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WM7121PIMSE/RV Cirrus Logic Consumer Circuit, CMOS, 3.76 X 2.95 MM, 1.10 MM HEIGHT, 1.70 MM PITCH, HALOGEN AND LEAD FREE, LGA-4 visit Digikey
WM7236IMSE/RV Cirrus Logic Consumer Circuit, CMOS, 4 X 3 MM, 1 MM HEIGHT, 0.90 MM PITCH, HALOGEN AND LEAD FREE, LGA-5 visit Digikey
WM7216IMSE/RV Cirrus Logic Consumer Circuit, CMOS, 4 X 3 MM, 1 MM HEIGHT, 0.85 MM PITCH, HALOGEN AND LEAD FREE, LGA-5 visit Digikey
WM7132PIMSE/RV Cirrus Logic Consumer Circuit, CMOS, 3.76 X 3 MM, 1.10 MM HEIGHT, 0.97 MM PITCH, HALOGEN AND LEAD FREE, LGA-6 visit Digikey
CS496102-CQZ Cirrus Logic 32-Bit AUDIO DSP IC; Package/Case:144-LQFP; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No visit Digikey

moisture handling and packaging

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs The effect of moisture in PSMC packages and , Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs Figure 8-15. Bag Packing for Tape and Reel , Databook 8-15 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs and temperature , Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter , Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs Figure 8-2. Package Crack Mechanism Intel
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822 smd MIL-STD-81705 intel 815 reflow profile MIL-B-81705 cap A5753-01 A5760
Abstract: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs Figure 8-15. Bag Packing for Tape and Reel , Databook 8-15 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs and temperature , Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter , 8-1 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs The effect of moisture in PSMC , , temperature, time and plastic moisture equilibrium solubility. 241187-1 8-2 A5736-01 1999 Packaging Intel
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SMD codes databook SMD CODE databook manufacturing process calcium chloride QFP Shipping Trays MIL-STD-38510 ic shelf life
Abstract: 2 8 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 1/22/97 10:19 AM , publication date) MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS 2 reflow environment , ) MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS 2 leads of insertion mount packages. The , 8.2.3. MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS Thermal Shock on Components , ) MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS 8.3. 2 ULTRASONIC CLEANING OF I.C Intel
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Ultrasonic cleaner circuit diagram intel packaging handbook 240800 MIL-B-81705 PQFP die size INTEL PLCC 68 dimensions tape LEAD FRAME SURFACE MOUNT CH08WIP
Abstract: Shipment, Storage, Packaging and Handling Guidelines Purpose The purpose of this application note , , packaging, handling, and shipment methods that afford suitable ESD protection for its many products. Unit , datasheets found on our website. Ecliptek has engineered storage, packaging, handling, and shipment methods , protected packaging and should be handled as moisture sensitive devices at the customerâ'™s facility and , packaging for use with root cause and corrective action activity. Storage and Handling Guidelines All Ecliptek
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TEN12-001-002
Abstract: and for controlling moisture content via dry-packing and handling procedures. The Challenge While , Package Cracking IPC-SM-786A Procedures for Characterizing and Handling of Moisture/Reflow Sensitive ICs , supplier and the SMT manufacturer. When handling moisture sensitive components, users at SMT assembly , cost of properly handling MBB dry packs and closely monitoring moisture exposure levels. The other , IPC-SM-786A Procedures for Characterizing and Handling of Moisture/Reflow Sensitive ICs IPC Pulse Engineering
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MIL-STD-81075 MIL-D-3464 IPC-4202 JESD22-A113 IPC-SM-786 P-21373
Abstract: strength and resistance to vibration and moisture. Common ways of packaging include wrapping storage , is advantageous in that handling during automatic mounting is simple and packaging density is high , HANDLING SEMICONDUCTOR DEVICES VII. HANDLING SEMICONDUCTOR DEVICES 1. PACKAGING 1.1 STORAGE CASES 1.2 PACKAGING 1.3 RECYCLING MAGAZINES AND PALLETS 2. TRANSPORTATION 3. STORAGE 3.1 NORMAL , , shock and vibration, moisture, and gas that cause damage to them. Devices are likely to break if they Mitsubishi
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Ultrasonic humidifier circuit ultrasonic humidifier humidifier circuit VII-13
