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TPSM84824MOLR Texas Instruments 4.5V to 17V Input, 0.6V-10V Output, 8A Power Module in Compact 7.5x7.5mm Footprint 24-QFM -40 to 105 visit Texas Instruments
PTPSM84824MOLR Texas Instruments 4.5V to 17V Input, 0.6V-10V Output, 8A Power Module in Compact 7.5x7.5mm Footprint 24-QFM -40 to 105 visit Texas Instruments Buy
ISO7142CCQDBQQ1 Texas Instruments Automotive, Small Footprint, Low Power, Quad-Channel 2/2 Digital Isolator 16-SSOP -40 to 125 visit Texas Instruments
ISO7142CCQDBQRQ1 Texas Instruments Automotive, Small Footprint, Low Power, Quad-Channel 2/2 Digital Isolator 16-SSOP -40 to 125 visit Texas Instruments Buy
REF3425IDBVR Texas Instruments Low-Drift Low-Power Small-Footprint Series Voltage Reference 6-SOT-23 -40 to 125 visit Texas Instruments
REF2125IDBVR Texas Instruments Low-Drift Low-Power Small-Footprint Series Voltage Reference With Clean Start 5-SOT-23 -40 to 125 visit Texas Instruments

TO220-5 footprint

Catalog Datasheet MFG & Type PDF Document Tags

N10015

Abstract: ebonol Device Tab dT, C MECHANICAL DIMENSIONS Footprint Dimensions in. (mm) 217-36CT6 Device Power , Footprint in. (mm) .40 (10.2) .40 (10.2) Standard P/N .90 (22.9) x .315 (8.0) 1.03 (26.2) x .50 , Plated 600 800 20 60 15 40 10 20 0 1000 25 5 0 200 0.5 400 1.0 , 25 20 60 15 40 10 20 0 5 0 200 0.5 400 1.0 100 80 0 200 , SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) MECHANICAL DIMENSIONS 8 23 5 10 400
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217-36CTTE6 N10015 ebonol 218-40cte3 unc screw 230-75ABE-01 SOL-20 217-36CTE6 217-36CTRE6 260-4T5E 260-4TH5E

ebonol

Abstract: abe sot-223 Device Tab dT, C MECHANICAL DIMENSIONS Footprint Dimensions in. (mm) 217-36CT6 Device Power , Footprint in. (mm) .40 (10.2) .40 (10.2) Standard P/N .90 (22.9) x .315 (8.0) 1.03 (26.2) x .50 , Plated 600 800 20 60 15 40 10 20 0 1000 25 5 0 200 0.5 400 1.0 , 25 20 60 15 40 10 20 0 5 0 200 0.5 400 1.0 100 80 0 200 , SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) MECHANICAL DIMENSIONS 8 23 5 10 400
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abe sot-223 MO-169

ebonol

Abstract: 637-10ABEP BOARD, D' PAK 125°C LEAD, 40°C AMBIENT Device Tab dT, C MECHANICAL DIMENSIONS Footprint , . (mm) Maximum Footprint in. (mm) .40 (10.2) .40 (10.2) .90 (22.9) x .315 (8.0) 1.03 (26.2 , 40 10 20 5 0 0 200 0.5 400 1.0 600 1.5 800 2.0 0 1000 2.5 , Vertical Mount Heat Sink TO-220 Height Above PC Board in. (mm) 206-1PABEH Maximum Footprint , Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuation Solderable
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WTS001 637-10ABEP 634-20ABEP sot-223 package dimensions 236-150ABE-01 TO5 thermal resistance

