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Part Manufacturer Description Datasheet BUY
EP9312-IBZ Cirrus Logic RISC Microprocessor, 32-Bit, 184MHz, CMOS, PBGA352, 27 X 27 MM, LEAD FREE, PLASTIC, BGA-352 visit Digikey
EP9312-CBZ Cirrus Logic RISC Microprocessor, 32-Bit, 200MHz, CMOS, PBGA352, 27 X 27 MM, LEAD FREE, PLASTIC, BGA-352 visit Digikey
EP9315-IBZ Cirrus Logic RISC Microprocessor, 32-Bit, 200MHz, CMOS, PBGA352, 27 X 27 MM, LEAD FREE, PLASTIC, MO-151BAL-2, BGA-352 visit Digikey
EP9315-CBZ Cirrus Logic RISC Microprocessor, 32-Bit, 200MHz, CMOS, PBGA352, 27 X 27 MM, LEAD FREE, PLASTIC, MO-151BAL-2, BGA-352 visit Digikey
WM8350GEB/V Cirrus Logic Consumer Circuit, CMOS, PBGA129, 7 X 7 MM, 0.94 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, MO-195, BGA-129 visit Digikey
WM8310CGEB/V Cirrus Logic Microprocessor Circuit, CMOS, PBGA169, 7 X 7 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, BGA-169 visit Digikey

emmc bga 162

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Standard and Ultra e.MMC 4.41 I/F Released Data Sheet 80-36-03462 V1.4 December 2011 Corporate , www.sandisk.com SanDisk Corporation 80-36-03462 SanDisk iNAND e.MMC 4.41 I/F - Data Sheet REVISION , SanDisk iNAND e.MMC 4.41 I/F - Data Sheet TABLE OF CONTENTS 1. Introduction , iNAND e.MMC 4.41 I/F - Data Sheet 4.2.2. Table 8 contains the SanDisk iNAND, with MMC interface (169 , e.MMC 4.41 I/F - data Sheet 1. INTRODUCTION 1.1. General Description iNAND is an Embedded Flash SanDisk
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SEM64G sandisk eMMC 4.41 Sandisk emmc SEM32G SDIN5C1-16G-L SEM16G SDIN5D1-16G-L SDIN5C2-32G-L SDIN5C1-32G-L SDIN5C2-64G-L SDIN5C1-64G-L
Abstract: rate (DDR) function â'" High-priority interrupt (HPI) PDF: 09005aef8523caab emmc , MTFC32GJDDQ-4M IT PDF: 09005aef8523caab 162, bits[1:0] to 0x1 Micron Technology
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MTFC4GLDDQ-4M IT MTFC32GJDDQ-4M IT MMC04G emmc CID MTFC4GLDDQ-4M mtfc4glddq MTFC16GJDDQ-4M 84-A441
Abstract: Ultra e.MMC 4.41 I/F Released Data Sheet 80-36-03666 V1.2 May 2012 SanDisk Corporation , ) 801-8657 www.sandisk.com 80-36-03666 SanDisk iNAND e.MMC 4.41 I/F - Data Sheet REVISION HISTORY , SanDisk Corporation -2- 80-36-03666 Table of Contents SanDisk iNAND e.MMC 4.41 I/F - Data Sheet , . 18 © 2012 SanDisk Corporation 3 80-36-03666 Table of Contents SanDisk iNAND e.MMC , . 28 © 2012 SanDisk Corporation 4 80-36-03666 Introduction SanDisk iNAND e.MMC 4.41 I SanDisk
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SEM08G SDIN7DU2-16G sandisk 8GB Nand flash sandisk Nand flash part number 8GB emmc sandisk emmc 5.0 SDIN7DU2-32G SDIN7DU2-64G
Abstract: '" High-priority interrupt (HPI) PDF: 09005aef8523ca91 emmc_4gb-64gb_ctrd_441-it.pdf - Rev. B 09/13 EN , -4M IT 8GB 16GB 32GB 64GB PDF: 09005aef8523ca91 emmc_4gb-64gb_ctrd_441-it.pdf - Rev. B 09/13 EN , : www.micron.com/decoder. PDF: 09005aef8523ca91 emmc_4gb-64gb_ctrd_441-it.pdf - Rev. B 09/13 EN 3 Micron , operating temperatures, and resists shock and vibration disruption. PDF: 09005aef8523ca91 emmc , disabled in the device. The host must set ECSD register byte 162, bits[1:0] to 0x1 to enable this Micron Technology
