NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| 776576-61 | National Instruments Corporation | SCXI-1361 Rear Filler Panel | 
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| 776576-60 | National Instruments Corporation | SCXI-1360 Front Filler Panel |
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| 196917-01 | National Instruments Corporation | NI 9977 C Series Filler Module for Empty Slot |
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| 196917-01 | National Instruments Corporation | NI 9977 C Series Filler Module for Empty Slot |
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| 196917-01 | National Instruments Corporation | NI 9977 C Series Filler Module for Empty Slot |
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: VMICPCI-0569 VMICPCI-0569 CompactPCI 6U EMC Filler Panel · · · · · · PICMG 2.0 R2.1 CompactPCI , - VMIC provides CompactPCI 6U filler panels with EMC gaskets to complete the customer's customized system. Filler panels may be used to cover unused slots to ensure the intended airflow management. They , types of filler panels currently offered by VMIC. The filler panels are brushed aluminum with a clear , 1 VMICPCI-0569 VMICPCI-0569 4 HP Filler Panels (Single Slot) 8 HP Filler Panels (Double Slot) VM IC ... | Original |
2 pages, |
injector EMI gaskets VMIC VMICPCI-0569 VMICPCI-0569 abstract |
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| Abstract: 71323-im. H32313 H32313 FILLER BREATHER FILTERS (MODULAR) A BRITISH DESIGN AWARD RANGE SPECIFICATIONS , (1 ) Single (63mm dia.) hole Filler Breather Filter installation that eliminates drilled and tapped holes using self-locking clamps (see below). (2) 3-hole Filler Breather Filter installation (3) 6-hole Filler Breather Filter installation available in 2 cap sizes - 76mm and 92mm dia. (Interchangeable with UCC metal filler breather filters). 3 x zinc and black chromate-plated steel screws. Spring steel ... | OCR Scan |
3 pages, |
UC.DIP.206 expanding foam filler expanded polypropylene uc.ab.68910 uc 1201 breather valve H32313 H32313 abstract |
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| Abstract: ELECTRONICS & TECHNOLOGY, INC. A FINE TECHNOLOGY GROUP EMC Gasketed Filler Panels Filler Panel Profiles - 4,8 or 12 HP Widths EMC Filler Panels/ Blank-off Plates Features , are included with all VectorPaktm filler panels and also sold separately in a hardware kit , Qty 48 48 ! " # Each Filler Panel Kit Includes 4,8 or 12HP EMC panel with EMC gasket Filler Panel / Blank-off plate EMC gaskets available M2.5 Nickel ... | Original |
1 pages, |
EMI gaskets datasheet abstract |
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| Abstract: assurance (T.P.A.) · Filler plug available for male and female housings · Several colour codings , housing Male housing Male housing Male housing Male housing Filler plug for female housing Filler plug for male housing Filler plug Colour White Black Grey Blue White Black Grey Blue Violet Violet Green , for 1.5 mm terminals Dimensional characteristics Female housing Male housing Filler plug ... | Original |
2 pages, |
Sicma 210S041 sicma 2 datasheet abstract |
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| Abstract: Laird Technologies Web site: www.LairdTech.com Item # Tflex 2130 V0, TflexTM 200 V0 Series Gap Filler Material TflexTM 200 V0 Series Gap Filler Material The TflexTM 200 V0 Series is a very soft, free standing gap filler that is more compressible than most gap fillers. TflexTM 200 V0 combines good thermal conductivity of 1.1 W/m-K with high compressibility to produce low thermal resistance. The alumina filler allows TflexTM 200 V0 to remain a cost effective solution where moderate thermal performance is ... | Original |
2 pages, |
CVCM ASTM D412 ASTM D2240, D412 ASTM ASTM D2240 astm D150 datasheet abstract |
