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Part Manufacturer Description Datasheet BUY
282807-5 TE Connectivity (282807-5) 3P TERMI-BLOK PLUG,MARKED visit TE Connectivity
7-1571986-2 TE Connectivity (7-1571986-2) A101J1AV2Q004AM marking O - visit TE Connectivity
5-2023347-3 TE Connectivity (5-2023347-3) LCEDI UPPER SHELL WITH DATUM MARK PLATED visit TE Connectivity
2238156-1 TE Connectivity (2238156-1) MARK II POSITIVE LOCK 22-18 visit TE Connectivity
91592-1 TE Connectivity (91592-1) CERTICRIMP 2 22-18 MIC MARK II visit TE Connectivity
2-1546857-7 TE Connectivity (2-1546857-7) 3P VERT PLUG,GRAY,MARKED visit TE Connectivity

cxf marking

Catalog Datasheet MFG & Type PDF Document Tags

siemens Package Outlines P-LCC

Abstract: =1,0) te e PFS W (PM0D:PSM=1; CMD1:CSS=0) FSC (CMD1:CSS, CSM=1,1) OD (CMD2:CXF=0) _X_ DU (CMD2:CRR=0) DD (CMD2:CXF=1) DU{CMD2:CRR=1) DD (CMD2:CXF=0) DU (CMD2:CRR=0) < m i \\Y A \ rv T rj VAT XI , Fram e Z ÍC c DD (CMD2:CXF=1 ) DU (CMD2:CRR=1) DD (CM02:CXF=1) DU (CMD2:CRR=0) DD (CMD2:CXF , =1;CMD1:CSS: (CM01 :CSS, CSM=1,1) DD (CMD2:CXF=0 DU (CMD2:CRR=0 DD (CMD2:CXF=1 DU (CMD2:CRR=1 DD (CMD2:CXF=0 DU (CMD2:CRR=0 DD (CHD2:CXF-1 DU (CMD2:CRR-` DD (CMD2;CXF=: DU (CMD2:CRR=i DD (CHD2:CXF=I DCL (CMD1
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OCR Scan