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32GB eMMC micron eMMC 5.0 micron emmc application note 169 ball eMMC memory MTFC32G micron emmc 4.5 MTFC16GJDEC-4M MTFC32GJDED-4M MTFC64GJDDN-4M
Abstract: e.MMC 4.41 I/F Preliminary Data Sheet 80-36-03433 February 2010 SanDisk Corporation Corporate , www.sandisk.com 80-36-03433 SanDisk iNAND e.MMC 4.41 I/F - Data Sheet REVISION HISTORY Doc. No , SanDisk iNAND e.MMC 4.41 I/F - Data Sheet TABLE OF CONTENTS 1. Introduction , e.MMC 4.41 I/F - Data Sheet 4.3. iNAND Registers , e.MMC 4.41 I/F - data Sheet 1. INTRODUCTION 1.1. General Description iNAND is an Embedded SanDisk
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emmc 4.41 spec eMMC 4.41 JESD84-A441 SEM04G emmc pcb layout 153 ball eMMC memory
Abstract: is an embedded MMC solution designed in a BGA package form. e·MMC operation is identical to a MMC , Rev. 1.0, Oct. 2011 KLMxGxFE3B-x00x Samsung e·MMC Product family e.MMC 4.41 Specification , , 2011 Aug. 05, 2011 Remark Target Target Rev. 1.0 e·MMC Revision History Revision No. 0.0 0.1 , .0.1) Rev. 1.0 e·MMC Revision History Appendix(0.1) Before(ver.0.0) -3- KLMxGxFE3B-x00x datasheet After(ver.0.5) Rev. 1.0 e·MMC Revision History Appendix(0.5) Before(ver.0.1) -4- Samsung Electronics
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KLM4G1FE3B-B001 KLM8G2FE3B-B001 samsung eMMC 4.5 Samsung eMMC 4.41 KLMAG4FE3B-A001 KLM4G1FE
Abstract: '" High-priority interrupt (HPI) PDF: 09005aef84a4d6f8 MTFC64GJVDN-4M IT 64GB PDF: 09005aef84a4d6f8 emmc , aspect of these products, please contact your nearest Micron sales office. PDF: 09005aef84a4d6f8 emmc , disruption. PDF: 09005aef84a4d6f8 162, bits[1:0] to 0x1 to enable this functionality before the host can use Micron Technology
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MTFC32GJVED-4M MTFC8GAKAJCN-4M IT MTFC4GACAJCN-4M IT 221 ball eMMC memory MTFC8GLDDQ-4M IT MTFC8GACAAAM-4M IT MTFC4GMVEA-4M IT MTFC16GJVEC-4M
Abstract: Preliminary THGBM3G4D1FBAIG TOSHIBA e-MMC Module 2GB THGBM3G4D1FBAIG INTRODUCTION THGBM3G4D1FBAIG is 2-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized , e-MMC Module Products â'" Part Numbers TOSHIBA Part Number Density Package Size NAND Flash , 6 0b [113:112] * Card/BGA CBX 2 01b [111:104] * OEM/Application ID OID , 0x00 [162] H/W reset function RST_n_FUNCTION 1 R/W 0x00 [161] HPI management Toshiba
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P-TFBGA153-1113-0 Toshiba emmc THGBM eMMC data retention Toshiba NAND BGA 224 THGBM3G4D1FBAIG
Abstract: Preliminary THGBM3G5D1FBAIE TOSHIBA e-MMC Module 4GB THGBM3G5D1FBAIE INTRODUCTION THGBM3G5D1FBAIE is 4-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized , Preliminary THGBM3G5D1FBAIE Part Numbers Available e-MMC Module Products â'" Part Numbers TOSHIBA Part , ] * Reserved - 6 0b [113:112] * Card/BGA CBX 2 01b [111:104] * OEM/Application ID , 0x00 [162] H/W reset function RST_n_FUNCTION 1 R/W 0x00 [161] HPI management Toshiba
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Toshiba BGA 224 toshiba emmc 4.41 THGBM3G5 THGBM3G THGB emmc jedec P-TFBGA169-1216-0
