water Vapor Mil-STD , accordance with JEDEC 17. Cypress Spec. 01-00081 2,200V 750V 12.0V Cypress Semiconductor 256K
Cypress Semiconductor
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CY27C128 cypress mil-std-883 prom CY27C256A 256K/128K CY27C256A/CY27C128 7C274E 256K/128
Abstract: Max Above 220°C 120sec Max â'¢ Dip Soldering Pre-heat 100°C Max Pre-heat Time 60sec , , Shaded areas: Footprint * The product is designed to be dip soldered and reflow soldered to a PCB. * Reflow soldering must not be performed more than twice. Dip soldering and manual soldering must only be , -4701 Tsld=260°C, 10sec, 1dip, 300 301 Precondition: 30°C, 70%RH, 168hr JEITA ED-4701 Tsld=260°C, 10sec, 2reflows, 300 301 Precondition: 30°C, 70%RH, 168hr Solderability JEITA ED -
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STS-DA1-1547A

NHSG017HT

Abstract: Max Above 220°C 120sec Max â'¢ Dip Soldering Pre-heat 100°C Max Pre-heat Time 60sec , opening , Shaded areas: Footprint * The product is designed to be dip soldered and reflow soldered to a PCB. * Reflow soldering must not be performed more than twice. Dip soldering and manual soldering , Precondition: 30°C, 70%RH, 168hr JEITA ED-4701 Tsld=260°C, 10sec, 2reflows, 300 301 Precondition: 30°C, 70%RH, 168hr Solderability JEITA ED-4701 Tsld=245±5°C, 5sec, (Dip/Reflow
Nichia
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NHSG017HT STS-DA1-1527A
Abstract: 220°C 120sec Max â'¢ Dip Soldering Pre-heat 100°C Max Pre-heat Time 60sec Max Solder , : Footprint * The product is designed to be dip soldered and reflow soldered to a PCB. * Reflow soldering must not be performed more than twice. Dip soldering and manual soldering must only be done once , Precondition: 30°C, 70%RH, 168hr JEITA ED-4701 Tsld=260°C, 10sec, 2reflows, 300 301 Precondition: 30°C, 70%RH, 168hr Solderability JEITA ED-4701 Tsld=245±5°C, 5sec, (Dip/Reflow -
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STS-DA1-1545A NHSB046AT
Abstract: Max Pre-heat 180 to 200°C 60sec Max Above 220°C 120sec Max â'¢ Recommended Dip Soldering , . Dip soldering/hand soldering must not be performed more than once. * Avoid rapid cooling. Ramp down , Duration JEITA ED-4701 Tsld=260°C, 10sec, 1dip, 300 301 Precondition: 30°C, 70%RH, 168hr JEITA ED-4701 Tsld=260°C, 10sec, 2reflows, 300 301 Precondition: 30°C, 70%RH, 168hr Solderability JEITA ED-4701 Tsld=245±5°C, 5sec, (Dip/Reflow Soldering) 303 303A Lead-free Nichia
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STS-DA1-2305
Abstract: °C 120sec Max â'¢ Recommended Dip Soldering Condition Pre-heat 100°C Max Pre-heat Time 60sec , . * Reflow soldering must not be performed more than twice. Dip soldering/hand soldering must not be , Precondition: 30°C, 70%RH, 168hr JEITA ED-4701 Tsld=260°C, 10sec, 2reflows, 300 301 Precondition: 30°C, 70%RH, 168hr Solderability JEITA ED-4701 Tsld=245±5°C, 5sec, (Dip/Reflow , -4701 Thermal Shock 0/22 1000hours #2 0/100 TA=-40°C, IF=5mA (Dip Soldering) #1 TA Nichia
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STS-DA1-2043

CY7C960A-UM

Abstract: CY7C960A-ASC Lead Finish, Composition / Thickness: Solder Dip, 63%Sn, 37%Pb Die Backside Preparation Method , MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level 1 , , Condition B, -40°C to 125°C Precondition: JESD22 Moisture Sensitivity Level 3 P (192 Hrs, 30C/60 , 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level 3 P (192 Hrs , %RH Precondition: JESD22 Moisture Sensitivity Level 3 P (192 Hrs, 30C/60%RH+3IR-Reflow, 220°C+5, 0°C) (24
Cypress Semiconductor
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CY7C960A-UM CY7C960A-ASC QMI2569 cy7c960a CY7C960AASC L28EPD CY7C960A/CY7C961A CY7C960-UMB CY7C961-NC 85C/60
Abstract: °C 120sec Max â'¢ Recommended Dip Soldering Condition Pre-heat 100°C Max Pre-heat Time 60sec , . * Reflow soldering must not be performed more than twice. Dip soldering/hand soldering must not be , JEITA ED-4701 Tsld=260°C, 10sec, 1dip, 300 301 Precondition: 30°C, 70%RH, 168hr JEITA ED-4701 Tsld=260°C, 10sec, 2reflows, 300 301 Precondition: 30°C, 70%RH, 168hr Solderability JEITA ED-4701 Tsld=245±5°C, 5sec, (Dip/Reflow Soldering) 303 303A Lead-free Solder(Sn Nichia
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STS-DA1-1535B
Abstract: 220°C 120sec Max â'¢ Recommended Dip Soldering Condition Pre-heat 100°C Max Pre-heat Time , to a PCB. * Reflow soldering must not be performed more than twice. Dip soldering/hand soldering , Precondition: 30°C, 70%RH, 168hr JEITA ED-4701 Tsld=260°C, 10sec, 2reflows, 300 301 Precondition: 30°C, 70%RH, 168hr Solderability JEITA ED-4701 Tsld=245±5°C, 5sec, (Dip/Reflow , =-40°C, IF=10mA Resistance to #1 TA=85°C, IF=7.2mA (Dip Soldering) 10sec transfer, 300 307 Nichia
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STS-DA1-1998 NESB505CT
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