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Part Manufacturer Description Datasheet BUY
ISL54209IRU1Z-T Intersil Corporation MP3/USB 2.0 High Speed Switch with Negative Signal Handling and Low Power Shutdown; DFN10, uTQFN10; Temp Range: -40° to 85°C visit Intersil Buy
ISL54209IRTZ-T Intersil Corporation MP3/USB 2.0 High Speed Switch with Negative Signal Handling and Low Power Shutdown; DFN10, uTQFN10; Temp Range: -40° to 85°C visit Intersil Buy
ISL54209IRTZ Intersil Corporation MP3/USB 2.0 High Speed Switch with Negative Signal Handling and Low Power Shutdown; DFN10, uTQFN10; Temp Range: -40° to 85°C visit Intersil Buy
ISL54209IRUZ-T Intersil Corporation MP3/USB 2.0 High Speed Switch with Negative Signal Handling and Low Power Shutdown; DFN10, uTQFN10; Temp Range: -40° to 85°C visit Intersil Buy
ISL54209IRUZ-T7A Intersil Corporation MP3/USB 2.0 High Speed Switch with Negative Signal Handling and Low Power Shutdown; DFN10, uTQFN10; Temp Range: -40° to 85°C visit Intersil Buy
ISL54210IRTZ Intersil Corporation MP3/USB 2.0 High Speed Switch with Negative Signal Handling/Click and Pop Suppression; DFN10, uTQFN10; Temp Range: -40° to 85°C visit Intersil Buy

moisture handling and packaging

Catalog Datasheet MFG & Type PDF Document Tags

822 smd

Abstract: MIL-STD-81705 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs The effect of moisture in PSMC packages and , Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs Figure 8-15. Bag Packing for Tape and Reel , Databook 8-15 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs and temperature , Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter , Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs Figure 8-2. Package Crack Mechanism
Intel
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SMD codes databook

Abstract: SMD CODE databook Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs Figure 8-15. Bag Packing for Tape and Reel , Databook 8-15 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs and temperature , Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter , 8-1 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs The effect of moisture in PSMC , , temperature, time and plastic moisture equilibrium solubility. 241187-1 8-2 A5736-01 1999 Packaging
Intel
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SMD codes databook SMD CODE databook 822 smd EQUIVALENCE datasheet for all smd components moisture sensitive handling and packaging MIL-B-81705 cap

intel packaging handbook 240800

Abstract: Ultrasonic cleaner circuit diagram 2 8 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 1/22/97 10:19 AM , publication date) MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS 2 reflow environment , ) MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS 2 leads of insertion mount packages. The , 8.2.3. MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS Thermal Shock on Components , ) MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS 8.3. 2 ULTRASONIC CLEANING OF I.C
Intel
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intel packaging handbook 240800 Ultrasonic cleaner circuit diagram MIL-B-81705 intel 815 reflow profile INTEL PLCC 68 dimensions tape LEAD FRAME SURFACE MOUNT CH08WIP
Abstract: Shipment, Storage, Packaging and Handling Guidelines Purpose The purpose of this application note , , packaging, handling, and shipment methods that afford suitable ESD protection for its many products. Unit , datasheets found on our website. Ecliptek has engineered storage, packaging, handling, and shipment methods , protected packaging and should be handled as moisture sensitive devices at the customerâ'™s facility and , packaging for use with root cause and corrective action activity. Storage and Handling Guidelines All Ecliptek
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TEN12-001-002

G004

Abstract: ipc-sm-786A and for controlling moisture content via dry-packing and handling procedures. The Challenge While , Package Cracking IPC-SM-786A Procedures for Characterizing and Handling of Moisture/Reflow Sensitive ICs , supplier and the SMT manufacturer. When handling moisture sensitive components, users at SMT assembly , cost of properly handling MBB dry packs and closely monitoring moisture exposure levels. The other , IPC-SM-786A Procedures for Characterizing and Handling of Moisture/Reflow Sensitive ICs IPC
Pulse Engineering
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G004 MIL-STD-81075 MIL-D-3464 IPC-4202 JESD22-A113 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE

Ultrasonic humidifier circuit

Abstract: ultrasonic humidifier strength and resistance to vibration and moisture. Common ways of packaging include wrapping storage , is advantageous in that handling during automatic mounting is simple and packaging density is high , HANDLING SEMICONDUCTOR DEVICES VII. HANDLING SEMICONDUCTOR DEVICES 1. PACKAGING 1.1 STORAGE CASES 1.2 PACKAGING 1.3 RECYCLING MAGAZINES AND PALLETS 2. TRANSPORTATION 3. STORAGE 3.1 NORMAL , , shock and vibration, moisture, and gas that cause damage to them. Devices are likely to break if they
Mitsubishi
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Ultrasonic humidifier circuit ultrasonic humidifier humidifier circuit VII-13

