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ISO7142CCQDBQRQ1 Texas Instruments Automotive, Small Footprint, Low Power, Quad-Channel 2/2 Digital Isolator 16-SSOP -40 to 125 visit Texas Instruments Buy
REF3425IDBVR Texas Instruments Low-Drift Low-Power Small-Footprint Series Voltage Reference 6-SOT-23 -40 to 125 visit Texas Instruments
REF2125IDBVR Texas Instruments Low-Drift Low-Power Small-Footprint Series Voltage Reference With Clean Start 5-SOT-23 -40 to 125 visit Texas Instruments
ISO7142CCQDBQQ1 Texas Instruments Automotive, Small Footprint, Low Power, Quad-Channel 2/2 Digital Isolator 16-SSOP -40 to 125 visit Texas Instruments
HIP1020CK-T Intersil Corporation SWITCHED CAPACITOR CONVERTER, PDSO5 visit Intersil
CSD95482RWJT Texas Instruments 40A Synchronous Buck NexFET™ Smart Power Stage in an Industry Standard Footprint 41-VQFN-CLIP -55 to 150 visit Texas Instruments

SURFACE MOUNT CAPACITORS footprint land pattern

Catalog Datasheet MFG & Type PDF Document Tags

SURFACE MOUNT CAPACITORS footprint land pattern

Abstract: 0201 footprint Surface Mount Multilayer Ceramic Chip Capacitors for Commodity Applications Vishay FOOTPRINT DESIGN Circuit board design first steps are to consider how the surface mount board will be manufactured. The , VJ.W1BC Soldering and Footprint Design Vishay Surface Mount Multilayer Ceramic Chip Capacitors for Commodity Applications RECOMMENDED SOLDERING CONDITIONS Lead (Pb)-free terminated MLCCs are , parameters for reliable joints TYPICAL SMD FOOTPRINT E Occupied area G D Solder land/Solder
Vishay Intertechnology
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Abstract: VJ.W1BC Soldering and Footprint Design Vishay Surface Mount Multilayer Ceramic Chip , AT www.vishay.com/doc?91000 VJ.W1BC Soldering and Footprint Design Surface Mount Multilayer Ceramic Chip Capacitors for Commodity Applications Vishay FOOTPRINT DESIGN Circuit board design first steps are to consider how the surface mount board will be manufactured. The manufacturing process , reliable joints TYPICAL SMD FOOTPRINT E Occupied area G D Solder land/Solder paste pattern Vishay Intertechnology
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MMA7660

Abstract: AN3839 sensor. The first topic that will be discussed is the minimum recommended footprint for surface mount , supply. Figure 2. I2C Connection to MCU MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the , used successfully for soldering the devices. Figure 3. Package Footprint, PCB Land Pattern, and
Freescale Semiconductor
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A7647

Abstract: A7647-01 's requirement for a manufacturing alternative allowing flexibility in selecting whether to surface mount an , application. The interposer has a die specific OLGA land pattern of .024" (0.609mm) diameter metal defined , pin lands. This pin land pattern is offset .025" (0.635mm) in the X and Y directions in relation to the OLGA land pattern. The pin lands and BGA land pairs are connected to each other with a .010" , Package Trace Metal Copper External Heat Slug Yes External Capacitors Yes Performance
Intel
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AN10365

Abstract: ipc 610D requirements for surface mount devices and land pattern standard. The next paragraph explains how to read the , AN10365 Surface mount reflow soldering description Rev. 04 - 13 August 2009 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling , semiconductor packages. AN10365 NXP Semiconductors Surface mount reflow soldering description , NXP Semiconductors Surface mount reflow soldering description 1. Introduction This application
NXP Semiconductors
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ipc 610D JEDEC J-STD-033b.1 Cu3Sn SSOP20 LAND PATTERN JEDEC J-STD-033b J-STD-033b.1

