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Part Manufacturer Description Datasheet BUY
HFA3135IH96 Intersil Corporation 2 CHANNEL, UHF BAND, Si, PNP, RF SMALL SIGNAL TRANSISTOR, PLASTIC PACKAGE-6 visit Intersil
ISL73096RHVF Intersil Corporation RF POWER TRANSISTOR visit Intersil
ISL73128RHVF Intersil Corporation RF POWER TRANSISTOR visit Intersil
ISL73127RHVF Intersil Corporation RF POWER TRANSISTOR visit Intersil
ISL73096RHVX Intersil Corporation RF POWER TRANSISTOR visit Intersil
SN75468NSRE4 Texas Instruments 500mA, 100V, 7 CHANNEL, NPN, Si, SMALL SIGNAL TRANSISTOR, GREEN, PLASTIC, SOP-16 visit Texas Instruments

W17 smd package transistor

Catalog Datasheet MFG & Type PDF Document Tags

HIR26-21C

Abstract: w32 smd transistor Look Emitter - SMD Photo Diode - DIP Photo Diode - Side Look Photo Diode - SMD Photo Transistor - DIP Photo Transistor - Side Look Photo Transistor - SMD Darlington Transistor - DIP-DC High Speed Transistor - DIP-AC Transistor - DIP-DC Transistor - SOP-AC Transistor - SOP-DC Transistor - SSOP-AC Transistor - SSOP-DC Triac Schmitt Trigger High Data Rate Short Burst - DIP-Vo-GND-Vcc High Data Rate , LEDs, LAMPs, SMD LEDs, Lighting Modules, Digital Displays, Optocouplers and Infrared components
EVERLIGHT
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88E1119R

Abstract: 88E1119 -ball fpBGA (1mm pitch) package. A complete description of this device can be found in the LatticeECP3 Family , under the Device pull-down menu, and 16-lead SOIC under the Package submenu. Figure 5. Select Device , U1E M17 P15 N16 U16 U15 AB17 AA17 T14 R14 AB18 AB19 W18 W17 Y17 Y18 V18 V17
Lattice Semiconductor
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LFE3-35E-FN484CES

Abstract: 88e1119r LatticeECP3 devices in the 484-ball fpBGA (1mm pitch) package. A complete description of this device can be , under the Package submenu. Figure 5. Select Device Dialog Box 6 LatticeECP3 Versa Evaluation , AB18 AB19 W18 W17 Y17 Y18 V18 V17 AA19 Y19 T15 T16 P22 R21 N19 M19 R22 T22 N18 P19
Lattice Semiconductor
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88E1119R

Abstract: 88E1119 pin-compatible LatticeECP3 devices in the 484-ball fpBGA (1mm pitch) package. A complete description of this , , and 16-lead SOIC under the Package submenu. Figure 5. Select Device Dialog Box 6 LatticeECP3 , LED4 LED5 LED6 LED7 U16 U15 AB17 AA17 T14 R14 AB18 AB19 W18 W17 Y17 Y18 V18 V17 AA19 Y19 T15 T16 P22
Lattice Semiconductor
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mdd 2605

Abstract: HCPL 1458 8 pin opto / T-1 and 5mm / T-1 3/4 package Ì High radiant intensity Ì Low forward voltage 5mm / T-1 3/4 537838 , package Ì High luminous output Ì Water clear lens 5mm / T-1 3/4 537565 Luminous Intensity LED Colour , readability in sunlight are essential Ì The package epoxy contains both UV-A and UV-B inhibitors to reduce the , , offering superior temperature and moisture resistance in outdoor signal and sign applications Ì The package
Element14 Catalog
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TRANSISTOR SMD K23

Abstract: B DIN 5463 start menu. Currently, the software package is only available for use with Microsoft Windows , Bill of Material www.ti.com 8 Bill of Material Table 1. Bill of Materials QTY Package , of Materials (continued) QTY Description Package Manufacturer Manufacturer PN , www.ti.com Table 1. Bill of Materials (continued) QTY Description Package Manufacturer , transformer SM-22 Tyco/Macom MABA-007159-000000 RoHS QUL TR1, TR2 1 16 Package
Texas Instruments
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TRANSISTOR SMD K23 B DIN 5463 SLAU296 ADS54RF63-ADX4

Alc201A

Abstract: HY-05 HYCOM 478-Pin Package Thermal Design Guidelines 249889 ® ® Mechanical Enabling for the Intel Pentium 4 Processor in the 478-pin Package 290728 Intel® 82801DB I/O Controller Hub 4 (ICH4 , DIMM slots - 732 pin Micro-FCBGA package - Intel® 82801DB I/O Controller Hub 4 (ICH4) · 421-ball mBGA package · Dual-channel ATA-100 for up to four devices · SMBus 2.0 · Six USB 2.0/1.1 ports · , Kbytes L2 cache on 0.13 micron process is a follow-on to the Pentium 4 processor in the 478-pin package
Intel
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Alc201A HY-05 HYCOM diode DB3 C531 ALC201 SmD TRANSISTOR a75 smd diode c539 852GME

7N60B equivalent

Abstract: 18N50 equivalent Voltage on Any Pin (3)(4) -0.5 VDDx + 0.5 Volts PD Package Power Dissipation 2.8 , 175 °C Package Thermal Resistance (Junction to Case) (7) 3.6 °C /W 1000 V -65 , ) Common Mode on LVPECL Pins ­ ­ Volts TC External Package Temperature 125 °C , transistor body tie connections to the p- and n-channel substrates are made to ensure no source/drain , ) Life Tests ­ 1000 hours at 125°C or equivalent Package related mechanical tests ­ Shock, Vibration
IXYS
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7N60B equivalent 18N50 equivalent ixgh 1499 MOSFET smd 4407 IXDD 614 C 547 B W57 BJT transistor MO-153 MS-013 MS-012 5M-1994 MO-229

