500 MILLION PARTS FROM 12000 MANUFACTURERS

DATASHEET SEARCH ENGINE

Top Results

Part Manufacturer Description Datasheet BUY
487378-1 TE Connectivity Ltd 002 HOUSING FFC RCPT 100CL SR visit Digikey
487526-1 TE Connectivity Ltd 002 HOUSING FFC RCPT 100CL SR visit Digikey
T2111020201-000 TE Connectivity (T2111020201-000) HMN-002-FC visit TE Connectivity
T2111020101-000 TE Connectivity (T2111020101-000) HMN-002-MC visit TE Connectivity
1601142-1 TE Connectivity (1601142-1) 159-002-000=TAB,187X020,MMDSMZ visit TE Connectivity
7-1415534-5 TE Connectivity (7-1415534-5) 0410 63 046 002 visit TE Connectivity

jstd 002

Catalog Datasheet MFG & Type PDF Document Tags

JESD 201 class 1A

Abstract: ® eSMP® SeriesV10PN50 J-STD-002 low voltage high frequency DC/DC converters, CHARACTERISTICS MECHANICAL , solderable per J-STD-002 VRRM - halogen-free, RoHS-compliant, and 22-B102 Base P/N-M3 0.40 V VF atJ F , 22-B102 solderable per 260 °C TJIFSM 2 150 °C J-STD-002 and JESD tin plated 1A whisker test , reverse voltage 150 °C TJ max. J-STD-002 and JESD 22-B102 Maximum repetitive A V suffix at I V , please meets JESD 201 10 IF (1) TJ max. 150 °C TJ max. TO-277A (SMPC) 150 °C J-STD-002 and A
Vishay Semiconductors
Original
JESD 201 class 1A V10PN50 V15PN50 VMN-PT0378-1308 DOCUMENT89965 91000TO
Abstract: hours), samples from 4 IPC/EIA/JEDEC J-STD-002 12/0 IPC/EIA/JEDEC J-STD-002 12/0 , Lead Free solder IPC/EIA/JEDEC J-STD-002 6/0 IPC/EIA/JEDEC J-STD-002 6/0 IPC/EIA/JEDEC J-STD-002 6/0 IPC/EIA/JEDEC J-STD-002 6/0 Thermal Shock Thermal Shock samples from Mini-Circuits
Original
AN-00-004 M150261 AN00004

MFSMDF030

Abstract: 0 281 002 472 .No arcing or burning Solderability .ANSI/J-STD-002 , : Standard Au finish: Meets ANSI/J-STD-002 Category 2. Optional Sn finish: Meets ANSI/J-STD-002 Category 3 , Recommended Pad Layout 1.5 ± 0.05 (.059 ± .002) 1.5 ± 0.05 (.059 ± .002) 4.6 ± 0.1 (.181 ± .004) 3.4 ± 0.1
Bourns
Original
MFSMDF030 0 281 002 472 MF-SMDF030 MF-SMDF050 MF-SMDF100 MF-SMDF150 MF-SMDF150/33 MF-SMDF200
Abstract: , FSM solderable 170 Matte RRM Terminals: VF IFSM F Categories I = 5.0 A (A) (V) J-STD-002 and , AF =JESD 201 class 1A whisker test JESD 22-B102 J-STD-002 a (A) (°C) 0.65 V Vmeets 5.0 A F at I M3 suffix0.67 V J-STD-002 and 175at I = 20 A TJ max. E3 suffix me VF °CF 175 °C M3 Vishay General Semiconductor
Original
VMN-PT0340-1411 V10170C V80170PW-M3 000TJ

