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d2 marking code dpak

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: LEAD CODE: 1) Anode 2) Cathode 3) Anode 4) Cathode Pin 2 is Common to Tab (4) MARKING: FULL PART , , D2 3) Anode D2 4) Cathode D1, D2 R2 Note: Pin 2 is Common to the Tab (4) Marking: Full Part , , 100V and 200V in the DPAK package CSHDD16 Series (16 Amp) 40V thru 200V Dual Common Cathode in the , '¢ Energy efficiency â'¢ Standard DPAK and D2PAK surface mount packages â'¢ Extended temperature range , Series CSHD8 Series (8 Amp) 60V, 100V and 200V in the DPAK package CSHDD16 Series (16 Amp) 40V Central Semiconductor
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CSHD8-60 CSHD8-100 CSHDD16-100C CSHDD16-200C
Abstract: SK5200Y XXXXXX / XXXXXXX = Product type marking code Suggested PAD Layout SIZE TO-252 / DPAK , Rectifiers Marking Code Marking Code Part Number CDBD5040-HF SK540Y CDBD5045-HF SK545Y , Forward Current: 5.0 Amp RoHS Device Halogen Free Features TO-252/DPAK - Batch process design , : Molded plastic, TO-252/DPAK Circuit diagram - Terminals: Solder plated, solderable per MIL-STD , Specification d P0 P1 T E Index hole F B P W C A 12 o 0 D2 D1 D W1 Comchip Technology
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CDBD540-HF CDBD5200-HF MIL-STD-19500 UL94-V0 MIL-STD-750 540-HF
Abstract: / XXXXXX = Product type marking code Suggested PAD Layout TO-252 / DPAK X1 SIZE (mm) (inch , Rectifiers Marking Code Part Number Marking Code CDBD620-G SK620Y CDBD640-G SK640Y , Forward Current: 6.0 Amp RoHS Device DPAK Features -Batch process design, excellent power , ) 0.185(4.70) 0.169(4.30) Mechanical data -Case: TO-252/DPAK, molded plastic. -Terminals: solderable , T E Index hole F W B P C A 12 o 0 D2 D1 D W1 Trailer Comchip Technology
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CDBD6100-G 620-G 640-G 650-G 660-G 680-G
Abstract: Comchip Technology CO., LTD. Page 3 Chip Schottky Barrier Rectifiers Marking Code Part Number Marking Code CDBD620-G SK620Y CDBD640-G SK640Y CDBD650-G SK650Y CDBD660-G SK660Y CDBD680-G SK680Y CDBD6100-G SK6100Y XXXXX XXXXX / XXXXXX = Product type marking code , Forward Current: 6.0 Amp RoHS Device DPAK Features -Batch process design, excellent power , ) 0.169(4.30) Mechanical data -Case: TO-252/DPAK, molded plastic. -Terminals: solderable per MIL-STD Comchip Technology
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6100-G QW-BB032
Abstract: Barrier Rectifiers SMD Diodes Specialist Marking Code Part Number Marking Code CDBD620-G , CDBD6100-G SK6100Y XXXXX XXXXX / XXXXXX = Product type marking code Suggested PAD Layout TO , Reverse Voltage: 20 to 100 Volts Forward Current: 6.0 Amp RoHS Device DPAK Features -Batch process , ) 0.039(1.00) 0.031(0.80) 0.185(4.70) 0.169(4.30) Mechanical data -Case: TO-252/DPAK, molded , P1 T E Index hole F W B P C A 12 o 0 D2 D1 D W1 Trailer Comchip Technology
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Abstract: AC control applications featuring gate triggering in all four (4) quadrants. MARKING CODE: FULL PART NUMBER DPAK THYRISTOR CASE MAXIMUM RATINGS: (TC=25°C unless otherwise noted) SYMBOL Peak Repetitive , MT2 GATE MT2 MARKING CODE: FULL PART NUMBER SYMBOL A B C D E F G H J K L M N DIMENSIONS , k q V d =12V, QUAD I, II, III, IV lj|^l=6.0A, tp=380(JS v D=2/3 v DRM, t C=125° c R0 (20-May 2004) 80 Central Semiconductor Corp. CQD-4M CQD-4N 4.0 AMP TRIAC 600 THRU 800 VOLTS DPAK -
