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iec 807-3

Catalog Datasheet MFG & Type PDF Document Tags

IEC 60603-7

Abstract: iec 807-3 IEC 807-3 IEC 807-3 IEC 807-3 ERNI D : 3.6 7.3 D ERNI ( ) : 3.6 , IEC 807-3 I/O D IEC 807-3 IEC 807-3 IEC 807-3 DEMC Systems Housings D , , 50 9, 15, 25, 37 9, 15, 25, 37 9, 15, 25, 37, 50 IDC IDC IEC 807-3 IEC 807-3 IEC 807-3 IEC 807-3 / ERNI9, 15, 25, 37 AWG 26AWG 281.27 IDC 937 , , 5W5, 8W8, 3WK3 3W3, 3WK3 IEC 807-3 IEC 807-3 ERNI D : 3W3, 5W5, 8W8, 3WK3
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IEC 60603-7 iec 807-3 ERNI RJ45 IEC 60603-13 ERNI 26 nF-47 M8/M12 2000CECC 6U418

DIN 41 652/IEC 807-3

Abstract: L177HDEH15SOL2RM8 L717SDA15PC309 L717SDB25PC309 L717SDC37PC309 Performance levels as per DIN 41 652/IEC 807-3 Amphenol , Performance levels as per DIN 41 652/IEC 807-3 Amphenol InfoCom Europe www.amphenol-online.com , DIN 41 652/IEC 807-3 Amphenol InfoCom Europe www.amphenol-online.com PRELIMINARY RELEASE 8 , levels as per DIN 41 652/IEC 807-3 Amphenol InfoCom Europe www.amphenol-online.com PRELIMINARY , levels as per DIN 41 652/IEC 807-3 Amphenol InfoCom Europe www.amphenol-online.com PRELIMINARY
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L77SDE09SA4CH4R DIN 41 652/IEC 807-3 L177HDEH15SOL2RM8 l77sdeh09sol2rm8 L77SDB25S1ACH4F L77HDE15SD1CH4R 7SDE09S1ACH4R L77SDE09S1ACH4RC309 L77SDE09SA4CH3F L77SDE09SA4CH3FC309 L77SDE09SA4CH3R L77SDE09SA4CH3RC309

D-Sub

Abstract: DIN 41652 loch Schichtaufbau im metallisierten Loch für D-Sub Steckverbinder nach IEC 807-3 / DIN 41652 Plated-thru-hole specification for D-Sub connectors acc. to IEC 807-3 / DIN 41652 Schichtaufbau im metallisierten , Schichtaufbau im metallisierten Loch für D-Sub Steckverbinder nach IEC 807-3 / DIN 41652 Plated-thru-hole specification for D-Sub connectors acc. to IEC 807-3 / DIN 41652 Schichtaufbau im metallisierten Loch (IEC , . 2 Schichtaufbau im metallisierten Loch für D-Sub Steckverbinder nach IEC 807-3 / DIN 41652
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D-Sub DIN 41652 loch 60352-5 IEC 60352-5 DIN 41652 hole 60352

IEC 60603-7

Abstract: IEC60603-13 , solder IEC 807-3 IEC 807-3 IEC 807-3 D-Sub D-Sub IDC D-Sub IDC D-Sub , , solder IDC IDC Crimp IEC 807-3 IEC 807-3 IEC 807-3 IEC 807-3 ERNI D-Sub , Edition 4, 10/08 ERmet® 2 mm ERNIERmet ERNI ERmet IEC , IEC 61076-4-101 1Gbit/s 7(52+ )ERmet 7 2mm : AA22BB19 B22CABLMN 11 PCB , Pressfit technology Pressfit technology Pressfit technology THR IEC 61076-4-101 IEC
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IEC60603-13 erni minibridge 1.27 IEC60603-2 DIN 41612 ERNI erni MINIBRIDGE TE160 ERNIISO9001

ERNI 024069

Abstract: DIN 41652 part 2 ERNI Part Number 003633 Category Connectors Family D-Sub Connectors acc. to IEC 807-3 / DIN 41652 , Part Number 013699 Category Connectors Family D-Sub Connectors acc. to IEC 807-3 / DIN 41652 Type , Family Type Number 205205-1 Number 014178 Connectors D-Sub Connectors acc. to IEC 807-3 / DIN , 207463-1 Number 014180 Connectors D-Sub Connectors acc. to IEC 807-3 / DIN 41652 Cable Connectors , D-Sub Connectors acc. to IEC 807-3 / DIN 41652 Type Cable Connectors: Male Crimp Snap-in Product Info
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ERNI 024069 DIN 41652 part 2 014-730 98317G-064-2MMF 6ES7972-0BA10-0XA0 erni 413864 FHB032-10

iec 807-3

Abstract: MIL-C-24308 Trapezoidal-Connectors Series TMC Subminiature-D Connectors to DIN 41 652/IEC 807-3 General Series TMC connectors are available in 5 different housing sizes with 9, 15, 25, 37 and 50 pins. In applications these connectors are frequently used for interface connections. Owing to the various sizes of , data sheets available. Performance Levels 207 to DIN 41 652/IEC 807-3 MIL-C-24308, CCTU 08-14 and , terminal zone gold-plated 107 to DIN 41 652/IEC 807-3 MIL-C-24308, CCTU 08-14 and IEC-Recommendation 48 B
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652/IEC

