87900-114HLF
Amphenol Communications Solutions
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
CED012001142001
Amphenol Communications Solutions
Double Density Cool Edge,storage and server connectors,SMT,200 signal pins, 0.8 mm,Vertical,2.36mm AIC
68000-114H
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch
68000-114HLF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 14 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
L17TF3700114
Amphenol Communications Solutions
Dsub, Stamped Signal 3A, Straight PCB Thru Hole Press-Fit, 37 Socket, Bright Tin Shell, Flash Gold, M3 Threaded Boardlock
L17TF2500114
Amphenol Communications Solutions
Dsub, Stamped Signal 3A, Straight PCB Thru Hole Press-Fit, 25 Socket, Bright Tin Shell, Flash Gold, M3 Threaded Boardlock
