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ctbga Datasheet

Part Manufacturer Description PDF Type
CTBGA Amkor Technology ChipArray Packages Original

ctbga

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Abstract: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray® Packages: Amkor's ChipArray , ), Amkor offers thin core ball grid array packages (CTBGA and CVBGA) which, coupled with a thin mold cap , ) 4.1nH (5.0 mm trace length) Theta JA at 1.0 Watt and 0 airflow (°C/Watt) CABGA CTBGA CVBGA 8x8 , sheet CABGA/CTBGA/CVBGA SIDE VIEW TOP VIEW BOTTOM VIEW Process Highlights Die thickness , available Burn-in Shipping JEDEC trays Tape and Reel services CABGA/CTBGA/CVBGA Standard Package Amkor Technology
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amkor CABGA 56 chiparray amkor CABGA 8X8 CABGA 17 x 17 thermal resistance 8x8 64 footprint CVBGA MO-216
Abstract: Speed Temperature Voltage Status Sample Minimum Order Quantity Factory Order Increment CTBGA 176 (BKG176) No CTBGA 176 NA C 1.8 V Active No 1000 1000 Distributor Inventory Part SSTUB32S868CHLFT Integrated Device Technology
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SSTUB32S868C 28BIT
Abstract: Order Increm ent CTBGA 176 (BKG176) No CTBGA 176 NA C 1.8 V Active No 208 208 Distributor Inventory Integrated Device Technology
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SSTUB32S868CHLF
Abstract: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray® Packages: ChipArray® BGA (CABGA / LFBGA) Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor's ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are compatible with established , JA at 1.0 Watt and 0 airflow (°C/Watt) ABGA C CTBGA CVBGA 8 x 8 37.28 36.45 37.52 10 x 10 , Date: 08'10 LAMINATE data sheet CABGA/CTBGA/CVBGA SIDE VIEW TOP VIEW BOTTOM VIEW Amkor Technology
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vFBGA* 96 bALL amkor cabga thermal resistance Amkor Wafer level mold compound BGA 256 PACKAGE thermal resistance MO-195 jedec Package
Abstract: Parameters Distributor Inventory Package CTBGA 160 (BKG160) Recom m ended For New Designs No Package CTBGA 160 Speed NA Tem perature C Voltage 1.8 V Status Active Sam Integrated Device Technology
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IDT CROSS SSTUB32S865A SSTUB32S865AHLF 25-BIT M-07-01
Abstract: Package Speed Tem perature Voltage Status Sam ple Minim um Order Quantity Factory Order Increm ent CTBGA 176 (BKG176) No CTBGA 176 NA C 1.8 V Active No 208 208 Distributor Inventory Part 74SSTU32D868BKG Integrated Device Technology
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74SSTU32D868 TB-0512-01
Abstract: PQFP 28 X 28 81 ball 8 X 8 CABGA 8 lead SOIC (halogen-free) 144 CABGA 12 X 12/0.8 144 CTBGA 10 X 10/0.8 , temperature applications -ATP P3 started on a new CTBGA (144 ball, 10X10, 0.8 wide) package for Pb-free Atmel
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TQ32 ablestik amkor amkor cabga ASE LQFP 208 CABGA 6x6
Abstract: Factory Order Increm ent CTBGA 160 (BKG160) No CTBGA 160 NA C 1.8 V Active No 1000 1000 Distributor Integrated Device Technology
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SSTUB32S865AHLFT
Abstract: Package Speed Tem perature Voltage Status Sam ple Minim um Order Quantity Factory Order Increm ent CTBGA 176 (BKG176) No CTBGA 176 NA C 1.8 V Active No 2000 2000 Distributor Inventory Part Integrated Device Technology
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74SSTU32D868BKG8