C80F

Abstract: CX5 marking SN74LVC1G80DBVT Reel of 3000 SN74LVC1G80DCKR Reel of 250 SN74LVC1G80DCKT TOP-SIDE MARKING (2) _ _ , design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three , -1-260C-UNLIM -40 to 85 (CX5 ~ CXF ~ CXK ~ CXR) SN74LVC1G80DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (CX5 ~ CXF ~ CXK ~ CXR
Texas Instruments
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C80F CX5 marking SN74LVC1G80 SCES221Q A114-A A115-A ISO/TS16949
Abstract: SN74LVC1G80DBVT SN74LVC1G80DCKR SN74LVC1G80DCKT TOP-SIDE MARKING (2) _ _ _CX_ C80_ CX_ Package drawings , www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month , ) (C805 ~ C80F ~ C80R) (C805 ~ C80F ~ C80R) (C805 ~ C80F ~ C80R) (CX5 ~ CXF ~ CXK ~ CXR) (CX5 ~ CXF ~ CXK ~ CXR) (CX5 ~ CXF ~ CXK ~ CXR) (CX5 ~ CXF ~ CXK ~ CXR) (CX5 ~ CXF ~ CXK ~ CXR) (CX5 ~ CXF ~ CXK ~ CXR Texas Instruments
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Abstract: Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking , (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CX5 ~ CXF ~ CXK ~ CXR , -1-260C-UNLIM -40 to 125 (CX5 ~ CXF ~ CXK ~ CXR) SN74LVC1G80DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CX5 ~ CXF ~ CXK ~ CXR , -1-260C-UNLIM -40 to 125 (CX5 ~ CXF ~ CXK ~ CXR) SN74LVC1G80DCKTE4 ACTIVE SC70 DCK 5 250 Texas Instruments
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SCES221R
Abstract: Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking , (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CX5 ~ CXF ~ CXK ~ CXR , -1-260C-UNLIM -40 to 125 (CX5 ~ CXF ~ CXK ~ CXR) SN74LVC1G80DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CX5 ~ CXF ~ CXK ~ CXR , -1-260C-UNLIM -40 to 125 (CX5 ~ CXF ~ CXK ~ CXR) SN74LVC1G80DCKTE4 ACTIVE SC70 DCK 5 250 Texas Instruments
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Abstract: capacitor (CxF) in one half of the period. During the other half of the period (transfer phase), CxF is , 50% duty cycle. Each single-ended charge pump transfers charge into its transfer capacitor (CxF) in one-half of the period. During the other half of the period (transfer phase), CxF is placed in series with , transfer capacitors (CxF) will be the smallest. The input capacitor improves system efficiency by reducing , times as large as CxF. The output capacitor (CO) can be selected from 5-times to 50-times larger than Texas Instruments
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TPS60100 SLVS213C TPS60100EVM
Abstract: capacitor (CxF) in one half of the period. During the other half of the period (transfer phase), CxF is , cycle. Each single-ended charge pump transfers charge into its transfer capacitor (CxF) in one-half of the period. During the other half of the period (transfer phase), CxF is placed in series with the , , the transfer capacitors (CxF) will be the smallest. The input capacitor improves system efficiency , to four times as large as CxF. The output capacitor (CO) can be selected from 8-times to 50 Texas Instruments
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TPS60111 SLVS216B TPS60110EVM
Abstract: ° phase shift. Each single ended charge pump transfers charge into its transfer capacitor (CxF) in one half of the period. During the other half of the period (transfer phase), CxF is placed in series with , (CxF) in one-half of the period. During the other half of the period (transfer phase), CxF is placed in , noise requirements, and mode of operation. Generally, the transfer capacitors (CxF) will be the smallest , input current. CIN is recommended to be about two to four times as large as CxF. The output capacitor Texas Instruments
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TPS60110EVM-132
Abstract: capacitor (CxF) in one half of the period. During the other half of the period (transfer phase), CxF is , single-ended charge pump transfers charge into its transfer capacitor (CxF) in one-half of the period. During the other half of the period (transfer phase), CxF is placed in series with the input to transfer its , , the transfer capacitors (CxF) will be the smallest. The input capacitor improves system efficiency by , times as large as CxF. The output capacitor (CO) can be selected from 5-times to 50-times larger than Texas Instruments
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TPS60100EVM-131
Abstract: Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking , -1-260C-UNLIM -40 to 125 (CX5 ~ CXF ~ CXK ~ CXR) SN74LVC1G80DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CX5 ~ CXF ~ CXK ~ CXR , -1-260C-UNLIM -40 to 125 (CX5 ~ CXF ~ CXK ~ CXR) SN74LVC1G80DCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CX5 ~ CXF ~ CXK ~ CXR Texas Instruments
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Abstract: transfer capacitor (CxF) in one half of the period. During the other half of the period (transfer phase), CxF is placed in series with the input to transfer its charge to CO. While one single-ended charge , single-ended charge pump transfers charge into its transfer capacitor (CxF) in one-half of the period. During the other half of the period (transfer phase), CxF is placed in series with the input to transfer its , transfer capacitors (CxF) is the smallest. The input capacitor improves system efficiency by reducing the Texas Instruments
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TPS60110 SLVS215C
Abstract: Characterisitcs: Properties Test Conditions Value min VRWM VBV IR VF vC vCl,IO vCl,VDD CIO CIO-F CX CX-F Pin 5 , : G Body Marking: 6 5 4 C A B C F E D 0.60 1.10 0.95 2.50 1.40 3.60 mm mm mm mm mm 1 2 Würth Elektronik
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UL94V-0 D-74638