Abstract: 4GB, 8GB, 16GB, 32GB: e·MMC Features e·MMCTM Memory MTFC4GGQDM, MTFC4GGQDI, MTFC8GKQDI , ); 130uA (32GB) ­ Active current (RMS): 70mA (4GB, 8GB); 90mA (16GB, 32GB) Figure 1: Micron e·MMC Device , without notice. © 2009 Micron Technology, Inc. All rights reserved. 4GB, 8GB, 16GB, 32GB: e·MMC Features Part Numbering Information Micron®e·MMC memory devices are available in different configurations and densities. Figure 2: e·MMC Part Numbering MT FC Micron Technology Product Family FC = NAND Flash Micron Technology
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MTFC16GKQDI MTFC4G MTFC16G micron emmc micron eMMC 100 ball BGA MTfc8g emmc csd MTFC32GKQDH CMD24 CMD12
Abstract: Hello All, 8/16/32GB 27nm eMMC parts are now available to sample (CS type)! Please input sample , binding. Rev. 1.0, Sep. 2010 KLMXGXFEJA Samsung e.MMC moviNAND Product family e.MMC 4.41 , . 11 4.0 e.MMC 4.41 features , moviNAND is an embedded MMC solution designed in a BGA package form. moviNAND operation is identical to a , 6. moviNAND Block Diagram - 11 - KLMXGXFEJA datasheet Rev. 1.0 moviNAND 4.0 e.MMC Samsung Electronics
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KLMXGXFEJA-X001 KLM8G2FEJA-A001 KLMAG4FEJA-A001 KLM8G2FEJA KLMBG8FEJA-A001 KLMAG4FEJA-B001 klm8g
Abstract: - - - - 3 4 1 1 1/1 4 4 1 1 2 2/2 4 57 1.62 / 3.6 Y QFP100/BGA100 , - - - - - - 3 4 1 1 1/1 4 4 1 1 2 2/2 4 57 1.62 / 3.6 Y , Y - HS - - - - - - 3 4 1 1 1/1 4 4 1 1 2 2/2 4 57 1.62 , 96 1.62 / 3.6 Y QFP144/BGA144 S SAM3U2E Cortex-M3 - / 1 96 36K - 128K Y 1 - 1 / 1 , 2 2/2 4 96 1.62 /3.6 Y QFP144/BGA144 S SAM3U4E Cortex-M3 - / 1 96 52K - 256K Y 1 Atmel
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BGA217 BGA324 saM9263 sam9m11 ATMEL QFP128 SAM3U4E emmc pin 32-BIT AT91SAM7L-STK SAM7L64 SAM7L128 AT91SAM7S-EK SAM7S16
Abstract: . 254 5.6.12.1 eMMC, Standard JC64 SDR, 24 MHz, Half Cycle, 1.8 V . 254 5.6.12.2 eMMC, Standard JC64 SDR, 24 MHz, Half Cycle, 1.2 V . 256 5.6.12.3 eMMC, High-Speed JC64 SDR, 48 MHz, Half Cycle, 1.8 V . 258 5.6.12.4 eMMC, High-Speed JC64 SDR, 48 MHz, Half Cycle, 1.2 V . 259 5.6.12.5 eMMC, High-Speed HS200 JC64 SDR, 192 MHz, Half Cycle, 1.8 V . 261 5.6.12.6 Texas Instruments
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OMAP5430 3E991 OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 toshiba eMMC DS MIPI DPI SWPS052F EAR99 ISO/TS16949
Abstract: ) Timers â'¢ One Selectable as a Watchdog or GP â'" Two Embedded Multimedia Card (eMMC) or Secure , , SPI Serial Flash or I2C EEPROM eMMC, SD, SDHC, UART, and USB PACKAGE: â'" 144-Terminal Pb-Free Plastic BGA (Ball Grid Array) (ZHH Suffix) 1 An IMPORTANT NOTICE at the end of this data sheet , NUMBER BGA MICROSTAR (144) 12.0 mm x 12.0 mm TMS320C5535AZHHA10 BGA MICROSTAR (144) 12.0 mm x 12.0 mm TMS320C5534AZHH10 BGA MICROSTAR (144) 12.0 mm x 12.0 mm TMS320C5534AZHHA10 Texas Instruments
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TMS320C5535 TMS320C5534 TMS320C5533 TMS320C5532 SPRS737C C5534
Abstract: ) to Boot From SPI EEPROM, SPI Serial Flash or I2C EEPROM eMMC/SD/SDHC, UART, and USB PACKAGE: ­ 144-Terminal Pb-Free Plastic BGA (Ball Grid Array) (ZHH Suffix) · CORE: ­ High-Performance, Low-Power, TMS320C55x , Card/Secure Digital (eMMC/SD) Interfaces ­ Universal Asynchronous Receiver/Transmitter (UART) ­ , (SCR) Peripherals TMS320C5534 TMS320C5533 Interconnect Program/Data Storage eMMC/SD SDHC (x2 , Active Mode and SARAM in Retention) PLL Options BGA Package Product Status (1) (1) Software Programmable Texas Instruments