Abstract: , video Phase Lock Loops (PLLs) driven from a single crystal Packaging · 248-pin CTBGA, 10x10mm, 0.5mm , /FootPrint Package Code/Variation Package: CTBGA; 248-pin; 104 mm² Package Code/Variation: X24800+1* RoHS GEO Semiconductor
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MAX64180 MAX64180CXO 720p30 H.264 encoder arm doorbells ARM9 AES h.264 codec 240MH
Abstract: Packaging 233-pin CTBGA, 10mm x 8mm x 1.1mm, 0.5mm pitch, RoHS compliant Applications H.264 USB , MAX64380CXU+ Package: Type/Pins Package Code/Variation Package: CTBGA; 233-pin Package Code/Variation: X23308 GEO Semiconductor
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MAX64380 1080p video encoder MAX6438 USB TO VIDEO 233pin 1080p video encoder IP X23308-1 400MH
Abstract: grid array (CTBGA) package and is specified for the extended industrial (-40°C to +85°C) temperature , . Packaging Information A. Package Type: 144-ball CTBGA 12x12 array B. Lead Frame: N/A C. Lead Maxim Integrated Products
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MAX19527 69dBFS MAX19527EXE QB0ZCQ002B JESD22-A114
Abstract: ent CTBGA 160 (BKG160) NA C 1.8 V Active No 1000 1000 Distributor Inventory No Pricing information Integrated Device Technology
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SSTUA32S865A SSTUA32S865AHLFT
Abstract: ent CTBGA 150 (BKG150) NA C 1.8 V Obsolete No 240 240 Distributor Inventory No Pricing information Integrated Device Technology
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SSTUB32S869A SSTUB32S869AHLF
Abstract: ent CTBGA 160 (BKG160) NA C 1.8 V Active No 595 119 Distributor Inventory No Pricing information Integrated Device Technology
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SSTUA32S865AHLF
Abstract: Minimum Order Quantity Factory Order Increment Related Documents 74SSTUBF32865ABK CTBGA 160 (BK160) NA C 1.8 V New Yes 119 119 74SSTUBF32865ABK8 CTBGA 160 (BK160) NA C 1.8 V New Yes 2000 2000 74SSTUBF32865ABKG CTBGA 160 (BKG160) NA C 1.8 V Active Yes 119 119 74SSTUBF32865ABKG8 CTBGA 160 (BKG160) NA C 1.8 Integrated Device Technology
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160-ball 28-BIT IDT74SSTUBF32865A 74SSTUBF32865A
Abstract: : FWFP 6 : EBGA 9 : ELQFP B : BGA D : DIP F : BCC H : SBGA K : CTBGA M : QFPH P : PLCC R Samsung Electronics
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RFC-M teBGA
Abstract: ent CTBGA 150 (BKG150) NA C 1.8 V Obsolete No 2000 2000 Distributor Inventory No Pricing Integrated Device Technology
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SSTUB32S869AHLFT
Abstract: Available in 160-pin CTBGA package The SSTU32865 is a 28-bit 1:2 configurable registered buffer designed , Connected HIGH. 160-BALL CTBGA TOP VIEW 3 IDT74SSTU32865 28-BIT 1:2 REGISTERED BUFFER WITH PARITY COMMERCIAL TEMPERATURE RANGE 160 BALL CTBGA PACKAGE ATTRIBUTES Top Mark 1 2 3 Integrated Device Technology
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MIL-STD-883 SSTU32
Abstract: 20 188 36,864 2 86 TFBGA (6x6 mm) 100 VQFP (14x14 mm) 101 CTBGA (6x6 mm) 144 TQFP (20x20 mm) 196 , . Table 2: Maximum Usable I/Os Platform QL8050 QL1P100 QL1P300 QL1P1000 86 TFBGA 100 VQFP 101 CTBGA 121 , QL8050 PF PU PV PU PU QL1P100 PU PF PT PS QL1P300 QL1P1000 PU PS PS Package Type TFBGA TQFP CTBGA VQFP , www.quicklogic.com · · · · · · 21 PolarPro Solution Platform Family Data Sheet Rev. A QL8050 - 101 CTBGA Pinout Table Table 19: QL8050 - 101 CTBGA Pinout Table Pin A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 B1 B2 B3 QuickLogic
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nand flash sdio quicklogic QUICKLOGIC SDIO Host
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