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Part Manufacturer Description Datasheet BUY
ISL54209IRTZ Intersil Corporation MP3/USB 2.0 High Speed Switch with Negative Signal Handling and Low Power Shutdown; DFN10, uTQFN10; Temp Range: -40° to 85°C visit Intersil Buy
ISL54213IRTZ-T Intersil Corporation MP3/USB 2.0 High Speed Switch with Negative Signal Handling and Mute Function; DFN10, uTQFN10; Temp Range: -40° to 85°C visit Intersil Buy
ISL54209IRU1Z-T Intersil Corporation MP3/USB 2.0 High Speed Switch with Negative Signal Handling and Low Power Shutdown; DFN10, uTQFN10; Temp Range: -40° to 85°C visit Intersil Buy
ISL54209IRUZ-T Intersil Corporation MP3/USB 2.0 High Speed Switch with Negative Signal Handling and Low Power Shutdown; DFN10, uTQFN10; Temp Range: -40° to 85°C visit Intersil Buy
ISL54213IRTZ Intersil Corporation MP3/USB 2.0 High Speed Switch with Negative Signal Handling and Mute Function; DFN10, uTQFN10; Temp Range: -40° to 85°C visit Intersil Buy
ISL54209IRTZ-T Intersil Corporation MP3/USB 2.0 High Speed Switch with Negative Signal Handling and Low Power Shutdown; DFN10, uTQFN10; Temp Range: -40° to 85°C visit Intersil Buy
ISL54210IRTZ Intersil Corporation MP3/USB 2.0 High Speed Switch with Negative Signal Handling/Click and Pop Suppression; DFN10, uTQFN10; Temp Range: -40° to 85°C visit Intersil Buy
ISL54211IRTZ Intersil Corporation MP3/USB 2.0 High Speed Switch with Negative Signal Handling/Click and Pop Suppression; DFN10, uTQFN10; Temp Range: -40° to 85°C visit Intersil Buy
ISL54211IRTZ-T Intersil Corporation MP3/USB 2.0 High Speed Switch with Negative Signal Handling/Click and Pop Suppression; DFN10, uTQFN10; Temp Range: -40° to 85°C visit Intersil Buy
ISL54210IRTZ-T Intersil Corporation MP3/USB 2.0 High Speed Switch with Negative Signal Handling/Click and Pop Suppression; DFN10, uTQFN10; Temp Range: -40° to 85°C visit Intersil Buy
ISL54213IRUZ-T Intersil Corporation MP3/USB 2.0 High Speed Switch with Negative Signal Handling and Mute Function; DFN10, uTQFN10; Temp Range: -40° to 85°C visit Intersil Buy
ISL54209IRUZ-T7A Intersil Corporation MP3/USB 2.0 High Speed Switch with Negative Signal Handling and Low Power Shutdown; DFN10, uTQFN10; Temp Range: -40° to 85°C visit Intersil Buy

moisture handling and packaging

Catalog Datasheet MFG & Type PDF Document Tags

822 smd

Abstract: MIL-STD-81705 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs The effect of moisture in PSMC packages and , Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs Figure 8-15. Bag Packing for Tape and Reel , Databook 8-15 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs and temperature , Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter , Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs Figure 8-2. Package Crack Mechanism
Intel
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SMD codes databook

Abstract: SMD CODE databook Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs Figure 8-15. Bag Packing for Tape and Reel , Databook 8-15 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs and temperature , Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter , 8-1 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs The effect of moisture in PSMC , , temperature, time and plastic moisture equilibrium solubility. 241187-1 8-2 A5736-01 1999 Packaging
Intel
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SMD codes databook SMD CODE databook 822 smd EQUIVALENCE datasheet for all smd components moisture sensitive handling and packaging MIL-B-81705 cap

intel packaging handbook 240800

Abstract: Ultrasonic cleaner circuit diagram 2 8 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 1/22/97 10:19 AM , publication date) MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS 2 reflow environment , ) MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS 2 leads of insertion mount packages. The , 8.2.3. MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS Thermal Shock on Components , ) MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS 8.3. 2 ULTRASONIC CLEANING OF I.C
Intel
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intel packaging handbook 240800 Ultrasonic cleaner circuit diagram MIL-B-81705 intel 815 reflow profile INTEL PLCC 68 dimensions tape LEAD FRAME SURFACE MOUNT CH08WIP
Abstract: Shipment, Storage, Packaging and Handling Guidelines Purpose The purpose of this application note , , packaging, handling, and shipment methods that afford suitable ESD protection for its many products. Unit , datasheets found on our website. Ecliptek has engineered storage, packaging, handling, and shipment methods , protected packaging and should be handled as moisture sensitive devices at the customerâ'™s facility and , packaging for use with root cause and corrective action activity. Storage and Handling Guidelines All Ecliptek
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TEN12-001-002

G004

Abstract: ipc-sm-786A and for controlling moisture content via dry-packing and handling procedures. The Challenge While , Package Cracking IPC-SM-786A Procedures for Characterizing and Handling of Moisture/Reflow Sensitive ICs , supplier and the SMT manufacturer. When handling moisture sensitive components, users at SMT assembly , cost of properly handling MBB dry packs and closely monitoring moisture exposure levels. The other , IPC-SM-786A Procedures for Characterizing and Handling of Moisture/Reflow Sensitive ICs IPC
Pulse Engineering
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G004 MIL-STD-81075 MIL-D-3464 IPC-4202 JESD22-A113 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE

Ultrasonic humidifier circuit

Abstract: ultrasonic humidifier strength and resistance to vibration and moisture. Common ways of packaging include wrapping storage , is advantageous in that handling during automatic mounting is simple and packaging density is high , HANDLING SEMICONDUCTOR DEVICES VII. HANDLING SEMICONDUCTOR DEVICES 1. PACKAGING 1.1 STORAGE CASES 1.2 PACKAGING 1.3 RECYCLING MAGAZINES AND PALLETS 2. TRANSPORTATION 3. STORAGE 3.1 NORMAL , , shock and vibration, moisture, and gas that cause damage to them. Devices are likely to break if they
Mitsubishi
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Ultrasonic humidifier circuit ultrasonic humidifier humidifier circuit VII-13

On semiconductor date Code

Abstract: Date Code restriction handling methods to ensure you will not experience manufacturing issues with Lattice products. Moisture Content and Lead Finish Exposure to moisture in the packaging and storage environment can lead to , to packaging, and then vacuum seal units in a Moisture Barrier Bag (MBB) along with desiccant and a , package moisture content and lead finish, as these can lead to difficulties during the circuit board , factor. With proper storage conditions, material handling, and monitoring of material, all of these
Lattice Semiconductor
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On semiconductor date Code Date Code restriction shelf life JESD22-B102-C J-STD-033 J-STD-020-A 1-888-ISP-PLDS

Date Code restriction

Abstract: J-STD-033 handling methods to ensure you will not experience manufacturing issues with Lattice products. Moisture Content and Lead Finish Exposure to moisture in the packaging and storage environment can lead to , to packaging, and then vacuum seal units in a Moisture Barrier Bag (MBB) along with desiccant and a , moisture content and lead finish, as these can lead to difficulties during the circuit board manufacturing , . With proper storage conditions, material handling, and monitoring of material, all of these concerns
Lattice Semiconductor
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JESD22-B102 jstd for msl 3 PB1146 J-STD-020 1-800-LATTICE

IPC-SM-780

Abstract: IPC-SM-786 performs moisture sensitivity tests according to Procedures for Characterizing and Handling of Moisture , , Inc. Procedures for Characterizing and Handling of Moisture-/Reflow-Sensitive ICs (IPC-SM-786A). New , and Packaging Electronic Circuits, Inc. Recommended Procedures for Handling of Moisture-Sensitive , introduction of moisture, simulation of infrared and vapor-phase reflow, and temperature cycling. Altera cannot , sensitivity to moisture becomes an important issue as board assemblers switch to hotter and faster reflow
Altera
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IPC-SM-780 IPC-SM-786 RQFP OVEN IPC-SM-780 solder paste ANSI/IPC-SM-780 ANSI/IPC-SM-786 IPC-TM-650 JESD22-A112

IPC-SM-780

Abstract: IPC-SM-786 Interconnecting and Packaging Electronic Circuits, Inc. Procedures for Characterizing and Handling of Moisture , and analyzed physically with x-ray and acoustic microscopy to gauge their sensitivity to moisture. Altera performs moisture sensitivity tests according to Procedures for Characterizing and Handling of , controlled introduction of moisture, simulation of infrared and vapor-phase reflow, and temperature cycling , non-hermetic package can absorb moisture. Like popcorn, the moisture in some plastic packages can vaporize and
Altera
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BGA and QFP Altera Package mounting Solder paste floor life

IPC-SM-786A

Abstract: BGA and QFP Altera Package mounting profile Characterizing & Handling of Moisture-/Reflow-Sensitive ICs (IPC-SM-786A), the standard from the Institute for Interconnecting and Packaging Electronic Circuits, and Moisture/Reflow Sensitivity Classification for , Characterizing and Handling of Moisture-/Reflow-Sensitive ICs (IPC-SM-786A). New York: Institute for , non-hermetic package can absorb moisture. Like popcorn, the moisture in some plastic packages can vaporize and , , which have the most current and reliable information about a device's sensitivity to moisture. When
Altera
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BGA and QFP Altera Package mounting profile altera board J-STD-020A EIA/JEP113-A 800-EPLD

IPC-SM-780

Abstract: , Inc. Procedures for Characterizing and Handling of Moisture-/Reflow-Sensitive ICs (IPC-SM-786A). New , and Packaging Electronic Circuits, Inc. Recommended Procedures for Handling of Moisture-Sensitive , Altera devices to the controlled introduction of moisture, simulation of infrared and vapor-phase reflow , nonhermetic package can absorb moisture. Like popcorn, the moisture in some plastic packages can vaporize and , electrically and analyzed physically with x-ray and acoustic microscopy to gauge their sensitivity to moisture
Altera
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Circuit diagram of 25W soldering iron

Abstract: 300w 300 W or less 20w 20 W or less Packaging Specifications Moisture Resistant Packaging Moisture resistant packaging using an aluminum envelope is used to avoid moisture absorption , condition of moisture resistant packaging for 6 months or longer, or for which 48 hours or longer have elapsed since the moisture resistant packaging was opened, should be baked according to the following , soldering, let the product return to room temperature before handling. Packaging Specifications CIM
Citizen Electronics
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Circuit diagram of 25W soldering iron CPT18448 CPT23015 CPT184 CPT230