HXSRD01

Abstract: 10Gb trivor : 1 · · · · · · · · · · Pinout Information Pinout Diagrams Package Specifications Flip-Chip Packages , particular package are pinout compatible and are listed in the same table (one table per package). In , needed for clocks. This pin is for the DCI voltage reference resistor of P transistor (per bank). This pin is for the DCI voltage reference resistor of N transistor (per bank). This is the alternative pin for the DCI voltage reference resistor of P transistor. This is the alternative pin for the DCI
Honeywell
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HXSRD01 10Gb trivor smd transistor M21 w18 smd transistor honeywell material spec microcircuit 10G serdes 2.5 quad 1875G 1X106 22CFR N61-1005-000-000

XC2V6000-ff1152

Abstract: 12x12 bga thermal resistance = = = Capacitor Connector Diode Fuse Inductor Transistor Resistor Resistor Pack Arbitrary Logic , CTRL Trace Spacing Minimum Spacing to Other DDR2 Minimum Isolation Spacing to non-DDR2 Package Length , to non-DDR2 Package Length P1 Trace Length Limit - L0 Trace Length Limit - L1 Stub Length S1-Stub , Length Matching (Total Length including Breakout package) Exceptions (Reduce geometries for GMCH , Termination Resistor Maximim Via Count CTRL to SCK/SCK# Length Matching (Total Length including package
Xilinx
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UG002 XC2V80 XC2V6000-ff1152 12x12 bga thermal resistance xc2v3000fg IO-L93N Printed Circuit Boards PCB smd transistor J6 pin CS144 FG256 FG456 FG676 FF896

SK 18751

Abstract: ALC269 = = = = = = = = Capacitor Connector Diode Fuse Inductor Transistor Resistor Resistor Pack Arbitrary , 4.5"~9.0" 5 / 10 mils GMCH Pin P1 Package Length Range L1 Min:0.5" Max:5.0" 7 mil trace, 4 , mil +/- 25 mil GMCH Pin P1 Package Length Range L1 L2 L3 L4 SO-DIMM0 PADS , # Min : Clock - 1.0" , Max : Clock + 0.5" B GMCH Pin P1 Package Length Range L1 L2 56 ohm 5% CPC Signals Topologies and Routing Guidelines SO-DIMM0,1 PADS L1 P1 Package Length Range Trace
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SK 18751 ALC269 RR0510S-80R6-FN TRANSISTOR SMD K27 FIC CW0A0 smd transistor g28 945GMS 1/16W SMT0402 1/10W SMT0603 NTC017-BA1G-A160T

via vn800

Abstract: EQUIVALENT transistor 18751 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Device/Package Combinations and Maximum , . . . . . . . . . . . . . . . FF484 Flip-Chip Fine-Pitch BGA Package Specifications (1.00 mm Pitch , . . . . . . . . FF784 Flip-Chip Fine-Pitch BGA Package Specifications (1.00 mm Pitch) . . . . . . , . . FF1156 Flip-Chip Fine-Pitch BGA Package Specifications (1.00 mm Pitch) . . . . . . . . . . . . , Flip-Chip Fine-Pitch BGA Package Specifications (1.00 mm Pitch) . . . . . . . . . . . . . . . . . . . . . .
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LM13W VT1631 via vn800 EQUIVALENT transistor 18751 DIODE SMD AE22 VT8237R layout audio power sb 18751 VN800 VT8237R VT8237 15PIN

npn transistor bc148 datasheet

Abstract: pin configuration NPN transistor BC148 the flip chip-pin grid array (FC-PGA) package · Supports Intel® Pentium® III processors (up to 1 GHz); in the flip chip-pin grid array (FCPGA) package · Supports Intel® Pentium® III processors with 512 Kbytes L2 cache; in the flip chip-pin grid array (FC-PGA2) package · Supports a 66, 100 , embedded requirements. It uses the Red Hat Package Manager (RPM) to allow customized installations on the , ® Pentium® III processors in the flip chip-grid array (FC-PGA) package, and Intel® Pentium® III processors
Intel
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BC137 BC148 BC157 BC158 npn transistor bc148 datasheet pin configuration NPN transistor BC148 TRANSISTOR BC135 BC148 pin configuration 82801 g SCHEMATIC DIAGRAM socket AM2 pinout 810E2 BC124 BC125 BC126 BC127 BC128

transistor SMD MARKING CODE L33

Abstract: TRANSISTOR SMD MARKING CODE W25 T17 U17 V17 W17 L18 M18 N18 P18 R18 Y18 L19 M19 N19 P19 R19 Y19 L20 M20 N20 P20 R20 Y20 L21 M21 N21
Xilinx
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UG365 transistor SMD MARKING CODE L33 TRANSISTOR SMD MARKING CODE W25 TRANSISTOR SMD MARKING CODE W32 LX240T XC6VLX240T UG365 AL2230

respack 8

Abstract: transistor BC188 npn INFORMATION PACKAGE OUTLINE SOLDERING Introduction to soldering surface mount packages Reflow soldering Wave , RGB output · Generation of synchronization and validation signals for the Thin Film Transistor (TFT , INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION plastic ball grid array package; 292 balls; body 27 × 27 × , D10 C10 D9 C9 C8 D7 U19 W17 U18 V19 W19 SAA6712E SYMBOL DQ29 DQ30 DQ31 DQ32 DQ33 DQ34 DQ35 DQ36
Intel
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respack 8 transistor BC188 npn bc107 TRANSISTOR SMD CODE PACKAGE SOT23 schematic diagram motor control MC60 BC217 BC188 pnp transistor
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