to220 pcb footprint

Abstract: "thermal via" PCB D2PAK } Reduced PCB footprint when compared to D2PAK Limitations } maller silicon size means relatively high RDS , to moisture ingress & ionic contamination causing degradation & early failure of the MOSFET. 5 , is for a simplified single LFPAK MOSFET mounted to a copper footprint with dimensions length = width , -layer 4-layer (layer 2 100% coverage) 120.0 4 layers - (4 x 5 vias) Rthj-a (K/W) 100.0 80.0 , ) Vias Layer 3, (signal) Layer 4, (power and signal) 7 LFPAK soldering & footprint
NXP Semiconductors
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to220 pcb footprint LFPAK footprint Renesas LFPAK footprint POWERPAK SO8 TO220 HEATSINK DATASHEET
Abstract: MECHANICAL DIMENSIONS Footprint Dimensions in. (mm) 217-36CT6 Device Power Dissipation. W Ã , Sink SMT Devices Height Above PC Board in. (mm) Maximum Footprint in. (mm) .40 (10.2 , 100 400 600 800 1000 25 80 20 60 15 40 10 20 5 0 0 200 , -220 Height Above PC Board in. (mm) 206-1PABEH Maximum Footprint in. (mm) 1.18 (30.0) Standard , ) Footprint Dimensions in. (mm) Mounting Configuation Solderable Tab Option Mounting Style Wakefield Thermal Solutions
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ebonol

Abstract: 217-36CT6 Tab dT, C MECHANICAL DIMENSIONS Footprint Dimensions in. (mm) 217-36CT6 Device Power , 25 80 20 60 15 40 10 20 5 0 0 200 0.5 400 1.0 600 1.5 800 , Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuation Solderable , 0 1000 20 18 16 14 12 10 8 6 4 2 0 5 1000 THERMAL RESISTANCE SINK TO AMBIENT (C , 40 4 20 2 0 0 1 200 2 400 3 600 4 800 0 5 1000 THERMAL
Wakefield Thermal Solutions
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218-40CT3 218-40CT5 204sb 217-36CTT6 217-36CTR6 635-5B2 635-75B2 635-10B2 635-125B2

ebonol

Abstract: 215CB ) 217-36CTR6 .390 (9.9) Material: Copper, Tin, Lead Plated MECHANICAL DIMENSIONS Footprint Dimensions , Self-Locking Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting , PATENT PENDING Self-Locking Wavesolderable Heat Sinks Height Above PC Board in. (mm) Footprint , 231-137PAB-13H (15V) 231-137PAB-XXX Footprint Dimensions in. (mm) .750 (19.1) .750 (19.1) .875 (12.7 , Locking-Tab Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting
Wakefield Engineering
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215CB 647-25ABP 260-4TH5B 204CB 205-CB 1134 sot dm

637-10ABEP

Abstract: 677-15ABEP °C/W @ 175 LFM 4.0°C/W @ 175 LFM DO-4/DO-5 Diodes Standard P/N Footprint Dimensions in. (mm , ) Footprint Dimensions in. (mm) 0.640 (16.26) x 0.640 (16.26) 0.640 (16.26) x 0.640 (16.26) 0.640 (16.26) x , Footprint in. (mm) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) 1.375 , SpeedClipTM Heat Sinks for Vertical Board Mounting Height Above PC Board "A" in. (mm) Maximum Footprint in , 0A BP 7-1 200 AIR VELOCITY (FPM) 400 600 800 1000 5 4 1.375 (34.9) REF 0.730 (18.5
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677-15ABEP 677-20ABEP 657-10ABEP 657-20ABEPSC 657-10ABEPN 66720 634-10AB 634-10ABEP 634-15AB 634-15ABEP 634-20AB 634-20ABP

ebonol

Abstract: 260-4TH5B ) 217-36CTR6 .390 (9.9) Material: Copper, Tin, Lead Plated MECHANICAL DIMENSIONS Footprint Dimensions , Self-Locking Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting , PATENT PENDING Self-Locking Wavesolderable Heat Sinks Height Above PC Board in. (mm) Footprint , 231-137PAB-13H (15V) 231-137PAB-XXX Footprint Dimensions in. (mm) .750 (19.1) .750 (19.1) .875 (12.7 , Locking-Tab Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting
Wakefield Engineering
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ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight

217-36CTT6

Abstract: ebonol ) 217-36CTR6 .390 (9.9) Material: Copper, Tin, Lead Plated MECHANICAL DIMENSIONS Footprint Dimensions , Self-Locking Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting , PATENT PENDING Self-Locking Wavesolderable Heat Sinks Height Above PC Board in. (mm) Footprint , 231-137PAB-13H (15V) 231-137PAB-XXX Footprint Dimensions in. (mm) .750 (19.1) .750 (19.1) .875 (12.7 , Locking-Tab Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting
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215AP 205ap 260-6SH5B 230-75AB-10 260-4T5 627 Series

