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pllmc

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Abstract: PLL MC SOT385-1 PLLMC; bulk pack; 12NC ending 122 Rev. 1 — 7 September 2011 Packing information 1. Packing method Padding material (2x) Sealed bag (5x) Label Printed plano-box Strap Preprinted ESD warning Space for additional label Barcode label aaa-000706 Fig 1. Bulk pack for PLLMC SOT385-1 NXP Semiconductors PLLMC; bulk pack; 12NC ending 122 Table 1 , SOT385-1 NXP Semiconductors PLLMC; bulk pack; 12NC ending 122 Table 2. Bag dimensions L ... NXP Semiconductors
Original
datasheet

3 pages,
238.62 Kb

TEXT
datasheet frame
Abstract: PDF: 2003 Oct 08 Philips Semiconductors Package outline PLLMC: plastic leadless module carrier package SOT385-1 A1 D A2 A E1 E A D1 A3 A Cross section A-A (not to scale) 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 A2 A3 D (1) D1(1) E (1) E1(1) mm 3.05 2.90 1.2 1.1 0.165 2.1 1.9 12.1 11.9 5.1 4.9 6.1 5.9 4.6 4.4 46 44o o Note 1. Plastic ... Philips Semiconductors
Original
datasheet

1 pages,
8.49 Kb

SOT385-1 package outline pllmc TEXT
datasheet frame
Abstract: kB EEPROM, 7-byte UID MF1SPLUS8001DA4/03 MF1SPLUS8001DA4/03 PLLMC plastic leadless module carrier package; 35 , ) see Ref. 3, 4 kB EEPROM, 4-byte UID MF1SPLUS8011DA4/03 MF1SPLUS8011DA4/03 PLLMC plastic leadless module carrier , /03 PLLMC plastic leadless module carrier package; 35 mm wide tape, SOT500-2 4 kB EEPROM, 4 , ) see Ref. 3, 2 kB EEPROM, 7-byte UID MF1SPLUS6001DA4/03 MF1SPLUS6001DA4/03 PLLMC plastic leadless module carrier , format) see Ref. 3, 2 kB EEPROM, 4-byte UID MF1SPLUS6011DA4/03 MF1SPLUS6011DA4/03 PLLMC plastic leadless module ... NXP Semiconductors
Original
datasheet

17 pages,
121.91 Kb

SECSII Mifare plus Mifare plus security level sot500-2 write perso mifare plus ISO 14443-4 Mifare PLUS X ISO 14443-4 Mifare Plus Mifare Plus X 4K UID 7 Byte 14443-4 14443-4 command Mifare plus protocol mifare classic 1k "M1PLUSx0y1" Mifare PLUS X command reference mifare plus functional specification Mifare plus commands TEXT
datasheet frame
Abstract: Package outline PLLMC: plastic leadless module carrier package; 35 mm wide tape SOT500-2 X D A detail X 0 10 scale DIMENSIONS (mm are the original dimensions) UNIT A (1) max. D mm 0.33 35.05 34.95 20 mm For unspecified dimensions see PLLMC-drawing given in the subpackage code. Note 1. Total package thickness, exclusive punching burr. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT500-2 - - - www.nxp.com © 2008 NXP ... NXP Semiconductors
Original
datasheet

1 pages,
285.43 Kb

SOT500-2 package outline TEXT
datasheet frame
Abstract: PDF: 2004 Jan 30 Philips Semiconductors Package outline PLLMC 35 mm; plastic leadless module carrier package; 35 mm wide tape SOT500-2 X D A detail X 0 10 20 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A (1) max. D 0.33 35.05 34.95 For unspecified dimensions see PLLMC-drawing given in the subpackage code. Note 1. Total package thickness, exclusive punching burr. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT500-2 - - ... Philips Semiconductors
Original
datasheet

