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hand soldering of CDR32

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is , soldering components, must be spaced sufficiently far apart to avoid bridging or shadowing (inability of , temperature differential from preheat to soldering of 150°C. In all other cases this differential should not , are designed for soldering to printed circuit boards or other substrates. The construction of the , substrate. AVX terminations are suitable for all wave and reflow soldering systems. If hand soldering ... AVX
Original
datasheet

12 pages,
291.32 Kb

CDR35 CDR33 CDR32 CDR31 08055A101JAT2A hand soldering of CDR33 hand soldering of CDR32 MIL-PRF-55681 TEXT
datasheet frame
Abstract: hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools , common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these , be allowed to enable rework should it be required. Preheat & Soldering The rate of preheat should , temperature differential from preheat to soldering of 150°C. In all other cases this differential should not , for soldering to printed circuit boards or other substrates. The construction of the components is ... AVX
Original
datasheet

22 pages,
307.94 Kb

CDR35BX CDR31BP1R0B- cecc32101801 CECC32101-801 CDR31 CDR35 MIL-PRF-55681 TEXT
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Abstract: systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air , movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is: · Pad width , soldering of 150°C. In all other cases this differential should not exceed 100°C. For further specific , are designed for soldering to printed circuit boards or other substrates. The construction of the ... AVX
Original
datasheet

19 pages,
416.74 Kb

CDR35 CDR33 CDR32 CDR31 capacitor 47 nano failure rate avx 0201 ceramic capacitor MIL-PRF-55681 TEXT
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Abstract: soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is: · Pad width equal to component width. It , soldering but sufficient space must be allowed to enable rework should it be required. The rate of , permissible to allow a temperature differential from preheat to soldering of 150°C. In all other cases this , temperature for lead-free wave soldering is 250°C-260 C-260°C for 3-5 seconds. The other parameters of the profile ... AVX
Original
datasheet

18 pages,
250.22 Kb

BX 330 transistor capacitor 47 nano capacitor cross reference CDR31 CDR32 CDR33 CDR35 hand soldering of CDR32 failure rate avx 0201 ceramic capacitor hand soldering of CDR33 MIL-PRF-55681 TEXT
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Abstract: component movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is: · Pad , generally permissible to allow a temperature differential from preheat to soldering of 150°C. In all other , for all wave and reflow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Cooling 300 200 It is important to ... AVX
Original
datasheet

18 pages,
250.42 Kb

hand soldering of CDR33 CDR35 CDR33 CDR32 CDR31 capacitor 47 nano capacitor cross reference hand soldering of CDR32 MIL-PRF-55681 TEXT
datasheet frame
Abstract: component movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is: • Pad , preheat to soldering of 150°C. In all other cases this differential should not exceed 100°C. For , are designed for soldering to printed circuit boards or other substrates. The construction of the , avoid the possibility of thermal shock during soldering and carefully controlled preheat is therefore ... AVX
Original
datasheet

18 pages,
285.97 Kb

CDR31 CDR35 MIL-PRF-55681 TEXT
datasheet frame
Abstract: movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is: • Pad width , is generally permissible to allow a temperature differential from preheat to soldering of 150 , substrate. AVX terminations are suitable for all wave and reflow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Cooling ... AVX
Original
datasheet

18 pages,
240.93 Kb

CDR31 CDR35 MIL-PRF-55681 TEXT
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Abstract: peeling of end terminal Measuring Conditions After soldering devices to circuit board apply 5N (0.51kg , AVX Multilayer Ceramic Chip Capacitor Ceramic Chip Capacitors Table of Contents Basic , Military Part Number Identification (CDR32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , 31 Packaging of Chip Components Automatic Insertion Packaging . . . . . . . . . . . . . . . . . . . , ) T.C. = Ct ­ C25 x 106 C25 (Tt ­ 25) III. Linear charge of a capacitor (Amperes) dV I=C dt XV ... AVX
Original
datasheet

46 pages,
644.75 Kb

Silver mica capacitor 68pf 100V 10uf elco 100v 1nF 2000V X7R 3300 XL capacitor 50v 4700 uF datasheet elco CDR02 CDR31 CDR32 CDR35 08055A101JAT2A 27NF 500V elco 330 u MIL-PRF-55681 CECC32101 TEXT
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Abstract: peeling of end terminal Measuring Conditions After soldering devices to circuit board apply 5N (0.51kg , AVX Multilayer Ceramic Chip Capacitor Ceramic Chip Capacitors Table of Contents Basic , Military Part Number Identification (CDR32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , 31 Packaging of Chip Components Automatic Insertion Packaging . . . . . . . . . . . . . . . . . . . , ) T.C. = Ct ­ C25 x 106 C25 (Tt ­ 25) III. Linear charge of a capacitor (Amperes) dV I=C dt XV ... AVX
Original
datasheet

46 pages,
395.05 Kb

08055A101JAT2A 1nF 2000V X7R capacitor 1nf 500v 1812 x7r CDR02 CDR31 CDR32 CDR35 elco 330 u MIL-PRF-55681 CECC32101 Silver mica capacitor 68pf 100V TEXT
datasheet frame
Abstract: peeling of end terminal Measuring Conditions After soldering devices to circuit board apply 5N (0.51kg , AVX Multilayer Ceramic Chip Capacitor Ceramic Chip Capacitors Table of Contents Basic , Military Part Number Identification (CDR32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , 31 Packaging of Chip Components Automatic Insertion Packaging . . . . . . . . . . . . . . . . . . . , ) T.C. = Ct ­ C25 x 106 C25 (Tt ­ 25) III. Linear charge of a capacitor (Amperes) dV I=C dt XV ... AVX
Original
datasheet

46 pages,
395.07 Kb

CDR35 CDR33 Reliability data CDR32 CDR31 CDR02 3300 XL TEXT
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