AN10365

Abstract: Lead Free reflow soldering profile BGA AN10365 Surface mount reflow soldering description Rev. 01 - 24 May 2005 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This , Semiconductors Surface mount reflow soldering description Revision history Rev Date Description 1 , . Rev. 01 - 24 May 2005 2 of 26 AN10365 Philips Semiconductors Surface mount reflow , surface mount IC packages. Nowadays, reflow soldering is a widely spread technology for soldering of
Philips Semiconductors
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Lead Free reflow soldering profile BGA philips pb-free products HVQFN48 Solder Paste, Indium, Type 3 SSOP20

Cu3Sn

Abstract: Solder Paste, Indium, Type 3 AN10365 Surface mount reflow soldering description Rev. 02 - 26 July 2006 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This , Semiconductors Surface mount reflow soldering description Revision history Rev Date Description , 2006 2 of 26 AN10365 Philips Semiconductors Surface mount reflow soldering description 1. Introduction This application note provides guidelines for board mounting of surface mount IC
Philips Semiconductors
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SOT266-1 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3

Cu3Sn

Abstract: Cu6Sn5 NXP Semiconductors Surface mount reflow soldering description Footprint information for reflow , AN10365 Surface mount reflow soldering description Rev. 03 - 22 April 2008 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This , Surface mount reflow soldering description Revision history Rev Date Description 03 , 2008 2 of 24 AN10365 NXP Semiconductors Surface mount reflow soldering description 1
NXP Semiconductors
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Cu6Sn5 J-STD-020D

IPC-A-6103

Abstract: 14 pin ic 7404 datasheet , PowerPAD land PCB footprint (Figure 2) SYMBOL* P W L L2 L1 S A Y X P1 W1 L3 S1 Y1 X1 , Instruments Incorporated Continued from previous page Figure 2. 48-pin HTSSOP land pattern Figure 2 shows the pattern of IC pin and PowerPAD landings, called the IC footprint. These are the PCB pads , landings of the surface mount components creates an effective contact between the PowerPAD, IC pins , Footprint L1 L2 Local Fiducials G3 G2 Global Fiducials to the input capacitors and feedback
Texas Instruments
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IPC-A-6103 14 pin ic 7404 datasheet PIC BASIC CIRCUIT IPC-2221 IPC-SM-782 SLMA002 TPA005D1 TPA032D0 C011905 SLYT182

RF1109

Abstract: RF1604D recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2 mil to , . Typical thickness is 3 inch to 8 inch gold over 180 inch nickel. PCB Land Pattern Recommendation PCB land , has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. PCB Metal Land Pattern DS110718 7628 Thorndike
RF Micro Devices
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RF1604D RF1109 7915M RF1604DPCBA-410

IPC-SM-780

Abstract: Electronic Industries Association, EIA. IPC-SM-782: Surface Mount Design and Land Pattern Standard, published , and pressure to form a single structure. Land Pattern: Also called footprint or Pad, define the site , provide(s) access to the surface of the land in one or more layers of the board. All-metal package: A , and voltage stress. Butt lead: A lead count of surface mount devices in which pin tips contact the PC , connection of the gold-plated TAB leads to the gold bump on the chip. I-lead: A surface mount device lead
Intel
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IPC-SM-780

CERAMIC PIN GRID ARRAY wire lead frame

Abstract: IPC-SM-780 Electronic Industries Association, EIA. IPC-SM-782: Surface Mount Design and Land Pattern Standard, published , and pressure to form a single structure. Land Pattern: Also called footprint or Pad, define the site , provide(s) access to the surface of the land in one or more layers of the board. All-metal package: A , and voltage stress. Butt lead: A lead count of surface mount devices in which pin tips contact the PC , connection of the gold-plated TAB leads to the gold bump on the chip. I-lead: A surface mount device lead
Intel
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CERAMIC PIN GRID ARRAY wire lead frame nickel corrosion electroplating

