| SOT870-1 |
|
NXP Semiconductors
|
Plastic thin small outline package; no leads; 4 terminals; body 1.6 x 2 x 1.1 mm |
|
Original |
PDF
|
| SOT871-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 52 terminals; body 6 x 6 x 0.85 mm |
|
Original |
PDF
|
| SOT873-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin small outline package; no leads; 8 terminals |
|
Original |
PDF
|
| SOT873-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT873-1 |
|
Original |
PDF
|
| SOT873-1_115 |
|
NXP Semiconductors
|
HVSON8; reel pack; standard product orientation; 12NC ending 115 |
|
Original |
PDF
|
| SOT878-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT878-1 |
|
Original |
PDF
|
| SOT878-2 |
|
NXP Semiconductors
|
Plastic rectangular-DIL-bent-SIL (reverse bent) power package; 27 leads (row spacing 2.54 mm) |
|
Original |
PDF
|
| SOT879-1 |
|
NXP Semiconductors
|
Plastic low profile ball grid array package; 196 balls; body 15 x 15 x 1 mm |
|
Original |
PDF
|