Abstract: handling methods to ensure you will not experience manufacturing issues with Lattice products. Moisture Content and Lead Finish Exposure to moisture in the packaging and storage environment can lead to , to packaging, and then vacuum seal units in a Moisture Barrier Bag (MBB) along with desiccant and a , package moisture content and lead finish, as these can lead to difficulties during the circuit board , factor. With proper storage conditions, material handling, and monitoring of material, all of these Lattice Semiconductor
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Date Code restriction On semiconductor date Code J-STD-033 JESD22-B102-C shelf life J-STD-020-A 1-888-ISP-PLDS
Abstract: handling methods to ensure you will not experience manufacturing issues with Lattice products. Moisture Content and Lead Finish Exposure to moisture in the packaging and storage environment can lead to , to packaging, and then vacuum seal units in a Moisture Barrier Bag (MBB) along with desiccant and a , moisture content and lead finish, as these can lead to difficulties during the circuit board manufacturing , . With proper storage conditions, material handling, and monitoring of material, all of these concerns Lattice Semiconductor
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JESD22-B102 jstd for msl 3 PB1146 J-STD-020 1-800-LATTICE
Abstract: performs moisture sensitivity tests according to Procedures for Characterizing and Handling of Moisture , , Inc. Procedures for Characterizing and Handling of Moisture-/Reflow-Sensitive ICs (IPC-SM-786A). New , and Packaging Electronic Circuits, Inc. Recommended Procedures for Handling of Moisture-Sensitive , introduction of moisture, simulation of infrared and vapor-phase reflow, and temperature cycling. Altera cannot , sensitivity to moisture becomes an important issue as board assemblers switch to hotter and faster reflow Altera
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IPC-SM-780 IPC-SM-780 solder paste OVEN RQFP ANSI/IPC-SM-780 ANSI/IPC-SM-786 IPC-TM-650 JESD22-A112
Abstract: Interconnecting and Packaging Electronic Circuits, Inc. Procedures for Characterizing and Handling of Moisture , and analyzed physically with x-ray and acoustic microscopy to gauge their sensitivity to moisture. Altera performs moisture sensitivity tests according to Procedures for Characterizing and Handling of , controlled introduction of moisture, simulation of infrared and vapor-phase reflow, and temperature cycling , non-hermetic package can absorb moisture. Like popcorn, the moisture in some plastic packages can vaporize and Altera
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BGA and QFP Altera Package mounting Solder paste floor life
Abstract: Characterizing & Handling of Moisture-/Reflow-Sensitive ICs (IPC-SM-786A), the standard from the Institute for Interconnecting and Packaging Electronic Circuits, and Moisture/Reflow Sensitivity Classification for , Characterizing and Handling of Moisture-/Reflow-Sensitive ICs (IPC-SM-786A). New York: Institute for , non-hermetic package can absorb moisture. Like popcorn, the moisture in some plastic packages can vaporize and , , which have the most current and reliable information about a device's sensitivity to moisture. When Altera
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J-STD-020A EIA/JEP113-A 800-EPLD
Abstract: , Inc. Procedures for Characterizing and Handling of Moisture-/Reflow-Sensitive ICs (IPC-SM-786A). New , and Packaging Electronic Circuits, Inc. Recommended Procedures for Handling of Moisture-Sensitive , Altera devices to the controlled introduction of moisture, simulation of infrared and vapor-phase reflow , nonhermetic package can absorb moisture. Like popcorn, the moisture in some plastic packages can vaporize and , electrically and analyzed physically with x-ray and acoustic microscopy to gauge their sensitivity to moisture Altera
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Abstract: 300w 300 W or less 20w 20 W or less Packaging Specifications Moisture Resistant Packaging Moisture resistant packaging using an aluminum envelope is used to avoid moisture absorption , condition of moisture resistant packaging for 6 months or longer, or for which 48 hours or longer have elapsed since the moisture resistant packaging was opened, should be baked according to the following , soldering, let the product return to room temperature before handling. Packaging Specifications CIM Citizen Electronics
