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Part Manufacturer Description Datasheet BUY
LTC2272CUJ#TRPBF Linear Technology LTC2272 - 16-Bit, 65Msps Serial Output ADC (JESD204); Package: QFN; Pins: 40; Temperature Range: 0°C to 70°C visit Linear Technology - Now Part of Analog Devices Buy
LTC2272IUJ#TRPBF Linear Technology LTC2272 - 16-Bit, 65Msps Serial Output ADC (JESD204); Package: QFN; Pins: 40; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC2272IUJ#PBF Linear Technology LTC2272 - 16-Bit, 65Msps Serial Output ADC (JESD204); Package: QFN; Pins: 40; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC2272CUJ#TR Linear Technology IC 1-CH 16-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PQCC40, 6 X 6 MM, PLASTIC, QFN-40, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices
LTC2272CUJ Linear Technology IC 1-CH 16-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PQCC40, 6 X 6 MM, PLASTIC, QFN-40, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices
LTC2272IUJ Linear Technology IC 1-CH 16-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PQCC40, 6 X 6 MM, PLASTIC, QFN-40, Analog to Digital Converter visit Linear Technology - Now Part of Analog Devices

TL 2272

Catalog Datasheet MFG & Type PDF Document Tags

CIR 2272

Abstract: TL 2272 R 7ZT E tA R XR-2272 High-Voltage 7-Digit Display Driver GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM The XR-2272 is a monolithic high voltage display driver array specifically designed to drive , a gas discharge panel. The XR-2272 is particularly well suited to interfacing with Panaplex II type , °C to + 70 °C 0°C to +70°C SYSTEM DESCRIPTION The XR-2272 high voltage display driver features , and mono lithic pull-up resistors. The output is an emitter follower. 7-4 XR-2272 V SS
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Abstract: material per M IL-D TL-24308 (3.05 *0.13] 2 Holes Retention Clips â'" S ta in le ss steel Related , marking may ditier trom package marking. A ll connectors marked per M IL-D TL-24308. .031 ± 005 , 205560-2 205413-1 205487-2 2.500 2.729 2.272 .494 63.5 69.32 57.71 12.55 .426 .230 10.82 5.84 , 2.500 7.9 63.5 2.272 .494 57.71 12.55 2-284F 205167-1 sept, only_ 2-4F 205561-2 -
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TL-24308 MIL-DTL-24308 M24308/ 4-259F 4-260F 2-282F

LM700

Abstract: XBDAWT-00-0000-00000LEE4 designs and configurations of reflow soldering equipment. TP Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts Preheat tS Ramp-down 25 t 25°C to Peak Time Profile , (Tsmax) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp , 0.284 0.284 1.136 1.136 2.272 2.272 A 0.28 A 0.36 0.28 0.36 0.284 0.92 0.92 2.34
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LM700 XBDAWT-00-0000-00000LEE4 CLD-DS45 J-STD-020C
Abstract: designs and configurations of reflow soldering equipment. TP Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts Preheat tS Ramp-down 25 t 25°C to Peak Time Profile , (Tsmax) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp , 0.36 0.36 2.34 2.34 0.284 0.284 1.136 1.136 2.272 2.272 A 0.28 A 0.36 0.28 Cree
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CLD-DS45

Abstract: K3-700 designs and configurations of reflow soldering equipment. TP Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts Preheat tS Ramp-down 25 t 25°C to Peak Time Profile , (Tsmax) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp , 1.136 1.136 2.272 2.272 A 0.28 A 0.36 0.28 0.36 0.284 0.92 0.92 2.34 0.284 0.284
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K3-700 LM-80 cree TL 2272

311P409-2S

Abstract: 311P409-2S-B-12 tijca A M P AMPLIMITE Connectors, Series 109 Electronics Non-Magnetic Crimp Receptacles, Series 109, Standard Density Connectors (NASA Qualified) Connector Material and Finish: Shell â'" Insert â'" Brass, gold plated Approved material per M IL-D TL-24308 Retention Clips â , ) 2.159 .311 2.500 2.729 2.272 .494 .422 .039 3.91 55.42 7.9 63.5 , 53.04 41.3 12.55 10.72 0.99 3.05 37 (4) 2.159 .311 2.500 2.729 2.272
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311P409-2S 311P409-2S-B-12 311p409-3s G-10-S1 M22520/2-01
Abstract: part numbers, certain parameters are intentionally excluded from this specification sheet. ECXO-2272 , -2272-24.99825M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25°C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above Ecliptek
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ECXO-2272-24 ECXO-2272 99825MH MIL-STD-883 MIL-STD-202 ECXO2272

lm 739

Abstract: soldering equipment. TP Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts , tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification , 0.36 B 2.34 0.284 1.136 2.272 0.36 2.34 0.284 1.136 2.272 A 0.28 0.36 0.284 0.92 2.34 A 0.284 0.284 2.272 RECOMMENDED STENCIL PATTERN (HATCHED 0.284 AREA IS OPENING) RECOMMENDED PCB 0.36 SOLDER PAD 0.28 0.92 2.34 2.272 THIRD ANGLE PROJECTION UNLESS OTHERWISE
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lm 739 E349212
Abstract: PCB designs and configurations of reflow soldering equipment. tP TP Critical Zone TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 Profile Feature t , ) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL , 0.426 0.46 B 0.36 0.426 0.82 0.923 0.462 0.284 0.284 2.272 2.272 2.34 , 2.272 RECOMMENDED STENCIL PATTERN (HATCHED AREA IS OPENING) 2.34 RECOMMENDED PCB SOLDER PAD Cree
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E349212