IPC-SM-786

Abstract: Soldering guidelines BGA DevicesJ- QFPBGA Institute for Interconnecting and Packaging Electronic Circuits, Inc. Component Packaging and Interconnecting with Emphasis on Surface Mounting (ANSI/IPC-SM-780). New York: Institute for Interconnecting and Packaging Electronic Circuits, Inc., 1988. Institute for Interconnecting and Packaging Electronic Circuits, Inc. Procedures for Characterizing and Handling of Moisture , Institute for Interconnecting and Packaging Electronic CircuitsProcedures for Characterizing & Handling of
Altera
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Soldering guidelines IPC-TM650 IPC-SM786AM PCB220

STMicroelectronics bake time chart

Abstract: water pressure i2c APPLICATION NOTE SOLDERING RECOMMENDATIONS and PACKAGING INFORMATION by the Micro Divisions , SOLDERING RECOMMENDATIONS AND PACKAGING INFORMATION The different packages available at , . 2/12 SOLDERING RECOMMENDATIONS AND PACKAGING INFORMATION 2 SMD PRESENTATION Unlike , conditions harder to determine (use of finer structures and higher pin count) Handling SMDs Though the , avoid touching the pins as much as possible. Manual handling could affect lead coplanarity and generate
STMicroelectronics
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STMicroelectronics bake time chart water pressure i2c VR02104A AN899/0299

oki qfp tray

Abstract: Ultrasonic humidifier circuit PACKAGE HANDLING GUIDE 3.1 Storing and Handling of Pack Products 3.1.1 Moisture Sensitivity Levels , ) Details of Moisture Sensitivity Levels The table 3.1.1 lists the packing and handling methods for , . 3.1.3 Storing and Handling of Simplified Dry Pack Products (Moisture Sensitivity Level 2) (1 , are shown below. · To prevent moisture absorption into packages during transportation and storage by , soldering by specifying the handling method for surface mount packages. The packing and handling methods
OKI Electric Industry
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oki qfp tray Oki Moisture 750H Oki Moisture level OKI Year Work Week

ipc-sm-786A

Abstract: Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel Reflow Soldering Process Sockets Moisture , conditions, moisture sensitivity standardized test and handling procedures have been published by two , -786A "Procedures for Characterizing and Handling of Moisture/Reflow Sensitive ICs". Available through IPC Phone , DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal , Reflow Package Moisture Sensitivity Levels per J-STD-020 Factory Floor Life Dry Bake Recommendation and
Xilinx
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JEDEC J-STD-020d.1

Abstract: JESD625-a necessary packaging, storage and handling guidelines to preclude component package delamination, package , AND8003/D Storage and Handling of Drypacked Surface Mounted Devices (SMD) Prepared by: R. Kampa , moisture sensitive and delivers in a dry pack. Moisture sensitive devices include, but are not limited to , label indicates the bag seal date, the qualified Moisture Sensitivity Level (MSL) of the SMD, and the , , storage and handling requirements when the SMDs are out of dry pack. Table 1 provides the MSL and the
ON Semiconductor
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JEDEC J-STD-020d.1 JESD625-a AND8003 12MSB17722C JEDEC J-STD-033b.1 jedec JESD625-a
Abstract: Specifications Moisture Resistant Packaging Specifications are the same as for the aforementioned CIM Series , resistant packaging for 6 months or longer, or for which a long period has elapsed since the moisture , PR20CPTCPD150CL PR20, CPT Series, CPD150, and CL Series CPT230290 ±0.15mm 300g Mounting (for surface mounting of CPT230 and 290) A chip mounter equipped with an image recognition device is used and the product is mounted with a device accuracy of within ±0.15 mm with respect to the Citizen Electronics
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PR20CPT181 PT23029015 CPT181
Abstract: RS 104 Moisture Resistant Packaging Specifications are the same as for the aforementioned CIM , In consideration of the moisture resistant packaging, mounting of the product is recommended promptly , moisture resistant packaging for 6 months or longer, or for which a long period has elapsed since the moisture resistant packaging was opened, should be baked according to the following conditions prior to use , PR20CPT CL PR20, CPT Series, and CL Series CPT230 Mounting (for surface mounting of CPT230 Citizen Electronics
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EIA-583

Abstract: JEP-113 Tape and Reel Packaging and Handling Requirements Rev C 2/3/09 TABLE OF CONTENTS Section , -033 Standard for Handling, Packing, Shipping, and use of Moisture/Reflow Sensitive Surface Mount Devices JEP-113 Symbol and Labels for Moisture Sensitive Devices EIA-541 Packaging material Standards , defines requirements for Tape and Reel Packaging of Aeroflex Metelics Semiconductor devices in surface , 12 mm Punched Carrier Taping of Surface Mount Components for Automatic Handling Packaging
Aeroflex
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EIA-481-B JESD-625 EIA-583 EIA 481 rev d US020 ML0606-A SOT-89-AV XA20053B MIL-STD-883 EIA-481
Abstract: handling. Packaging Specifications CIM CPI RS 136 Moisture Resistant Packaging Specifications , . Temperature: 5 to 30 Humidity: 60% RH or less In consideration of the moisture resistant packaging, mounting , Product that has been in a condition of moisture resistant packaging for 6 months or longer, or for which a long period has elapsed since the moisture resistant packaging was opened, should be baked , PR CPT CL PR Series, CPT Series, and CL Series CPT230 Mounting (for surface mounting of Citizen Electronics
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CPT176 10MAX

SMD CODE 9Z

Abstract: 80C251 PLCC44 generalities and the TEMIC packaging procedures used for SMD (Surface Mount Components) of digital ICs products , including package design (dimensions) and material properties. Moisture in a plastic package exposed to high , and wire damage. Matra MHS Rev. B (6 March.98) 3 SMD Packaging 3.1. Package Cracking at Board Assembly This kind of failure is considered as the most visible and severe form of moisture , Matra MHS Rev. B (6 March.98) 4 SMD Packaging MOISTURE ABSORPTION DURING STORAGE Die Wire
Temic Semiconductors
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SMD CODE 9Z 80C251 PLCC44 J-STD-20 SMD CODE 9T temic ulc products 14x14x1.4mm
Abstract: section of this catalog. Packaging Specifications Moisture Resistant Packaging Moisture resistant packaging using an aluminum envelope is used to avoid moisture absorption while the switches are being transported or stored. 60×12H Disposition When Moisture Has Been Absorbed When switches have absorbed moisture, they should be baked according to the following conditions. 60 x , Single parts taping LUMISWITCH single parts are taped and delivered. The taping specifications will Citizen Electronics
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LS10/11
Abstract: taping section of this catalog. 60×12H Packaging Specifications Moisture Resistant Packaging Moisture resistant packaging using an aluminum envelope is used to avoid moisture absorption while the switches are being transported or stored. Disposition When Moisture Has Been Absorbed When switches have absorbed moisture, they should be baked according to the following conditions 60 x 12 hours , Modes Single parts taping LUMISWITCH single parts are taped and delivered. The taping specifications Citizen Electronics
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LS10/112

EIA-726

Abstract: EIA-747 devices (ESDS) requiring specific precautionary measures regarding handling and processing. Discharging , ESD include the handling, processing and packing of ESDS. A few hints are provided below on handling , handling - Part 1: Tape packaging of components with axial leads on continuous tapes Application Note , components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes IEC 60286-3 Packaging of components for automatic handling - Part 3: Packaging of
Infineon Technologies
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EIA-726 EIA-747 Infineon moisture sensitive package MIPI design guideline spansion solder profile INFINEON trace code label
Abstract: packages, and are distributed in packaging including a moisture barrier. AVX solid tantalum TCN PulseCapâ , including a moisture barrier. Product Safety Information Datasheet Material Data and Handling AVX solid tantalum TACmicrochips® (TAC, TPC) are considered MSL 1 and supplied in packaging with a moisture barrier. TLC series is considered MSL 3 and is distributed in packaging including a moisture barrier. 7 , Product Safety Information Datasheet Material Data and Handling This should be read in -
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rohm surface mounted transistor series

Abstract: silica gel the packaging with moisture proof for better condition is use, please also note that 5-1) Not to be opened before using. 5-2) To be kept in our moisture proof packaging with some desiccant (SILICA GEL , product is often influenced by moisture absorption so we apply the packaging with moisture proof for , our moisture proof packaging with some desiccant (SILICA GEL) after opening it. To be baked in case , Surface Mount PAGE SML51Series Chip LED PACKAGING REQUIREMENTS 1. PACKING (1) 3,000pcs
ROHM
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SML512BC4T rohm surface mounted transistor series silica gel TSZ22111 TSZ2211104

GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE

Abstract: STMICROELECTRONICS MSL (Institute for Interconnecting and Packaging Electronic Circuits), defines up to six levels of moisture , GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICES According to the specification J-STD , B-10a Committees handling SMDs in damproof bags Materials Desiccant Moisture Barrier , and then sealed in damproof bags with desiccant and humidity indicator card. Corresponding Moisture , summarizes the estructions for safe handling and utilization of the product. After opening the drybag
STMicroelectronics
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STMICROELECTRONICS MSL GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICES Corn 30C/60 30/C60 125C/24

EIA-583

Abstract: JESD31 -033, Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow-Sensitive Surface-Mount Devices , , storage, and handling. Non-hermetic, plastic-encapsulated surface-mount devices are particularly , subjected to normal handling, shipping, and storage. Normative references Dry bagging or vacuum , The following documents contain useful information regarding the storage, handling, and related , guide to the receipt, storage, packing, and shipping of Allegro semiconductor devices and a quick
Allegro MicroSystems
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JEP113 JEP124 J-STD033 EDR4701 JESD31 JEDEC J-STD-033 TAPE AND REEL JEDEC JESD31 JESD625 JESD-31 JSTD-033 JESD22-A103 JSTD-020 MIL-STD-750
Abstract: part between mold resin and substrate. Therefore please be careful when handling LED and PCB for , reliability of this product is often influenced by moisture absorption so we apply the packaging with , ) To be kept in our moisture proof packaging with some desiccant (SILICA GEL) after opening it. To be , Attention Points In Handling Surface Mount Chip LEDs SML-J1* Series This product was , pattern, Please refer to Fig-1. The size and direction of the pad pattern depends on the condition of -
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Ultrasonic cleaner circuit diagram

