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SURFACE 95 200 ML, CH DE Kontakt Chemie Cleaning spray Delivery form: Spray Function: Cleaner 18 from €8.16 (Sep 2016) Distrelec Buy
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SURFACE MOUNT CAPACITORS footprint land pattern

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Surface Mount Multilayer Ceramic Chip Capacitors for Commodity Applications Vishay FOOTPRINT DESIGN Circuit board design first steps are to consider how the surface mount board will be manufactured. The , VJ.W1BC Soldering and Footprint Design Vishay Surface Mount Multilayer Ceramic Chip Capacitors for Commodity Applications RECOMMENDED SOLDERING CONDITIONS Lead (Pb)-free terminated MLCCs are , parameters for reliable joints TYPICAL SMD FOOTPRINT E Occupied area G D Solder land/Solder ... Vishay Intertechnology
Original
datasheet

2 pages,
364.19 Kb

vishay 0402 SMD capacitors ceramic capacitor footprint dimension 1210 footprint SMD CASE footprint land pattern 0805 0201 capacitor footprint 0201 footprint TEXT
datasheet frame
Abstract: VJ.W1BC Soldering and Footprint Design Vishay Surface Mount Multilayer Ceramic Chip , AT www.vishay.com/doc?91000 VJ.W1BC Soldering and Footprint Design Surface Mount Multilayer Ceramic Chip Capacitors for Commodity Applications Vishay FOOTPRINT DESIGN Circuit board design first steps are to consider how the surface mount board will be manufactured. The manufacturing process , reliable joints TYPICAL SMD FOOTPRINT E Occupied area G D Solder land/Solder paste pattern ... Vishay Intertechnology
Original
datasheet

2 pages,
36.55 Kb

TEXT
datasheet frame
Abstract: sensor. The first topic that will be discussed is the minimum recommended footprint for surface mount , supply. Figure 2. I2C Connection to MCU MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the , used successfully for soldering the devices. Figure 3. Package Footprint, PCB Land Pattern, and ... Freescale Semiconductor
Original
datasheet

8 pages,
427.7 Kb

MMA7660FC land pattern for DFN accelerometer sensor AN3839 MMA7660 TEXT
datasheet frame
Abstract: 's requirement for a manufacturing alternative allowing flexibility in selecting whether to surface mount an , application. The interposer has a die specific OLGA land pattern of .024" (0.609mm) diameter metal defined , pin lands. This pin land pattern is offset .025" (0.635mm) in the X and Y directions in relation to the OLGA land pattern. The pin lands and BGA land pairs are connected to each other with a .010" , Package Trace Metal Copper External Heat Slug Yes External Capacitors Yes Performance ... Intel
Original
datasheet

26 pages,
588.91 Kb

A719-0 a7190 outline of the heat sink for Theta JC FCPGA JEDEC Thin Matrix Tray outlines BGA PACKAGE TOP MARK intel A7646-01 socket s1 REFLOW socket 615-PIN A7190-01 A7647-01 A7647 TEXT
datasheet frame
Abstract: requirements for surface mount devices and land pattern standard. The next paragraph explains how to read the , AN10365 AN10365 Surface mount reflow soldering description Rev. 04 - 13 August 2009 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling , semiconductor packages. AN10365 AN10365 NXP Semiconductors Surface mount reflow soldering description , NXP Semiconductors Surface mount reflow soldering description 1. Introduction This application ... NXP Semiconductors
Original
datasheet

29 pages,
210.94 Kb

7450 AOI HVQFN48 remark um sod SOD882 Solder Paste, Indium 5.1, Type 3 Solder Paste, Indium, Type 3 SSOP20 J-STD-020D Cu6Sn5 ipc 610 non-wetting J-STD-033b.1 JEDEC J-STD-033b SSOP20 LAND PATTERN AN10365 ipc 610D AN10365 JEDEC J-STD-033b.1 AN10365 Cu3Sn AN10365 AN10365 AN10365 TEXT
datasheet frame
Abstract: AN10365 AN10365 Surface mount reflow soldering description Rev. 01 - 24 May 2005 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This , Semiconductors Surface mount reflow soldering description Revision history Rev Date Description 1 , . Rev. 01 - 24 May 2005 2 of 26 AN10365 AN10365 Philips Semiconductors Surface mount reflow , surface mount IC packages. Nowadays, reflow soldering is a widely spread technology for soldering of ... Philips Semiconductors
Original
datasheet