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E02F EEPROM SPRS737B C5533 C5532 IEEE-1149 144-T
Abstract: (eMMC/SD) Interfaces ­ Universal Asynchronous Receiver/Transmitter (UART) ­ Serial-Port Interface , On-Chip ROM Bootloader (RBL) to Boot From SPI EEPROM, SPI Serial Flash or I2C EEPROM eMMC/SD/SDHC, UART, and USB PACKAGE: ­ 144-Terminal Pb-Free Plastic BGA (Ball Grid Array) (ZHH Suffix) 1 Please , TMS320C5535 TMS320C5533 Interconnect Program/Data Storage DMA (x4) eMMC/SD SDHC (x2 , 1.3 V PLL Options Software Programmable Multiplier BGA Package 12 x 12 mm Product Texas Instruments
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emmc spec emmc 4.5 spec emmc reader emmc 4.5 C5535 emmc 4.4 standard jedec SPRS737 TMS320C55 100-MH
Abstract: ) to Boot From SPI EEPROM, SPI Serial Flash or I2C EEPROM eMMC/SD/SDHC, UART, and USB PACKAGE: ­ 144-Terminal Pb-Free Plastic BGA (Ball Grid Array) (ZHH Suffix) · CORE: ­ High-Performance, Low-Power, TMS320C55x , Card/Secure Digital (eMMC/SD) Interfaces ­ Universal Asynchronous Receiver/Transmitter (UART) ­ , (SCR) Peripherals TMS320C5534 TMS320C5533 Interconnect Program/Data Storage eMMC/SD SDHC (x2 , Room Temp 25°C (DARAM in Active Mode and SARAM in Retention) PLL Options BGA Package Product Status (1 Texas Instruments
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0x2E40 162 emmc TMS320C5533AZHHA10 SPRS737A
Abstract: a Watchdog and/or GP â'" Two Embedded Multimedia Card/Secure Digital (eMMC/SD) Interfaces â , : â'" On-Chip ROM Bootloader (RBL) to Boot From SPI EEPROM, SPI Serial Flash or I2C EEPROM eMMC/SD/SDHC, UART, and USB PACKAGE: â'" 144-Terminal Pb-Free Plastic BGA (Ball Grid Array) (ZHH Suffix , Interconnect Program/Data Storage DMA (x4) eMMC/SD SDHC (x2) Connectivity I2C SPI , 0.15 mW @ 1.05 V 0.28 mW @ 1.3 V PLL Options Software Programmable Multiplier BGA Package Texas Instruments
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Abstract: ) to Boot From SPI EEPROM, SPI Serial Flash or I2C EEPROM eMMC/SD/SDHC, UART, and USB PACKAGE: ­ 144-Terminal Pb-Free Plastic BGA (Ball Grid Array) (ZHH Suffix) · CORE: ­ High-Performance, Low-Power, TMS320C55x , Card/Secure Digital (eMMC/SD) Interfaces ­ Universal Asynchronous Receiver/Transmitter (UART) ­ , (SCR) Peripherals TMS320C5534 TMS320C5533 Interconnect Program/Data Storage eMMC/SD SDHC (x2 , Active Mode and SARAM in Retention) PLL Options BGA Package Product Status (1) (1) Software Programmable Texas Instruments
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emmc boot eMMC "thermal impedance" emmc footprint emmc spi bridge L11IO rtcm
Abstract: . 2.4.4.12 eMMC , . eMMC Signal Descriptions , RealNetworks, Inc. SD is a registered trademark of Toshiba Corporation. MMC and eMMC are trademarks of Texas Instruments
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SWPS051E MIPI csi-2 spec toshiba emmc 4.4 spec toshiba 16GB Nand flash emmc 4GB eMMC toshiba ABE 814 toshiba emmc 4.4
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