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TLV320AIC23BIGQER Texas Instruments SPECIALTY CONSUMER CIRCUIT, PBGA80, PLASTIC, VFBGA-80 visit Texas Instruments
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SN74ABT574AGQNR Texas Instruments ABT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PBGA20, PLASTIC, VFBGA-20 visit Texas Instruments
SN74GTLP22033GQLR Texas Instruments GTLP SERIES, 8-BIT REGISTERED TRANSCEIVER, INVERTED OUTPUT, PBGA56, VFBGA-56 visit Texas Instruments

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VFBGA-56

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: SOT991-1 VFBGA56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118 Rev. 1 â'" 19 April 2013 Packing information 1 , 4000 1 341 x 338 x 26 SOT991-1 NXP Semiconductors VFBGA56; Reel pack; SMD, 13" Q1/T1 , Semiconductors VFBGA56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending , -1 NXP Semiconductors VFBGA56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part NXP Semiconductors
Original

TSSOP48

Abstract: 74LVT16245B -1 74LVT16245BEV -40 °C to +85 °C VFBGA56 plastic very thin fine-pitch ball grid array package; 56 balls , configuration for VFBGA56 6.2 Pin description Table 3. Symbol Pin description Pin Description (T)SSOP48 VFBGA56 1DIR 1 A1 direction control input 1DIR n.c. - A2, A3 not connected , description .continued Pin Description (T)SSOP48 VFBGA56 1B4 8 D2 data input/output 1B4 , -state Table 3. Symbol Pin description .continued Pin Description (T)SSOP48 VFBGA56 1A1 46
Philips Semiconductors
Original
74LVT16245B JESD78 TSSOP48 74LVT16245BDGG 74LVT16245BDL 74LVTH16245BDGG 74LVTH16245B 74LVT LVTH16245B

diode SMD MARKING CODE K6

Abstract: diode SMD MARKING CODE K6 06 configuration SSOP48 and TSSOP48. Fig.2 Pin configuration VFBGA56. 2003 Dec 08 5 Philips , OUTPUT nYn L H Z PACKAGE MATERIAL SSOP48 SSOP48 TSSOP48 TSSOP48 VFBGA56 VFBGA56 plastic plastic , 16-bit buffer/line driver; 5 V input/output tolerant; 3-state 74LVC16244A; 74LVCH16244A VFBGA56 , ) SOT362-1 (TSSOP48) SOT370-1 (SSOP48) SOT370-1 (SSOP48) SOT702-1 (VFBGA56) SOT702-1 (VFBGA56) SOT702-1 (VFBGA56) SOT362-1 (TSSOP48) SOT362-1 (TSSOP48) SOT370-1 (SSOP48) SOT370-1 (SSOP48) SOT702-1 (VFBGA56
Philips Semiconductors
Original
diode SMD MARKING CODE K6 diode SMD MARKING CODE K6 06 smd diode code g6 NXP MARKING *H5 smd code marking A6 diode SMD MARKING CODE K6 03 EIA/JESD22-A114-A EIA/JESD22-A115-A 74LVC 74LVCH16244ADL 74LVCH16244AEV

marking code h4 SMD ic

Abstract: marking code 95-0210 SSOP/TSSOP48. Fig.2 Pin configuration VFBGA56. 2003 Jan 30 5 Philips Semiconductors , SSOP48 SSOP48 TSSOP48 TSSOP48 VFBGA56 VFBGA56 plastic plastic plastic plastic plastic plastic CODE , -state) 74LVC16244A; 74LVCH16244A VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 , Marking SOT702-1 online 9352 719 37118 * Reel Pack, (VFBGA56) Full production SMD, 13" Standard Marking SOT702-1 9352 719 37151 * Tray Pack, (VFBGA56) Full production Bakeable, Single Standard Marking SOT702
Philips Semiconductors
Original
marking code h4 SMD ic marking code 95-0210 marking code E5 SMD ic smd 3y2 smd diode MARKING F6 marking code E3 SMD ic 4LVCH16244AEV