1 pages,
37.97 Kb

SOT500 sot500-2 pllmc SOT500-2 package outline TEXT
datasheet frame
Abstract: PDF: 2003 Mar 17 Philips Semiconductors Package outline PLLMC: plastic leadless module carrier SOT385-1 A1 D A2 A E1 E A D1 A3 A Cross section A-A (not to scale) 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 A2 A3 D (1) D1(1) E (1) E1(1) mm 3.05 2.90 1.2 1.1 0.165 2.1 1.9 12.1 11.9 5.1 4.9 6.1 5.9 4.6 4.4 46 44o o Note 1. Plastic ... Original
datasheet

1 pages,
8.47 Kb

pllmc SOT385-1 package outline TEXT
datasheet frame
Abstract: kB EEPROM, 7-byte UID, L1 card - MF1PLUS8001DA4/03 MF1PLUS8001DA4/03 MOA4 PLLMC plastic leadless module , , L1 card - MF1PLUS8011DA4/03 MF1PLUS8011DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape, 4 kB EEPROM, 4-byte UID, L1 card SOT500-2 MF1PLUS8021DA4/03 MF1PLUS8021DA4/03 MOA4 PLLMC , Ref. 3, 2 kB EEPROM, 7-byte UID, L1 card - MF1PLUS6001DA4/03 MF1PLUS6001DA4/03 MOA4 PLLMC plastic , to ISO/IEC 14443-3, L1 card - MF1PLUS6011DA4/03 MF1PLUS6011DA4/03 MOA4 PLLMC plastic leadless module ... NXP Semiconductors
Original
datasheet

20 pages,
135.8 Kb

MOA4 Package Car security system block diagram Mifare plus security level 3 ISO 14443-4 Mf1plus Mifare plus security level mifare plus personalization ISO 14443-4 Mifare Plus MOA4 package specification Mifare plus protocol write perso mifare plus Mifare PLUS X commands mifare classic 1k Mifare PLUS X Mifare PLUS X command reference mifare classic 1k card 14443-4 command mifare plus functional specification Mifare plus commands TEXT
datasheet frame
Abstract: Package outline PLLMC: plastic leadless module carrier package; 35 mm wide tape SOT500-3 X D A detail X 0 10 scale DIMENSIONS (mm are the original dimensions) UNIT A (1) max. D mm 0.25 35.05 34.95 20 mm For unspecified dimensions see PLLMC-drawing given in the subpackage code. Note 1. Total package thickness, exclusive punching burr. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT500-3 - - - www.nxp.com © 2008 NXP ... NXP Semiconductors
Original
datasheet

1 pages,
285.13 Kb

TEXT
datasheet frame
Abstract: HITAG1 HT1DC20S30 HT1DC20S30 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME HT1DC20S30 HT1DC20S30 PLLMC DESCRIPTION VERSION , OUTLINE PLLMC: plastic leadless module carrier SOT385-1 A1 D A2 A E1 E A ... Philips Semiconductors
Original
datasheet

8 pages,
52.84 Kb

hitag 1 HT1DC20S30 HTRM800 transponder philips Transponders transponders philips HT1ICS30 hitag application note HT1 Transponder Family HITAG PROTOCOL HITAG 2 PROTOCOL TEXT
datasheet frame
Abstract: Package outline PLLMC: plastic leadless module carrier package; 35 mm wide tape SOT500-4 X D A 0 10 A(1) D max 0.26 35.05 nom 35.00 min 34.95 mm detail X scale Dimensions Unit 20 mm For unspecified dimensions see PLLMC-drawing given in the subpackage code. Note 1. Total package thickness, exclusive punching burr. sot500-4_po References Outline version IEC JEDEC JEITA SOT500-4 - - - www.nxp.com © 2010 NXP B.V ... NXP Semiconductors
Original
datasheet