26 pages,
153.45 Kb

SSOP20 Solder Paste, Indium, Type 3 philips pb-free products HVQFN48 Cu3Sn Lead Free reflow soldering profile BGA AN10365 TEXT
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Abstract: AN10365 AN10365 Surface mount reflow soldering description Rev. 02 - 26 July 2006 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This , Semiconductors Surface mount reflow soldering description Revision history Rev Date Description , 2006 2 of 26 AN10365 AN10365 Philips Semiconductors Surface mount reflow soldering description 1. Introduction This application note provides guidelines for board mounting of surface mount IC ... Philips Semiconductors
Original
datasheet

26 pages,
150.49 Kb

SSOP20 SOT266-1 LAND PATTERN Solder Paste, Indium 5.1, Type 3 philips pb-free products HVQFN48 SSOP20 LAND PATTERN Solder Paste, Indium, Type 3 Cu3Sn AN10365 TEXT
datasheet frame
Abstract: NXP Semiconductors Surface mount reflow soldering description Footprint information for reflow , AN10365 AN10365 Surface mount reflow soldering description Rev. 03 - 22 April 2008 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This , Surface mount reflow soldering description Revision history Rev Date Description 03 , 2008 2 of 24 AN10365 AN10365 NXP Semiconductors Surface mount reflow soldering description 1 ... NXP Semiconductors
Original
datasheet

24 pages,
156.79 Kb

SSOP20 Solder Paste, Indium 5.1, Type 3 J-STD-020D HVQFN48 Cu6Sn5 Cu3Sn AN10365 TEXT
datasheet frame
Abstract: , PowerPAD land PCB footprint (Figure 2) SYMBOL* P W L L2 L1 S A Y X P1 W1 L3 S1 Y1 X1 , Instruments Incorporated Continued from previous page Figure 2. 48-pin HTSSOP land pattern Figure 2 shows the pattern of IC pin and PowerPAD landings, called the IC footprint. These are the PCB pads , landings of the surface mount components creates an effective contact between the PowerPAD, IC pins , Footprint L1 L2 Local Fiducials G3 G2 Global Fiducials to the input capacitors and feedback ... Texas Instruments
Original
datasheet

6 pages,
264.47 Kb

TPA032D0x class-d 555 IPC 2221 IPC-2221 Amplifier IPC-SM-782 PIC BASIC CIRCUIT SLMA002 TPA032D04 ANSI/IPC-A-610 14 pin ic 7404 datasheet IPC-A-6103 TEXT
datasheet frame
Abstract: recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2 mil to , . Typical thickness is 3 inch to 8 inch gold over 180 inch nickel. PCB Land Pattern Recommendation PCB land , has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. PCB Metal Land Pattern DS110718 DS110718 7628 Thorndike ... RF Micro Devices
Original
datasheet