VFBGA56

Abstract: 74LVT16244B VFBGA56 plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 × 7 × 0.65 mm , configuration for SSOP48 and TSSOP48 Fig 4. Pin configuration for VFBGA56 6.2 Pin description Table 3. Pin description Symbol Pin Description (T)SSOP48 VFBGA56 1OE 1 A1 n.c. - , Description (T)SSOP48 VFBGA56 2Y1 9 D1 data output 2Y1 GND 10 D3 ground (0 V , Description (T)SSOP48 VFBGA56 1A1 46 B6 data input 1A1 1A0 47 B5 data input 1A0
Philips Semiconductors
Original
74LVT16244B 74LVTH16244B 74LVT16244BDGG 74LVT16244BDL 74LVT16244BEV LVTH16244B

1a6 SMD diode

Abstract: 1B4 SMD and TSSOP48. Fig.2 Pin configuration VFBGA56. 2003 Jan 30 5 Philips Semiconductors , SSOP48 TSSOP48 TSSOP48 VFBGA56 VFBGA56 74LVC16245A; 74LVCH16245A MATERIAL plastic plastic plastic , direction pin; 5 V tolerant (3-state) 74LVC16245A; 74LVCH16245A VFBGA56: plastic very thin fine-pitch , * Reel Pack, (VFBGA56) Full production SMD, 13" Standard Marking SOT702-1 9352 707 93151 * Tray Pack, (VFBGA56) Full production Bakeable, Single Standard Marking SOT702-1 * Tray Pack, 9352 707 93157 (VFBGA56
Philips Semiconductors
Original
1a6 SMD diode 1B4 SMD smd 1a5 1B6 SMD smd diode code 1B2 smd 2A5 74LVCH16245AEV

PTN3700EV

Abstract: sublvds Pb-free (SnAgCu VFBGA56 plastic very thin fine-pitch ball grid array package; solder ball compound) 56 , VFBGA56 1 2 3 4 5 6 7 1 2 3 4 5 6 7 A D2+ VDDA DE , grid; transparent top view 56-ball, 7 × 8 grid; transparent top view Fig 4. VFBGA56 ball mapping , Fig 5. VFBGA56 ball mapping - Transmitter mode (TX/RX = HIGH); PSEL[1:0] = 01b 7 1 2 3 , ; transparent top view Fig 6. VFBGA56 ball mapping - Transmitter mode (TX/RX = HIGH); PSEL[1:0] = 10b Fig
NXP Semiconductors
Original
PTN3700 RGB888 PTN3700EV sublvds sublvds driver wVGA r2fm sot991

ls 7432 IC pin configuration

Abstract: Package Name PTN3700EV/G Description Version SOT991-1 Type number Pb-free (SnAgCu VFBGA56 plastic very , . Ball configuration for VFBGA56 1 A B C D E F G H D2+ D2- D1+ D1- CLK+ CLK- D0+ D0- 2 VDDA GNDA TX , 56-ball, 7 8 grid; transparent top view Fig 4. VFBGA56 ball mapping - Transmitter mode (TX/RX , G5 G6 G7 002aac380 Fig 5. VFBGA56 ball mapping - Transmitter mode (TX/RX = HIGH); PSEL[1:0] = , Fig 6. VFBGA56 ball mapping - Transmitter mode (TX/RX = HIGH); PSEL[1:0] = 10b Fig 7. VFBGA56
NXP Semiconductors
Original
ls 7432 IC pin configuration