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| Abstract: Laird Technologies Web site: www.LairdTech.com Item # Tpli 215, TpliTM 200 Series Gap Filler Material TpliTM 200 Series Gap Filler Material Industry Leading Soft Elastomer Gap Filler Tpli 200 SeriesTM is the premium gap filler. An unique blend of boron nitride and silicone produce Laird Technologies' highest performing interface pad. Tpli 200's exceptional combination of high thermal conductivity and compliancy generate unmatched thermal resistances in a gap filling interface material. Tpli 200 ... | Original |
2 pages, |
astm D150 ADHESIVE GAP PAD 200 SERIES ASTM D2240 datasheet abstract |
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| Abstract: TflexTM 500 Series Thermal Gap Filler Innovative Technology for a Connected World Compliant 2.8 W/mK Thermally Conductive Gap Filler TflexTM 500 is a compliant elastomer gap filler designed , unique silicone and filler combination has extremely low silicone extractables compared to many other , CLV-customerservice@lairdtech.com www.lairdtech.com/thermal TM TflexTM 500 Series Thermal Gap Filler Innovative Technology for a Connected World TflexTM 500 TYPICAL PROPERTIES Thermal Gap Filler Preliminary ... | Original |
2 pages, |
E595 D257 D2240 D575 ADHESIVE GAP PAD datasheet abstract |
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| Abstract: Gap Filler 3500S35 3500S35 (Two-Part) Thermally Conductive Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 3500S35 3500S35 · Thermal conductivity: 3.6 W/m-K · Thixotropic , Section B GF3500S35 GF3500S35 Thickness vs.Thermal Resistance Gap Filler 3500S35 3500S35 NA = Selected standard , Section A Gap Filler 3500S35 3500S35 is the technology leader in thermally conductive, liquid gap filling , from the interface. Gap Filler 3500S35 3500S35 will lightly adhere to surfaces, thus improving surface area ... | Original |
1 pages, |
3500S35 D149 D150 D2196 D2240 D257 D792 GF35 GF-3500 gf3500s35 3500S35 abstract |
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| Abstract: Features · Green non-toxic filler material · Rugged and environmentally friendly components · No mixing , cables as a revolutionary alternative to two-component filler systems. Based on Raychem's outstanding , · Range taking · Reduced waste disposal Green filler material Rayligator II uses a green , high-performance filler material is an integral part of the outer fibrereinforced heat-shrinkable wraparound. No , conventional two-component filler systems, Rayligator II joints have virtually unlimited shelf life. Rugged ... | Original |
4 pages, |
4836 elcon raychem JOINT procedure raychem 11 kv raychem JOINT KIT raychem epp raychem JOINT KIT Heat-shrinkable mastic components Raychem joint simel simel CONNECTORS raychem cable jointing kit raychem JOINT KIT datasheet abstract |
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| Abstract: TflexTM 700 Series Thermal Gap Filler Innovative Technology for a Connected World HIGH THERMAL CONDUCTIVITY COMPLIANT GAP FILLER TflexTM 700 is a 5 W/mK soft gap filler thermal interface , and ceramic filler technology allows a combination of high compliancy and high thermal performance. , www.lairdtech.com/thermal TM TflexTM 700 Series Thermal Gap Filler Innovative Technology for a , MATERIAL NAME AND THICKNESS TflexTM - indicates elastomeric gap filler product line 7XXX - indicates ... | Original |
2 pages, |
E595 D257 D2240 datasheet abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| V 50 K 78743458290 filler Y 0 D 0 0 200 60 Z 10 i 34 U 100 70 15 0 5 3 @NAME=FILLER P 34 200 50 190 50 0 3 0 A 200 50 10 0 2 0 PINTYPE=OUT L 190 50 10 0 8 0 1 0 A[15:0] P 32 200 10 190 10 0 3 0 A 200 10 10 0 2 0 PINTYPE=OUT L 190 10 10 0 8 0 1 0 B[15:0] b 190 46 200 54 Q 11 1 0 b 190 6 200 14 Q 11 1 0 c 160 70 0 b 10 0 190 60 E www.datasheetarchive.com/download/16437793-995939ZC/xapp233.zip (filler.1) |
