500 MILLION PARTS FROM 12000 MANUFACTURERS

DATASHEET SEARCH ENGINE

Top Results

Part Manufacturer Description Datasheet BUY
0358431235 Molex Socket visit Digikey
0358431216 Molex Socket visit Digikey
PCI1250APEF Texas Instruments PCI1250A Dual Socket CardBus Controller visit Texas Instruments
0804MC Texas Instruments 0804MC 8-Pin TO-3 Socket visit Texas Instruments
TMDXEZS2812 Texas Instruments F2812 eZdsp Starter Kit - Socketed version visit Texas Instruments
PCI1250GFN Texas Instruments Dual Socket CardBus Controller 256-BGA visit Texas Instruments

Socket+754 Datasheet

Part Manufacturer Description PDF Type
Socket 754 Advanced Micro Devices Socket 754 Design and Qualification Requirements Original

Socket+754

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Socket 754 Design and Qualification Requirements Publication # 24850 Rev: 3.07 Issue Date , companies. 24850 Rev. 3.07 August 2003 Socket 754 Design and Qualification Requirements , .13 3 Socket 754 Design Requirements .15 3.1 Socket 754 , .17 3.2.1 Socket 754 Vendor Marking Advanced Micro Devices
Original
AMD athlon socket 754 AMD socket s1 amd athlon 64 socket 754 AMD Socket 754 EIA 364-60 socket s1 Advanced Micro Devices EIA-364-90 EIA-364-23 EIA-364-70 EIA-364-20
Abstract: ) Product Highlights: l Zero Insertion Force l 754 Positions l PC B Mount Style = Surface Mount l Grid , Pages/Data Sheets: l None Available Related Products: l Tooling Product Specifications: l 754 , Insertion Force = Zero l Number of Positions = 754 l PC B Mount Style = Surface Mount l Grid Size = 29x29 , ) Termination Related Features: l Socket Identifier = Socket 754 Body Related Features: l Assembly Process Tyco Electronics
Original
Abstract: ) Product Highlights: l Zero Insertion Force l 754 Positions l PC B Mount Style = Through Hole l Grid , Product specification, 754 position mPGA socket ( Ba. (TIF, English) Application Specifications: l , Insertion Force = Zero l Number of Positions = 754 l PC B Mount Style = Through Hole l Grid Size = 29x29 , Termination Post Length (mm [in]) = 2.25 [0.088] l Socket Identifier = Socket 754 Body Related Features: l Tyco Electronics
Original
Abstract: ) Product Highlights: l Zero Insertion Force l 754 Positions l PC B Mount Style = Surface Mount l Grid , Product specification, 754 position mPGA socket ( Ba. (TIF, English) Application Specifications: l , Insertion Force = Zero l Number of Positions = 754 l PC B Mount Style = Surface Mount l Grid Size = 29x29 , Features: l Socket Identifier = Socket 754 Body Related Features: l Assembly Process Feature = Pick and Tyco Electronics
Original
Abstract: 754 l PC B Mount Style = Surface Mount l Grid Size = 29x29 l Grid Spacing = 1.27 x 1.27 mm , Related Products: l Tooling Product Specifications: l 754 Position Lever Actuated ZIF Micro PGA , l Number of Positions = 754 l PC B Mount Style = Surface Mount l Grid Size = 29x29 l Grid Spacing , Features: l Socket Identifier = Socket 754 Body Related Features: l Assembly Process Feature = None l Tyco Electronics
Original
Abstract: ) Product Highlights: l Zero Insertion Force l 754 Positions l PC B Mount Style = Surface Mount l Grid , Product specification, 754 position mPGA socket ( Ba. (TIF, English) Application Specifications: l , Insertion Force = Zero l Number of Positions = 754 l PC B Mount Style = Surface Mount l Grid Size = 29x29 , Features: l Socket Identifier = Socket 754 Body Related Features: l Assembly Process Feature = Pick and Tyco Electronics