OCR Scan
triac t 218 L2T MARKING CODE
Abstract: sensing circuit applications and control systems. MARKING CODE: FULL PART NUMBER DPAK THYRISTOR CASE , -4M CSD-4N 4.0 AMP SCR 600 THRU 800 VOLTS DPAK THYRISTOR CASE - MECHANICAL OUTLINE I-^ I 1 2 3 T K DATA SHEETS R0 LEAD CODE: 1) CATHODE 2) ANODE 3) GATE 4) ANODE MARKING CODE: FULL PART NUMBER SYMBOL A B C D E F G H J K L M N DIMENSIONS INCHES MILLIMETERS MIN , d =12V, R l =10Q lj=50m A, R qj^=1KQ V d =12V, R l =10Q It M=8 0A, tp=380|JS v D=2/3 v DRM, r GK -
OCR Scan
gk1k
Abstract: 3 1 3 Marking Type number Marking code A 601C A602C A604C A606C A608C A610C , . 4 Marking , Features DPAK â'¢ Batch process design, excellent power dissipation offers better reverse leakage , rated flame retardant â'¢ Case : Molded plastic, TO-252 / DPAK â'¢ Terminals : Solder plated , C DPAK 0.272(6.90) E 0.059(1.50) Y1 0.276(7.00) Y2 Y2 0.276(7.00) X2 Formosa MS
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FM601C-D FM610C-D DS-121129 MIL-STD-750D METHOD-2031 MIL-STD-202F
Abstract: Pinning information Simplified outline Symbol 2=4 4 1 2 3 1 3 Marking Type number Marking code SKFM620C-D SKFM630C-D SKFM640C-D SKFM650C-D SKFM660C-D SKFM680C-D , . 4 Marking , Features â'¢ Batch process design, excellent power dissipation offers DPAK better reverse leakage , data â'¢ Epoxy:UL94-V0 rated flame retardant â'¢ Case : Molded plastic, TO-252 / DPAK â'¢ Terminals Formosa MS
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SKFM6200C-D DS-121635 METHOD-208 METHOD-1026 METHOD-1027 METHOD-1036
Abstract: SGFM51Y-D SGFM52Y-D SGFM54Y-D SGFM56Y-D SGFM58Y-D Marking code SF51Y SF52Y SF54Y SF56Y SF58Y Suggested , P D2 T C D W1 D1 unit:mm Item Symbol Tolerance DPAK Carrier width Carrier , . 4 Marking , SGFM58Y-D 5.0A Surface Mount Super Fast Rectifiers-50-600V Features Package outline Formosa MS DPAK , -252 / DPAK · Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 0.114(2.90) 0.098(2.50 Formosa MS
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DS-12 DS-121411 METHOD-1038 JESD22-A102 METHOD-1051 METHOD-1056
Abstract: Simplified outline Symbol 2=4 4 1 2 3 1 3 Marking Type number Marking code , . 4 Marking , Package outline 3 Features · Batch process design, excellent power dissipation offers DPAK , plastic, TO-252 / DPAK · Terminals : Solder plated, solderable per 0.039(1.00) 0.031(0.80) 0.185 , SK680Y SK6100Y Suggested solder pad layout X1 PACKAGE DPAK C 0.272(6.90) E 0.059 Formosa MS
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SKFM640Y-D SKFM620Y-D SKFM6100Y-D DS-12161O 125OC METHOD-4066-2 175OC
Abstract: 2 3 1 3 Marking Type number Marking code SKFM820Y-D SKFM840Y-D SKFM850Y-D , . 4 Marking , Features â'¢ Batch process design, excellent power dissipation offers DPAK better reverse leakage , ) Mechanical data â'¢ Epoxy:UL94-V0 rated flame retardant â'¢ Case : Molded plastic, TO-252 / DPAK â , pad layout X1 PACKAGE C DPAK 0.272(6.90) E 0.059(1.50) Y1 0.276(7.00) Y2 Formosa MS
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smd 0y SKFM8100Y-D DS-12160 DS-12160J METHOD-1021 METHOD-1031
Abstract: Simplified outline Symbol 2=4 4 1 2 3 1 3 Marking Type number Marking code , . 4 Marking , Features â'¢ Batch process design, excellent power dissipation offers DPAK better reverse leakage , data â'¢ Epoxy:UL94-V0 rated flame retardant â'¢ Case : Molded plastic, TO-252 / DPAK â'¢ Terminals , Suggested solder pad layout X1 PACKAGE C DPAK 0.272(6.90) E 0.059(1.50) Y1 0.276(7.00 Formosa MS
