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LTM4600DCM#PBF Linear Technology IC DC/DC UMODULE 10A 104-LGA visit Linear Technology - Now Part of Analog Devices
LTM4601IV-1#2DMPBF Linear Technology IC DC/DC UMODULE 12A 118-LGA visit Linear Technology - Now Part of Analog Devices
LTM4605EV#3CNPBF Linear Technology IC DC/DC UMODULE 5A 141-LGA visit Linear Technology - Now Part of Analog Devices
LTM9004CV-AA#PBF Linear Technology LTM9004 - 14-Bit Direct Conversion Receiver Subsystem; Package: LGA; Pins: 204; Temperature Range: 0°C to 70°C visit Linear Technology - Now Part of Analog Devices Buy
LTM9004IV-AB#PBF Linear Technology LTM9004 - 14-Bit Direct Conversion Receiver Subsystem; Package: LGA; Pins: 204; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTM9004IV-AD#PBF Linear Technology LTM9004 - 14-Bit Direct Conversion Receiver Subsystem; Package: LGA; Pins: 204; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy

land pattern PQFP 132

Catalog Datasheet MFG & Type PDF Document Tags

land pattern PQFP 132

Abstract: PQFP 132 PACKAGE DIMENSION LAND PATTERN DIMENSIONS l~P2l -rp2i- MIN MAX P 17.80 18.00 P1 14.40 14.60 P2 12.35 BSC X .30 , REDRAW TO JEDEC FORMAT 03/13/85 LAND PATTERN DIMENSIONS CEI _L resi - [IN- MIN MAX P 24.50 24.70 , DCN REV DESCRIPHON DATE APPROVED 27663 02 REDRAW TO JEDEC FORMAT 03/15/95 LAND PATTERN DIMENSIONS , PACKAGE DIAGRAM OUTLINES PQFP (Continued) PACKAGE DIAGRAM OUTLINES PQFP (Continued) DWG f , mm PQFP 1.60/.25 MAX FORM DRAWN ^ D1/IB/H CHECKED SIZE C DRAWING No. PSC-4035 REV 04
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land pattern PQFP 132 PQFP 132 PACKAGE DIMENSION N2979 land pattern PQFP 208 MO-112 PQ80- 5U-1982 M0-10B M0-112 PS0-4035 P5C-4049

PA44QF03-44QF

Abstract: PA44QF14C-44QF land pattern on the prototype. Additional QFP Plugs can be purchased separately. Adapter Wiring , the dimension sets listed below: Socket 44QF-03 PQFP 44QF-14C PQFP 44QF-16 PQFP Body , mm typ Pitch 0.8 mm 10.0 mm typ 11.6 mm typ 13.2 mm typ 0.8 mm PA44QF16-44QF 0.8 mm The QFP plug will fit most 44 pin. 0.8mm pitch, QFP land patterns. Usually the pads extend
Logical Systems
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PA44QF03-44QF PA44QF14C-44QF OTQ-44-0 44QXQF QFP 128 pin Socket Enplas Enplas fpq PA44QF 44QF-03-TP 44QF-

m0-112

Abstract: land pattern PQFP 132 LAND PATTERN DIMENSIONS l~P2l -rp2i- MIN MAX P 17.80 18.00 P1 14.40 14.60 P2 12.35 BSC X .30 , REDRAW TO JEDEC FORMAT 03/13/85 LAND PATTERN DIMENSIONS CEI _L resi - [IN- MIN MAX P 24.50 24.70 , PACKAGE DIAGRAM OUTLINES PQFP (Continued) PACKAGE DIAGRAM OUTLINES PQFP (Continued) DWG f , mm PQFP 1.60/.25 MAX FORM DRAWN ^ D1/IB/H CHECKED SIZE C DRAWING No. PSC-4035 REV 04 DO NOT SCALE DRAWING | SHEET 2 OF 2 PACKAGE DIAGRAM OUTLINES PQFP (Continued) I» 1.20 (g>I C
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MO-069 tc 4049

land pattern for TSOP

Abstract: TSOP 86 land pattern © 2004 National Semiconductor Corporation MS011811 www.national.com Land Pattern Recommendations January 2004 Land Pattern Recommendations Plastic Quad Flat Packages (PQFP) 01181102 D D , Land Pattern Recommendations The following land pattern recommendations are provided as , 28.08 28.08 31.62 31.62 0.35 www.national.com 2 Land Pattern Recommendations , SSOP 3 www.national.com Land Pattern Recommendations EIAJ Small Outline, Shrink Small
National Semiconductor
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MA05A land pattern for TSOP TSOP 86 land pattern land pattern for SOP land pattern for TSOP 2 86 land pattern PQFP 100 CSP-9-111C2 CSP-9-111S2

land pattern for SSOP

Abstract: TSOP 86 land pattern Land Pattern Recommendations The following land pattern recommendations are provided as guidelines , MS011811 www.national.com Land Pattern Recommendations August 1999 Land Pattern , 31.62 0.35 www.national.com 2 Land Pattern Recommendations JEDEC Small Outline and , 3 www.national.com Land Pattern Recommendations EIAJ Small Outline, Shrink Small Outline , Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 (5-Lead) and TO-263 (3- or 5-Lead) packages
National Semiconductor
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land pattern for SSOP TSOP 48 Pattern tip 3035 land pattern for TSOP 2 TSOP 44 Pattern MS011811-1