J-STD-002

Abstract: 180 Ohm, 1 Watt Resistor %
TT Electronics
Original
180 Ohm, 1 Watt Resistor HRISTITEXAS53 TEXAS53
Abstract: .No arcing or burning Solderability .ANSI/J-STD-002 , Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. Optional Sn finish: Meets ANSI/J-STD-002 Category 3. 3.4 ± 0.1 (.134 ± .004) D Recommended Storage: 40 °C max , . 0.30 (0.012) Max. 1.09 (0.043) 1.5 ± 0.05 (.059 ± .002) 1.5 ± 0.05 (.059 ± .002) 4.6 Bourns
Original

iNAND SPEC

Abstract: %
TT Electronics
Original
iNAND SPEC

J-STD-002

Abstract: CA110338 .No arcing or burning Solderability .ANSI/J-STD-002 , solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. Optional Sn finish: Meets ANSI/J-STD-002 , C Recommended Pad Layout 1.5 ± 0.05 (.059 ± .002) 1.5 ± 0.05 (.059 ± .002) 4.6 ± 0.1 (.181 ± .004
Bourns
Original
CA110338 C0804 E174545 MIL-STD-202
Abstract: % TT Electronics
Original
2011/65/EU

J-STD-002

Abstract: 0 281 002 472 .No arcing or burning Solderability .ANSI/J-STD-002 , : Standard Au finish: Meets ANSI/J-STD-002 Category 2. Optional Sn finish: Meets ANSI/J-STD-002 Category 3 , View 1.5 ± 0.05 (.059 ± .002) 1.5 ± 0.05 (.059 ± .002) 4.6 ± 0.1 (.181 ± .004) B MM
Bourns
Original
J-STD-002 95%
Abstract: of ASNSI/J-STD-002. LEAD PULL & BEND TEST: Lead Pull Test: TAPE AND REEL CONFIGURATIONS: IC , RS296E EIA RS468 EIA RS376 EIA RS377 IEC 68 IEC 384 MIL 62 MIL 202 MIL C55514 ANSI/J-STD-002 -
OCR Scan
0-50H ASNSI/J-STD-002 ANSI/J-STD-002
Abstract: .No arcing or burning Solderability .ANSI/J-STD-002 , : Standard Au finish: Meets ANSI/J-STD-002 Category 2. Optional Sn finish: Meets ANSI/J-STD-002 Category 3 , Recommended Pad Layout 1.0 ± 0.05 (.039 ± .002) 1.0 ± 0.05 (.039 ± .002) 1.6 ± 0.1 (.063 ± .004) 2.0 ± 0.1 Bourns
Original
MF-NSMF012 MF-NSMF020 MF-NSMF035 MF-NSMF050 MF-NSMF075 MF-NSMF110
Abstract: .No arcing or burning Solderability .ANSI/J-STD-002 , : Standard Au finish: Meets ANSI/J-STD-002 Category 2. Optional Sn finish: Meets ANSI/J-STD-002 Category 3 , Recommended Pad Layout 1.0 ± 0.05 (.039 ± .002) 1.0 ± 0.05 (.039 ± .002) 1.6 ± 0.1 (.063 ± .004) 2.0 ± 0.1 Bourns
Original
MF-NSMF150

JESD 201 class 1A

Abstract: VWM 22 V to 78 V J-STD-002 and JESD 22-B102 â'¢ Meets MSL level 1, per J-STD-020, LF maximum peak , table otherwise noted) J-STD-002 an 150 °C TJ See next A I A (1) commercial grade Case: °C , , MAX. PEAK PULSE P/NHM3 - JESD 22-B102 halogen-free, and J-STD-002 (2) DEVICE REVERSE CLAMPING , , automotive and telecommunication. CODE AT VWM AT IPPM PARAMETER SYMBO J-STD-002 andSMC3K22CA JESD 22 , incremental surge resistance â'¢ Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
Vishay General Semiconductor
Original
DO-214AB AEC-Q101 SMC3K22CA SMC3K78CA VMN-PT0344-1411 SMC3K22CA-M3/57