On semiconductor date Code

Abstract: Date Code restriction handling methods to ensure you will not experience manufacturing issues with Lattice products. Moisture Content and Lead Finish Exposure to moisture in the packaging and storage environment can lead to , to packaging, and then vacuum seal units in a Moisture Barrier Bag (MBB) along with desiccant and a , package moisture content and lead finish, as these can lead to difficulties during the circuit board , factor. With proper storage conditions, material handling, and monitoring of material, all of these
Lattice Semiconductor
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On semiconductor date Code Date Code restriction shelf life JESD22-B102-C J-STD-033 J-STD-020-A 1-888-ISP-PLDS

Date Code restriction

Abstract: J-STD-033 handling methods to ensure you will not experience manufacturing issues with Lattice products. Moisture Content and Lead Finish Exposure to moisture in the packaging and storage environment can lead to , to packaging, and then vacuum seal units in a Moisture Barrier Bag (MBB) along with desiccant and a , moisture content and lead finish, as these can lead to difficulties during the circuit board manufacturing , . With proper storage conditions, material handling, and monitoring of material, all of these concerns
Lattice Semiconductor
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JESD22-B102 jstd for msl 3 PB1146 J-STD-020 1-800-LATTICE

IPC-SM-780

Abstract: IPC-SM-786 performs moisture sensitivity tests according to Procedures for Characterizing and Handling of Moisture , , Inc. Procedures for Characterizing and Handling of Moisture-/Reflow-Sensitive ICs (IPC-SM-786A). New , and Packaging Electronic Circuits, Inc. Recommended Procedures for Handling of Moisture-Sensitive , introduction of moisture, simulation of infrared and vapor-phase reflow, and temperature cycling. Altera cannot , sensitivity to moisture becomes an important issue as board assemblers switch to hotter and faster reflow
Altera
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IPC-SM-780 IPC-SM-786 RQFP OVEN IPC-SM-780 solder paste ANSI/IPC-SM-780 ANSI/IPC-SM-786 IPC-TM-650 JESD22-A112

IPC-SM-780

Abstract: IPC-SM-786 Interconnecting and Packaging Electronic Circuits, Inc. Procedures for Characterizing and Handling of Moisture , and analyzed physically with x-ray and acoustic microscopy to gauge their sensitivity to moisture. Altera performs moisture sensitivity tests according to Procedures for Characterizing and Handling of , controlled introduction of moisture, simulation of infrared and vapor-phase reflow, and temperature cycling , non-hermetic package can absorb moisture. Like popcorn, the moisture in some plastic packages can vaporize and
Altera
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BGA and QFP Altera Package mounting Solder paste floor life

IPC-SM-786A

Abstract: BGA and QFP Altera Package mounting profile Characterizing & Handling of Moisture-/Reflow-Sensitive ICs (IPC-SM-786A), the standard from the Institute for Interconnecting and Packaging Electronic Circuits, and Moisture/Reflow Sensitivity Classification for , Characterizing and Handling of Moisture-/Reflow-Sensitive ICs (IPC-SM-786A). New York: Institute for , non-hermetic package can absorb moisture. Like popcorn, the moisture in some plastic packages can vaporize and , , which have the most current and reliable information about a device's sensitivity to moisture. When
Altera
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BGA and QFP Altera Package mounting profile J-STD-020A EIA/JEP113-A 800-EPLD

IPC-SM-780

Abstract: , Inc. Procedures for Characterizing and Handling of Moisture-/Reflow-Sensitive ICs (IPC-SM-786A). New , and Packaging Electronic Circuits, Inc. Recommended Procedures for Handling of Moisture-Sensitive , Altera devices to the controlled introduction of moisture, simulation of infrared and vapor-phase reflow , nonhermetic package can absorb moisture. Like popcorn, the moisture in some plastic packages can vaporize and , electrically and analyzed physically with x-ray and acoustic microscopy to gauge their sensitivity to moisture
Altera
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Circuit diagram of 25W soldering iron