DIN 41 652/IEC 807-3

Abstract: L17DEFRA09PC309 levels as per DIN 41 652/IEC 807-3 Amphenol InfoCom Europe www.amphenol-online.com 10 , levels as per DIN 41 652/IEC 807-3 Amphenol InfoCom Europe www.amphenol-online.com 11
Amphenol InfoCom Europe
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L17DEFRA09P L17DAFRA15P L117DEFRA09P L117DBFRA25P L17DEFRA09PC309 L17DAFRA15PC309 50 c 16 D1016 L17D UL94V-0 L17DBFRA25P L17DCFRA37P

10R-02

Abstract: 10P10 Cre e p ag e / c l e aranc e d i stan c e s A sse mb l y p ro c e ss a) Contact - contact IEC 807-3 0,52 mm T ray P ackagi ng b) Co ntact - she ll IEC 807-3 min. 1. 0 mm So lde r te mpe rature , de scri pti o n C5210 (acc. JIS) Inse rtio n/ wi thdrawal fo rce IEC 603-7 Contact finish, mating zone Thickness of plating 30 µin Au over 50 µin Ni Mechanical operations IEC 512-5, 9a min. 1.000 , connector co upli ng de vi ce IEC 512-8, 15f 50 N . She ll/shi e ld mate ri al Standard de scri pti o n
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C2680 10P10C 10R-02 10P10 DY 645 E145613

C2680

Abstract: C5210 ) coupling device IEC 512-8, 15f 50 N 50 µin Ni El e c tri cal p ro p e rti e s Cre e p ag e / cl e arance d i stanc e s a) Contact - contact IEC 807-3 0,52 mm Tray b) Contact - shell IEC 807-3 min , C5210 (acc. JIS) Insertion/withdrawal force IEC 603-7 max. 20 N see chart Mechanical operations IEC , ) Contact - contact IEC 512-2, 4a min. 1.000 V AC/DC b) Contact - shell/testpanel IEC 512-2, 4a min. 1.500 V AC/DC Current carrying capacity IEC 512-3, 5b 1,5 A @ 25° C V0 Contact resistance IEC
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Abstract: max. 20 N Inse rtio n/withdrawal fo rce IEC 603-7 Mechanical operations IEC 512-5, 9a min. 1.000 Effectiveness of connector co upling de vice IEC 512-8, 15f 50 N El e c tri c al p ro p e rti e s Cre e p ag e / c l e aran c e d i stan c e s a) Contact - contact IEC 807-3 0,52 mm b) Co ntact - she ll min. 1,0 mm IEC 807-3 Vo l tag e p ro o f (Di e l e c tri c Wi th stan d Vo l tag e ) a) Co ntact - co ntact IEC 512-2, 4a mi n. 1.000 V AC/ DC b) Contact - shell/testpanel IEC 512-2, 4a min. 1.500 V AC/DC ERNI
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Abstract: contact IEC 807-3 0,52 mm A sse mb l y p ro c e ss b) Co ntact - she ll IEC 807-3 mi n. 1,0 mm P , ani c al p ro p e rti e s . Co ntact mate ri al Inse rti o n/ wi thdrawal fo rce IEC 603-7 , 50 µin Ni Mechanical operations IEC 512-5, 9a min. 1.000 Contact finish termination zone , upling de vice IEC 512-8, 15f Standard de scri pti o n N .A. 50 N Shell/shield plating Thickness of , te mpe rature a) Co ntact - co ntact IEC 512-2, 4a Suitable asse mbly pro ce ss wave min. 1. 000 ERNI
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Abstract: IEC 512-8, 15f Electrical properties Creepage / clearance distances a) Contact - contact IEC 807-3 b) Contact - shell IEC 807-3 Voltage proof (Dielectric Withstand Voltage) a) Contact - contact IEC 512-2, 4a min. b) Contact - shell/ testpane IEC 512-2, 4a min. Current carrying capacity IEC 512-3, 5b Contact resistance IEC 512-2, 2a max. Insulation resistance IEC 512-2, 3a min , GREEN 203536 Std. applicable IEC 603-7 max. 20 N IEC 512-5, 9a min. 1.000 Copyright by ERNI ERNI
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LDE 500

Abstract: MJLS y p ro c e ss a) Contact - contact IEC 807-3 0,52 mm T ray P ackaging b) Co ntact - she ll IEC 807-3 min. 0, 1 mm So lde r te mpe rature 235°C at 10s Vo l tag e p ro o f (Di e l e c tri c , IEC 603-7 max. 20 N Contact finish, mating zone Thickness of plating 30 µin Au over 50 µin Ni Mechanical operations IEC 512-5, 9a min. 1.000 Contact finish termination zone Thickness of plating 80 µin , C2680 ( acc. JIS ) co upling de vice IEC 512-8, 15f 50 N Shell/shield plating Thickness of plating
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LDE 500 MJLS