Original
Abstract: 754 l PC B Mount Style = Surface Mount l Grid Size = 29x29 l Grid Spacing = 1.27 x 1.27 mm , Related Products: l Tooling Product Specifications: l 754 Position Lever Actuated ZIF Micro PGA , l Number of Positions = 754 l PC B Mount Style = Surface Mount l Grid Size = 29x29 l Grid Spacing , Features: l Socket Identifier = Socket 754 Body Related Features: l Assembly Process Feature = Pick and Tyco Electronics
Original
Abstract: SPECIFICATIONS Socket 754 BGA Series CPU Socket Vertical, SMT Type 1.27mm [.050"] Pitch 754 Pos. Mechanical Contact Retention Force: 0.13Kg min. Durability: 50 Cycles Low Level Circuit Resistance (LLCR): 20m max. Insulation Resistance: 1000M min. Dielectric Withstanding Voltage(650 V AC): No Flashover or Breakdown Self­inductance: 4nH max. Mutual Capacitance: 1pF max. Electrical Physical Cover , 754 ORDERING I N FO R M ATI O N PRODUCT NO.: P Z 7 5 4 0 3 - 2 9 4 8 - 0 P=PGA Socket Foxconn
Original
foxconn
Abstract: on-chip Packaging ­ 754-pin lidded micro PGA ­ 1.27-mm pin pitch ­ 29x29-row pin array ­ 40mm x , Gigabytes/s in each direction 754-Pin Package Specific Features · Refer to the AMD Functional Data Sheet, 754 Pin Package, order# 31410, for functional, electrical, and mechanical details of 754 , support. · Added Socket AM2 Specific Features · Duplicated Electrical Interfaces under the 754-pin and Advanced Micro Devices
Original
amd athlon 64 socket 939 amd publication 31117 socket AM2 Socket am2 Processor Functional AM2 Processor Functional 31117 AMD64 512-K 256-K
Abstract: /8"-27 Thread Hex Nut 5.56 Recommended Panel Cutout 39.83 Ø17.86 7.54 13.11 Fig. 4 , 2 4 6 8 10 .634 .634 .864 1.092 1.324 .504 .754 .754 .754 .754 WM17509-ND , .754 .754 .754 .754 WM17504-ND WM17505-ND WM17506-ND WM17507-ND WM17508-ND Price Each 10 -
Original
MX150L EN3C8F sc1161 SC1161-ND sc1160 sc1177 sc1170 1500VAC WM17510-ND WM17511-ND WM17512-ND WM17513-ND
Abstract: instructions *SSE3 supported by Rev E and later processors 754-Pin Package Specific Features Runs existing operating systems and drivers · Refer to the AMD Functional Data Sheet, 754 Local APIC on-chip Pin , also use DDR SDRAM-like electrical specifications · Packaging ­ 754-pin lidded micro PGA ­ , hardware scrubbing of major ECC-protected arrays · electrical, and mechanical details of 754 , · Duplicated Electrical Interfaces under the 754-pin and 939-pin Specific Features. April 2005 Advanced Micro Devices
Original
AM2 31117 AM2 Processor Functional Data Sheet am2 athlon 64 pin amd socket 939 am2 specification 31117 socket AM2 754-P
Abstract: AMD SempronTM Processor Product Data Sheet · · Compatible with Existing 32-Bit Code Base ­ Including support for SSE, SSE2, SSE3*, MMXTM, 754-Pin Package Specific Features 3DNow!TM technology and , Data Sheet, ­ Runs existing operating systems and drivers 754-Pin Package, order# 31410, for functional, ­ Local APIC on-chip electrical, and mechanical details of 754-pin package processors. AMD64 , registers (16 total) ­ Eight additional 128-bit SSE registers (16 total) · Packaging ­ 754 Advanced Micro Devices
Original
SEMPRON Socket 754 amd sempron am2 sempron 754 Sempron AMD sempron Socket 754 socket am2 31117