IPC-SM-780

Abstract: Electronic Industries Association, EIA. IPC-SM-782: Surface Mount Design and Land Pattern Standard, published , a multilayer board that provide(s) access to the surface of the land in one or more layers of the , lead: A lead count of surface mount devices in which pin tips contact the PC board. C Carrier: A , : A surface mount device lead whose ends contact the board at a 90º angle; also called a butt joint , the surface of a conductive pattern utilizing component holes. Insulators: A class of materials with
Intel
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smema

Abstract: ultrasonic bond Engineering Council. J-lead: A surface mount device whose leads are formed into a "J" pattern, folding under , multilayer board that provide(s) access to the surface of the land in one or more layers of the board , lead: A lead count of surface mount devices in which pin tips contact the PC board. C Carrier: A , gold-plated TAB leads to the gold bump on the chip. I-lead: A surface mount device lead whose ends contact , mechanical connection of a component to the surface of a conductive pattern utilizing component holes
Intel
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smema ultrasonic bond land pattern for TSOP tensile-strength soft solder die bonding TO metal package aluminum kovar

AN4077

Abstract: the Quad Flat No Lead (QFN) Package Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder , 0.25mm PCB Land Pattern & Stencil Package footprint Solder mask opening = PCB land pad edge + , , Pull-down Resistor, Sensor, I/O pins, Non Solder Mask Defined, Solder Mask, Land Pattern, Stencil, Halogen , operating at a higher voltage. Bypass capacitors are recommended on the input voltage pins to ensure a
Freescale Semiconductor
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AN4077 MMA845 MMA8450Q MMA8451Q MMA8452Q MMA8453Q

MMA6271QR2

Abstract: MMA6271QT MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to , conditions with 260°C maximum temperature. PCB land pattern - NSMD Package Pad Signal trace 0.1mm , °C Drop Test (1) Storage Temperature Range 1. Dropped onto concrete surface from any axis , integrated-circuit accelerometer. The device consists of two surface micromachined capacitive sensing cells (g-cell
Freescale Semiconductor
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MMA6271QT QFN-16 MMA6271QR2 16-LEAD

mp3 player circuit diagram pcb layout

Abstract: MMA7261QR2 Freescale Semiconductor MINNIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages , . PCB land pattern - NSMD Package Pad Signal trace 0.1mm width and 0.5mm (min) length near , ) Storage Temperature Range 1. Dropped onto concrete surface from any axis. ELECTRO STATIC DISCHARGE , accelerometer. The device consists of two surface micromachined capacitive sensing cells (g-cell) and a signal
Freescale Semiconductor
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MMA7261QT mp3 player circuit diagram pcb layout MMA7261QR2 MMA7261Q

QFN footprint

Abstract: MMA6281QR2 FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder , conditions with 260°C maximum temperature. \ PCB land pattern - NSMD Package Pad Signal trace , °C Drop Test (1) Storage Temperature Range 1. Dropped onto concrete surface from any axis , integrated-circuit accelerometer. The device consists of two surface micromachined capacitive sensing cells (g-cell
Freescale Semiconductor
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MMA6281QT MMA6281QR2 QFN footprint

pedometer

Abstract: QFN "200 pin" PACKAGE Semiconductor MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the , multiple reflow of leadfree conditions with 260°C maximum temperature. PCB land pattern - NSMD , 1.8 m Tstg ­40 to +125 °C Storage Temperature Range 1. Dropped onto concrete surface , accelerometer. The device consists of two surface micromachined capacitive sensing cells (g-cell) and a signal
Freescale Semiconductor
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MMA6280QT MMA6280QR2 pedometer QFN "200 pin" PACKAGE circuit diagram of pedometer

QFN "200 pin" PACKAGE

Abstract: MMA6270QR2 Sensors Freescale Semiconductor MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount , . PCB land pattern - NSMD Package Pad Signal trace 0.1mm width and 0.5mm (min) length near , Temperature Range 1. Dropped onto concrete surface from any axis. ELECTRO STATIC DISCHARGE (ESD) WARNING , integrated-circuit accelerometer. The device consists of two surface micromachined capacitive sensing cells (g-cell
Freescale Semiconductor
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MMA6270QT MMA6270QR2
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