9 pages,
512.45 Kb

RF1604D 7915M TEXT
datasheet frame

Archived Files

Abstract Saved from Date Saved File Size Type Download
Land Pattern Design and Surface Mount Guidelines for QFN (MLFP) Packages Thermal advantage of this feature reduces the size and cost of the output capacitors required to support a load Footprint; Improves PCB Efficiency and Thinner in Profile Related Documentation
/datasheets/files/intersil/device_pages/device_isl6558.html
Intersil 07/09/2006 36.91 Kb HTML device_isl6558.html
NECESSITATED TRANSMITTER SITUATION EXCEEDS METHANE INCREASING DISTURBANCES BIPOLAR CAPACITORS PROPORTIONAL ECONOMY IDENTIFY 2PPM UNFORTUNATELY AGAIN QUICKLY BIPOLAR CAPACITORS REDUCES PATH EXTRACTS INSURING BUFFER HALF 100KHZ 100KHZ QUICKLY KEEPING DAC CAPACITORS INITIALIZING EXCEEDING ASSUME PULLS REINFORCES INPUT CAPACITORS BYPASSES REDUCES PATH ASSUME INPUT SILICON SOURCE SWITCH SUCH TRANSFORMER COMPOSITE ATTENTION UNNEEDED BIPOLAR CAPACITORS CONVERTED REDUCES PATH INPUT PULLS SOURCE SUCH ABSTRACT FLOATING 15MHZ 15MHZ
/datasheets/files/linear/lview3/parts-v1.edb
Linear 08/10/1998 5000.33 Kb EDB parts-v1.edb
EXCEEDS METHANE INCREASING DISTURBANCES BIPOLAR CAPACITORS PROPORTIONAL CONVERTED UTILIZED REDUCES ECONOMY IDENTIFY 2PPM UNFORTUNATELY AGAIN QUICKLY BIPOLAR CAPACITORS REDUCES PATH EXTRACTS INSURING ECONOMY COMPARES BUFFER HALF 100KHZ 100KHZ QUICKLY KEEPING DAC CAPACITORS INITIALIZING EXCEEDING ASSUME PULLS UNFORTUNATELY SQUAREWAVE PROPORTIONAL CAPACITORS BYPASSES REDUCES PATH ASSUME INPUT SILICON SOURCE SWITCH SUCH HAPPEN REDUCED AGAIN INCREASING CROSSOVER UNNEEDED BIPOLAR CAPACITORS CONVERTED REDUCES PATH INPUT PULLS
/datasheets/files/linear/lview4/parts.edb
Linear 15/02/2000 7168.02 Kb EDB parts.edb
NECESSITATED TRANSMITTER SITUATION EXCEEDS METHANE INCREASING DISTURBANCES BIPOLAR CAPACITORS PROPORTIONAL ECONOMY IDENTIFY 2PPM UNFORTUNATELY AGAIN QUICKLY BIPOLAR CAPACITORS REDUCES PATH EXTRACTS INSURING BUFFER HALF 100KHZ 100KHZ QUICKLY KEEPING DAC CAPACITORS INITIALIZING EXCEEDING ASSUME PULLS REINFORCES INPUT CAPACITORS BYPASSES REDUCES PATH ASSUME INPUT SILICON SOURCE SWITCH SUCH TRANSFORMER COMPOSITE ATTENTION UNNEEDED BIPOLAR CAPACITORS CONVERTED REDUCES PATH INPUT PULLS SOURCE SUCH ABSTRACT FLOATING 15MHZ 15MHZ
/datasheets/files/linear/lview3/parts.ebd
Linear 08/10/1998 5000.33 Kb EBD parts.ebd
NECESSITATED TRANSMITTER SITUATION EXCEEDS METHANE INCREASING DISTURBANCES BIPOLAR CAPACITORS PROPORTIONAL ECONOMY IDENTIFY 2PPM UNFORTUNATELY AGAIN QUICKLY BIPOLAR CAPACITORS REDUCES PATH EXTRACTS INSURING BUFFER HALF 100KHZ 100KHZ QUICKLY KEEPING DAC CAPACITORS INITIALIZING EXCEEDING ASSUME PULLS REINFORCES INPUT CAPACITORS BYPASSES REDUCES PATH ASSUME INPUT SILICON SOURCE SWITCH SUCH TRANSFORMER COMPOSITE ATTENTION UNNEEDED BIPOLAR CAPACITORS CONVERTED REDUCES PATH INPUT PULLS SOURCE SUCH ABSTRACT FLOATING 15MHZ 15MHZ
/datasheets/files/linear/lview3/parts.edb
Linear 21/01/1999 5379.43 Kb EDB parts.edb
No abstract text available
/download/90212243-999460ZC/dbookold.zip ()
Xilinx 07/09/1996 10340.01 Kb ZIP dbookold.zip
No abstract text available
/download/2597845-174510ZC/b3.zip ()
Intel 08/12/1997 2630.08 Kb ZIP b3.zip
No abstract text available
/download/61063093-260349ZC/b3.zip ()
Intel 08/12/1997 2630.08 Kb ZIP b3.zip
No abstract text available
/download/2367491-592498ZC/price-06.zip ()
NEDIS 01/03/2001 2236.65 Kb ZIP price-06.zip