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SESUB-PAN-DA14580
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Renesas Electronics Corporation
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TDK Bluetooth® Low Energy Module |
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133-512F-11H
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Amphenol Communications Solutions
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Paladin 5-Pair, 14 Column, Direct Orthogonal Header, Double End Wall, 1.5mm Wipe, APP |
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144-812F-11D
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Amphenol Communications Solutions
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Paladin RPO, DO, 8-Pair, 14 Column, 1.5mm Wipe, NiS |
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144-612F-11D
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Amphenol Communications Solutions
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Paladin RPO, DO, 6-Pair, 14 Column, 1.5mm Wipe,NiS |
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L17RRD2F1110G
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, RR Crimping Socket, AWG 24~28, Flash Gold +2um (78u\\)Sn, Tape & Reel 10000pcs, Left Feed |
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L17HRD2F115G
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, HR Crimping Socket, AWG 24~28, Flash Gold +2um (78u\\)Sn, Tape & Reel 5000pcs, Left Feed |
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