Abstract: pliobond packaging 2. LEDs that have been exposed to a humid environment longer than listed in the Moisture , moisture from the package and reset the exposure time, as defined in the Moisture Sensitivity section above , The diagrams below show the packaging and labels Cree will use to ship XLamp MC-E LEDs. XLamp MC-E , Cree® XLamp® LED Soldering & Handling XLamp MC-E LEDs This application note applies to XLamp , note explains how XLamp MC-E LEDs and assemblies containing XLamp MC-E LEDs should be handled during
Cree
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pliobond cree led HUmiseal 1B73 pledge 1B51 dow 1-2577 CLD-AP21

component data

Abstract: avago shipping label Moisture Sensitivity Construction · Tape and Reel Packaging · Moisture Sensitivity · Automatic Placement Equipment Considerations , components from moisture absorption during shipping and handling, reels for SMT LED components are packaged , Package Construction Tape and Reel Packaging The design of the ASMT-Bx20 package is very unique to , CARD Figure 6. Moisture Barrier Bag Packaging for SMT LED components Moisture Sensitivity , Figure 8. Moisture Classification Level and Floor Life Figure 7. Example of Humidity Indicator
Avago Technologies
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component data avago shipping label Moisture Sensitivity JEDEC SMT reflow profile avago Moisture Sensitivity avago, SMT LED AV02-0393EN

HUmiseal 1B73

Abstract: Ultrasonic cleaner circuit diagram not been soldered Baking Procedure Baking the LEDs will remove moisture from the package and reset , : Packaging & Labels The diagrams below show the packaging and labels Cree will use to ship XLamp LEDs to , Cree® XLamp® LED Soldering & Handling XLamp 4550 & XR Family LEDs This application note applies , how XLamp 4550 & XR family LEDs and assemblies containing these LEDs should be handled during , . Table of Contents Handling XLamp 4550 & XR Family LEDs
Cree
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CLD-AP16 HUmiseal tilex pledge furniture polish NC-SMQ92J Indium Corporation of America Part number 82676 3M Touch Systems XL4550 XR7090

moisture handling and packaging

Abstract: required between first and second soldering process. Emitting Direction 3.HANDLING AFTER MOUNTING In , resin and substrate. Therefore please be careful when handling LED and PCB for there is a possibility , we apply the packaging with moisture proof for better condition is use, please also note that 5-1) Not to be opened before using. 5-2) To be kept in our moisture proof packaging with some desiccant , Attention Points In Handling Surface Mount Chip LEDs SML-L1* Series This product was
-
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moisture handling and packaging
Abstract: so we apply the packaging with moisture proof for better condition is use, please also note that 6-1) Not to be opened before using. 6-2) To be kept in our moisture proof packaging with some desiccant , Attention Points In Handling Surface Mount Chip LEDs SML-F1* Series This product was , solder fillet. Therefore, foot print and metal mask thickness shall be checked carefully. 1.2mm , this product. (See Fig-2) Number of reflow process shall be max 2 times and these processes shall be -
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A576

Abstract: 28F160 reliability and moisture resistance. An additional advantage of µBGA is that it can be used with today's PCB surface mount device assembly processes. Lacking leads, the µBGA package has reduced coplanarity and , to Chapter 10, "Transport Media and Packing" of this manual. 15.7 Preconditioning And Moisture , Packaging/Handling of PSMCs" provides an in-depth view of package preconditioning 1998 Packaging Databook 15-5 The Micro Ball Grid Array (µBGA) Package and moisture sensitivity requirements. Specific
Intel
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28F160 A576 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS A5763-01 28F008S3/S5

AVX tantalum MSL

Abstract: AVX taa in packaging including a moisture barrier. Product Safety Information Datasheet Material Data and Handling AVX solid tantalum TACmicrochips® (TAC, TPC, TMC) are considered MSL 1 and supplied in packaging with a moisture barrier. TLC seires is considered MSL 3 and is distributed in packaging , Product Safety Information Datasheet Material Data and Handling This should be read in , considered MSL 1. They are packaged in standard packaging, not including a moisture barrier unless dry pack
-
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AVX tantalum MSL AVX taa avx taj D2863-70

SN60

Abstract: led moisture after opening the moisture barrier bag. 05/02/07 -1- Ver O SMD Handling and Application , APPLICATION NOTES: SMD Handling and Application Precautions The purpose of this document is to provide information regarding SMD LED handling and application precautions to the customers. The , is a moisture sensitive device. If moisture is absorbed into the SMT package, it may vaporize and , moisture absorption into LED during transportation and storage, moisture barrier bag is used for packing
DOMINANT Semiconductors
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SN60 led moisture

AVX tantalum MSL

Abstract: avx taj , and are packaged in standard packaging, not including a moisture barrier unless dry pack MSL 3 , moisture barrier. 121 Product Safety Information Datasheet Material Data and Handling AVX solid tantalum TACmicrochips® (TAC, TPC, TMC) are considered MSL 1 and supplied in packaging with a moisture barrier. TLC series is considered MSL 3 and is distributed in packaging including a moisture barrier. 7 , Product Safety Information Datasheet Material Data and Handling This should be read in
-
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46AG

Abstract: Moisture Resistant Packaging Moisture resistant packaging using an aluminum envelope is used to avoid , the moisture resistant packaging, mounting of the product is recommended promptly after opening , Product that has been in a condition of moisture resistant packaging for 6 months or longer, or for which 48 hours or longer have elapsed since the moisture resistant packaging was opened, should be baked , a soldering iron of 25 W or less and keep the temperature of the soldering iron tip to 300 or less
Citizen Electronics
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46AG AK225
Abstract: influenced by moisture absorption so we apply the packaging with moisture proof for better condition is use , Attention Points In Handling Surface Mount Chip LEDs SML-52* Series 0.5mm 1.DESIGNING OF PCB As for a recommendable solder pattern, Please refer to Fig-1. The size and direction of the pad , characteristic of this product. (See Fig-2) Number of reflow process shall be max 2 times and these processes shall be performed in a row. Cooling process to normal temperature shall be required between first and -
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101ON

Abstract: TOSHIBA _ [ 7 ] Handling Devices 7. Handling Devices 7.1 Transport Handle devices and packaging materials with care. To avoid damage to the devices , vibration or shock. Avoid getting devices or packaging wet. Moisture can adversely affect packaging by , with device packaging are made of materials that will conduct static electricity; and check to verify , will be exposed to moisture or direct sunlight. (Be especially careful during periods of rain or snow
-
OCR Scan
101ON

AN5305

Abstract: Avago an 1060 .01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN , qualified as Moisture Sensitive Level xx per Jedec J-STD-020. Precautions when handling this moisture , AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen , remove absorbed moisture. Avago's ultra-thin Leadframe ChipLED available in Red, Yellow Green and Amber , )(78 KB, PDF) z Application Note - AN5305 - Handling Moisture Sensitive Surface Mount LED(250 KB
Avago Technologies
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Avago an 1060

MIL-D-3464

Abstract: MIL-B-81705 JEDEC-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices JEDEC-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices EIA ­ 583 Packaging Material Standards für Moisture Sensitive Items , . This document gives an overview about the requirements for packing, labeling, handling and storage of , VERPACKUNG 3. Normenbezug TAPE AND REEL 3. Normative References JEDEC-STD-020A Moisture/Reflow
OSRAM
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EIA/JEP 124 HYM328025GS-60 MIL-D3464 MIL-B-81705C

TSOP-48 pcb LAYOUT

Abstract: str 6654 . 8.2.6. 8.3. 8.4. 8.5. 8.6. 8.7. 8.8. STORAGE AND HANDLING , small form factor packaging. Intel's 28F200CV 2-megabit, 28F400CV 4-megabit and 28F800CV 8 , . Product handling of SOP products during test is done in a fully automated, tray to tray, pick and place , (AUTOCLAVE) The steam stress accelerates moisture penetration through the plastic packaging material to , , leakage, and contamination. Passivation defects or marginalities can allow moisture penetration to a
Intel
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TSOP-48 pcb LAYOUT str 6654 pin details of str f 6654 amd socket 940 pinout str W 6654 pin details of str W 6654

land pattern for TSOP 2-44

Abstract: Wells programming adapter TSOP 48 . 8.2.6. 8.3. 8.4. 8.5. 8.6. 8.7. 8.8. STORAGE AND HANDLING , small form factor packaging. Intel's 28F200CV 2-megabit, 28F400CV 4-megabit and 28F800CV 8 , . Product handling of SOP products during test is done in a fully automated, tray to tray, pick and place , (AUTOCLAVE) The steam stress accelerates moisture penetration through the plastic packaging material to , , leakage, and contamination. Passivation defects or marginalities can allow moisture penetration to a
Intel
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land pattern for TSOP 2-44 Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70
Abstract: 12 E-mail: albert.mallet@vishay.com Molded Surface-Mount Tantalum Capacitors and Moisture , 's molded chip capacitors meet MSL 1 per J-STD-020D,are not considered moisture sensitive, and are not stored or shipped in moisture-protective packaging. These series do not require any special handling, provided the storage and manufacturing environment is maintained at 30 °C and 60 % RH. Moisture , is known that large plastic packages can entrap some moisture during shipment and/or storage. This Vishay Intertechnology
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ipc-sm-786

Abstract: IPC-SM-780 and Packaging Electronic Circuits, Inc. Procedures for Characterizing and Handling of Moisture , Institute for Interconnecting and Packaging Electronic Circuits Procedures /Reflow-Sensitive ICs for Characterizing and Handling of MoistureIPC-SM-786A 220 PCB 220 QFP QFP , JJ-QFP Lead & QFP Devices Institute for Interconnecting and Packaging Electronic Circuits, Inc. Component Packaging and Interconnecting with Emphasis on Surface Mounting (ANSI/IPC-SM-780). New York
Altera
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780 AC guidelines 100PQFP 84JPLCC

PAL 007 pioneer

Abstract: pioneer PAL 007 A . 8.2.6. 8.3. 8.4. 8.5. 8.6. 8.7. 8.8. STORAGE AND HANDLING , small form factor packaging. Intel's 28F200CV 2-megabit, 28F400CV 4-megabit and 28F800CV 8 , quality and electrical reliability. Product handling of SOP products during test is done in a fully , accomplished through a combination of moisture penetration of the plastic, voltage potentials and , 's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel
Intel
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PAL 007 pioneer pioneer PAL 007 A PAL 008 pioneer 648-0482211 sn 7600 n sem 2106 28F800F3 28F160F3

pioneer PAL 007 A

Abstract: PAL 007 pioneer . 8.2.6. 8.3. 8.4. 8.5. 8.6. 8.7. 8.8. STORAGE AND HANDLING , small form factor packaging. Intel's 28F200CV 2-megabit, 28F400CV 4-megabit and 28F800CV 8 , experience. This test flow ensures the highest level of quality and electrical reliability. Product handling , (AUTOCLAVE) The steam stress accelerates moisture penetration through the plastic packaging material to , , leakage, and contamination. Passivation defects or marginalities can allow moisture penetration to a
Intel
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Yamaichi Electronics ic197 TSOP56 jackson Meritec 980020-56 980020-56 IC179-44600-500

