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SHANDLES SOURIAU TOOL HAND CRIMPER visit Digikey Buy
CDR32BX103BKUM KEMET Corporation Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, BX, 15% TC, 0.01uF, Surface Mount, 1206, CHIP visit Digikey Buy
CDR32BX103BKSS AVX Corporation Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, BX, 15% TC, 0.01uF, Surface Mount, 1206, CHIP visit Digikey Buy
CDR32BX103BKSM KEMET Corporation Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, BX, 15% TC, 0.01uF, Surface Mount, 1206, CHIP visit Digikey Buy
CDR32BX103BKSP KEMET Corporation Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, BX, 15% TC, 0.01uF, Surface Mount, 1206, CHIP visit Digikey Buy
CDR32BX103BKWS KEMET Corporation Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, BX, 15% TC, 0.01uF, Surface Mount, 1206, CHIP visit Digikey Buy

hand soldering of CDR32

Catalog Datasheet MFG & Type PDF Document Tags

hand soldering of CDR32

Abstract: hand soldering of CDR33 of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is , soldering components, must be spaced sufficiently far apart to avoid bridging or shadowing (inability of , temperature differential from preheat to soldering of 150°C. In all other cases this differential should not , are designed for soldering to printed circuit boards or other substrates. The construction of the , substrate. AVX terminations are suitable for all wave and reflow soldering systems. If hand soldering
AVX
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CECC32101-801

Abstract: cecc32101801 hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools , common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these , be allowed to enable rework should it be required. Preheat & Soldering The rate of preheat should , temperature differential from preheat to soldering of 150°C. In all other cases this differential should not , for soldering to printed circuit boards or other substrates. The construction of the components is
AVX
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failure rate avx 0201 ceramic capacitor

Abstract: capacitor 47 nano systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air , movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is: · Pad width , soldering of 150°C. In all other cases this differential should not exceed 100°C. For further specific , are designed for soldering to printed circuit boards or other substrates. The construction of the
AVX
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hand soldering of CDR33

Abstract: failure rate avx 0201 ceramic capacitor soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is: · Pad width equal to component width. It , soldering but sufficient space must be allowed to enable rework should it be required. The rate of , permissible to allow a temperature differential from preheat to soldering of 150°C. In all other cases this , temperature for lead-free wave soldering is 250°C-260°C for 3-5 seconds. The other parameters of the profile
AVX
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CDR31 CDR35 CDR32 CDR33 hand soldering of CDR33 failure rate avx 0201 ceramic capacitor capacitor 47 nano MIL-PRF-55681/C MIL-PRF-55681

hand soldering of CDR32

Abstract: capacitor cross reference component movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is: · Pad , generally permissible to allow a temperature differential from preheat to soldering of 150°C. In all other , for all wave and reflow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Cooling 300 200 It is important to
AVX
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hand soldering of CDR32 capacitor cross reference CDR34 RS481 AVX/MIL-PRF-55681/CDR31
Abstract: component movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is: â'¢ Pad , preheat to soldering of 150°C. In all other cases this differential should not exceed 100°C. For , are designed for soldering to printed circuit boards or other substrates. The construction of the , avoid the possibility of thermal shock during soldering and carefully controlled preheat is therefore AVX
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Abstract: movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. The basis of these designs is: â'¢ Pad width , is generally permissible to allow a temperature differential from preheat to soldering of 150Â , substrate. AVX terminations are suitable for all wave and reflow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Cooling AVX
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CECC32101

Abstract: 27NF 500V peeling of end terminal Measuring Conditions After soldering devices to circuit board apply 5N (0.51kg , AVX Multilayer Ceramic Chip Capacitor Ceramic Chip Capacitors Table of Contents Basic , Military Part Number Identification (CDR32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , 31 Packaging of Chip Components Automatic Insertion Packaging . . . . . . . . . . . . . . . . . . . , ) T.C. = Ct ­ C25 x 106 C25 (Tt ­ 25) III. Linear charge of a capacitor (Amperes) dV I=C dt XV
AVX
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CECC32101 27NF 500V elco 330 u 08055A101JAT2A CDR02 1nF 2000V X7R S-MCC20M299-C