231-75PAB-14V

Abstract: 251-62AB Footprint Dimensions .600 in. (15.2) x .740 in. (18.8) .600 in. (15.2) x .740 in. (18.8) .600 in. (15.2 , ) .215 (5.5) .600 (15.2) COPPER FOOTPRINT FOR HEAT SINK 1.260 (32.0) .390 (9.9) .945 , ) .790 in. (20.0) .790 in. (20.0) .500 in. (12.7) 400 500 6 5 4 3 2 THERMAL PERFORMANCE , .640 (16.3) 6 LAYER BOARD, D2PAK 125°C LEAD, 40°C AMBIENT RECOMMENDED COPPER FOOTPRINT A , , tin-lead plated. PATENT 361317 .390 (9.9) Package Quantity 1 25 250 Footprint Dimensions
Wakefield Engineering
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216-40CTT 231-75PAB-14V 251-62AB wakefield engineering 67 232-200AB-23 203 13H 216-40CT 216-40CTR 677-15ABP 677-20ABP 677-25ABP

to220 pcb footprint

Abstract: Minimum Footprint TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 2.4 Sep 06, 2004 5 G960 , PACKAGE TYPE PIN OPTION 1 1 : VOUT 2 : VOUT 3 : GND 4 : GND 5 : VIN 6 : VIN T3 : TO-220 T4 , ≤ TA ≤85°C Note (1): See Recommended Minimum Footprint Electrical , Minimum Footprint] If the TO-220 package is used with a heat sink, θJA is the sum of the package thermal , recommended mimimum footprint (RθJA=156°C/W) 900 800 Output Current (mA) TA=25°C,Still Air
Global Mixed-Mode Technology
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G960T33T G960T36T G960T43U G960T45U G960T53U G960T63U

680-125220

Abstract: 635-75B2 available with or without wave- MECHANICAL DIMENSIONS TO-220 and TO-218 Footprint Dimensions in , 2.000 (50.8) 637-25ABP 2.500 (63.5) Material: Aluminum, Black Anodized Maximum Footprint in. (mm , ) Maximum Footprint in. (mm) 626-10ABP 627-10ABP 1.000 (25.4) 626-15ABP 627-15ABP 1.500 (38.1 , High-Performance Heat Sinks for Vertical Board Mounting Height Above PC Board "A" in. (mm) Maximum Footprint , "A" in. (mm) Maximum Footprint in. (mm) Thermal Performance at Typical Load Natural Forced
Wakefield Engineering
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637-10ABP 637-15ABP 680-125220 657-10ABPSC 680-5K 603K 634-10ABP 634-15ABP 637-20ABP

ebonol

Abstract: 217-36CT6 Tab dT, C MECHANICAL DIMENSIONS Footprint Dimensions in. (mm) 217-36CT6 Device Power , 25 80 20 60 15 40 10 20 5 0 0 200 0.5 400 1.0 600 1.5 800 , Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuation Solderable , 0 1000 20 18 16 14 12 10 8 6 4 2 0 5 1000 THERMAL RESISTANCE SINK TO AMBIENT (C , 40 4 20 2 0 0 1 200 2 400 3 600 4 800 0 5 1000 THERMAL
Wakefield Engineering
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TO38 Laser Wakefield Thermal Solutions Wakefield Thermal Solutions TYPE 120 207AB

Wakefield Thermal Solutions TYPE 120

Abstract: ebonol Tab dT, C MECHANICAL DIMENSIONS Footprint Dimensions in. (mm) 217-36CT6 Device Power , 25 80 20 60 15 40 10 20 5 0 0 200 0.5 400 1.0 600 1.5 800 , Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuation Solderable , 0 1000 20 18 16 14 12 10 8 6 4 2 0 5 1000 THERMAL RESISTANCE SINK TO AMBIENT (C , 40 4 20 2 0 0 1 200 2 400 3 600 4 800 0 5 1000 THERMAL
Wakefield Thermal Solutions
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TO-44