JEDEC J-STD-033b

Abstract: GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE . IPC/JEDEC J-STD-033B: Standard for Handling and Shipping of Moisture/Reflow Sensitive Surface Mount Devices. The guidelines for classification, handling, packing, shipping and use of SMDs are defined , Handling Moisture Sensitive Surface Mount LED Application Note 5305 1. Introduction 2 , . Moisture from atmospheric humidity enters permeable packaging materials by diffusion. The assembly , of this application note is to provide SMD users with recommended methods for handling and using
Avago Technologies
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JEDEC J-STD-033b smds 1A floor life reset AV01-0601EN AV02-1298EN

Intel reflow soldering profile BGA

Abstract: socket s1 REFLOW PROFILE and problems for IC packaging. Typically a package cannot be capable of handling a given power , leads, the PBGA has reduced coplanarity problems and minimized handling issues. During reflow the , be used in few chip packaging (FCPs) and multi-chip modules (MCMs). 14.2. PACKAGE ATTRIBUTES , ) PACKAGING Figure 14-5. HL-PBGA Package Outline and Ball Configuration Table 14-5. HL-PBGA Dimensions , packaging is used for high-performance applications with high thermal and electrical requirements. PBGAs
Intel
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Intel reflow soldering profile BGA socket s1 REFLOW PROFILE intel topside mark outline of the heat slug for JEDEC pbga package weight heat pipes intel CH14WIP
Abstract: careful when handling LED and PCB for there is a possibility to break the device or PCB. 4 , product is often influenced by moisture absorption so we apply the packaging with moisture proof for , our moisture proof packaging with some desiccant (SILICA GEL) after opening it. To be baked in case , is often influenced by moisture absorption so we apply the packaging with moisture proof for better , moisture proof packaging with some desiccant (SILICA GEL) after opening it. To be baked in case the SILICA ROHM
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SML-J14DT SMLJ14

ASTM F1249

Abstract: ASTM D2103 Barrier Bags and Statshield® High Moisture Barrier Bags is created by vacuum deposited manufacturing , Bags provide a better moisture barrier but require more care in handling when used to prevent tears or , with EMI-RFI-ESD shielding. Statshield® Moisture Barrier Bags meet the electrical and physical requirements of ANSI/ESD S541, EIA 583, EIA 541, and EIA 625. All Statshield® Moisture Barrier Bags are amide and amine free and pass outgassing and corrosion tests. All bags are printed with ESD and moisture
Desco Industries
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ASTM F1249 ASTM D2103 F1249 F-1249 F1249-90 ESD S11.11 TB-2031

Unity Opto Technology

Abstract: SOURCE LABLE moisture to resin of LED Cooling process to nomal temp,shall be required between first and second refiow , Specifications 1. Controlling Moisture Unity Opto Technology, in its design of packing materials and packing , moisture-induced failures. Please follow JEDEC-STD-033A standards for handling moisture sensitive devices. 2. Packaging SMD devices: Unity packages all SMD devices into dry pack bags (moisture barrier bags). , during shipment and storage. 3. Handling Dry Packed Parts Upon receipt, the bags should be
Unity Opto Technology
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MSL-1947HB3-5 Unity Opto Technology SOURCE LABLE

Unity Opto Technology

Abstract: UV LED 295 nm ,intervals between first and second process shall be as short as possible to prevent absorption of moisture , . Controlling Moisture Unity Opto Technology, in its design of packing materials and packing methods, takes , moisture-induced failures. Please follow JEDEC-STD-033A standards for handling moisture sensitive devices. 2. Packaging SMD devices: Unity packages all SMD devices into dry pack bags (moisture barrier bags). , during shipment and storage. 3. Handling Dry Packed Parts Upon receipt, the bags should be
Unity Opto Technology
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MSL-1947HB3-S MSL-1947HB3 UV LED 295 nm
Abstract: so we apply the packaging with moisture proof for better condition is use, please also note that 6-1) Not to be opened before using. 6-2) To be kept in our moisture proof packaging with some desiccant , Attention Points In Handling Surface Mount Chip LEDs SML-A1* Series This product was , solder fillet. Therefore, foot print and metal mask thickness shall be checked carefully. Solderability , characteristic of this product. (See Fig-2) Number of reflow process shall be max 2 times and these processes -
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Abstract: 3 seconds for each connection. 80 Packaging Specifications Moisture Resistant Packaging Moisture resistant packaging using an aluminum envelope is used to avoid moisture absorption , Taping LUMISWITCH parts are taped and delivered. The taping specifications will differ depending , preheating and regular heating. Be careful not to exceed the peak value of 250. The temperature profile in , between the switch and the upper surface of the board will arise depending on the type of board and the Citizen Electronics
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transport media and packing

Abstract: ic shelf life described on the bag and in this Packaging Databook The user must limit exposure of moisture sensitive , Packaging and Bagging Flow Chart SUPPORTING TECHNICAL INFORMATION The phenomenon of moisture induced , proposed a model describing the kinetics of PSMC moisture absorption based on this data The handling and , CHAPTER 8 MOISTURE SENSITIVITY DESICCANT PACKING HANDLING OF PSMCs INTRODUCTION This chapter of the Packaging Handbook examines surface mount assembly processes and establishes preconditioning
Intel
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transport media and packing ic shelf life PQFP moisture sensitive handling and packaging PQFP dimension intel smt 28rh PLCC 68 intel package dimensions

BGA and QFP Altera Package mounting profile

Abstract: BGA PROFILING Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices (IPC , page 10 for more information). Altera subjects devices to a controlled introduction of moisture and , and bottom of the device. Semiconductor moisture sensitivity becomes an important issue as board assemblers switch to hotter and faster reflow processes. Any nonhermetic package can absorb moisture. Like popcorn, the moisture in some plastic packages can vaporize and expand rapidly due to high temperatures
Altera
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JEP113-B BGA PROFILING infrared heating gun J-STD-033 PCB JESD22-A113-B Reliability Data Plastic Packages QFP

AEDR-8300

Abstract: 5247 8 pin AEDR-8300 Encoder Design Handling and Tooling Considerations Application Note 5247 Handling and Usage Pre-Bake Requirements The optical grade materials used in the AEDR-8300 Encoder can , the device from the moisture barrier bag for use. For tape and reel option, remove tape from reel , Figure 1. Recommended pick and place tool dimensions. Tape and Reel Packaging The orientation of the , from top Figure 2. Orientation of encoder in tape and reel packaging. 2 1.5 2 8 4
Avago Technologies
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5247 8 pin avago encoder ic 5247 5989-4065EN AV01-0281EN

JEDEC J-STD-033b.1

Abstract: ipc-JEDEC J-STD-033 moisture barrier bags (MBB) together with a desiccant and a Humidity Indicator Card (HIC). National Semiconductor generally follows Industry Standards IPC/ JEDEC J-STD-020 and J-STD-033 to determine the moisture , recommendations for handling, storing and mounting of National Semiconductor's surface mount IC packages. The , suppliers and vendors to achieve the optimum board assembly yield. Moisture Sensitivity Level Due to , ), the entrapped moisture Handling & Process Recommendations Handling & Process Recommendations
National Semiconductor
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AN-2029 ipc-JEDEC J-STD-033 Drypacked Devices

CQ208

Abstract: CQFP 208 datasheet integrity and protects the leads from bending and skewing. HANDLING OF PLASTIC SURFACE MOUNT PACKAGING , starting at the 256 pin count. QuickLogic offers both through-hole and surface-mount hermetic packaging , . The high solder temperature vaporizes moisture absorbed in the plastic, and creates a high pressure , proper package design and materials. It can also be prevented by removing the moisture from the plastic , moisture induced cracking. Therefore, QuickLogic bakes and dry-packs these devices prior to shipment
QuickLogic
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PF100 PF144 CF160 PQ208 CQ208 PB256 CQFP 208 datasheet CERAMIC QUAD FLATPACK CQFP CERAMIC QUAD FLATPACK CQFP 14 pin CG144

SMT LED

Abstract: HSMX-C650 LED Indicators · Standard EIA Tape and Reel Packaging · Moisture Barrier Envelope Packaging · , dimensions for the reels and embossed tapes. Moisture Barrier Envelope Packaging The optical grade , absorption during shipping and handling, reels for SMT LED components may be packaged in moisture barrier , indicators onto a pc board. Standard EIA Tape and Reel Packaging SMT LED lamps are packaged tape and reel , IDENTIFICATION LABEL Figure 2. Moisture Barrier Envelope Packaging for SMT LED Indicator Components. Figure
Agilent Technologies
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SMT LED HSMX-C650 h730

Avago Optical Encoder

Abstract: avago encoder AEDR-8400 Design Handling and Tooling Consideration Application Note 5271 Handling and Usage , to be considered during handling. For the pick and place machine, the pick-up nozzle should always , , D2 1.8 2.0 Unit Note mm Tolerance ±0.1mm Tape and Reel Packaging The , -8400 encoder can absorb moisture directly out of the air. However, moisture absorption prior to reflow soldering is of serious concern. If moisture is absorbed by the device prior to reflow soldering
Avago Technologies
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Avago Optical Encoder AV01-0141EN

ISO-780

Abstract: D-4196 , vibration, compression, moisture and ESD. 3. Provide packaging that permits safe handling, shipping and , 54 PACKAGING and HANDLING Supplier and Interplant Requirements This booklet is the property of , electronic components. It specifies packaging, handling, labeling, and bar-coding requirements for these , Summary This is a summary of the major areas of concern regarding packaging. The rest of the document and , Palletization Marking and Labeling Wooden Packaging Field Service Parts Quality Seals Heavy Packages
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ISO-780 D-4196 hardwood based plywood EPP foam B727 HITACHI B-131-F