CuZn32

Abstract: ) Contact - contact IEC 807-3 0,52 mm Tray b) Contact - shell IEC 807-3 min. 0,1 mm 260°C at 3-5s Vo l tag e p ro o f (Di e l e c tri c Wi thstan d Vo l tag e ) reflow a) Contact - contact IEC 512-2, 4a min. 1.000 V AC/DC b) Contact - shell/testpanel IEC 512-2, 4a min. 1.500 V AC/DC Current , /withdrawal force IEC 603-7 max. 20 N 30 µin Au over 50 µin Ni Mechanical operations IEC 512-5, 9a min. 1.000 80 µin matte Sn over 50 µin Ni Effectiveness of connector CuZn32 coupling device IEC 512-8
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CuZn32
Abstract: ) coupling device IEC 512-8, 15f 50 N 50 µin Ni El e c tri c al p ro p e rti e s Cre e p ag e / c l e aranc e d i stan c e s a) Contact - contact IEC 807-3 0,52 mm Tray b) Contact - shell IEC 807-3 , (acc. JIS) Insertion/withdrawal force IEC 603-7 max. 20 N see chart Mechanical operations IEC , ) Contact - contact IEC 512-2, 4a min. 1.000 V AC/DC b) Contact - shell/testpanel IEC 512-2, 4a min. 1.500 V AC/DC Current carrying capacity IEC 512-3, 5b 1.5 A @ 25° C V0 Contact resistance IEC ERNI
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Abstract: mb l y p ro c e ss a) Contact - contact IEC 807-3 0,52 mm T ray b) Co ntact - she ll IEC 807-3 min. 0 , fo rce IEC 603-7 Co ntact mate rial max. 20 N Contact finish, mating zone Thickness of plating 30 µin Au over 50 µin Ni Mechanical operations IEC 512-5, 9a min. 1.000 Contact finish termination zone , CuZn32 co upling de vice IEC 512-8, 15f 50 N She ll/shie ld mate rial El e c tri c al p ro p e rti e s , IEC 512-2, 4a b) Contact - shell/testpanel IEC 512-2, 4a min. 1.500 V AC/DC A p p ro v al s Current ERNI
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Abstract: p ro c e ss a) Contact - contact IEC 807-3 1,02 mm P ackaging T ray b) Co ntact - she ll IEC 807-3 4 , Phosphor Bronze Insertion/withdrawal force IEC 603-7 max. 20 N Contact finish, mating zone Thickness of plating 50 µin Au over 50 µin Ni Mechanical operations IEC 512-5, 9a > 500 Contact finish termination zone , Standard de scri pti o n CuZn 88 N co upling de vice IEC 512-8, 15f Shell/shield plating Thickness of , °C Suitable asse mbly pro ce ss min. 900 V AC Re flo w a) Co ntact - co ntact IEC 512-2, 4a b) Contact - shell ERNI
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C5210

Abstract: de vice IEC 512-8, 15f 50 N Thickness of plating 50 µin Ni El e c tri c al p ro p e rti e s Cre e p ag e / c l e aran c e d i stanc e s a) Contact - contact IEC 807-3 0,52 mm Bag b) Co ntact - she ll IEC 807-3 min. 1,0 mm N . A. Vo l tag e p ro o f (D i e l e c tri c Wi th stan d Vo l tag e , Standard de scri pti o n C5210 (acc. JIS) max. 20 N Inse rtio n/withdrawal fo rce IEC 603-7 Thickness of plating 30 µin Au over 50 µin Ni Mechanical operations IEC 512-5, 9a min. 1.000 T hi ckne ss o f
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SUS301

752 48 09 ng

Abstract: C5210 ) co upli ng de vi ce IEC 512-8, 15f 50 N Thickness of plating N.A. El e c tri c al p ro p e rti e s Cre e p ag e / c l e aran c e d i stan ce s a) Contact - contact IEC 807-3 0,52 mm Bag b) Co ntact - she ll IEC 807-3 min. 1,0 mm N .A. Vo l tag e p ro o f (D i e l e c tri c Wi th stan d Vo l , e rti e s . Standard description C5210 (acc. JIS) Insertion/withdrawal force IEC 603-7 max. 20 N Thickness of plating 30 µin Au over 50 µin Ni Mechanical operations IEC 512-5, 9a min. 1.000 Effe cti ve
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752 48 09 ng 740 48 09 ng

C2680

Abstract: C5210 Insertion/withdrawal force IEC 603-7 max. 20 N Mechanical operations IEC 512-5, 9a min. 1.000 Effectiveness of connector coupling device IEC 512-8, 15f 50 N El e c tri c al p ro p e rti e s Cre e p ag e / c l e aran ce d i stan c e s a) Contact - contact IEC 807-3 0,52 mm b) Contact - shell IEC 807-3 min. 1,0 mm Vo l tag e p ro o f (D i e l e c tri c Wi th stan d Vo l tag e ) a) Contact - contact IEC 512-2, 4a min. 1.000 VDC/VAC b) Contact - shell/testpanel IEC 512-2, 4a min. 1.500 VDC/VAC
ERNI
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