Abstract: TM-21-11 Zone TL to TP Temperature TL Tsmax Tsmin ts Preheat tS Ramp-down 25 t 25°C to , ) Preheat: Temperature Max (Tsmax) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak , 2.272 2.272 A 0.28 A 0.36 0.28 0.36 0.284 0.92 0.92 2.34 0.284 0.284 2.272 RECOMMENDED , PCB SOLDER PAD 2.272 D. CRONIN CHECK DATE 09/ TITLE DAT RECOMMENDED STENCIL PATTERN
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TM-21-11
Abstract: soldering equipment. TP Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts , tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification , 0.36 B 2.34 0.284 1.136 2.272 0.36 2.34 0.284 1.136 2.272 A 0.28 0.36 0.284 0.92 2.34 A 0.284 0.284 2.272 RECOMMENDED STENCIL PATTERN (HATCHED 0.284 AREA IS OPENING) RECOMMENDED PCB 0.36 SOLDER PAD 0.28 0.92 2.34 2.272 THIRD ANGLE PROJECTION UNLESS OTHERWISE Cree
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Abstract: TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 , (Tsmax to Tp) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature , 0.46 B 0.36 2.34 0.852 0.426 0.284 2.272 1.136 0.36 A 2.34 0.284 2.272 0.284 0.28 0.36 1.136 0.284 0.92 2.34 0.284 0.28 RECOMMENDED PCB 0.36 Cree
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Abstract: designs and configurations of reflow soldering equipment. tP TP Critical Zone TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 Profile Feature t , ) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL , 0.82 0.36 0.426 0.82 0.46 B 0.36 2.34 0.852 0.426 0.284 2.272 1.136 0.36 A 2.34 0.284 2.272 0.284 0.28 0.36 1.136 0.284 0.92 2.34 0.284 Cree
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TL 2272 M

Abstract: TL 2272 1.083 0.020 0.090 44 1.534 1.852 2.088 1.625 0.020 0.090 62 2.182 2.500 2.729 2.272 0.023 0.094 , CONTACT ACCEPTS 28 - 24 AWG WIRE mm ©[mmim© "LT TL ©©[MPILOMW I® THESE DRAWINGS AND , 0.250 XI 03X.0.250" (MATING SIDE) - CN8 0.250 j_r 0.293 -1 "LT TL ©OIMPILOMT te mm \m©M Â
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TL 2272 M 00VAC 180-MYY-1 180-MYY-10YLYYY
Abstract: tqca Electronics AMP AMPLIM1TE Connectors, Series 109 Straight PCB, Series 109, Standard Density Connectors (MIL Qualified) Material and Finish: j Shell â'" Insert â'" Steel, cadm ium plated Approved material per M IL-D TL-24308 Contact â'" Copper alloy plated gold over nickel , 69.32 2.182 55.42 2.500 63.5 .329 8.36 .494 12.55 2.272 57.71 .422 10,72 .039 0.99 Receptacle 2.729 69.32 2.159 54.84 2.500 63.5 .311 7,90 .494 12.55 2.272 -
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24-15F 24-16F 23-17F 24-17F 23-19F 24-19F

TL 2272

Abstract: PCB designs and configurations of reflow soldering equipment. TP Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts Preheat tS Ramp-down 25 t 25°C to Peak , : Temperature Max (Tsmax) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp , 2.272 0.36 2.34 0.284 1.136 2.272 A 0.28 0.36 0.284 0.92 2.34 A 0.284 0.284
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Abstract: PCB designs and configurations of reflow soldering equipment. TP Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts Preheat tS Ramp-down 25 t 25°C to Peak , : Temperature Max (Tsmax) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp , 0.426 0.852 0.852 0.36 0.36 2.34 2.34 0.284 0.284 1.136 1.136 2.272 2.272 A Cree
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Abstract: Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts Preheat tS Ramp-down , : Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5 °C of , 0.36 B 2.34 0.284 1.136 2.272 0.36 2.34 0.284 1.136 2.272 A 0.28 0.36 0.284 0.92 2.34 A 0.284 0.284 2.272 RECOMMENDED STENCIL PATTERN (HATCHED 0.284 AREA IS OPENING) RECOMMENDED PCB 0.36 SOLDER PAD 0.28 0.92 2.34 2.272 THIRD ANGLE PROJECTION UNLESS OTHERWISE Cree
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XBDAWT00-0000

Abstract: PCB designs and configurations of reflow soldering equipment. TP Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts Preheat tS Ramp-down 25 t 25°C to Peak , : Temperature Max (Tsmax) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp , 2.272 2.272 A 0.28 A 0.36 0.28 0.36 0.284 0.92 0.92 2.34 0.284 0.284 2.272 RECOMMENDED
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XBDAWT00-0000

311P407-2P-B-15

Abstract: 311P407-4P-B-12 tifca A M P AM PLI M ITE Connectors, Series 90 Electronics Non-Magnetic Crimp Plugs, Series 90, High Density Connectors (NASA Qualified) Connector Material and Finish Shell â'" Brass, gold plated tnsert â'" Approved material per M IL-D TL-24308 R etention C lips â'" Copper alloy , 10.72 10.82 .120 3.05 .154 2.182 .329 2.500 2.729 .230 2.272 .494 .422 .426 3.91 55.42 8.36 63.5 , 5.84 .230 5.84 .230 5.84 .230 5.84 .759 19.28 1.083 27.51 1.625 41.3 2.272 57.7 2.178
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311P407-2P-B-15 311P407-4P-B-12 G-08-P1
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