BGA reflow guide

Abstract: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Products Guide Product Data Sheets Package Drawings Packaging and Thermal Characteristics Application Notes White Papers , Floor Life Dry Bake Recommendation and Dry Bag Policy Handling Parts in Sealed Bags Tape and Reel , Label Shipping Box Tape and Reel Packaging Reflow Soldering Process Guidelines This section contains , Literature Request Form Back to Start Page Package Drawings Thermal Packaging Management Application Note
Xilinx
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BGA reflow guide XAPP415

9117 opto

Abstract: OHAY0734 packing, labeling, handling and storage of moisture sensitive components in dry pack of OSRAM Opto , Surface Mount Devices JEDEC-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices JEDEC-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices EIA ­ 583 Packaging Material Standards für Moisture Sensitive Items EIA ­ 583 Packaging Material Standards für Moisture Sensitive
OSRAM
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JESD22-B102-B 9117 opto OHAY0734 OHAY1358 OHAY2271 OHAY2272
Abstract: GTDW1656JTE-20Y-TR This products are baked (moisture removal) before packaging, and are shipped in moisture-proof packaging (as show below) to minimize moisture absorption during transportation. However, in , and second process should be as short as possible to prevent absorption of moisture to resin of LED , handling by operator and other charged materials coming in contact with the product, Stanley recommends , sealed after packaging. Desiccant with indicator for moisture level is enclosed. 1 SYM. PART Stanley Electric
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hakko 941

Abstract: GTDW1656JTE-24Y-TR This products are baked (moisture removal) before packaging, and are shipped in moisture-proof packaging (as show below) to minimize moisture absorption during transportation. However, in , and second process should be as short as possible to prevent absorption of moisture to resin of LED , handling by operator and other charged materials coming in contact with the product, Stanley recommends , sealed after packaging. Desiccant with indicator for moisture level is enclosed. 1 SYM. PART
Stanley Electric
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hakko 941
Abstract: GTDW1656JTE-40Y-TR This products are baked (moisture removal) before packaging, and are shipped in moisture-proof packaging (as show below) to minimize moisture absorption during transportation. However, in , , interval between first and second process should be as short as possible to prevent absorption of moisture , handling by operator and other charged materials coming in contact with the product, Stanley recommends , sealed after packaging. Desiccant with indicator for moisture level is enclosed. 1 SYM. PART Stanley Electric
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GTDW1656JTE-50Z-TR

Abstract: FJ CHEMICALS cooling water GTDW1656JTE-50Z-TR This products are baked (moisture removal) before packaging, and are shipped in moisture-proof packaging (as show below) to minimize moisture absorption during transportation. However, in , and second process should be as short as possible to prevent absorption of moisture to resin of LED , handling by operator and other charged materials coming in contact with the product, Stanley recommends , sealed after packaging. Desiccant with indicator for moisture level is enclosed. 1 SYM. PART
Stanley Electric
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FJ CHEMICALS cooling water
Abstract: GTDW1656JTE-30Y-TR This products are baked (moisture removal) before packaging, and are shipped in moisture-proof packaging (as show below) to minimize moisture absorption during transportation. However, in , (die) damage from static electricity caused by unprotected handling by operator and other charged , specification sheets should be exchanged and signed by both parties. 2011.12.22 Page : 13 Handling , sealed after packaging. Desiccant with indicator for moisture level is enclosed. 1 SYM. PART Stanley Electric
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HUmiseal 1B73

Abstract: 1B73 (inside bag) The diagrams below show the packaging and labels Cree will use to ship XLamp ML-E LEDs , Cree® XLamp® LED Soldering & Handling XLamp ML-E LED This application note applies to XLamp , note explains how XLamp ML-E LEDs and assemblies containing these LEDs should be handled during , of Contents 0 Rev 0 ote: CLD-AP5 Application N Handling XLamp ML-E LEDs , . 5 Moisture Sensitivity
Cree
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1B73 NC-SMQ92J solder paste Cree optics SN62 PB36 ag2 sn-pb-ag solder paste CLD-AP50

ESD audit

Abstract: S541 for the handling and assembly of sensitive Components, 3M offers you an even more comprehensive , Instrumentation & Monitoring 3M's wide range of static shielding and moisture barrier bags Precision , environments, such as disk drive and flat panel assembly, handling, storage and transport, allowing you to , monitoring system. · Cushioned bags and wrap Moisture Barrier Bags and Dry Packing Air ionizers · , Providing global ESD, EMI and EMC solutions 3M has long been a leader in providing static control solutions
3M Electronic Solutions
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ESD audit S541
Abstract: GTDW1656JTE-27X-TR This products are baked (moisture removal) before packaging, and are shipped in moisture-proof packaging (as show below) to minimize moisture absorption during transportation. However, in , (die) damage from static electricity caused by unprotected handling by operator and other charged , specification sheets should be exchanged and signed by both parties. 2011.12.22 Page : 13 Handling , sealed after packaging. Desiccant with indicator for moisture level is enclosed. 1 SYM. PART Stanley Electric
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hakko 941

Abstract: GTDW1656JTE-30X-TR GTDW1656JTE-30X-TR This products are baked (moisture removal) before packaging, and are shipped in moisture-proof packaging (as show below) to minimize moisture absorption during transportation. However, in , (die) damage from static electricity caused by unprotected handling by operator and other charged , specification sheets should be exchanged and signed by both parties. 2011.12.22 Page : 13 Handling , sealed after packaging. Desiccant with indicator for moisture level is enclosed. 1 SYM. PART
Stanley Electric
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JIS-X0503

Abstract: Temprel GTDW1656JTE-27Z-TR This products are baked (moisture removal) before packaging, and are shipped in moisture-proof packaging (as show below) to minimize moisture absorption during transportation. However, in , and second process should be as short as possible to prevent absorption of moisture to resin of LED , handling by operator and other charged materials coming in contact with the product, Stanley recommends , sealed after packaging. Desiccant with indicator for moisture level is enclosed. 1 SYM. PART
Stanley Electric
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JIS-X0503 Temprel EIAJ-4701

Temprel

Abstract: JIS-C-0806 GTDW1656JTE-30Z-TR This products are baked (moisture removal) before packaging, and are shipped in moisture-proof packaging (as show below) to minimize moisture absorption during transportation. However, in , , interval between first and second process should be as short as possible to prevent absorption of moisture , handling by operator and other charged materials coming in contact with the product, Stanley recommends , sealed after packaging. Desiccant with indicator for moisture level is enclosed. 1 SYM. PART
Stanley Electric
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JIS-C-0806

ESD audit

Abstract: 3M EMC Products Packaging Solutions 3M's wide range of static shielding and moisture barrier bags provide static and physical protection for your products during handling, storage and transport, allowing you to comply with , environment for the handling and assembly of sensitive components. These products are the key items needed to , of packaging, workstation and instrumentation product solutions and helps electronic products , reclosable bags · Cushioned bags and wrap Moisture Barrier Bags and Dry Packing · Metallized moisture
3M Electronic Solutions
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3M EMC Products

EIA-583

Abstract: CECC 00802 during handling and shipping TEM IC has laid dow n procedures which detail the methods to be used for , exceeded, the devices should be baked: · Low-tem perature packaging - 192 hours at 40°C and 5% RH 125 , Tem ic S e m i c o n d u c t o r s Handling for Quality · Electrostatic Discharge (ESD , discharge. They can also be dam aged if they are charged to a high voltage and then discharged to ground. Damage due to ESD may occur at any point in the process of manufacture and use o f the device. ESD is a
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OCR Scan
CECC 00802 IL-STD-1686

hakko

Abstract: GTDW1656JTE-27Y-TR This products are baked (moisture removal) before packaging, and are shipped in moisture-proof packaging (as show below) to minimize moisture absorption during transportation. However, in , (die) damage from static electricity caused by unprotected handling by operator and other charged , specification sheets should be exchanged and signed by both parties. 2011.12.22 Page : 13 Handling , sealed after packaging. Desiccant with indicator for moisture level is enclosed. 1 SYM. PART
Stanley Electric
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hakko
Abstract: GTDW1646JTE-40X-TR This products are baked (moisture removal) before packaging, and are shipped in moisture-proof packaging (as show below) to minimize moisture absorption during transportation. However, in , and second process should be as short as possible to prevent absorption of moisture to resin of LED , handling by operator and other charged materials coming in contact with the product, Stanley recommends , sealed after packaging. Desiccant with indicator for moisture level is enclosed. 1 SYM. PART Stanley Electric
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GTDW1646JTE-50X-TR

Abstract: Specifications GTDW1646JTE-50X-TR This products are baked (moisture removal) before packaging, and are shipped in moisture-proof packaging (as show below) to minimize moisture absorption during transportation , and second process should be as short as possible to prevent absorption of moisture to resin of LED , handling by operator and other charged materials coming in contact with the product, Stanley recommends , sealed after packaging. Desiccant with indicator for moisture level is enclosed. 1 SYM. PART
Stanley Electric
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Abstract: GTDW1656JTE-40Z-TR This products are baked (moisture removal) before packaging, and are shipped in moisture-proof packaging (as show below) to minimize moisture absorption during transportation. However, in , (die) damage from static electricity caused by unprotected handling by operator and other charged , specification sheets should be exchanged and signed by both parties. 2011.12.22 Page : 13 Handling , sealed after packaging. Desiccant with indicator for moisture level is enclosed. 1 SYM. PART Stanley Electric
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arctic silver thermal adhesive

Abstract: LOCTITE ACTIVATOR 7387 Baking the LEDs will remove moisture from the package and reset the exposure time, as defined in the , Cree® XLamp® LED Soldering & Handling XLamp MPL-EZW LEDs This application note applies to XLamp , note explains how XLamp MPL-EZW LEDs and assemblies containing XLamp MPL-EZW LEDs should be handled , MPL-EZW LEDs. Table of Contents 6 Rev 0 ote: CLD-AP3 Application N Handling XLamp MPL-EZW LEDs , . 5 Moisture Sensitivity
Cree
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arctic silver thermal adhesive LOCTITE ACTIVATOR 7387 Loctite MPLEZW ADHESIVE GAP PAD hydrocarbon polymeric CLD-AP36
Abstract: m m < tc c E i\ f f l S t t l i / Packaging Specifications ip VPWP!MRS? r-f m M oisture R esistant Packaging Moisture resistant packaging using an aluminum envelope is used to avoid moisture absorption while the switches are being transported or stored. Disposition When Moisture Has Been Absorbed · H x M IC fc 'U V C .e O fc X 1 2 H When switches have absorbed moisture, they should be baked , single parts are taped and delivered. The taping sp e c ific a tio n s will diffe r depending on th e m -
OCR Scan
LS10/

