DIP to SOIC Package Converters; Dip Width Top (in.): 0.3; Bottom Package Code: SOG32; Top Pitch (mm): 2.54; Bottom Pitch (mm): 1.27; Top Pin Count: 32; Bottom Pin Count: 32; Top Interface: Female Socket Pins; Bottom Interface: J-Lead SMT Foot; Compatible Part 1: N/A; One Piece Or Two Piece: 1; IC Package Lead Tip to Tip (mm): 7.52; Part Description: DIP to SOIC Package Converter;