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VF526DT Honeywell Sensing and Control SS520 Series Dual Hall-effect Digital Position Sensor with speed and direction outputs; SOT-89B surface mount package; available in 1,000/tape and reel ri Buy
ISL54209EVAL1Z Intersil Corporation Eval Board for ISL54209 MP3/USB 2.0 High Speed Switch with Negative Signal Handling and Low Power Shutdown ri Buy
ISL54210EVAL1Z Intersil Corporation Eval Board for ISL54210 MP3/USB 2.0 High Speed Switch with Negative Signal Handling/Click and Pop Suppression ri Buy

moisture handling and packaging

Catalog Datasheet Results Type PDF Document Tags
Abstract: Moisture Resistant Packaging Moisture resistant packaging using an aluminum envelope is used to avoid , the moisture resistant packaging, mounting of the product is recommended promptly after opening , Product that has been in a condition of moisture resistant packaging for 6 months or longer, or for which 48 hours or longer have elapsed since the moisture resistant packaging was opened, should be baked , a soldering iron of 25 W or less and keep the temperature of the soldering iron tip to 300 or less. ... Original
datasheet

1 pages,
171.13 Kb

datasheet abstract
datasheet frame
Abstract: taping section of this catalog. 60-12H Packaging Specifications Moisture Resistant Packaging Moisture resistant packaging using an aluminum envelope is used to avoid moisture absorption while the switches are being transported or stored. Disposition When Moisture Has Been Absorbed When switches have absorbed moisture, they should be baked according to the following conditions 60 x 12 hours , Modes Single parts taping LUMISWITCH single parts are taped and delivered. The taping specifications ... Original
datasheet

1 pages,
401.72 Kb

datasheet abstract
datasheet frame
Abstract: section of this catalog. Packaging Specifications Moisture Resistant Packaging Moisture resistant packaging using an aluminum envelope is used to avoid moisture absorption while the switches are being transported or stored. 60-12H Disposition When Moisture Has Been Absorbed When switches have absorbed moisture, they should be baked according to the following conditions. 60 x , Single parts taping LUMISWITCH single parts are taped and delivered. The taping specifications will ... Original
datasheet

1 pages,
193.47 Kb

datasheet abstract
datasheet frame
Abstract: 60� () 100� () 150� () P R 2 0 C L 72CPT18118248 72CPT18118248 CPT23029015 CPT23029015 Packaging Specifications Moisture Resistant Packaging Specifications are the same as for the aforementioned CIM Series, CPI Series, and RS , recommended. Temperature: 5 to 30 Humidity: 60% RH or less In consideration of the moisture resistant packaging , plastic bag. Baking Product that has been in a condition of moisture resistant packaging for 6 months or longer, or for which a long period has elapsed since the moisture resistant packaging was opened ... Original
datasheet

2 pages,
331.17 Kb

PR20CPTCPD150CL CPD150 CPT230290 CPT230 PR20CPTCPD150CL abstract
datasheet frame
Abstract: 10MAX 10MAX 10 seconds MAX 4癈/SEC MAX 105 Packaging Specifications CIM CPI RS 104 Moisture Resistant Packaging Specifications are the same as for the aforementioned CIM Series, CPI Series, and RS , moisture resistant packaging, mounting of the product is recommended promptly after opening the envelope , P T 2 3 0 1 5 Baking Product that has been in a condition of moisture resistant packaging for 6 months or longer, or for which a long period has elapsed since the moisture resistant packaging ... Original
datasheet

2 pages,
176.39 Kb

PR20CPT CPT230 PR20CPT abstract
datasheet frame
Abstract: handling methods to ensure you will not experience manufacturing issues with Lattice products. Moisture Content and Lead Finish Exposure to moisture in the packaging and storage environment can lead to , to packaging, and then vacuum seal units in a Moisture Barrier Bag (MBB) along with desiccant and a , package moisture content and lead finish, as these can lead to difficulties during the circuit board , factor. With proper storage conditions, material handling, and monitoring of material, all of these ... Original
datasheet

2 pages,
16.42 Kb

shelf life JESD22-B102-C J-STD-033 datasheet abstract
datasheet frame
Abstract: handling methods to ensure you will not experience manufacturing issues with Lattice products. Moisture Content and Lead Finish Exposure to moisture in the packaging and storage environment can lead to , to packaging, and then vacuum seal units in a Moisture Barrier Bag (MBB) along with desiccant and a , moisture content and lead finish, as these can lead to difficulties during the circuit board manufacturing , With proper storage conditions, material handling, and monitoring of material, all of these concerns ... Original
datasheet

2 pages,
83.06 Kb

jstd for msl 3 JESD22-B102 J-STD-033 datasheet abstract
datasheet frame
Abstract: and Packaging Electronic Circuits, Inc. Procedures for Characterizing and Handling of Moisture , Institute for Interconnecting and Packaging Electronic Circuits Procedures /Reflow-Sensitive ICs for Characterizing and Handling of MoistureIPC-SM-786A 220 PCB 220 QFP QFP , JJ-QFP Lead & QFP Devices Institute for Interconnecting and Packaging Electronic Circuits, Inc. Component Packaging and Interconnecting with Emphasis on Surface Mounting (ANSI/IPC-SM-780 ANSI/IPC-SM-780). New York ... Original
datasheet