Silver mica capacitor 68pf 100V

Abstract: CECC32101 peeling of end terminal Measuring Conditions After soldering devices to circuit board apply 5N (0.51kg , AVX Multilayer Ceramic Chip Capacitor Ceramic Chip Capacitors Table of Contents Basic , Military Part Number Identification (CDR32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , 31 Packaging of Chip Components Automatic Insertion Packaging . . . . . . . . . . . . . . . . . . . , ) T.C. = Ct ­ C25 x 106 C25 (Tt ­ 25) III. Linear charge of a capacitor (Amperes) dV I=C dt XV
AVX
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Silver mica capacitor 68pf 100V capacitor 1nf 500v 1812 x7r

CDR31

Abstract: CDR32 peeling of end terminal Measuring Conditions After soldering devices to circuit board apply 5N (0.51kg , AVX Multilayer Ceramic Chip Capacitor Ceramic Chip Capacitors Table of Contents Basic , Military Part Number Identification (CDR32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , 31 Packaging of Chip Components Automatic Insertion Packaging . . . . . . . . . . . . . . . . . . . , ) T.C. = Ct ­ C25 x 106 C25 (Tt ­ 25) III. Linear charge of a capacitor (Amperes) dV I=C dt XV
AVX
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CDR33 Reliability data CECC32101-801 3300 XL

failure rate avx 0201 ceramic capacitor

Abstract: mica compression trimmer capacitor Ceramic Chip Capacitors Table of Contents How to Order - AVX Part Number Explanation . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . 40 Military Part Number Identification (CDR32) . . . . , . . . . . . . . . . 42 Packaging of Chip Components . . . . . . . . . . . . . . . . . . . . . . . . , Series 101 Capacitance 2 Sig. Fig + No. of Zeros Examples: 100 = 10 pF 101 = 100 pF 102 = 1000 pF , place of Decimal point, e.g., 9.1 pF = 9R1. J* Tolerance B = ±.10 pF C = ±.25 pF D = ±.50 pF F =
AVX
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mica compression trimmer capacitor rf component catalog crimp FPC avx surface mount ceramic capacitor 50v 4700 uF elco rf-microwave product S-SMTCC00M1201-C

capacitor 50v 4700 uF elco

Abstract: rf-microwave components AVX Multilayer Ceramic Chip Capacitor Ceramic Chip Capacitors Table of Contents Basic , Identification (CDR32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Packaging of Chip , . Linear charge of a capacitor (Amperes) dV I=C dt XV. Cap Drift (%) C1 ­ C2 C.D. = C1 IV. Total Impedance of a capacitor (ohms) Z = RS + (XC - XL ) V. Capacitive Reactance (ohms) 1 xc = 2
AVX
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rf-microwave components z5u .05 cecc32101801 CECC32101-801 specification MIL-C-55681 MIL-PRF 10 micro farad 16V capacitor

capacitor 50v 4700 uF datasheet elco

Abstract: ceramic capacitor 104m Capacitors Table of Contents How to Order - AVX Part Number Explanation . . . . . . . . . . . . . . . . . . , Identification (CDR32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Packaging of Chip , + No. of Zeros Examples: 100 = 10 pF 101 = 100 pF 102 = 1000 pF 223 = 22000 pF 224 = 220000 pF 105 = 1µF 106 = 10µF 107 = 100µF For values below 10 pF, use "R" in place of Decimal point
AVX
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capacitor 50v 4700 uF datasheet elco ceramic capacitor 104m capacitor 2200 uF 200v CAPACITOR 16,000 UF 350V TR-MX0541 AVX 620 102M S-MLCC10M1204-C