MF diode By 127

Abstract: MF-NSMF012 .No arcing or burning Solderability .ANSI/J-STD-002 , : Meets ANSI/J-STD-002 Category 2. Optional Sn finish: Meets ANSI/J-STD-002 Category 3. E , Layout C A 1.0 ± 0.05 (.039 ± .002) 1.0 ± 0.05 (.039 ± .002) 1.6 ± 0.1 (.063 ± .004) B
Bourns
Original
MF diode By 127 jstd 002
Abstract: , and J-STD-002 and JESD22-B102ï'  applications. Surface Mount Trench MOS Barrier Schottky Rectifier , profile - typical heightMatte tin plated leads, TMBS® SlimSMATM applications. J-STD-002 â'¢ Ideal for , ) 0.31 = A J-STD-002 and JESD22-B102 F= A = 125 °C M3 suffix PARAMETERmeets JESD 201 class 1A , °C unless otherwise noted) °C/W 0.8 A = 25 thermal resistance J-STD-002 and JESD22-B102ï'  (2 , MSL level 1, per J-STD-020, drop 260 °C Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C Vishay Semiconductors
Original
VSSAF3L45 VSSAF5L45 DO-221AC JS709A VMN-PT0354-1211 I13-A
Abstract: J-STD-002 grade commercial J-STD-002 and JESD22-B102ï'  grade VF at IF = 0.4 A 0.95 V Terminals , plated 150 °C TJ max. J-STD-002 marked on body Polarity: Asand Polarity: As marked on body J-STD-002 , MSL MSL level per per J-STD-020, level level 1, 1, per 1, J-STD-020, â'¢ Meets categorization: For J-STD-020, of compliance â'¢ Material maximum peak of 260definitions LF LF maximum peakpeak of 260 Vishay Semiconductors
Original
MBL104S MBL106S MBL108S MBL110S MBL104S-M3/I MBL106S-M3/I
Abstract: polarity protection Base P/N-M3 - halogen-free, RoHS-compliant, and J-STD-002 and JESD22-B102ï , leads, TMBS® SlimSMATM applications. J-STD-002 â'¢ Ideal for automated placement and JESD22-B102 , unless otherwise specified) VF THERMAL and JESD22-B102 J-STD-002 0.31 IF = 1.5 A A = 125 °C M3 , 0.8 A = 25 thermal resistance J-STD-002 and JESD22-B102ï'  (2) 12 TARJM °C = 25 650 = tp/T , forward voltage drop â'¢ Low forward voltage LF maximum peak of â'¢ Meets MSL level 1, per J-STD Vishay General Semiconductor
Original
VMN-PT0354-1411 VSSAF5L45-M3/6B VSSAF5L45-M3/6A
Abstract: capacitors meet the solderability requirements of ANSI/J-STD 002. Flow soldering can be used when the above , E.I.A. RS296D E.I.A. RS468A MIL-202F J.I.S.-C-5141 I.E.C. Standards ANSI/J-STD-002 CLEANING -
OCR Scan
100WVDC 0-50HZ

polyswitch u110

Abstract: rxe300 LVR005 - 0.08 0.06 0.05 0.05 0.04 0.04 0.03 0.03 0.02 - New LVR008 , 0.02 - RXE010 0.16 0.14 0.11 0.10 0.096 0.08 0.072 0.067 0.05 0.04 , [0.52mm2 (20)] RUE600 6.0 12.0 30 - 40 3.5 30.0 16.0 0.005 0.02 0.04 , 0.005 0.02 0.03 R13, R15, R16 [0.52mm2 (20)] RUE800 8.0 16.0 30 - 40 4.0 40.0 18.8 0.005 0.013 0.02 R13, R15, R16 [0.52mm2 (20)] RUE900 9.0 18.0
Raychem Circuit Protection
Original
TR600 TR250 polyswitch u110 rxe300 polyswitch u250 x030 PolySwitch polyswitch application notes RUE300 IEEE-1394 265VAC
Showing first 20 results.