8 pages,
57.78 Kb

JESD22-A112 IPC-TM650 guidelines 780 AC ipc-sm-786A IPC-SM-780 ipc-sm-786 datasheet abstract
datasheet frame
Abstract: within 3 seconds for each connection. 80 Packaging Specifications Moisture Resistant Packaging Moisture resistant packaging using an aluminum envelope is used to avoid moisture absorption , Taping LUMISWITCH parts are taped and delivered. The taping specifications will differ depending , preheating and regular heating. Be careful not to exceed the peak value of 250. The temperature profile in , between the switch and the upper surface of the board will arise depending on the type of board and the ... Original
datasheet

2 pages,
292.13 Kb

datasheet abstract
datasheet frame
Abstract: ) classification. IPC/JEDEC J-STD-033B J-STD-033B: Standard for Handling and Shipping of Moisture/Reflow Sensitive , Moisture barrier bag, MSID and Caution label Figure 1b. Desiccant Figure 1c. HIC 5. Handling , moisture handling of SMDs. For product information and a complete list of distributors, please go to our , Handling Moisture Sensitive Surface Mount LED Application Note 5305 1. Introduction 2. , Moisture from atmospheric humidity enters permeable packaging materials by diffusion. The assembly ... Original
datasheet

5 pages,
244.31 Kb

smds 1A floor life reset J-STD-033B JEDEC J-STD-033b datasheet abstract
datasheet frame

Datasheet Content (non pdf)

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Moisture Sensitivity Integrated Circuit (IC) Storage and Handling: Moisture Sensitivity The plastic packaging used to manufacture surface mount technology devices will absorb moisture from the environment. The high Storage and Handling
www.datasheetarchive.com/files/intel/products one/design/quality/icstor~1/moistu~1.htm
Intel 30/04/1999 9.85 Kb HTM moistu~1.htm
Moisture Sensitivity Integrated Circuit (IC) Storage and Handling: Moisture Sensitivity The plastic packaging used to manufacture surface mount technology devices will absorb moisture from the environment. The high Storage and Handling
www.datasheetarchive.com/files/intel/design/quality/icstor~1/moistu~1-v4-vx2.htm
Intel 30/04/1999 9.85 Kb HTM moistu~1-v4-vx2.htm
Moisture Sensitivity Integrated Circuit (IC) Storage and Handling: Moisture Sensitivity The plastic packaging used to manufacture surface mount technology devices will absorb moisture from the environment. The high Storage and Handling
www.datasheetarchive.com/files/intel/design/quality/icstor~1/moistu~1-v4.htm
Intel 01/02/1999 9.86 Kb HTM moistu~1-v4.htm
Moisture Sensitivity Integrated Circuit (IC) Storage and Handling: Moisture Sensitivity The plastic packaging used to manufacture surface mount technology devices will absorb moisture from the environment. The high Storage and Handling
www.datasheetarchive.com/files/intel/design/quality/icstor~1/moistu~1-v2.htm
Intel 31/07/1998 9.87 Kb HTM moistu~1-v2.htm
Moisture Sensitivity Integrated Circuit (IC) Storage and Handling: Moisture Sensitivity The plastic packaging used to manufacture surface mount technology devices will absorb moisture from the environment. The high Storage and Handling
www.datasheetarchive.com/files/intel/design/quality/icstor~1/moistu~1-v1.htm
Intel 31/10/1998 9.88 Kb HTM moistu~1-v1.htm
Moisture Sensitivity Integrated Circuit (IC) Storage and Handling: Moisture Sensitivity The plastic packaging used to manufacture surface mount technology devices will absorb moisture from the environment. The high Storage and Handling
www.datasheetarchive.com/files/intel/design/quality/icstor~1/moistu~1-v3.htm
Intel 01/02/1999 9.86 Kb HTM moistu~1-v3.htm
Moisture Sensitivity Integrated Circuit (IC) Storage and Handling: Moisture Sensitivity The plastic packaging used to manufacture surface mount technology devices will absorb moisture from the environment. The high Storage and Handling
www.datasheetarchive.com/files/intel/design/quality/icstor~1/moistu~1.htm
Intel 30/04/1998 9.87 Kb HTM moistu~1.htm
Storage and Handling Moisture Sensitivity Integrated Circuit (IC) Storage and Handling: Transport Methods Tape and Reel Waffle Trays Packaging Single Edge Contact (S.E.C.) Cartridge Packaging
www.datasheetarchive.com/files/intel/design/quality/icstor~1/transp~1-v4.htm
Intel 01/02/1999 8.41 Kb HTM transp~1-v4.htm
Storage and Handling Moisture Sensitivity Integrated Circuit (IC) Storage and Handling: Transport Methods Tape and Reel Waffle Trays Packaging Single Edge Contact (S.E.C.) Cartridge Packaging
www.datasheetarchive.com/files/intel/design/quality/icstor~1/transp~1-v4-vx2.htm
Intel 30/04/1999 8.41 Kb HTM transp~1-v4-vx2.htm
Storage and Handling Moisture Sensitivity Integrated Circuit (IC) Storage and Handling: Transport Methods Tape and Reel Waffle Trays Packaging Single Edge Contact (S.E.C.) Cartridge Packaging
www.datasheetarchive.com/files/intel/design/quality/icstor~1/transp~1-v3.htm
Intel 01/02/1999 8.41 Kb HTM transp~1-v3.htm