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Circuit diagram of 25W soldering iron CPT18448 CPT23015 CPT184 CPT230
Abstract: BGA DevicesJ- QFPBGA Institute for Interconnecting and Packaging Electronic Circuits, Inc. Component Packaging and Interconnecting with Emphasis on Surface Mounting (ANSI/IPC-SM-780). New York: Institute for Interconnecting and Packaging Electronic Circuits, Inc., 1988. Institute for Interconnecting and Packaging Electronic Circuits, Inc. Procedures for Characterizing and Handling of Moisture , Institute for Interconnecting and Packaging Electronic CircuitsProcedures for Characterizing & Handling of Altera
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IPC-TM650 Soldering guidelines IPC-SM786AM PCB220
Abstract: APPLICATION NOTE SOLDERING RECOMMENDATIONS and PACKAGING INFORMATION by the Micro Divisions , SOLDERING RECOMMENDATIONS AND PACKAGING INFORMATION The different packages available at , . 2/12 SOLDERING RECOMMENDATIONS AND PACKAGING INFORMATION 2 SMD PRESENTATION Unlike , conditions harder to determine (use of finer structures and higher pin count) Handling SMDs Though the , avoid touching the pins as much as possible. Manual handling could affect lead coplanarity and generate STMicroelectronics
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STMicroelectronics bake time chart water pressure i2c VR02104A AN899/0299
Abstract: PACKAGE HANDLING GUIDE 3.1 Storing and Handling of Pack Products 3.1.1 Moisture Sensitivity Levels , ) Details of Moisture Sensitivity Levels The table 3.1.1 lists the packing and handling methods for , . 3.1.3 Storing and Handling of Simplified Dry Pack Products (Moisture Sensitivity Level 2) (1 , are shown below. · To prevent moisture absorption into packages during transportation and storage by , soldering by specifying the handling method for surface mount packages. The packing and handling methods OKI Electric Industry
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oki qfp tray 750H Oki Moisture Oki Moisture level OKI Year Work Week
Abstract: Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel Reflow Soldering Process Sockets Moisture , conditions, moisture sensitivity standardized test and handling procedures have been published by two , -786A "Procedures for Characterizing and Handling of Moisture/Reflow Sensitive ICs". Available through IPC Phone , DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal , Reflow Package Moisture Sensitivity Levels per J-STD-020 Factory Floor Life Dry Bake Recommendation and Xilinx
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Abstract: necessary packaging, storage and handling guidelines to preclude component package delamination, package , AND8003/D Storage and Handling of Drypacked Surface Mounted Devices (SMD) Prepared by: R. Kampa , moisture sensitive and delivers in a dry pack. Moisture sensitive devices include, but are not limited to , label indicates the bag seal date, the qualified Moisture Sensitivity Level (MSL) of the SMD, and the , , storage and handling requirements when the SMDs are out of dry pack. Table 1 provides the MSL and the ON Semiconductor
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JEDEC J-STD-020d.1 JESD625-a 12MSB17722C AND8003 JEDEC J-STD-033b.1 jedec JESD625-a
Abstract: Specifications Moisture Resistant Packaging Specifications are the same as for the aforementioned CIM Series , resistant packaging for 6 months or longer, or for which a long period has elapsed since the moisture , PR20CPTCPD150CL PR20, CPT Series, CPD150, and CL Series CPT230290 ±0.15mm 300g Mounting (for surface mounting of CPT230 and 290) A chip mounter equipped with an image recognition device is used and the product is mounted with a device accuracy of within ±0.15 mm with respect to the Citizen Electronics
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PR20CPT181 PT23029015 CPT181
Abstract: RS 104 Moisture Resistant Packaging Specifications are the same as for the aforementioned CIM , In consideration of the moisture resistant packaging, mounting of the product is recommended promptly , moisture resistant packaging for 6 months or longer, or for which a long period has elapsed since the moisture resistant packaging was opened, should be baked according to the following conditions prior to use , PR20CPT CL PR20, CPT Series, and CL Series CPT230 Mounting (for surface mounting of CPT230 Citizen Electronics
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