W468

Abstract: KEMET MLCC rework . Resistance to Soldering Heat: EIA-198, Method 302, Condition B (260°C, 10 seconds) no leaching of nickel , CERAMIC CHIP CAPACITORS INTRODUCTION Ceramic chips consist of formulated ceramic dielectric , exposed on opposite edges of the laminated structure. The entire structure is then fired at high , . After firing, conductive terminations are applied to opposite ends of the chip to make contact with the , designed specifically for chip capacitor manufacture. The process features a high degree of mechanization
KEMET
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W468 KEMET MLCC rework

821 ceramic capacitor

Abstract: J 709 . Resistance to Soldering Heat: EIA-198, Method 302, Condition B (260°C, 10 seconds) no leaching of nickel , CERAMIC CHIP CAPACITORS INTRODUCTION Significant Figure of Temperature Coefficient Working , temperature range. The reliability of multilayer ceramic capacitors is not extremely sensitive to voltage, and brief applications of voltage above rated will not result in immediate failure. However , (includes C0G), the first symbol designates the significant figures of the temperature coefficient in PPM
KEMET
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821 ceramic capacitor J 709 F-2100 F-2102 F-2103 F-2105

1206-103

Abstract: J 709 assume any responsibility for correctness of this information, nor for damages consequent to its use , of capacitor characteristics. KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 CERAMIC CHIP CAPACITORS INTRODUCTION Significant Figure of Temperature , entire operating temperature range. The reliability of multilayer ceramic capacitors is not extremely sensitive to voltage, and brief applications of voltage above rated will not result in immediate failure
KEMET
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1206-103 kemet capacitor C0603 KD 472 M 1206 fuse FD 752 J 1600 V CAPACITOR C1206 KEMET packaging CWR11 MIL-PRF-55365/8

B 103 K ceramic capacitor

Abstract: capacitor 2200 micro farad 25V CERAMIC CHIP CAPACITORS INTRODUCTION Significant Figure of Temperature Coefficient Working , temperature range. The reliability of multilayer ceramic capacitors is not extremely sensitive to voltage, and brief applications of voltage above rated will not result in immediate failure. However , (includes C0G), the first symbol designates the significant figures of the temperature coefficient in PPM , shown in Table 1. Tolerance of Temperature Coefficient PPM per Degree C Letter Symbol
KEMET
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B 103 K ceramic capacitor capacitor 2200 micro farad 25V dg sn60 202 7201 EB capacitor W412

F-2100

Abstract: F-2102 . Resistance to Soldering Heat: EIA-198, Method 302, Condition B (260°C, 10 seconds) no leaching of nickel , CERAMIC CHIP CAPACITORS INTRODUCTION Significant Figure of Temperature Coefficient Working , temperature range. The reliability of multilayer ceramic capacitors is not extremely sensitive to voltage, and brief applications of voltage above rated will not result in immediate failure. However , (includes C0G), the first symbol designates the significant figures of the temperature coefficient in PPM
KEMET
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Abstract: CERAMIC CHIP CAPACITORS INTRODUCTION Ceramic chips consist of formulated ceramic dielectric , exposed on opposite edges of the laminated structure. The entire structure is then fired at high , . After firing, conductive terminations are applied to opposite ends of the chip to make contact with the , designed specifically for chip capacitor manufacture. The process features a high degree of mechanization , stable X7R (military BX or BR), the stable X5R, and the general purpose Z5U and Y5V. A wide range of KEMET
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F-2103

Abstract: F-2105 . Resistance to Soldering Heat: EIA-198, Method 302, Condition B (260°C, 10 seconds) no leaching of nickel , CERAMIC CHIP CAPACITORS INTRODUCTION Significant Figure of Temperature Coefficient Working , temperature range. The reliability of multilayer ceramic capacitors is not extremely sensitive to voltage, and brief applications of voltage above rated will not result in immediate failure. However , (includes C0G), the first symbol designates the significant figures of the temperature coefficient in PPM
KEMET
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F2110 k 629 MLCC rework
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