DDR2 SSTL class

Abstract: SSTL_18 distribution, DIMMs VFBGA-56 power-down; TSSOP-48, DDR200 - DDR333 zero-delay TVSOP-48, clock , zero-delay input frequency PCKV857A 2.5 DDR200 - DDR333 zero-delay VFBGA-56 individual output , select power-down; VFBGA-56 power-down; VFBGA-52, selective disable, HVQFN-40 DDR2 400 , register TVSOP-48. VFBGA-56 SSTV16857A 2.5 200 14 x SSTL-2 14 x SSTL-2 2.4 0.2 0.75 0 to +70 master reset TSSOP-48, DDR SDRAM register TVSOP-48. VFBGA-56 SSTV16859
NXP Semiconductors
Original
DDR266 DDR400 DDR2-400 DDR2-533 DDR2-667 DDR2-800 DDR2 SSTL class SSTL_18 DDR2 SDRAM with SSTL_18 interface DDR1-400 PCK2059 SSTL-18 PC100 PC133 PCK2509 PCK2510

74LVT16244B

Abstract: 74LVT16244BDGG ; body width 6.1 mm SOT362-1 74LVT16244BEV -40 °C to +85 °C VFBGA56 plastic very thin , SOT702-1 (VFBGA56) 74LVT_LVTH16244B_7 Product data sheet © NXP B.V. 2009. All rights reserved , Min Max Unit Tamb = -40 °C to +85 °C; (T)SSOP48 package [3] - 500 mW VFBGA56 , /driver; 3-state VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 , SOT702-1 (VFBGA56) 74LVT_LVTH16244B_7 Product data sheet © NXP B.V. 2009. All rights reserved
NXP Semiconductors
Original
JESD22-A114E 74LVTH16244BDGG 8304a0 JESD22-A115-A

jedec MO 225

Abstract: VFBGA56 PDF: 2003 Jul 01 Philips Semiconductors Package outline VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm B D SOT702-1 A ball A1 index area A E A2 A1 detail X e1 1/2 C v M C A B w M C b e y1 C e y K J H e G F e2 E D 1/2 e C X B A ball A1 index area 1 2 3 4 5 6 DIMENSIONS (mm are the original dimensions) mm A max. A1 A2
Philips Semiconductors
Original
MO-225 jedec MO 225 SOT702-1 sot702
Abstract: Package outline VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm B D SOT702-1 A ball A1 index area A E A2 A1 detail X e1 C âv M C A B b e âw M C 1/2 e y1 C y K J H e G F e2 E D 1/2 e C X B A ball A1 index area 1 2 3 4 5 6 DIMENSIONS (mm are the original dimensions) mm A max. A1 A2 b D E e e1 e2 v w NXP Semiconductors
Original

r2fm

Abstract: ls 7432 IC pin configuration Package Name PTN3700EV/G Description Version SOT991-1 Type number Pb-free (SnAgCu VFBGA56 plastic very , . Ball configuration for VFBGA56 1 A B C D E F G H D2+ D2- D1+ D1- CLK+ CLK- D0+ D0- 2 VDDA GNDA TX , 56-ball, 7 8 grid; transparent top view Fig 4. VFBGA56 ball mapping - Transmitter mode (TX/RX , G5 G6 G7 002aac380 Fig 5. VFBGA56 ball mapping - Transmitter mode (TX/RX = HIGH); PSEL[1:0] = , Fig 6. VFBGA56 ball mapping - Transmitter mode (TX/RX = HIGH); PSEL[1:0] = 10b Fig 7. VFBGA56
NXP Semiconductors
Original
sublvds lvds
Abstract: PC board footprint Philips Semiconductors Footprint information for reflow soldering of VFBGA56 package SOT702-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste SL SP occupied area SR solder resist detail X DIMENSIONS in mm P SL SP SR Hx Hy 0.65 0.325 0.400 0.475 7.550 5.050 SOT702-1_fp PDF Â Philips Semiconductors
Original
Abstract: Pb-free (SnAgCu VFBGA56 plastic very thin fine-pitch ball grid array package; solder ball compound) 56 , 002aac377 Transparent top view Fig 3. Ball configuration for VFBGA56 1 2 3 4 5 6 , top view Fig 4. 56-ball, 7 ï'´ 8 grid; transparent top view VFBGA56 ball mapping - , VFBGA56 ball mapping - Transmitter mode (TX/RX = HIGH); PSEL[1:0] = 01b 1 2 3 4 5 6 7 , grid; transparent top view VFBGA56 ball mapping - Transmitter mode (TX/RX = HIGH); PSEL[1:0] = 10b NXP Semiconductors
Original