HUmiseal 1B73

Abstract: HUmiseal Indicator Humidity Indicator The diagrams below show the packaging and labels Cree will use to ship , Cree® XLamp® LED Soldering & Handling XLamp XP Family LEDs This application note applies to , : XPxxxx-xx-xxxx-xxxxxx This application note explains how XLamp XP Family LEDs and assemblies containing these LEDs , handle XLamp XP Family LEDs. Table of Contents Handling XLamp XP Family LEDs , . . 4 . Moisture Sensitivity
Cree
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CLD-AP25 Solder Paste, Indium, Type 3 Loctite 401 led cree Loctite 7387 pliobond 20

GTDW1646JTE-65X-TR

Abstract: corrugated SHEET GTDW1646JTE-65X-TR This products are baked (moisture removal) before packaging, and are shipped in moisture-proof packaging (as show below) to minimize moisture absorption during transportation. However, in , (die) damage from static electricity caused by unprotected handling by operator and other charged , specification sheets should be exchanged and signed by both parties. 2011.12.22 Page : 13 Handling , sealed after packaging. Desiccant with indicator for moisture level is enclosed. 1 SYM. PART
Stanley Electric
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corrugated SHEET
Abstract: GTDW1656JTE-50Y-TR This products are baked (moisture removal) before packaging, and are shipped in moisture-proof packaging (as show below) to minimize moisture absorption during transportation. However, in , and second process should be as short as possible to prevent absorption of moisture to resin of LED , handling by operator and other charged materials coming in contact with the product, Stanley recommends , sealed after packaging. Desiccant with indicator for moisture level is enclosed. 1 SYM. PART Stanley Electric
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HUmiseal 1B73

Abstract: Indium Corporation of America Part number 82676 (inside bag) The diagrams below show the packaging and labels Cree will use to ship XLamp MX-6 LEDs , Cree® XLamp® LED Soldering & Handling XLamp MX-6 LEDs This application note applies to XLamp MX , explains how XLamp MX-6 LEDs and assemblies containing these LEDs should be handled during manufacturing , Contents 2 Rev 1 ote: CLD-AP3 Application N Handling XLamp MX-6 LEDs , . 5 Moisture Sensitivity
Cree
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Dow corning 3-1953 1-2577 SN62 Dow Corning 1-2577 Loctite 242 threadlocker for application 1B51NS CLD-AP32

HUmiseal 1B73

Abstract: pliobond (inside bag) The diagrams below show the packaging and labels Cree will use to ship XLamp MX LEDs. XLamp , Cree® XLamp® LED Soldering & Handling XLamp MX Family of LEDs This application note applies to , MX3xxx-xx-xxxx-xxxxxx This application note explains how XLamp MX Family of LEDs and assemblies containing these LEDs , handle XLamp MX LEDs. Table of Contents 2 Rev 1 ote: CLD-AP3 Application N Handling XLamp MX , . 5 Moisture Sensitivity
Cree
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parylene conformal coating nc-smq92 arctic silver alumina 984-LVUF cree MX6 920-55
Abstract: during handling and processing. Refer to Avago Application Note AN-1142 for additional details , Moisture Sensitive Level 2 per Jedec J-STD-020. Precautions when handling this moisture sensitive product , Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use â'" Unopen , , push button, HVAC and ambient decorative lighting applications in automotive interiors. x Industry standard Mini PLCC-2 The LEDs are packed in EIA-compliant tape and reel to facilitate easy pick and Avago Technologies
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AV02-2205EN

Circuit diagram of 25W soldering iron

Abstract: 300w 300 W or less 20w 20 W or less Packaging Specifications Moisture Resistant Packaging Moisture resistant packaging using an aluminum envelope is used to avoid moisture absorption , condition of moisture resistant packaging for 6 months or longer, or for which 48 hours or longer have elapsed since the moisture resistant packaging was opened, should be baked according to the following , R Taping CITISENSOR parts are taped and delivered. The taping specifications will
Citizen Electronics
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Abstract: handling and processing. Refer to Avago Application Note AN-1142 for additional details. Package , the product and cause premature failure. During assembly or handling, the unit should be held on the , handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details , customize dedicated and color point depending on needs, the latest oï¬'ering provides a sense of Avago Technologies
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AV02-2208EN
Abstract: the unused items into the moisture proof package and seal tightly. Pleases refer to the individual , concentrated to the jointed part between mold resin and substrate. Therefore please be careful when handling , product is often influenced by moisture absorption so we apply the packaging with moisture proof for , our moisture proof packaging with some desiccant (SILICA GEL) after opening it. To be baked in case , packaging with moisture proof for better condition is use, please also note that 4-1) Not to be opened ROHM
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SML-L13DTAFS
Abstract: : DDx-xJx Packaging Specification Moisture sensitivity level Barcode label DOMINANT LOT NO : lotno , absorbent material and moisture indicator are sealed inside the moisture proof foil bag Label Average , : DDx-xJx DomiLED TM TM Synonymous with function and performance, the DomiLED series is perfectly suited for a variety of cross-industrial applications due to its small package outline, durability and , JEDEC moisture sensitivity Level 2. Compatible to IR reflow soldering. Environmental friendly; RoHS DOMINANT Opto Technologies
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Abstract: . Please observe appropriate precautions during handling and processing. Refer to Avago Application Note , Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive , Handling of Moisture Sensitive Surface Mount Devices for details. D. Control of assembled boards A , 1125.0 Packaging Option (X5) Tolerance of each bin limit = ± 12% For product information and a , , push button, HVAC and ambient decorative lighting applications in automotive interiors. â Avago Technologies
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Abstract: . Qualified according to JEDEC moisture sensitivity Level 2. Compatible to both IR reflow soldering and TTW , : DDx-xJx Semiconductors Innovating Illumination Packaging Specification Moisture sensitivity , material + Moisture indicator The reel, moisture absorbent material and moisture indicator are sealed , InGaN : DDx-xJx TM Synonymous with function and performance, the DomiLED series is perfectly suited for a variety of cross-industrial applications due to its small package outline, durability and DOMINANT Semiconductors
Original
Abstract: appropriate precautions during handling and processing. Refer to Avago Application Note AN 1142 for , product and cause premature failure. During assembly or handling, the unit should be held on the body , handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details , the industry standard PLCC 2 package. These SMT LEDs have high reliability performance and are Avago Technologies
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Avago AN 5288

Abstract: : ASMTSWB5Nxxxx LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during handling and , as Moisture Sensitive Level 2a per Jedec JSTD020. Precautions when handling this moisture , Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A , LEDs. These SMT LEDs have higher reliability and better performance and are designed to , suitable for use under harsh environment and conditions like automotive. In addition, they
Avago Technologies
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Avago AN 5288
Abstract: : DDx-xJx Packaging Specification Moisture sensitivity level Barcode label DOMINANT LOT NO : lotno , absorbent material and moisture indicator are sealed inside the moisture proof foil bag Label Average , : DDx-xJx DomiLED TM TM Synonymous with function and performance, the DomiLED series is perfectly suited for a variety of cross-industrial applications due to its small package outline, durability and , JEDEC moisture sensitivity Level 2. Compatible to IR reflow soldering. Environmental friendly; RoHS DOMINANT Opto Technologies
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7070 led

Abstract: : DDx-xJx Packaging Specification Moisture sensitivity level Barcode label DOMINANT LOT NO : lotno , absorbent material and moisture indicator are sealed inside the moisture proof foil bag Label Average , DomiLED TM TM Synonymous with function and performance, the DomiLED series is perfectly suited for a variety of cross-industrial applications due to its small package outline, durability and superior , ° viewing angle. Small package outline (LxWxH) of 3.2 x 2.8 x 1.8mm. Qualified according to JEDEC moisture
DOMINANT Opto Technologies
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7070 led
Abstract: 300w 300 W or less 20w 20 W or less /Moisture Resistant Packaging Packaging Specifications Moisture Resistant Packaging Moisture resistant packaging using an aluminum envelope is used to , : 60% RH or less In consideration of the moisture resistant packaging, mounting of the product is , condition of moisture resistant packaging for 6 months or longer, or for which 48 hours or longer have elapsed since the moisture resistant packaging was opened, should be baked according to the following Citizen Electronics
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NC-SMQ92J solder paste

Abstract: NC-SMQ92J from the package and reset the exposure time, as defined in the Moisture Sensitivity section above , Cree® XLamp® LED Soldering & Handling XLamp MP-L EasyWhite LEDs This application note applies , : MPLEZW-XX-XXXX-XXXXXXXXX This application note explains how XLamp MP-L EasyWhite LEDs and assemblies containing XLamp , Application N Handling XLamp MP-L EasyWhite LEDs , . 5 Moisture Sensitivity
Cree
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Loctite 406 mcpcb reflow criteria SN62 MP LOCTITE 384 Aluminum Base LED PCB

ASMT-QTC0-0AA02

Abstract: AN-1142 sensitive. Please observe appropriate precautions during handling and processing. Please refer to Avago , the product and cause premature failure. During assembly of handling, the unit should be held on the , handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details , capability enabling it to be driven at even higher current. These SMT LEDs have high brightness and
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ASMT-QTC0-0AA02
Abstract: : DDx-xJx Semiconductors Innovating Illumination Packaging Specification Moisture sensitivity , material + Moisture indicator The reel, moisture absorbent material and moisture indicator are sealed , InGaN : DDx-xJx TM Synonymous with function and performance, the DomiLED series is perfectly suited for a variety of cross-industrial applications due to its small package outline, durability and , according to JEDEC moisture sensitivity Level 2. Compatible to IR reflow soldering. Environmental friendly DOMINANT Semiconductors
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Abstract: Innovating Illumination TM Opto Technologies InGaN : DDx-xJx Packaging Specification Moisture , + Moisture indicator The reel, moisture absorbent material and moisture indicator are sealed inside , : DDx-xJx DomiLED TM TM Synonymous with function and performance, the DomiLED series is perfectly suited for a variety of cross-industrial applications due to its small package outline, durability and , JEDEC moisture sensitivity Level 2. Compatible to IR reflow soldering. Environmental friendly; RoHS DOMINANT Opto Technologies
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ASMT-QTB0-0AA02

Abstract: asmtqtb00aa02 observe appropriate precautions during handling and processing. Please refer to Avago Application Note AN , Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface , enabling it to be driven at even higher current. These SMT LEDs have high brightness and reliability performance and are designed to work under a wide range of environmental conditions. This high reliability
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ASMT-QTB0-0AA02 asmtqtb00aa02 Material Handling Systems