land pattern PQFP 132

Abstract: MS-026 lqfp 80 REVISE I REDRAW 10176 01/26/1994 DEG/HJK D TITLE: LQFP WAS PQFP; UPDATE NOTE 3: ADD GEOMETRIC TOLERANCE 12317 11/30/1999 ACS/MS/RW E ADD LAND PATTERN; UPDATE NOTE 1, TITLE S REFORMAT DWG IN B SIZE PER CURRENT STD 1729 02/16/2005 TL/RW (13.2 TYP (80 X 1.6) â'"I (80X 0.3) (76X 0.5) RECOMMENDED LAND PATTERN DIMENSIONS ARE IN MILLIMETERS DIMENSIONS IN ( ) FOR REFERENCE ONLY APPROVALS DATE fQ National
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MS-026 lqfp 80 MS-026 LAND PATTERN tl 1729 MKT-VHG80A

land pattern PQFP 132

Abstract: MO-108 CURRENT STDS 953 02/05/2003 TL/RW 22 â'" (40X 0.8) (10.2) TYP 13.2 ±0.25 TYP (13.8) TYP 3- 3- 4X (8) m (44X 0.5) Y RECOMMENDED LAND PATTERN 5-16 TOP & BOTTOM 2.45 MAX GAGE PLANE SEATING , National Semiconductor 2900 Semiconductor Dr, Santa Clara, CA 95052-8090 PQFP, JEDEC METRIC, (S),10 X 10
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MO-108 DIMENSIONS PQFP 132 SOMKT-VGZ44A
Abstract: and T Q F P P C B land pattern T Q FP/PQ FP Symbol Cl Cl D1 D2 e Gl G2 N' X Y ZI ZI Description , t Pad w idth Pad length Pad ou ter dim ension Pad outer dim en sion Min Max T h is land pattern acco m m od ates b oth PQFP and TQ FP packages C2 D2 1 5 .9 8 ref. 2 1 9 8 ref. 1 2 .3 5 ref. 1 , d im en sion : m m . N otes on land pattern 1 2 S 4 Pad req u irem ent to acco m m od ate tw o , 0 0 mil Min - 3 2 -pin 3 0 0 mil Min - 28-pin 4 0 0 mil Min 0 132 0 062 0 105 0 024 0.013 0 -
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solder voids to263

Abstract: R/Detector/"detectors+ic"/"CD"/solder voids to263 . At this point in the project it was discovered that the PCB land pattern for the 56L LLP was not , configurations (gull wing, J-bend, and land contact area). 2. Represent a wide range of package body sizes , packages. Table 1: Packages Selected for Board Level Qualification. Package 208L PQFP 84L PLCC 20L , Wing J-Bend J-Bend Gull Wing Gull Wing Land Contact Land Contact PCB Design and Board Level , temperature cycling system. The PCB was designed to accommodate, on each side of the board, four PQFP 208L
National Semiconductor
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solder voids to263 R/Detector/"detectors+ic"/"CD"/solder voids to263 IEC 68-2-32

IEC 68-2-32

Abstract: interface. At this point in the project it was discovered that the PCB land pattern for the 56L LLP was , configurations (gull wing, J-bend, and land contact area). 2. Represent a wide range of package body sizes , Qualification. Package 208L PQFP 84L PLCC 20L PLCC 9L TO-263 5L SC-70 56L LLP 8L LLP Body Size (mm , x 2.5 x 0.75 Lead Configuration Gull Wing J-Bend J-Bend Gull Wing Gull Wing Land Contact Land Contact PCB Design and Board Level Assembly Due to cost considerations, each PCB was designed
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programming smt machine

Abstract: pick and place robot Land Pattern Design The surface mount land patterns, also called footprints or pads, define the sites , or success of SMT is dependent upon the land pattern design. 7-6 1999 Packaging Databook , compounded the problem of standardizing the land pattern. There are a variety of package types offered by , manufacturing problems for SMC users. In this section, general guidelines are presented for land pattern design , pattern designs for reliability. A desirable requirement is that the land pattern design be transparent
Intel
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programming smt machine pick and place robot A5668-01 SURFACE MOUNT RESISTOR tank water level control SMT Process A5660-01 IPC-SM-782

240817

Abstract: SURFACE MOUNT TECHNOLOGY Land Pattern Design The surface mount land patterns, also called footprints or pads, define the sites , or success of SMT is dependent upon the land pattern design. 7-6 1998 Packaging Databook , problem of standardizing the land pattern. There are a variety of package types offered by the industry , manufacturing problems for SMC users. In this section, general guidelines are presented for land pattern design , pattern designs for reliability. A desirable requirement is that the land pattern design be transparent
Intel
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240817 SURFACE MOUNT TECHNOLOGY