IPS6021

Abstract: TO220-5 footprint Control Rdgs In(2) Gnd(1) Out(5) V Diag Rin Input Signal www.irf.com Load 1 , voltage Maximum power dissipation (internally limited by thermal protection) Rth=5°C/W IPS6021 Rth=40°C/W IPS6021S 1"sqrt. footprint Rth=50°C/W IPS6021R 1"sqrt. footprint Electrostatic discharge voltage , case IPS6021 TO220 Thermal resistance junction to ambient IPS6021S D²Pak std. footprint Thermal resistance junction to ambient IPS6021S D²Pak 1" sqrt. footprint Thermal resistance junction to case
International Rectifier
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TO220-5 footprint IPS6021RPBF Q100 PD60280 IPS6021P IPS6021SP IPS6021RP

IPS6011PBF

Abstract: IPS6011 (internally limited by thermal protection) Rth=5°C/W IPS6011 Rth=40°C/W IPS6011S 1"sqrt. footprint Rth=50°C/W IPS6011R 1"sqrt. footprint Electrostatic discharge voltage (Human body) C=100pF, R=1500 Between , required for open load off and short circuit to Vbat detection Control Rdgs In(2) Gnd(1) Out(5 , resistance junction to ambient IPS6011S D²Pak std. footprint Thermal resistance junction to ambient IPS6011S D²Pak 1" sqrt. footprint Thermal resistance junction to case IPS6011S D²Pak Thermal resistance
International Rectifier
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IPS6011PBF PD60279 IPS6011P IPS6011SP IPS6011RP

IPS6011

Abstract: Q100 (2) Gnd(1) Out(5) V Diag Rin Input Signal www.irf.com Load 1 IPS6011(S)(R , voltage Maximum power dissipation (internally limited by thermal protection) Rth=5°C/W IPS6011 Rth=40°C/W IPS6011S 1"sqrt. footprint Rth=50°C/W IPS6011R 1"sqrt. footprint Electrostatic discharge voltage , case IPS6011 TO220 Thermal resistance junction to ambient IPS6011S D²Pak std. footprint Thermal resistance junction to ambient IPS6011S D²Pak 1" sqrt. footprint Thermal resistance junction to case
International Rectifier
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SMD220

Abstract: SMD-220 junction temperature (°C) 6 IPS1021(S)(R)PbF 50 30 5°C/W 10°C/W 1" sq footprint std footprint 50°C/W 25°C ambient 20 15 10 5 0 -50 50°C/W 85°C ambient 40 Ids, output , power dissipation (internally limited by thermal protection) Rth=5°C/W IPS1021 Rth=40°C/W IPS1021S 1" sqr. footprint Rth=50°C/W IPS1021R 1" sqr. footprint Electrostatic discharge voltage (Human body) C , case IPS1021 TO-220 Thermal resistance junction to ambient IPS1021S D²Pak std. footprint Thermal
International Rectifier
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SMD-220 SMD220 IPS1021RPBF PD60236 IPS1021P IPS1021SP IPS1021RP 1E-05 1E-04

TO-220 footprint

Abstract: current, Tambient=85°C, Tj=125°C, Vin=5V Rth=5°C/W IPS1031 Rth=40°C/W IPS1031S 1" sqr. footprint Rth=50C/W , IPS1031(S)(R)PbF 30 25 5°C/W 10°C/W 1" sq footprint std footprint 40 50°C/W 25°C ambient 50°C/W 85 , dissipation) Maximum power dissipation (internally limited by thermal protection) Rth=5°C/W IPS1031 Rth=40°C/W IPS1031S 1" sqr. footprint Rth=50C/W IPS1031R 1" sqr. footprint Electrostatic discharge voltage (Human body , -220 Thermal resistance junction to ambient IPS1031S D²Pak std. footprint Thermal resistance junction to
International Rectifier
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TO-220 footprint PD60237 IPS1031P IPS1031SP IPS1031RP IPS1031RPBF IPS1031RTRL
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