Abstract: 300w 300 W or less 20w 20 W or less Packaging Specifications Moisture Resistant Packaging Moisture resistant packaging using an aluminum envelope is used to avoid moisture absorption , condition of moisture resistant packaging for 6 months or longer, or for which 48 hours or longer have elapsed since the moisture resistant packaging was opened, should be baked according to the following , soldering, let the product return to room temperature before handling. Packaging Specifications CIM
Citizen Electronics
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Circuit diagram of 25W soldering iron CPT18448 CPT23015 CPT184 CPT230

IPC-SM-786

Abstract: Soldering guidelines BGA DevicesJ- QFPBGA Institute for Interconnecting and Packaging Electronic Circuits, Inc. Component Packaging and Interconnecting with Emphasis on Surface Mounting (ANSI/IPC-SM-780). New York: Institute for Interconnecting and Packaging Electronic Circuits, Inc., 1988. Institute for Interconnecting and Packaging Electronic Circuits, Inc. Procedures for Characterizing and Handling of Moisture , Institute for Interconnecting and Packaging Electronic CircuitsProcedures for Characterizing & Handling of
Altera
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Soldering guidelines IPC-TM650 IPC-SM786AM PCB220

STMicroelectronics bake time chart

Abstract: water pressure i2c APPLICATION NOTE SOLDERING RECOMMENDATIONS and PACKAGING INFORMATION by the Micro Divisions , SOLDERING RECOMMENDATIONS AND PACKAGING INFORMATION The different packages available at , . 2/12 SOLDERING RECOMMENDATIONS AND PACKAGING INFORMATION 2 SMD PRESENTATION Unlike , conditions harder to determine (use of finer structures and higher pin count) Handling SMDs Though the , avoid touching the pins as much as possible. Manual handling could affect lead coplanarity and generate
STMicroelectronics
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STMicroelectronics bake time chart water pressure i2c VR02104A AN899/0299

oki qfp tray

Abstract: Ultrasonic humidifier circuit PACKAGE HANDLING GUIDE 3.1 Storing and Handling of Pack Products 3.1.1 Moisture Sensitivity Levels , ) Details of Moisture Sensitivity Levels The table 3.1.1 lists the packing and handling methods for , . 3.1.3 Storing and Handling of Simplified Dry Pack Products (Moisture Sensitivity Level 2) (1 , are shown below. · To prevent moisture absorption into packages during transportation and storage by , soldering by specifying the handling method for surface mount packages. The packing and handling methods
OKI Electric Industry
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oki qfp tray Oki Moisture 750H Oki Moisture level OKI Year Work Week

ipc-sm-786A

Abstract: Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel Reflow Soldering Process Sockets Moisture , conditions, moisture sensitivity standardized test and handling procedures have been published by two , -786A "Procedures for Characterizing and Handling of Moisture/Reflow Sensitive ICs". Available through IPC Phone , DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal , Reflow Package Moisture Sensitivity Levels per J-STD-020 Factory Floor Life Dry Bake Recommendation and
Xilinx
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JEDEC J-STD-020d.1

Abstract: JESD625-a necessary packaging, storage and handling guidelines to preclude component package delamination, package , AND8003/D Storage and Handling of Drypacked Surface Mounted Devices (SMD) Prepared by: R. Kampa , moisture sensitive and delivers in a dry pack. Moisture sensitive devices include, but are not limited to , label indicates the bag seal date, the qualified Moisture Sensitivity Level (MSL) of the SMD, and the , , storage and handling requirements when the SMDs are out of dry pack. Table 1 provides the MSL and the
ON Semiconductor
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JEDEC J-STD-020d.1 JESD625-a AND8003 12MSB17722C JEDEC J-STD-033b.1 jedec JESD625-a
Abstract: Specifications Moisture Resistant Packaging Specifications are the same as for the aforementioned CIM Series , resistant packaging for 6 months or longer, or for which a long period has elapsed since the moisture , PR20CPTCPD150CL PR20, CPT Series, CPD150, and CL Series CPT230290 ±0.15mm 300g Mounting (for surface mounting of CPT230 and 290) A chip mounter equipped with an image recognition device is used and the product is mounted with a device accuracy of within ±0.15 mm with respect to the Citizen Electronics
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PR20CPT181 PT23029015 CPT181
Abstract: RS 104 Moisture Resistant Packaging Specifications are the same as for the aforementioned CIM , In consideration of the moisture resistant packaging, mounting of the product is recommended promptly , moisture resistant packaging for 6 months or longer, or for which a long period has elapsed since the moisture resistant packaging was opened, should be baked according to the following conditions prior to use , PR20CPT CL PR20, CPT Series, and CL Series CPT230 Mounting (for surface mounting of CPT230 Citizen Electronics
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