Abstract: AMD TurionTM 64 Mobile Technology Product Data Sheet · · Compatible with Existing 32-Bit Code Base ­ Including support for SSE, SSE2, SSE3*, MMXTM, 754-Pin Package Specific Features 3DNow , Functional Data Sheet, ­ Runs existing operating systems and drivers 754-Pin Package, order# 31410, for functional, ­ Local APIC on the chip mechanical, and electrical details of 754-pin packages. AMD64 , (1600 MT/s) or 3.2 Gbytes/s in each direction · Packaging ­ 754-pin lidless micro PGA ­ 1.27 Advanced Micro Devices
Original
Socket S1g1 Processor Functional S1G1 turion 754 31731 turion Socket S1g1
Abstract: '˜ P/N: 1612596-2, i S0CKÉ 754 Q v 11 -m m â'" Iâ'" m m - , ocket-754\C 1612596b.dw q Kawasaki,Japan NAME SOCKET MICRO PGA 754 POSITION SINGLE LEVER -
OCR Scan
010CT03 31MAR2000 07NOV2OO2 20MAR03 FJ030708
Abstract: MAXIMUM solutions Introducing 754-Pin & 940-Pin PGA Sockets for AMD Athlon Processors AMD64 & AMD64FX Mill-Max introduces a 754-pin & a 940-pin low insertion force PGA socket to accept AMD's new 64-bit Athlon microprocessors. · These sockets may be plugged into an existing ZIF socket on the motherboard and function as a "socket saver" during test and debug, or they may be soldered directly into a pattern of PTHs on the motherboard. · Each socket has pluggable solder tails, Ø.012" for a length of .100" stepped-up Mill-Max Mfg.
Original
Athlon Processors 754 PIN Socket 940 pin AMD Socket 754 processor Motherboard socket 754 940-P UL94V-0
Abstract: 754 l PC B Mount Style = Surface Mount l Grid Size = 29x29 l Grid Spacing = 1.27 x 1.27 mm , Features: l Insertion Force = Zero l Number of Positions = 754 l PC B Mount Style = Surface Mount l , C omment = Sn/Ag/C u solderballs. Termination Related Features: l Socket Identifier = Socket 754 Tyco Electronics
Original
Abstract: . 50 0.063 0.093 0.110 9.26 9.26 9.26 7.94 7.94 7.94 7.54 7.54 7.54 6.95 6.95 , 7.54 7.54 7.54 6.95 6.95 6.95 C C C low force low force low force 0.063 0.093 Mouser Catalog
Original
817-FCN-268M036-G1D B 817 c 817 BY B 817 817-FCN-268D008-G3MR 817-FCN-268D008-G1D FCD-ZZ00021 817-FCN-268M012-G0D 817-FCN-268M012-G1D 817-FCN-268M012-G2D 817-FCN-268M012-G3D 817-FCN-268M024-G0D 817-FCN-268M024-G1D
Abstract: (14.33) .564 (14.33) .754 (19.15) .754 (19.15) .754 (19.15) .754 (19.15) .754 (19.15) .754 (19.15) .754 ITT Industries
Original
cbt 600 crimp tool 031-1040-001 CBT-600B CCHP-8-6 CET-FRF-16-22A FRF6 MIL-C-5015 M22520/1-01
Abstract: ) .833 |21.15) .765 (19.44) .396 (7.54) .093 (2.36) 1.197 (30.40) 1.020 (25.90) .765 (19.44) .396 (7.54) K O I-2 1 -* * .093 (2.36) 1-5/16-6 1.322 (33.57) 1.175 (29.84) .765 (19.44) .396 (7.54) K 0 A 1 -2 1 -* .093(2.36) 1-5/16-6 1.312 (33.32) 1.195 , ) .296 (7.54) .093 (2.36) .843 (21.41; 1.125 (28.57) .765 (19.44) .296 (7.54) .093 (2.36) .972 (24.68; 1.250 (31.75) 1.175 (29.84) .765 (19.44) .296 (7.54) .093 (2.36 -
OCR Scan
k0219 K0216 QQ-A-591 K02-16-DC K02-19-DC 2-21-1-DC KD2-16-1 K02-21-0C
Abstract: Configurtions) PCB Layout ­ 9/9 Sym. 0.492 (12.50) 0.035 (0.89) 0.216 (5.49) 0.108 Typ (2.74) 0.297 (7.54 , Typ (1.37) 0.297 (7.54) 0.013 (0.33) 0.162 (4.11) 0.108 Typ (2.74) 0.378 (9.60) 0.324 (8.23) PCB Layout ­ 25/25 Sym. 0.926 (35.62) 0.035 (0.89) 0.109 Typ (2.77) 0.297 (7.54) 0.013 (0.33) 0.055 Typ (1.40) 0.652 (16.56) PCB Layout ­ 37/37 Sym. 1.250 (31.75) 0.035 (0.89) 0.109 Typ (2.77) 0.297 (7.54 MAXCONN
Original
mst 702 817 BN maxcom MAXCONN MRS-ef-9p-n E107337 E145613 RS232C RS449
Showing first 20 results.