MSOP-10L

Abstract: WE-TVS ITLP = 17A, VDD to GND 9 V CIO CIO-F CX CX-F VPin3=5V, VPin8=0V, VIO=2.5V, f=1MHz, I/O , : G Body Marking: C 10 A 2.50 mm C 0.50 mm D 0.30 mm E 1.60 mm
Würth Elektronik
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MSOP-10L WE-TVS W1444 marking code YW DIODE cxf marking 824014

MSP430

Abstract: TPS60310 offered as either open-drain or push-pull output. AVAILABLE OPTIONS PART NUMBER MARKING DGS PACKAGE , Capacitor Values for Low-Output Voltage Ripple Operation IO(OUT2) [mA] CIN [µF] CXF [µF] COUT , for Lowest Output Voltage Ripple VIN [V] IO(OUT2) [mA] CIN[µF] CERAMIC CXF[µF] CERAMIC
Texas Instruments
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TPS60310 TPS60311 TPS60312 TPS60313 MSP430 TPS60310DGS TPS60311DGS SLVS362A
Abstract: . AVAILABLE OPTIONS PART NUMBER MARKING DGS PACKAGE ATG ATI ATK ATL OUTPUT CURRENT 1 [mA] 40 40 40 40 OUTPUT , CXF [µF] CERAMIC 1 1 1 COUT [µF] CERAMIC 1 2.2 10 // 0.1 VP­P [mV] AT 20 mA/ VIN = 1.1 V 16 10 6 , CIN[µF] CERAMIC 1 1 1 1 CXF[µF] CERAMIC 1 1 1 1 COUT[µF] CERAMIC 1 1 1 1 LP[µH] 0.1 0.1 1 1 CP[µF -
OCR Scan
Q67101-H6484 P-MQFP-80-1 Q67101-H6605 1TDD5B70 54CC2
Abstract: either open-drain or push-pull output. AVAILABLE OPTIONS PART NUMBER MARKING DGS PACKAGE OUTPUT , 1 10 // 0.1 6 IO(OUT2) [mA] CIN [µF] CXF [µF] COUT [µF] CERAMIC VIN [V , Voltage Ripple VIN [V] IO(OUT2) [mA] CIN[µF] CERAMIC CXF[µF] CERAMIC COUT[µF Texas Instruments
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SLVS362 TPS6031X

TPS60302

Abstract: TPS60302DGS MARKING DGS PACKAGE OUTPUT CURRENT 1 [mA] OUTPUT CURRENT 2 [mA]§ OUTPUT VOLTAGE 1 [V , ) [mA] CIN [µF] CXF [µF] COUT [µF] CERAMIC VIN [V] CERAMIC CERAMIC Table 2 , 4. Recommended Values for Lowest Output Voltage Ripple VIN [V] IO(OUT2) [mA] CIN[µF] CXF
Texas Instruments
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TPS60300 TPS60301 TPS60302 TPS60303 TPS60302DGS TPS60303DGS TPS60300DGS SLVS302 TPS6030

MSP430

Abstract: TPS60300 offered as either open-drain or push-pull output. AVAILABLE OPTIONS PART NUMBER MARKING DGS PACKAGE , Capacitor Values for Low-Output Voltage Ripple Operation IO(OUT2) [mA] CIN [µF] CXF [µF] COUT , for Lowest Output Voltage Ripple VIN [V] IO(OUT2) [mA] CIN[µF] CERAMIC CXF[µF] CERAMIC
Texas Instruments
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TPS60301DGS SLVS302A

MSP430

Abstract: TPS60310 OPTIONS PART NUMBERâ'  MARKING DGS PACKAGE OUTPUT CURRENT 1 [mA]â'¡ OUTPUT CURRENT 2 [mA] , [µF] CXF [µF] COUT [µF] CERAMIC VIN [V] CERAMIC CERAMIC Table 2. Recommended , [µF] CXF[µF] COUT[µF] CERAMIC CERAMIC CERAMIC CERAMIC VP(OUT) VPâ'"P[mV
Texas Instruments
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TPS60312DGS
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