LED wavelength 520

Abstract: sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application , per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture , , HVAC and ambient decorative lighting applications in automotive interiors. The LEDs are packed in EIA-compliant tape and reel to facilitate easy pick and place assembly. Every reel will be shipped in single
Avago Technologies
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LED wavelength 520

ELCH06

Abstract: ELCH06-BJ4J6Z10-N0 method: SMT Binning Parameters: Brightness, Forward Voltage , and Chromaticity Moisture Sensitivity , . 10 Soldering and Handling , based upon the results of these die as well as the professionalism and ingenuity of Everlight packaging , CBU@everlight.com torrentchin@everlight.com Soldering and Handling 1. Over-current-proof Though ELCH06 , millimeters. 2. Tolerances for fixed dimensions are ±0.1mm. Moisture Resistant Packaging Label Label
EVERLIGHT
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ELCH06-BJ4J6Z10-N0 ELCH NOIHAET-JPDIHT-0001 ELCH06-FJ4J6Z10-N0

NCSU034B

Abstract: -1052B 4.PACKAGING · The LEDs are packed in cardboard boxes after packaging in moisture proof , catch one's eye directly. · The caution label is attached to the moisture proof foil bag and cardboard , and damage the optical characteristics of the LEDs. For this reason, the moisture proof package is , . The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent , (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal
Nichia
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NCSU034B STS-DA1-1052B NCSU03

STS-DA1-1050B

Abstract: NCSU033B -1050B 4.PACKAGING · The LEDs are packed in cardboard boxes after packaging in moisture proof , catch one's eye directly. · The caution label is attached to the moisture proof foil bag and cardboard , and damage the optical characteristics of the LEDs. For this reason, the moisture proof package is , . The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent , (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal
Nichia
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STS-DA1-1050B NCSU033B
Abstract: . Please observe appropriate precautions during handling and processing. Refer to Avago Application Note , the product and cause premature failure. During assembly or handling, the unit should be held on the , -020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices , , push button, HVAC and ambient decorative lighting applications in automotive interiors. â Avago Technologies
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Abstract: Innovating Illumination TM Opto Technologies InGaN : DDx-xJx Packaging Specification Moisture , + Moisture indicator The reel, moisture absorbent material and moisture indicator are sealed inside , : DDx-xJx DomiLED TM TM Synonymous with function and performance, the DomiLED series is perfectly suited for a variety of cross-industrial applications due to its small package outline, durability and , JEDEC moisture sensitivity Level 2. Compatible to IR reflow soldering. Environmental friendly; RoHS DOMINANT Opto Technologies
Original
Abstract: are packed in cardboard boxes after packaging in moisture proof foil bag. Please refer to "PACKING" on , resistant and therefore must be kept away from water and moisture. · When the LEDs are transported, we , 's eye directly. · The caution label is attached to the moisture proof foil bag and cardboard box. (2) Moisture Proof Package · When moisture is absorbed into the SMT package it may vaporize and expand during , and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof Nichia
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STS-DA1-0892A NC4U133 NC4U13

dominant DDB-UJS-RS1-1

Abstract: : DDx-xJx Packaging Specification Moisture sensitivity level Barcode label DOMINANT LOT NO : lotno , absorbent material and moisture indicator are sealed inside the moisture proof foil bag Label Average , : DDx-xJx DomiLED TM TM Synonymous with function and performance, the DomiLED series is perfectly suited for a variety of cross-industrial applications due to its small package outline, durability and , JEDEC moisture sensitivity Level 2. Compatible to IR reflow soldering. Environmental friendly; RoHS
DOMINANT Opto Technologies
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dominant DDB-UJS-RS1-1

nichia uv led

Abstract: are packed in cardboard boxes after packaging in moisture proof foil bag. Please refer to "PACKING" on , resistant and therefore must be kept away from water and moisture. · When the LEDs are transported, we , 's eye directly. · The caution label is attached to the moisture proof foil bag and cardboard box. (2) Moisture Proof Package · When moisture is absorbed into the SMT package it may vaporize and expand during , and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof
Nichia
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nichia uv led STS-DA1-0894A NC4U134

DDB-UJS-RS1-1

Abstract: dominant DDB-UJS-RS1-1 : DDx-xJx Semiconductors Innovating Illumination Packaging Specification Moisture sensitivity , material + Moisture indicator The reel, moisture absorbent material and moisture indicator are sealed , InGaN : DDx-xJx TM Synonymous with function and performance, the DomiLED series is perfectly suited for a variety of cross-industrial applications due to its small package outline, durability and , according to JEDEC moisture sensitivity Level 2. Compatible to IR reflow soldering. Environmental friendly
DOMINANT Semiconductors
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DDB-UJS-RS1-1 DDb-CJS-pq2-1 DDT-UJS-TU2-1 DDC-UJS-TU1-1
Abstract: : DDx-xJx Packaging Specification Moisture sensitivity level Barcode label DOMINANT LOT NO : lotno , absorbent material and moisture indicator are sealed inside the moisture proof foil bag Label Average , : DDx-xJx DomiLED TM TM Synonymous with function and performance, the DomiLED series is perfectly suited for a variety of cross-industrial applications due to its small package outline, durability and , JEDEC moisture sensitivity Level 2. Compatible to IR reflow soldering. Environmental friendly; RoHS DOMINANT Opto Technologies
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Abstract: , TOKUSHIMA, JAPAN è­¦å'ラベル Warning and Explanatory Labels ã'¢ãƒ«ãƒé˜²æ¹¿è¢' Moisture Proof Foil , packaging or equivalent in transit. 5 NICHIA STS-DA1-1762 TAPE AND REEL DIMENSIONS , ƒ©ãƒ™ãƒ« Warning and Explanatory Labels ã'¢ãƒ«ãƒé˜²æ¹¿è¢' Moisture Proof Foil Bag LE LED æ"¾å , details of the moisture sensitivity levels. ● Interface delamination can occur due to vaporization and , water, moisture and salt air damage. ● This LED also emits visible light. Please take notice of Nichia
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NC4U133A
Abstract: Technologies Innovating Illumination Packaging Specification Moisture sensitivity level Barcode label , Moisture indicator The reel, moisture absorbent material and moisture indicator are sealed inside the , InGaN : DDx-xJx TM Synonymous with function and performance, the DomiLED series is perfectly suited for a variety of cross-industrial applications due to its small package outline, durability and , . Qualified according to JEDEC moisture sensitivity Level 2. Compatible to IR reflow soldering DOMINANT Opto Technologies
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RF-INRA30DS-DC

Abstract: JESD22-A108 :W05004 Packaging specifications ATTENTIO N OBSERVE P RECAUT IO NS F O R HANDLING E LECTRO , %RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with , LEDs to the original moisture proof bag and to reseal the moisture proof bag again. REFOND:WI-E , HANDLING ELECTROSTATIC SENSITIVE DEVICES NOTES: 1. 2. All dimensions are in millimeters (inches , ±10%, d ±2nm, Vf ±0.05V) IFP Conditions: Pulse Width10msec. and Duty 1/10. REFOND:WI-E-045 REV
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RF-INRA30DS-DC JESD22-A108 JESD22-A119 JESD22-B106 JESD22-A101 WI--E--045

smd 4600

Abstract: SMD CODE G7 Packaging Standard" document for more information about shipping and packaging options. Cree LEDs are sold , prevent moisture absorption into SMD LED during the transportation and storage, SMD LED is packed in a moisture barrier bag. Desiccants and a humidity indicator are packed together with SMD LED as the secondary , are not water resistant and they must be kept away from water and moisture. The LEDs are packed in , applications. A wide viewing angle and high brightness make these LEDs suitable for outdoor signage
Cree
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CLD-CT1163 smd 4600 SMD CODE G7 smd transistor G9 transistor 313 smd ED-4701 D-CT1163

RF-GNRA30TS-CF

Abstract: G0500 storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After , gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the , OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES NOTES: 1. 2. All dimensions , Reverse current NOTE: (Tolerance: Iv ±10%, d ±2nm, Vf ±0.05V) IFP Conditions: Pulse Width10msec. and , . 3. When hand soldering, keep the temperature of the iron under 300, and at that temperature keep
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RF-GNRA30TS-CF G0500 G05001

RF-BNB190TS-CD

Abstract: :B01009 Packaging specifications ATTENTIO N OBSERVE P RECAUT IO NS F O R HANDLING E LECTRO , %RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with , LEDs to the original moisture proof bag and to reseal the moisture proof bag again. REFOND:WI-E , 2 OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES 2 NOTES: 1. 2 , ±2nm, Vf ±0.05V) IFP Conditions: Pulse Width10msec. and Duty 1/10. REFOND:WI-E-45 REV:B/0
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RF-BNB190TS-CD WI--E--45

RF-OURA30TS

Abstract: storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After , gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the , OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES NOTES: 1. 2. All dimensions , : Pulse Width10msec. and Duty 1/10. REFOND:WI-E-045 REV:B/2 DATE:2007/02/06 PAGE:3/8 Cat , under 300, and at that temperature keep the time under 3 sec. The hand soldering should be done only a
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RF-OURA30TS RF-OURA30TS-CD O05002

dominant DDB-UJS-RS1-1

Abstract: : DDx-xJx Packaging Specification Moisture sensitivity level Barcode label DOMINANT LOT NO : lotno , absorbent material and moisture indicator are sealed inside the moisture proof foil bag Label Average , : DDx-xJx DomiLED TM TM Synonymous with function and performance, the DomiLED series is perfectly suited for a variety of cross-industrial applications due to its small package outline, durability and , JEDEC moisture sensitivity Level 2. Compatible to IR reflow soldering. Environmental friendly; RoHS
DOMINANT Opto Technologies
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RF-GNB190TS-CF

Abstract: :G01006 Packaging specifications ATTENTIO N OBSERVE P RECAUT IO NS F O R HANDLING E LECTRO , %RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with , LEDs to the original moisture proof bag and to reseal the moisture proof bag again. REFOND:WI-E , 2 OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES 2 NOTES: 1. 2 , ±2nm, Vf ±0.05V) IFP Conditions: Pulse Width10msec. and Duty 1/10. REFOND:WI-E-045 REV:B/0
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RF-GNB190TS-CF
Abstract: storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After , gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the , OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES NOTES: 1. 2. All dimensions , Conditions: Pulse Width10msec. and Duty 1/10. Typical optical characteristics curves REFOND:WI-E , under 300, and at that temperature keep the time under 3 sec. The hand soldering should be done only a -
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RF-YURA30TS-AD Y05003