D2863-77

Abstract: Plastic Encapsulate Diodes the package is thinner, and the dimensions governing the solder land pattern are different. The , of solder bumps. The bumps are soldered onto a land pattern on a circuit board in the end-use , Leaded Chip Carrier (PLCC) 44Ñ84 leads J-Bend/4 sides Quad Flat Pack (PQFP) 100Ñ240 leads , Land Pad Printed Circuit Board Figure 1: J-bend (on the left) and gull-wing lead formations (on the , PQFP package families include high-performance variations for devices having greater power and speed
Vantis
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D2863-77 Plastic Encapsulate Diodes hermetic packages PCB land bond wire copper cmos methane SENSOR circuit for wind mill

footprint jedec MS-026 TQFP

Abstract: footprint jedec MS-026 LQFP leaded packages. Instead, the package is removed from the board, the land pattern redressed, and a new , assembly to form a bond with a corresponding land pattern of solder pads on the substrate. Traces from , , with industry standards established for both the JEDEC package outline and the IPC land pattern for , a matching land pattern on the circuit board in the end-use application. A solder mask is photo , has been established for both the JEDEC package outline and the IPC land pattern. Figure 2.3
Advanced Micro Devices
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footprint jedec MS-026 TQFP footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 TQFP 44 footprint jedec MS-026 LQFP 64 pin MS-026 BED MO-015 MS-011

Intel reflow soldering profile BGA

Abstract: all ic data achieves more uniform solder paste volume within a given land pattern. 2. Move the hot air solder level at a 45 ° angle to the lands. This achieves more uniform solder volumes within a given land pattern , reflected in the reflow profile. The volume of solder paste on the land is significantly greater than the , affected by the loading pattern and drastic changes in the surrounding environment such as exhaust rate , land, and subsequently wicks up the component lead. Sufficient time must be allocated for foot and
Intel
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Intel reflow soldering profile BGA all ic data infrared heating gun 82425EX 80c196kb 1988 Intel reflow soldering profile BGA intel IPC-SM-786

plx 9030 176-pin pqfp

Abstract: land pattern PQFP 132 . . . . . . . . . . . . . . . . . 12-5 13-2 176-Pin PQFP PCB Layout Suggested Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-2 13-3 176-Pin PQFP Signal and Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . 13-1 13.1. 176-Pin PQFP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-1 13.2. 180
PLX Technology
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plx 9030 176-pin pqfp plx 9030 PCI 9030 BGA 180 PLX Technology pci 9030 PCI9030

pick and place robot

Abstract: land pattern QFP 208 SMT. 7.3. 7.3.1. SURFACE MOUNT DESIGN Land Pattern Design The surface mount land patterns , standardizing the land pattern. There are a variety of package types offered by the industry, and the , for SMC users. In this section, we will present general guidelines for land pattern design that , guidelines are based on manufacturability and environmental testing of different land pattern designs for reliability. A desirable requirement is that the land pattern design be transparent to the soldering process
Intel
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land pattern QFP 208 pick and place robot used for circuit assembling Surface mount SMA connector 300C edge mount sma footprint OMEGA P-M CH07WIP

A5620

Abstract: A5625-01 . Summary of PQFP Electrical Data Lead Count Electrical Parameter 84 Lead PQFP 100 Lead PQFP 132 , circuit consisting of representative elements for the bondwire, the trace, the pin or land, and the , pin/land parasitics include the socket effects. Figure 4-3. Package I/O Signal Lead Model for Multilayer Packages Vccp Bondwire L bw Trace Pin / Land R bw L Pin / Land R Pin / Land , ) 2.47 1.53 1.53 Trace Z_0 (ohms) 42 47 47 Pin/Land R (mohms) 10 10 0
Intel
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A5620 A5625-01 3g call flow CQ DIODE DATABOOK inductive displacement sensors schematic AC inductive proximity sensor IPCSM-785

pick and place robot

Abstract: application of pick place robot SURFACE MOUNT DESIGN Land Pattern Design The surface mount land patterns also called footprints or pads , or success of SMT is dependent upon the land pattern design The lack of standardization of surface mount packages has compounded the problem of standardizing the land pattern There are a variety of , for land pattern design that accommodate reasonable tolerances in component packages process and , different land pattern designs for reliability A desirable requirement is that the land pattern design be
Intel
Original
application of pick place robot qfp 0.4mm land pattern QFP 132 qfp 32 land pattern wired pick and place robot

all ic data

Abstract: Intel reflow soldering profile BGA lands. This will achieve more uniform solder paste volume within a given land pattern. 2. Move the hot , given land pattern. 3. If #1 and/or #2 above are not feasible, specify squeegee & HASL orientations , 35 +5/-0 PQFP 100 132 164 270 280 280 250 250 250 35 +5/-0 35 +5/-0 35 +5/-0 , paste on the land is significantly greater than the plated solder volume on the component lead and is , pattern and drastic changes in the surrounding environment such as exhaust rate and ambient temperature
Intel
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CH09WIP intel 80486 DX4 hot air bga TSOP infrared 28F010 80C196KB
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