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LT1074HVCT7#44 Linear Technology Step-Down Switching Regulator; Package: TO-220; No of Pins: 7; Temperature Range: 0°C to +70°C ri Buy
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hand soldering of CDR32

Catalog Datasheet Results Type PDF Document Tags
Abstract: of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is , soldering components, must be spaced sufficiently far apart to avoid bridging or shadowing (inability of , temperature differential from preheat to soldering of 150°C. In all other cases this differential should not , are designed for soldering to printed circuit boards or other substrates. The construction of the , substrate. AVX terminations are suitable for all wave and reflow soldering systems. If hand soldering ... Original
datasheet

12 pages,
291.32 Kb

CDR35 CDR33 CDR32 CDR31 hand soldering of CDR33 MIL-PRF-55681 CDR31 abstract
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Abstract: reflow soldering. The basis of these designs is: · Pad width equal to component width. It is , soldering but sufficient space must be allowed to enable rework should it be required. The rate of , permissible to allow a temperature differential from preheat to soldering of 150°C. In all other cases this , thermal shock during soldering and carefully controlled preheat is therefore required. The rate of , increases. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder to give a ... Original
datasheet

19 pages,
416.74 Kb

CDR35 CDR33 CDR32 CDR31 capacitor 47 nano failure rate avx 0201 ceramic capacitor MIL-PRF-55681 CDR31 abstract
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Abstract: systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air , component movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is: · Pad , soldering of 150°C. In all other cases this differential should not exceed 100°C. For further specific , soldering and carefully controlled preheat is therefore required. The rate of preheat should not exceed 4°C ... Original
datasheet

18 pages,
250.22 Kb

BX 330 transistor capacitor 47 nano capacitor cross reference CDR31 CDR32 CDR33 CDR35 hand soldering of CDR32 failure rate avx 0201 ceramic capacitor hand soldering of CDR33 MIL-PRF-55681 CDR31 abstract
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Abstract: component movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is: · Pad , generally permissible to allow a temperature differential from preheat to soldering of 150°C. In all other , for all wave and reflow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Cooling 300 200 It is important to ... Original
datasheet

18 pages,
250.42 Kb

hand soldering of CDR33 CDR35 CDR33 CDR32 CDR31 capacitor 47 nano capacitor cross reference hand soldering of CDR32 MIL-PRF-55681 CDR31 abstract
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Abstract: movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is: · Pad width equal to , rework should it be required. Preheat & Soldering The rate of preheat should not exceed 4°C/second to , from preheat to soldering of 150°C. In all other cases this differential should not exceed 100°C. For , soldering to printed circuit boards or other substrates. The construction of the components is such that ... Original
datasheet

22 pages,
307.94 Kb

CECC32101-801 CDR35BX CDR31BP1R0B- cecc32101801 CDR31 CDR35 MIL-PRF-55681 CDR31 abstract
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Abstract: AVX Multilayer Ceramic Chip Capacitor Ceramic Chip Capacitors Table of Contents Basic , (CDR32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Packaging of Chip Components , Linear charge of a capacitor (Amperes) dV I=C dt XV. Cap Drift (%) C1 ­ C2 C.D. = C1 IV. Total Impedance of a capacitor (ohms) Z = RS + (XC - XL ) V. Capacitive Reactance (ohms) 1 xc = 2 ... Original
datasheet

49 pages,
683.25 Kb

08055A101JAT2A CDR31 CDR32 CDR35 CECC32101-801 specification MIL-C-55681 MIL-PRF 10 micro farad 16V capacitor z5u .05 rf-microwave components capacitor 50v 4700 uF elco datasheet abstract
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Abstract: AVX Multilayer Ceramic Chip Capacitor Ceramic Chip Capacitors Table of Contents Basic , Military Part Number Identification (CDR32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , 31 Packaging of Chip Components Automatic Insertion Packaging . . . . . . . . . . . . . . . . . . . , ) T.C. = Ct ­ C25 x 106 C25 (Tt ­ 25) III. Linear charge of a capacitor (Amperes) dV I=C dt XV. Cap Drift (%) C1 ­ C2 C.D. = C1 IV. Total Impedance of a capacitor (ohms) Z = RS + (XC - XL ... Original
datasheet

46 pages,
395.05 Kb

Silver mica capacitor 68pf 100V 1nF 2000V X7R capacitor 1nf 500v 1812 x7r CDR02 CDR31 CDR32 CDR35 elco 330 u MIL-PRF-55681 08055A101JAT2A CECC32101 datasheet abstract
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Abstract: peeling of end terminal Measuring Conditions After soldering devices to circuit board apply 5N (0.51kg , AVX Multilayer Ceramic Chip Capacitor Ceramic Chip Capacitors Table of Contents Basic , Military Part Number Identification (CDR32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , 31 Packaging of Chip Components Automatic Insertion Packaging . . . . . . . . . . . . . . . . . . . , ) T.C. = Ct ­ C25 x 106 C25 (Tt ­ 25) III. Linear charge of a capacitor (Amperes) dV I=C dt XV. ... Original
datasheet

46 pages,
644.75 Kb

Silver mica capacitor 68pf 100V 10uf elco 100v 1nF 2000V X7R 3300 XL capacitor 50v 4700 uF datasheet elco CDR02 CDR31 CDR32 CDR35 08055A101JAT2A 27NF 500V elco 330 u MIL-PRF-55681 datasheet abstract
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Abstract: AVX Multilayer Ceramic Chip Capacitor Ceramic Chip Capacitors Table of Contents Basic , Military Part Number Identification (CDR32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , 31 Packaging of Chip Components Automatic Insertion Packaging . . . . . . . . . . . . . . . . . . . , ) T.C. = Ct ­ C25 x 106 C25 (Tt ­ 25) III. Linear charge of a capacitor (Amperes) dV I=C dt XV. Cap Drift (%) C1 ­ C2 C.D. = C1 IV. Total Impedance of a capacitor (ohms) Z = RS + (XC - XL ... Original
datasheet

46 pages,
395.07 Kb

CDR35 CDR32 CDR31 CDR02 3300 XL datasheet abstract
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Abstract: Ceramic Chip Capacitors Table of Contents How to Order - AVX Part Number Explanation . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . 40 Military Part Number Identification (CDR32) . . . . , . . . . . . . . . . 42 Packaging of Chip Components . . . . . . . . . . . . . . . . . . . . . . . . , Series 101 Capacitance 2 Sig. Fig + No. of Zeros Examples: 100 = 10 pF 101 = 100 pF 102 = 1000 pF , place of Decimal point, e.g., 9.1 pF = 9R1. J* Tolerance B = ±.10 pF C = ±.25 pF D = ±.50 pF F = ... Original
datasheet

60 pages,
1078.65 Kb

capacitor 50v 4700 uF elco mica compression trimmer capacitor datasheet abstract
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