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SKFM1020C-D SKFM10200C-D DS-121639
Abstract: layout Marking code Sk1620 SK1630 SK1640 SK1650 SK1660 SK1680 SK16100 SK16150 SK16200 X1 PACKAGE C , . 4 Marking , outline DPAK SKFM1620C-D THRU SKFM16200C-D 16.0A Surface Mount Schottky Barrier Rectifiers - 20V-200V , -252 / DPAK · Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 0.185(4.70) 0.169(4.30 , information Simplified outline 4 1 2 3 1 3 Marking Type number SKFM1620C-D SKFM1630C-D Formosa MS
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L-STD-750D METHOD-215 DS-121664
Abstract: 4 1 2 3 1 3 Marking Type number Marking code SKFM620Y-D SKFM640Y-D , . 4 Marking , Features â'¢ Batch process design, excellent power dissipation offers DPAK better reverse leakage , data â'¢ Epoxy:UL94-V0 rated flame retardant â'¢ Case : Molded plastic, TO-252 / DPAK â'¢ Terminals , Suggested solder pad layout X1 PACKAGE C DPAK 0.272(6.90) E 0.059(1.50) Y1 0.276(7.00 Formosa MS
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Abstract: Suggested solder pad layout Marking code SK620 SK630 SK640 SK650 SK660 SK680 SK6100 SK6150 SK6200 X1 , . 4 Marking , outline DPAK SKFM620C-D THRU SKFM6200C-D 6.0A Surface Mount Schottky Barrier Rectifiers - 20V-200V , -252 / DPAK · Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 0.185(4.70) 0.169(4.30 , SKFM6200C-D Pinning information Simplified outline 4 1 2 3 1 3 Marking Type number Formosa MS
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DS-121
Abstract: Simplified outline Symbol 2=4 4 1 2 3 1 3 Marking Type number Marking code , . 4 Marking , Features DPAK â'¢ Batch process design, excellent power dissipation offers better reverse leakage , ) Mechanical data â'¢ Epoxy:UL94-V0 rated flame retardant â'¢ Case : Molded plastic, TO-252 / DPAK â , solder pad layout X1 PACKAGE C DPAK 0.272(6.90) E 0.059(1.50) Y1 0.276(7.00) Y2 Formosa MS
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Abstract: information Simplified outline Symbol 2=4 4 1 2 3 1 3 Marking Type number Marking code SGFM51Y-D SGFM52Y-D SGFM54Y-D SGFM56Y-D SGFM58Y-D SF51Y SF52Y SF54Y SF56Y SF58Y , . 4 Marking , '¢ Batch process design, excellent power dissipation offers â'¢ â'¢ â'¢ â'¢ â'¢ â'¢ DPAK better , ) Mechanical data â'¢ Epoxy:UL94-V0 rated flame retardant â'¢ Case : Molded plastic, TO-252 / DPAK â Formosa MS
Original
S-121411
Abstract: pad layout Marking code SK620 SK630 SK640 SK640 SK650 SK660 SK680 SK6100 SK6150 SK6200 X1 , . 4 Marking , Formosa MS Package outline DPAK SKFM620C-D THRU SKFM6200C-D 6.0A Surface Mount Schottky Barrier , plastic, TO-252 / DPAK · Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 0.114(2.90 , information Simplified outline 4 1 2 3 1 3 Marking Type number SKFM620C-D SKFM630C-D Formosa MS
Original
Abstract: information Simplified outline 4 Formosa MS Symbol 2=4 1 2 3 1 3 Marking Type number SGFM51Y-D SGFM52Y-D SGFM54Y-D SGFM56Y-D SGFM58Y-D Marking code SF51Y SF52Y SF54Y SF56Y SF58Y Suggested , . 4 Marking , "-H" indicates Halogen free parts, ex. SGFM51Y-D-H. Formosa MS DPAK Package outline 0.048 , · Case : Molded plastic, TO-252 / DPAK · Terminals : Solder plated, solderable per MIL-STD Formosa MS
Original
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