NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: 90.0 -594.1 260 VS207 VS207 3390.0 -594.1 206 VS153 VS153 150.0 -594.1 261 VS208 ... | Original |
23 pages, |
VS115 VS112 VS217 VS233 VS247 T4 3570 VS281 VS285 LD3001 LD300 vs133 t4 and 3570 VS205 VS261 VS291 WFP6462 WFP6462 abstract |
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| Abstract: 5152.0 -450.1 215 VS171 VS171 2656.0 -450.1 255 VS208 5216.0 -450.1 216 VS172 VS172 ... | Original |
25 pages, |
WFP6540B cl 2556 tan IQR 2400 vs133 VS208 vs237 VS241 VS95 4501 ac VS247 H44 928 WFP6540B abstract |
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| Abstract: VS207 VS207 6055.0 -463.4 211 VS170 VS170 3465.0 -463.4 249 VS208 6125.0 -463.4 212 ... | Original |
26 pages, |
WFP6530B VS232 vs133 60-1600 vs237 WFP6530B abstract |
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| Abstract: PRELIMINARY PRODUCT INFORMATION MOS INTEGRATED CIRCUIT uPD161834 uPD161834 240-OUTPUT 240-OUTPUT TFT-LCD SOURCE DRIVER WITH TIMING GENERATOR (COMPATIBLE WITH 64-GRAY 64-GRAY SCALES) DESCRIPTION The uPD161834 uPD161834 is a source driver for LTPS TFTs with on-chip timing generator and featuring 240 outputs. Data input as 6-bit x 3-dot digital data is output as 64 -corrected values using an internal D/A converter, achieving 262,144-color (fullcolor) display. FEATURES · CMOS level input · 240 outputs (R, G, B three di ... | Original |
84 pages, |
8188 78570 6903 controller 3543 amplifier IC 8038 function generator NEC 2403 106 S240 S180 s170 RBS 6600 NEC 2403 s193 ic 4017 daigram for power supply circuit PD161834 240-OUTPUT PD161834 abstract |
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| Abstract: ASIC Technology Brief Ball Grid Array (BGA) Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both our CG/CE46 CG/CE46 (0.65 micron) and CG/CE51 CG/CE51 (0.5 micron) high performance CMOS ASIC product families. BGA's have proven to offer several advantages over more conventional packages including: 1. Reduced footprint: High pin count BGA packages require up to 26% less real estate than QFPs. 2. Better electr ... | Original |
8 pages, |
QFP PACKAGE thermal resistance BGA-256 bga256 power dissipation BGA416 BGA576 CE-5-12 CE51364 CG51114 CE51654 BGA256 CE51484 BGA 256 PACKAGE power dissipation micron 100 ball BGA CG/CE46 CG/CE51 CG/CE46 abstract |
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