Xilinx | 21/12/2000 | 315.91 Kb | ZIP | xapp233.zip |
| V 50 K 78743458290 filler Y 0 D 0 0 200 60 Z 10 i 34 U 100 70 15 0 5 3 @NAME=FILLER P 34 200 50 190 50 0 3 0 A 200 50 10 0 2 0 PINTYPE=OUT L 190 50 10 0 8 0 1 0 A[15:0] P 32 200 10 190 10 0 3 0 A 200 10 10 0 2 0 PINTYPE=OUT L 190 10 10 0 8 0 1 0 B[15:0] b 190 46 200 54 Q 11 1 0 b 190 6 200 14 Q 11 1 0 c 160 70 0 b 10 0 190 60 E www.datasheetarchive.com/download/16437793-995939ZC/xapp233.zip (filler.1) |
Xilinx | 21/12/2000 | 315.91 Kb | ZIP | xapp233.zip |
| package dimensions "Filler" compounds are added to basic mold compound: Chemistry Intel is experimenting with filler shapes: Quantitative Results for Differing Percentage of Silicon Filler Filler Content (% wt) 78 80 www.datasheetarchive.com/files/intel/design/quality/icstor~1/improv~2.htm |
Intel | 30/04/1998 | 5.75 Kb | HTM | improv~2.htm |
| package dimensions "Filler" compounds are added to basic mold compound: Chemistry Intel is experimenting with filler shapes: Quantitative Results for Differing Percentage of Silicon Filler Filler Content (% wt) 78 80 www.datasheetarchive.com/files/intel/design/quality/icstor~1/improv~2-v3.htm |
Intel | 01/02/1999 | 5.74 Kb | HTM | improv~2-v3.htm |
| package dimensions "Filler" compounds are added to basic mold compound: Chemistry Intel is experimenting with filler shapes: Quantitative Results for Differing Percentage of Silicon Filler Filler Content (% wt) 78 80 www.datasheetarchive.com/files/intel/design/quality/icstor~1/improv~2-v1.htm |
Intel | 31/10/1998 | 5.76 Kb | HTM | improv~2-v1.htm |
| package dimensions "Filler" compounds are added to basic mold compound: Chemistry Intel is experimenting with filler shapes: Quantitative Results for Differing Percentage of Silicon Filler Filler Content (% wt) 78 80 www.datasheetarchive.com/files/intel/design/quality/icstor~1/improv~2-v2.htm |
Intel | 01/08/1998 | 5.75 Kb | HTM | improv~2-v2.htm |
| package dimensions "Filler" compounds are added to basic mold compound: Chemistry Intel is experimenting with filler shapes: Quantitative Results for Differing Percentage of Silicon Filler Filler Content (% wt) 78 80 www.datasheetarchive.com/files/intel/products one/design/quality/icstor~1/improv~2.htm |
Intel | 01/05/1999 | 5.74 Kb | HTM | improv~2.htm |
| =IN AP virtex:fdce 3 PINTYPE=IN AP virtex:fdce 4 PINTYPE=IN AP virtex:fdce 5 PINTYPE=OUT AS filler @NAME=FILLER AS filler PINORDER = A[15:0] B[15:0] AP filler 1 PINTYPE=OUT AP filler 2 PINTYPE=OUT AS FILL2 LABEL=EQD1` W filler $1I191 1I191 1I191 1I191 I $1I191 1I191 1I191 1I191 filler DEAD[15:0] CODE[15:0] LABEL=FILLER` W virtex www.datasheetarchive.com/download/16437793-995939ZC/xapp233.zip (user.1) |
Xilinx | 21/12/2000 | 315.91 Kb | ZIP | xapp233.zip |
| PINTYPE=IN AP virtex:fd16ce 4 PINTYPE=IN AP virtex:fd16ce 5 PINTYPE=OUT AS filler @NAME=FILLER AS filler PINORDER = A[15:0] B[15:0] AP filler 1 PINTYPE=OUT AP filler 2 PINTYPE=OUT W virtex:vcc $1I316 1I316 1I316 1I316 :0] DOUT[15:0] LABEL=DATAREG` W filler $1I313 1I313 1I313 1I313 I $1I313 1I313 1I313 1I313 filler DCA[15:0] DCB[15:0] LABEL=FILLER` P ? R I www.datasheetarchive.com/download/16437793-995939ZC/xapp233.zip (framer.1) |
Xilinx | 21/12/2000 | 315.91 Kb | ZIP | xapp233.zip |
| struct parsefile { long fd; char *buf; }; struct parsefile basepf; struct parsefile *parsefile = &basepf; #ifdef STACK_SIZE int filler[STACK_SIZE / (2*sizeof(int)]; #else int filler[0x3000]; #endif int el; char * g1 (a, b) int a; int *b; { } g2 (a) long a; { if (a != 0xdeadbeefL) abort (); exit (0); } f () { register char *p, *q; register int i; register int something; if (parsefile->fd = 0L && el) { const char *rl_cp; int len; rl_cp = g1 (el www.datasheetarchive.com/download/46713865-484035ZC/gnu_tsc.bz2 |
Motorola | 16/02/2000 | 22032.79 Kb | BZ2 | gnu_tsc.bz2 |