TSSOP48 outline

Abstract: JESD78 ; body width 6.1 mm SOT362-1 74LVT16244BEV -40 °C to +85 °C VFBGA56 plastic very thin , SOT702-1 (VFBGA56) 74LVT_LVTH16244B_6 Product data sheet © NXP B.V. 2008. All rights reserved , Min Max Unit Tamb = -40 °C to +125 °C; (T)SSOP48 package [3] - 500 mW VFBGA56 , 74LVT16244B; 74LVTH16244B NXP Semiconductors 3.3 V 16-bit buffer/driver; 3-state VFBGA56: plastic , PROJECTION ISSUE DATE 02-08-08 03-07-01 Fig 11. Package outline SOT702-1 (VFBGA56) 74LVT
NXP Semiconductors
Original
TSSOP48 outline
Abstract: to +85 °C VFBGA56 plastic very thin fine-pitch ball grid array package; SOT702-1 56 balls , TSSOP48 Fig 4. Pin configuration for VFBGA56 74LVT_LVTH16245B_5 Product data sheet © NXP , 500 mW VFBGA56 package [4] - 1000 mW HUQFN60U package [4] - 1000 mW , -bit transceiver; 3-state VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 , outline SOT702-1 (VFBGA56) 74LVT_LVTH16245B_5 Product data sheet © NXP B.V. 2009. All rights NXP Semiconductors
Original

jedec MO 225

Abstract: VFBGA56 PDF: 2002 Aug 09 Philips Semiconductors Package outline VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm B D SOT702-1 A ball A1 index area A E A2 A1 detail X e1 b e 1/2 C v M C A B w M C e y1 C y K J H e G F e2 E D 1/2 e C X B A ball A1 index area 1 2 3 4 5 6 DIMENSIONS (mm are the original dimensions) mm A max. A1 A2 b
Philips Semiconductors
Original

LVTH16245B

Abstract: 74LVT16245B VFBGA56 plastic very thin fine-pitch ball grid array package; SOT702-1 56 balls; body 4.5 × 7 × 0.65 , VFBGA56 74LVT_LVTH16245B_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 - , +150 °C [2] - 150 °C (T)SSOP48 package [3] - 500 mW VFBGA56 package , 74LVT16245B; 74LVTH16245B NXP Semiconductors 3.3 V 16-bit transceiver; 3-state VFBGA56: plastic very , ISSUE DATE 02-08-08 03-07-01 MO-225 Fig 11. Package outline SOT702-1 (VFBGA56) 74LVT
NXP Semiconductors
Original
lvth16245

jedec MO 225

Abstract: VFBGA56 PDF: 2001 Jun 26 Philips Semiconductors Package outline VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm B D SOT702-1 A ball A1 index area A2 A E A1 detail X e1 b e C v M C A B w M C 1/2 e y1 C y K J H e G F e2 E D 1/2 e C X B A 1 2 3 4 5 6 DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 b D E e e1 e2 v
-
Original
Abstract: 74LVT16244BEV 74LVT16244BBX 74LVTH16244BBX 40 C to +85 C 40 C to +85 C VFBGA56 40 C to +85 C TSSOP48 40 C to +85 , ) Fig 4. Pin configuration SOT702-1 (VFBGA56) 74LVT_LVTH16244B All information provided in this , VFBGA56 package HXQFN60U package [1] [2] [3] [4] [3] [4] [4] Min - Max 500 1000 1000 Unit mW mW , NXP Semiconductors 74LVT16244B; 74LVTH16244B 3.3 V 16-bit buffer/driver; 3-state VFBGA56 , outline SOT702-1 (VFBGA56) 74LVT_LVTH16244B All information provided in this document is subject to legal NXP Semiconductors
Original
JESD78B JESD22-A114F 74LVTH16244BDL