1 pages,
326.39 Kb

SOT500-4 TEXT
datasheet frame

Archived Files

Abstract Saved from Date Saved File Size Type Download
SOT500-2   PLLMC  plastic leadless module carrier package; 35 mm wide tape  - (EIAJ) - (JEDEC )   Thermal enhanced (1)   Other (6)   PLLMC (1
/datasheets/files/philips/packages/plastic/surfacemount/bottom/zzz_other/pllmc.html
Philips 16/06/2005 8.07 Kb HTML pllmc.html
Packages SOT385-1 ; plastic leadless module carrier SOT385-1 PLLMC plastic leadless module carrier 01-06-27 heatspreader Cu 130 mg
/datasheets/files/philips/packages/sot385-1-v2.html
Philips 05/02/2002 20.2 Kb HTML sot385-1-v2.html
Package Information Page Package information To find a package you can browse the package tree.   Ceramic (98)   Glass (47)   Metal (2)   Plastic (608)   Flange mount (22)   Heatsink mount (16)   Surface mount (477)   Array (158)   Bottom (12)   Thermal enhanced (1)   Other (6)   PLLMC (1)  
/datasheets/files/philips/packages/plastic/surfacemount/bottom/zzz_other/xson.html
Philips 16/06/2005 8.46 Kb HTML xson.html
Packages Information on package SOT500-2 plastic leadless module carrier package; 35 mm wide tape   Outline drawing Package version Package name Package description Drawing issue date SOT500-2 PLLMC plastic leadless module carrier package; 35 mm wide tape 9/17/2003 General package information Soldering Information Thermal considerations
/datasheets/files/philips/packages/sot500-2-v1.html
Philips 17/06/2005 1.88 Kb HTML sot500-2-v1.html
Packages Information on package SOT385-1 plastic leadless module carrier Outline drawing Package version Package name Package description Drawing issue date SOT385-1 PLLMC plastic leadless module carrier 01-06-27 Chemical content Part Material Weight (mg) heatspreader Cu 130 mg leadframe epoxy, glass fibre filled 5 mg active device Si 20 mg plastic
/datasheets/files/philips/packages/sot385-1.html
Philips 15/04/2003 3.12 Kb HTML sot385-1.html
Packages Information on package SOT500-2 plastic leadless module carrier package; 35 mm wide tape   Outline drawing Package version Package name Package description Drawing issue date SOT500-2 PLLMC plastic leadless module carrier package; 35 mm wide tape 9/17/2003 Chemical content Part Material Weight (mg) leadframe CuSn 30 mg active device Si 12 mg plastic
/datasheets/files/philips/packages/sot500-2.html
Philips 16/06/2005 2.9 Kb HTML sot500-2.html
Package Information Page Package information To find a package you can browse the package tree.   Ceramic (98)   Glass (47)   Metal (2)   Plastic (608)   Flange mount (22)   Heatsink mount (16)   Surface mount (477)   Array (158)   Bottom (12)   Thermal enhanced (1)   Other (6)   PLLMC (1)  
/datasheets/files/philips/packages/plastic/surfacemount/bottom/zzz_other/zzz_other.html
Philips 16/06/2005 7.74 Kb HTML zzz_other.html
Package Information Page Package information To find a package you can browse the package tree.   Ceramic (98)   Glass (47)   Metal (2)   Plastic (608)   Flange mount (22)   Heatsink mount (16)   Surface mount (477)   Array (158)   Bottom (12)   Thermal enhanced (1)   Other (6)   PLLMC (1)  
/datasheets/files/philips/packages/plastic/surfacemount/bottom.html
Philips 16/06/2005 7.36 Kb HTML bottom.html
Packages Information on package SOT385-1 plastic leadless module carrier   Outline drawing Package version Package name Package description Drawing issue date SOT385-1 PLLMC plastic leadless module carrier 3/12/2003 General package information Soldering Information Thermal considerations
/datasheets/files/philips/packages/sot385-1-v1.html
Philips 17/06/2005 1.83 Kb HTML sot385-1-v1.html
Packages Information on package SOT385-1 plastic leadless module carrier   Outline drawing Package version Package name Package description Drawing issue date SOT385-1 PLLMC plastic leadless module carrier 3/12/2003 Chemical content Part Material Weight (mg) heatspreader Cu 130 mg leadframe epoxy, glass fibre filled 5 mg active device Si 20 mg plastic
/datasheets/files/philips/packages/sot385-1-v3.html
Philips 16/06/2005 3.24 Kb HTML sot385-1-v3.html