JESD22-A101

Abstract: JESD22-A103 storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After , gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the , ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES G O B NOTES: 1. 2 , ±10%, d ±2nm, Vf ±0.05V) IFP Conditions: Pulse Width10msec. and Duty 1/10. REFOND:WI-E-045 REV , temperature of the iron under 300, and at that temperature keep the time under 3 sec. The hand soldering
REFOND
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RF-W2SA30BS-A40

intel 04195

Abstract: uBGA device MARKing intel 4.0 4.1 THE µBGA* PACKAGE SHIPPING MEDIA, HANDLING, AND DEVICE MARKINGS Shipping Media , moisture barrier bags (MBB) with a desiccant card and desiccant bags, and finally in a cardboard box. Labels are placed on the individual MBB and the cardboard box which list product name, moisture level , ) QTY: (9D) DATE: Figure 13. Moisture Barrier Bag (MBB) and Box Label 24 ASSEMBLED IN , Figure 14. Tube and Tape Label 4.5 Handling and Floor Life 4.5.1 Handling When manually or
Intel
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intel 04195 uBGA device MARKing intel BGA package tray 40 x 40 T1234567 F800B3 04195 JES22-A112
Abstract: %RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with , proof bag and to reseal the moisture proof bag again. Cal-Chip Electronics, Inc. 59 Steamwhistle Dr , Package Outline 1 1 2 2 OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES , : 800.915.9576 F: 215.942.6400 www.calchip.com Packaging specifications P/N: Label LOT NO: BIN , 250mm x about 250 x about 68mm) and Five inside boxes of maximums are put the outside box (size: about Cal-Chip Electronics
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CC-GST1204TS-BC
Abstract: %RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with , proof bag and to reseal the moisture proof bag again. Cal-Chip Electronics, Inc. 59 Steamwhistle Dr , Outline OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES ATTENTION 1 1 2 2 , : 800.915.9576 F: 215.942.6400 www.calchip.com Packaging specifications P/N: Label LOT NO: BIN , 250mm x about 250 x about 68mm) and Five inside boxes of maximums are put the outside box (size: about Cal-Chip Electronics
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CC-YUT1204TS-AE

JESD22-A101

Abstract: JESD22-A103 storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After , gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the , , InGaP and GaAs 3.50mm×2.80mm×1.90mm SMT-LED RoHS compliant lead-free soldering compatible Package Outline ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES G O B , ±10%, d ±2nm, Vf ±0.05V) IFP Conditions: Pulse Width10msec. and Duty 1/10. REFOND:WI-E-045 REV
REFOND
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RF-W2SA30BS-A56
Abstract: %RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with , LEDs to the original moisture proof bag and to reseal the moisture proof bag again. REFOND:WI-E , , InGaP and AlGaInP 5.30mm×5.00mm×1.60mm SMT-LED RoHS compliant lead-free soldering compatible , ] [5] [6] 1 3 B R G 5 2 4 6 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING , - 10 A (Tolerance: Iv ±10%, d ±2nm, Vf ±0.05V) IFP Conditions: Pulse Width10msec. and Duty REFOND
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RF-W1SA50TS-A40

NC-SMQ230

Abstract: tamura rma soldering. Surface Mount LED Indicators Standard EIA Tape and Reel Packaging Moisture Barrier Envelope , LED components from moisture adsorption during shipping and handling, reels for SMT LED components , . Standard EIA Tape and Reel Packaging SMT LED lamps are packaged tape and reel in accordance with EIA , . Moisture Barrier Envelope Packaging for SMT LED Indicator Components. AXISOFSMTLEDDEVICE , degrade or change reflow characteristics due to moisture absorption and oxidation over time period of 12
Avago Technologies
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NC-SMQ230 tamura rma tamura solder paste rma tamura solder paste tamura solder paste rma-10-61a VISCOSITY tamura solder paste 150SEC 120SEC 100SEC 5989-2268EN AV01-0654EN
Abstract: storing the LEDs, moisture proof packaging with absorbent material is recommended. After opening the , return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again , Outline 1 1 2 2 OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES ATTENTION , , PA 18974 3 T: 800.915.9576 F: 215.942.6400 www.calchip.com Packaging specifications P , ) packed in an inside box (size: about 250mm x about 250 x about 68mm) and Five inside boxes of maximums Cal-Chip Electronics
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CC-OUT1204TS-CE
Abstract: . When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended , moisture proof bag and to reseal the moisture proof bag again. Cal-Chip Electronics, Inc. 59 , Outline 2 1 OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES ATTENTION , : 800.915.9576 F: 215.942.6400 www.calchip.com Packaging specifications PART NO: LOT NO: BIN CODE: IV , with buffer material, and it is packed. (Pare No., Lot No., quantity should appear on the label on the Cal-Chip Electronics
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CC-OURA3528TS-CE
Abstract: used within a year. When storing the LEDs, moisture proof packaging with absorbent material is , material. It is also recommended to return the LEDs to the original moisture proof bag and to reseal the , PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES ATTENTION 1 1 2 2 NOTES: 1. 2. All , www.calchip.com Packaging specifications P/N: Label LOT NO: BIN CODE: QTY: DATE: PCS CAUTIONS , of products are 15,000pcs) packed in an inside box (size: about 250mm x about 250 x about 68mm) and Cal-Chip Electronics
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CC-BNT1204TS-CF

AMY-5M-0003

Abstract: AMY-5M-0 Moisture Sensitivity Levels The Moisture Sensitivity Level (MSL) relates to the packaging and handling , . 19 6.2 Shipment, storage and handling , Devices (ESD) and require special precautions when handling. For more information see the AMY-5M Hardware , -08196-A2 Preliminary Page 17 of 27 AMY-5M - Data Sheet 6 Product handling 6.1 Packaging AMY-5M modules are , of 27 AMY-5M - Data Sheet 6.2 Shipment, storage and handling AMY-5M is designed and packaged
u-blox
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AMY-5M-0003 AMY-5M-0 AMY-5 u-blox gps 2010 u-blox 5 AMY-5M G5-MS5-08196-A2 CH-8800
Abstract: storing the LEDs, moisture proof packaging with absorbent material is recommended. After opening the , return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again , Outline OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES ATTENTION 1 1 2 2 , , PA 18974 3 T: 800.915.9576 F: 215.942.6400 www.calchip.com Packaging specifications P , ) packed in an inside box (size: about 250mm x about 250 x about 68mm) and Five inside boxes of maximums Cal-Chip Electronics
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CC-AUT1204TS-ED
Abstract: %RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with , proof bag and to reseal the moisture proof bag again. Cal-Chip Electronics, Inc. 59 Steamwhistle Dr , PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES ATTENTION 1 1 2 2 NOTES: 1. 2. All , : 800.915.9576 F: 215.942.6400 www.calchip.com Packaging specifications P/N: Label LOT NO: BIN , 250mm x about 250 x about 68mm) and Five inside boxes of maximums are put the outside box (size: about Cal-Chip Electronics
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CC-RUT1204TS-BD

CC-OURA3528TS-CE

Abstract: . When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended , moisture proof bag and to reseal the moisture proof bag again. Cal-Chip Electronics, Inc. 59 , Outline 2 1 OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES ATTENTION , : 800.915.9576 F: 215.942.6400 www.calchip.com Packaging specifications PART NO: LOT NO: BIN CODE: IV , with buffer material, and it is packed. (Pare No., Lot No., quantity should appear on the label on the
Cal-Chip Electronics
Original
Abstract: product and cause premature failure. During assembly or handling, the unit should be held on the body only , qualified as Moisture Sensitive Level 4 per Jedec J-STD-020. Precautions when handling this moisture , AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use ­ Unopen , Power LED Light Source is a high performance energy efficient device which can handle high thermal and , compatible with reflow soldering. To facilitate easy pick and place assembly, the LEDs are also available in Avago Technologies
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2600K 10000K AV02-1449EN
Abstract: product and cause premature failure. During assembly or handling, the unit should be held on the body , is qualified as Moisture Sensitive Level 2 per Jedec J-STD-020. Precautions when handling this , Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage , device which can handle high thermal and high driving current. The exposed pad design has excellent , operation The package is compatible with reflow soldering. To facilitate easy pick and place assembly Avago Technologies
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Intel reflow soldering profile BGA

Abstract: A5832 , the PBGA has greatly reduced coplanarity problems and minimized handling issues. During reflow the , BGA packaging can be used for high-performance applications with high thermal and electrical , Tape and Reel Tape and reel handling is engineered to contain and protect surface mount components in , components are highly sensitive to moisture exposure before the reflow temperature 14-16 2000 Packaging Databook Ball Grid Array (BGA) Packaging exposure. Maintaining proper control of moisture uptake in
Intel
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A5832 JEDEC bga 63 tray Intel BGA pcb warpage in ipc standard Intel reflow soldering profile BGA LEAD FREE cte table epoxy substrate

GPS-SW-09017

Abstract: LEA-6S-0-000 Levels The Moisture Sensitivity Level (MSL) relates to the packaging and handling precautions required , . 20 6.2 Shipment, storage and handling , -09004-C Preliminary Page 19 of 28 LEA-6 - Data Sheet 6 Product handling & soldering 6.1 Packaging LEA , on tape 6.2 Shipment, storage and handling LEA 6 modules are designed and packaged to be processed in an automatic assembly line, and are shipped in Tape-and-Reel. LEA 6 modules are Moisture
u-blox
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LEA-6H-0-000 LEA-6S-0-000 LEA-6A-0-000 LEA-6R-0-000 LEA-6T-0-000 GPS-SW-09017 ISO16750-4 u-blox NEO-6 G6-HW-09004-C

Ublox NEO-6M

Abstract: LEA-6H packaging and handling precautions required. LEA 6 modules are rated at MSL level 4. For MSL standard see , . 20 6.2 Shipment, storage and handling , Product handling & soldering 6.1 Packaging LEA-6 modules are delivered as hermetically sealed, reeled , : Dimensions and orientation for LEA-6 modules on tape 6.2 Shipment, storage and handling LEA 6 modules are , . Appropriate MSD handling instructions and precautions are summarized in Sections 6.2.1 to 6.2.3. Read them
u-blox
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Ublox NEO-6M LEA-6H G6-HW-09004-E LEA-6H-0-001 LEA-6T-1-000
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