74LVT16374ADGG

Abstract: 74LVT16374ADL 6.1 mm SOT362-1 74LVT16374AEV -40 °C to +85 °C VFBGA56 plastic very thin fine-pitch , SOT702-1 (VFBGA56) All information provided in this document is subject to legal disclaimers. Rev , [2] - 150 °C (T)SSOP48 package [3] - 500 mW VFBGA56 and HXQFN60U package , -bit edge-triggered D-type flip-flop; 3-state VFBGA56: plastic very thin fine-pitch ball grid array package; 56 , -225 Fig 13. Package outline SOT702-1 (VFBGA56) 74LVT_LVTH16374A_7 Product data sheet All
NXP Semiconductors
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74LVT16374ADL 74LVT16374ADGG 74LVTH16374ADGG 74lvt16374a 74lvth16374a 74LVT16374A 74LVTH16374A
Abstract: -Q100 74LVCH16245AEV-Q100 40 C to +125 C VFBGA56 40 C to +125 C TSSOP48 Description plastic thin shrink small outline , ) Fig 5. Pin configuration SOT702-1 (VFBGA56) 74LVC_LVCH16245A_Q100 All information provided in , power dissipation Tamb = 40 C to +125 C; TSSOP48 package VFBGA56 package [1] [2] [3] [4] [3] [4 , -state VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm SOT702 , outline SOT702-1 (VFBGA56) 74LVC_LVCH16245A_Q100 All information provided in this document is subject to NXP Semiconductors
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74LVC16245A-Q100 74LVCH16245A-Q100 AEC-Q100

74LVC16244A

Abstract: 74LVC16244ADGG mm SOT362-1 -40 °C to +125 °C VFBGA56 plastic very thin fine-pitch ball grid array , configuration SOT702-1 (VFBGA56) All information provided in this document is subject to legal disclaimers , Tamb = -40 °C to +125 °C; (T)SSOP48 package [3] - 500 mW VFBGA56 package [4] - , /line driver; 5 V input/output tolerant; 3-state VFBGA56: plastic very thin fine-pitch ball grid , 02-08-08 03-07-01 MO-225 Fig 12. Package outline SOT702-1 (VFBGA56) 74LVC_LVCH16244A_9 Product
NXP Semiconductors
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74LVC16244ADGG 74LVC16244ADL 74LVC16244AEV 74LVCH16244ADGG JESD36
Abstract: 74LVT16244BBX 74LVTH16244BBX 40 C to +85 C 40 C to +85 C VFBGA56 40 C to +85 C TSSOP48 40 C to +85 C Name SSOP48 , configuration SOT702-1 (VFBGA56) 74LVT_LVTH16244B All information provided in this document is subject to , VFBGA56 package HXQFN60U package [1] [2] [3] [4] [3] [4] [4] Min - Max 500 1000 1000 Unit mW mW , -bit buffer/driver; 3-state VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body , ISSUE DATE 02-08-08 03-07-01 Fig 11. Package outline SOT702-1 (VFBGA56) 74LVT_LVTH16244B All NXP Semiconductors
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Abstract: ; SOT362-1 body width 6.1 mm 74LVT16245BEV ï'­40 ï'°C to +85 ï'°C VFBGA56 plastic very thin , SSOP48 and TSSOP48 74LVT_LVTH16245B Product data sheet Fig 4. Pin configuration for VFBGA56 , 150 ï'°C (T)SSOP48 package [3] - 500 mW VFBGA56 package [4] - 1000 mW , ; 74LVTH16245B NXP Semiconductors 3.3 V 16-bit transceiver; 3-state VFBGA56: plastic very thin , ISSUE DATE 02-08-08 03-07-01 MO-225 Fig 11. Package outline SOT702-1 (VFBGA56) 74LVT NXP Semiconductors
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