| SOT310-1 |
|
NXP Semiconductors
|
Plastic quad flat package; 80 leads (lead length 1.6 mm); body 14 x 20 x 3.0 mm |
|
Original |
PDF
|
| SOT313-2 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT313-2 |
|
Original |
PDF
|
| SOT313-2 |
|
NXP Semiconductors
|
Plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm |
|
Original |
PDF
|
| SOT313-2_118 |
|
NXP Semiconductors
|
LQFP48; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
|
Original |
PDF
|
| SOT313-2_128 |
|
NXP Semiconductors
|
LQFP48; Reel pack; SMD, 13", TurnedQ2/T3 Standard product orientationOrderable part number ending ,128 or HPOrdering code (12NC) ending 128 |
|
Original |
PDF
|
| SOT314-2 |
|
NXP Semiconductors
|
Plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm |
|
Original |
PDF
|
| SOT314-2 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT314-2 |
|
Original |
PDF
|
| SOT314-2_118 |
|
NXP Semiconductors
|
LQFP64; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
|
Original |
PDF
|
| SOT315-1 |
|
NXP Semiconductors
|
Plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm |
|
Original |
PDF
|
| SOT315-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT315-1 |
|
Original |
PDF
|
| SOT315-1_118 |
|
NXP Semiconductors
|
LQFP80; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118 |
|
Original |
PDF
|
| SOT316-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT316-1 |
|
Original |
PDF
|
| SOT316-1 |
|
NXP Semiconductors
|
Plastic shrink quad flat package; 208 leads (lead length 1.3 mm); body 28 x 28 x 3.4 mm; high stand-off height |
|
Original |
PDF
|
| SOT317-1 |
|
NXP Semiconductors
|
Plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height |
|
Original |
PDF
|
|
|
| SOT317-2 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT317-2 |
|
Original |
PDF
|
| SOT317-2 |
|
NXP Semiconductors
|
Plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm |
|
Original |
PDF
|
| SOT317-3 |
|
NXP Semiconductors
|
Plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm |
|
Original |
PDF
|
| SOT317-3 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT317-3 |
|
Original |
PDF
|
| SOT318-1 |
|
NXP Semiconductors
|
Plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height |
|
Original |
PDF
|
| SOT318-2 |
|
NXP Semiconductors
|
Plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm |
|
Original |
PDF
|
