L177SDE09SA4CH4FG
Amphenol Communications Solutions
Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=8.08mm (0.318in), Row Pitch 2.84mm, 09 Socket, 0.38m (15in) Gold, Bright Tin Shell, 4-40 Front Screwlock, Ground Tab with Boardlock, G=Green Insulator
L177HDE15SD0CH4RBL
Amphenol Communications Solutions
Dsub, Stamped Signal 3A, Right Angle PCB Thru Hole, FP=1.5mm (0.059\\), 15 Socket, Bright Tin Shell, 0.38um (15u\\) Gold, 4-40 Rear Insert, Ground Tab with Boardlock, Blue Insulator
L177HDE15SD4CH4FBL
Amphenol Communications Solutions
Dsub, Stamped Signal 3A, Right Angle PCB Thru Hole, FP=3.08mm (0.121\\), 15 Socket, Bright Tin Shell, 0.38um (15u\\) Gold, 4-40 Removable Front Screwlock, Ground Tab with Boardlock, Blue Insulator
ISO7731FBDW
Texas Instruments
High-speed basic insulation triple-channel digital isolator 16-SOIC -55 to 125
ISO7731FBDWR
Texas Instruments
High-speed basic insulation triple-channel digital isolator 16-SOIC -55 to 125
ISO7731BDW
Texas Instruments
High-speed basic insulation triple-channel digital isolator 16-SOIC -55 to 125